Circuit board, display panel and intelligent tablet

Abstract

The embodiment of the utility model discloses a circuit board, a display panel and an intelligent tablet. The circuit board comprises a first standard bonding pad, a second standard bonding pad and a compatible bonding pad, the compatible bonding pad is arranged between the first standard bonding pad and the second standard bonding pad, and the compatible bonding pad is used for forming equivalent resistance of the zero ohmic resistor through solder paste, so that the solder paste on the first standard bonding pad and the solder paste on the second standard bonding pad are short-circuited. The solder paste on the first standard bonding pad and the solder paste on the second standard bonding pad are short-circuited through tin soldering of the compatible bonding pad, and the solder paste on the first standard bonding pad and the solder paste on the second standard bonding pad are open-circuited through no tin soldering of the compatible bonding pad, so that the operation difficulty of electrical connection and electrical disconnection of the solder paste on the bonding pads or components is greatly reduced; therefore, the operation convenience of realizing electrical connection and electrical disconnection of the solder paste or the component on the bonding pad is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of display technology, and in particular to a circuit board, a display panel, and a smart tablet. Background Art

[0002] With the continuous development of the electronics industry, intelligent electronic products have become part of people's lives, and a growing variety of products are emerging. As functionality continues to expand, the design requirements for circuit boards are also increasing. Circuit boards are becoming increasingly miniaturized and highly integrated. As circuit board size decreases, circuit short circuits on them are becoming increasingly sophisticated, making connecting and disconnecting circuits increasingly difficult.

[0003] In the related art, the electrical connection and disconnection between components on pads on a circuit board are typically achieved by separating the two pads to be electrically connected and then soldering wires to the two pads to achieve electrical connection, and then leaving the two pads separated by a gap to achieve electrical disconnection. Soldering wires is cumbersome and inconvenient. Utility Model Content

[0004] The embodiments of the present application provide a circuit board, a display panel, and a smart tablet, which can solve the technical problem of cumbersome operations for electrically connecting and disconnecting components on the soldering pads, reduce the difficulty of operating the components on the soldering pads to achieve electrical connection and disconnection, and improve the convenience of operating the components on the soldering pads to achieve electrical connection and disconnection.

[0005] An embodiment of the present application provides a circuit board, comprising: a first standard pad, a second standard pad, and a compatible pad;

[0006] The compatible pad is set between the first standard pad and the second standard pad. The compatible pad is used to form an equivalent resistance of zero ohm resistance through solder paste, so that the solder paste on the first standard pad and the solder paste on the second standard pad are short-circuited.

[0007] As described above, the solder paste on the first standard solder pad and the solder paste on the second standard solder pad are short-circuited by soldering the compatible solder pad, and the solder paste on the first standard solder pad and the solder paste on the second standard solder pad are open-circuited by not soldering the compatible solder pad. Compared with the method of realizing electrical connection and electrical disconnection by wires in the related art, the embodiment of the present application realizes electrical connection and electrical disconnection by whether the compatible solder pad is soldered or not. According to actual circuit requirements, when the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically connected, the compatible solder pad can be soldered while the first standard solder pad and the second standard solder pad are soldered. When the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically disconnected, the compatible solder pad is not processed. Compared with the method of requiring additional soldering wires in the related art, the difficulty of operating the solder paste or components on the solder pad to realize electrical connection and electrical disconnection is greatly reduced, thereby improving the convenience of operating the solder paste or components on the solder pad to realize electrical connection and electrical disconnection.

[0008] In one embodiment, the spacing between the compatible pad and the first standard pad and the second standard pad is 0.18 mm to 0.22 mm.

[0009] As mentioned above, by setting the spacing between the compatible pad and the first standard pad and the second standard pad to 0.18mm-0.22mm, compared with the related art method of directly welding the two pads, this embodiment sets the compatible pad to maintain a certain spacing with the first standard pad and the second standard pad, which can avoid the occurrence of tombstone or suspension bridge phenomenon, effectively reduce defective products, and thus improve the production efficiency and production quality of the circuit board.

[0010] In one embodiment, the shape of the compliant pad is rectangular;

[0011] The compatible pad is arranged in parallel with the first standard pad and the second standard pad, and they do not overlap with each other.

[0012] As described above, by setting the compatible pad to a rectangular shape and arranging it parallel to the first standard pad and the second standard pad without overlapping each other, a certain distance is maintained between the compatible pad and the first standard pad and the second standard pad. After the compatible pad is soldered, a certain distance is maintained with the first standard pad and the second standard pad, so that the tombstone or suspension bridge phenomenon can be avoided, thereby effectively reducing defective products and improving the production efficiency and production quality of the circuit board.

[0013] In one embodiment, the shape of the compatible pad is a superposition of a first isosceles triangle and a second isosceles triangle;

[0014] The base of the first isosceles triangle is parallel to the first side of the first standard pad, and the first side is the side facing the second standard pad;

[0015] The base of the second isosceles triangle is parallel to the second side of the second standard pad, and the second side is the side facing the first standard pad;

[0016] The vertex angle of the first isosceles triangle and the vertex angle of the second isosceles triangle are between the base of the first isosceles triangle and the base of the second isosceles triangle.

[0017] As described above, the solder paste on the first standard solder pad and the solder paste on the second standard solder pad are short-circuited by soldering the compatible solder pad, and the solder paste on the first standard solder pad and the solder paste on the second standard solder pad are open-circuited by not soldering the compatible solder pad. The embodiment of the present application realizes electrical connection and electrical disconnection by whether the compatible solder pad is soldered or not. According to actual circuit requirements, when the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically connected, the compatible solder pad can be soldered while the first standard solder pad and the second standard solder pad are soldered. When the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically disconnected, the compatible solder pad is not processed. Compared with the method of requiring additional soldering wires in the related art, the difficulty of operating the solder paste or components on the solder pad to achieve electrical connection and electrical disconnection is greatly reduced, thereby improving the convenience of operating the solder paste or components on the solder pad to achieve electrical connection and electrical disconnection.

[0018] In one embodiment, the compatible pad includes four triangular sub-pads, the circumscribed outlines of the four triangular sub-pads are a rectangle, and the four triangular sub-pads maintain a spacing along the diagonal line of the rectangle.

[0019] As described above, the solder paste on the first standard solder pad and the solder paste on the second standard solder pad are short-circuited by soldering the compatible solder pad, and the solder paste on the first standard solder pad and the solder paste on the second standard solder pad are open-circuited by not soldering the compatible solder pad. The embodiment of the present application realizes electrical connection and electrical disconnection by whether the compatible solder pad is soldered or not. According to actual circuit requirements, when the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically connected, the compatible solder pad can be soldered while the first standard solder pad and the second standard solder pad are soldered. When the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically disconnected, the compatible solder pad is not processed. Compared with the method of requiring additional soldering wires in the related art, the difficulty of operating the solder paste or components on the solder pad to achieve electrical connection and electrical disconnection is greatly reduced, thereby improving the convenience of operating the solder paste or components on the solder pad to achieve electrical connection and electrical disconnection. In addition, the circumscribed outline of the four triangular sub-pads is a rectangle, which maintains a certain distance from the first standard pad and the second standard pad, thereby avoiding the occurrence of tombstone or suspension bridge phenomena, thereby effectively reducing defective products and improving the production efficiency and production quality of the circuit board.

[0020] In one embodiment, the circuit board includes: a conductive layer;

[0021] The first standard pad, the second standard pad and the compatible pad are arranged on the conductive layer.

[0022] In one embodiment, the conductive layer is a copper layer.

[0023] The embodiment of the present application further provides a display panel, comprising a display substrate and the above-mentioned circuit board;

[0024] The display substrate is electrically connected to the circuit board, and is used to display images.

[0025] An embodiment of the present application further provides a smart tablet comprising the above-mentioned display panel and processor.

[0026] An embodiment of the present application further provides a smart tablet comprising the above-mentioned circuit board.

[0027] The beneficial effects of the display panel and smart tablet provided above can refer to the beneficial effects of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a first schematic diagram of a circuit board provided in an embodiment of the present application;

[0029] Figure 2 This is a second schematic diagram of a circuit board provided in an embodiment of the present application;

[0030] Figure 3 This is a third schematic diagram of a circuit board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0032] In the related art, the electrical connection and disconnection between components on the pads on the circuit board are usually achieved by setting the two pads that need to be electrically connected at intervals and separating them, and then electrically connecting them by welding wires on the two pads, or by not processing the two pads that are set at intervals and separated. Soldering wires is cumbersome and inconvenient to use, and is not conducive to reducing the size of the circuit board. On small-sized circuit boards, the two pads that need to be electrically connected usually need to be set in parallel and close to each other. Solder paste can be used to directly connect the two pads, but the heating temperature of the solder paste needs to be controlled, which makes the operation difficult. In addition, when rectangular or circular pads are directly connected based on solder paste, the intersection area is small, which makes it difficult to achieve electrical connection, and often a monument or suspension bridge phenomenon will occur. At the same time, when adjacent pads need to be electrically disconnected, due to the close distance, soldering is likely to occur, causing abnormal short circuit.

[0033] Therefore, in the design of the circuit board of the related art, it is not easy to electrically connect and disconnect the components on the two pads, and the operation is cumbersome and inconvenient.

[0034] Based on this, a circuit board, a display panel and a smart tablet according to the embodiments of the present application are provided. By setting a compatible pad between the first standard pad and the second standard pad on the circuit board, when it is necessary to electrically connect the components on the two standard pads, soldering can be performed on the compatible pad, and the solder paste on the compatible pad forms an equivalent resistance of zero ohm resistance, so that the solder paste on the first standard pad and the solder paste on the second standard pad are short-circuited, thereby electrically connecting the components on the first standard pad and the second standard pad; when it is necessary to electrically disconnect the components on the two standard pads, soldering is not performed on the compatible pad. Based on the spacing between the first standard pad and the second standard pad, the solder paste on the first standard pad and the solder paste on the second standard pad are open-circuited, thereby electrically disconnecting the components on the first standard pad and the second standard pad. By adopting the above-mentioned technical means, the solder paste on the first standard solder pad and the solder paste on the second standard solder pad can be short-circuited by soldering the compatible solder pad, and the solder paste on the first standard solder pad and the second standard solder pad can be open-circuited by not soldering the compatible solder pad. Compared with the method of realizing electrical connection and electrical disconnection by means of wires in the related art, the embodiment of the present application realizes electrical connection and electrical disconnection by whether the compatible solder pad is soldered or not. According to actual circuit requirements, when the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically connected, the compatible solder pad can be soldered while the first standard solder pad and the second standard solder pad are soldered. When the solder paste or components on the first standard solder pad and the second standard solder pad need to be electrically disconnected, the compatible solder pad is not processed. Compared with the method of requiring additional soldering wires in the related art, the difficulty of realizing electrical connection and electrical disconnection of the solder paste or components on the solder pad is greatly reduced, thereby improving the convenience of realizing electrical connection and electrical disconnection of the solder paste or components on the solder pad.

[0035] Figure 1 This is a first schematic diagram of a circuit board provided in an embodiment of the present application, referring to Figure 1, the circuit board includes a first standard pad 10, a compatible pad 20 and a second standard pad 30; the compatible pad 20 is arranged between the first standard pad 10 and the second standard pad 30, and the compatible pad 20 is used to form an equivalent resistance of zero ohm resistance through solder paste, so that the solder paste on the first standard pad 10 and the solder paste on the second standard pad 30 are short-circuited. When designing the circuit of the circuit board, the components (corresponding pads) that need to be directly electrically connected are usually designed to be adjacent or close in distance to avoid adding materials such as wires or solder paste. Therefore, the first standard pad 10 and the second standard pad 30 can be understood as two standard pads on the circuit board that are close in distance and may need to be directly electrically connected. The solder paste on the first standard solder pad 10 and the solder paste on the second standard solder pad 30 can be short-circuited by soldering the compatible solder pad 20, and the solder paste on the first standard solder pad 10 and the solder paste on the second standard solder pad 30 can be open-circuited by not soldering the compatible solder pad 20. Compared with the method of realizing electrical connection and electrical disconnection by wires in the related art, the embodiment of the present application realizes electrical connection and electrical disconnection by whether the compatible solder pad 20 is soldered or not. According to actual circuit requirements, when the solder paste or element on the first standard solder pad 10 and the second standard solder pad 30 is required, When the device is electrically connected, the compatible pad 20 can be soldered while the first standard pad 10 and the second standard pad 30 are soldered. When the solder paste or components on the first standard pad 10 and the second standard pad 30 need to be electrically disconnected, the compatible pad is not processed. Compared with the method of requiring additional welding wires in the related art, the difficulty of electrically connecting and disconnecting the solder paste or components on the pad is greatly reduced, thereby improving the convenience of electrically connecting and disconnecting the solder paste or components on the pad.

[0036] When soldering the compatible pad 20 , the thickness of the solder paste is 0.2 mm.

[0037] The spacing between the compatible pad 20 and the first standard pad 10 and the second standard pad 30 is 0.18mm-0.22mm. By setting the spacing between the compatible pad 20 and the first standard pad 10 and the second standard pad 30 to 0.18mm-0.22mm, compared to the related art method of directly soldering the two pads, the present embodiment sets the compatible pad 20 to maintain a certain spacing with the first standard pad 10 and the second standard pad 30. After the compatible pad 20 is soldered, based on maintaining a certain spacing with the first standard pad 10 and the second standard pad 30, the occurrence of a tombstone or a drawbridge phenomenon can be avoided. If a tombstone or a drawbridge phenomenon occurs, it is a defective product. Therefore, the present embodiment sets the compatible pad 20 to maintain a certain spacing with the first standard pad 10 and the second standard pad 30, which can effectively reduce defective products, thereby improving the production efficiency and production quality of the circuit board.

[0038] The compatible pad 20 is rectangular in shape. The compatible pad 20 is arranged parallel to the first standard pad 10 and the second standard pad 30, and does not overlap with each other. The width of the compatible pad 20 is the same as the width of the first standard pad 10 and the second standard pad 30. The distance between the compatible pad 20 and the first standard pad 10 and the second standard pad 30 is 0.18mm-0.22mm. By setting the compatible pad 20 to be rectangular in shape and being arranged parallel to the first standard pad 10 and the second standard pad 30, and not overlapping with each other, a certain distance is maintained between the compatible pad 20 and the first standard pad 10 and the second standard pad 30. After the compatible pad 20 is soldered, the certain distance maintained with the first standard pad 10 and the second standard pad 30 can avoid the occurrence of tombstone or drawbridge phenomena, thereby effectively reducing defective products and thereby improving the production efficiency and production quality of the circuit board.

[0039] Figure 2This is a second schematic diagram of a circuit board provided in an embodiment of the present application, which includes: a first standard pad 10, a second standard pad 30 and a compatible pad 20. The compatible pad 20 is shaped like a first isosceles triangle 21 and a second isosceles triangle 22 superimposed. The base of the first isosceles triangle 21 is parallel to the first side of the first standard pad 10, and the spacing is 0.18mm-0.22mm, and the first side is the side facing the second standard pad 30. Exemplarily, the base of the first isosceles triangle 21 and the first side of the first standard pad 10 are the same length. The base of the second isosceles triangle 22 is parallel to the second side of the second standard pad 30, and the spacing is 0.18mm-0.22mm, and the second side is the side facing the first standard pad 10. Exemplarily, the base of the second isosceles triangle 22 and the second side of the second standard pad 30 are the same length. The vertex angle of the first isosceles triangle 21 and the vertex angle of the second isosceles triangle 22 are between the bases of the first isosceles triangle 21 and the bases of the second isosceles triangle 22. When soldering the compatible pad 20, since the vertex angle of the first isosceles triangle 21 and the vertex angle of the second isosceles triangle 22 are between the bases of the first isosceles triangle 21 and the bases of the second isosceles triangle 22, the solder paste in the first isosceles triangle 21 and the solder paste in the second isosceles triangle 22 can be fused and connected. Therefore, the solder paste on the first standard solder pad 10 and the solder paste on the second standard solder pad 30 can be short-circuited by soldering the compatible solder pad 20, and the solder paste on the first standard solder pad 10 and the solder paste on the second standard solder pad 30 can be open-circuited by not soldering the compatible solder pad 20. In the embodiment of the present application, electrical connection and electrical disconnection are achieved by whether the compatible solder pad 20 is soldered or not. According to actual circuit requirements, when the solder paste or components on the first standard solder pad 10 and the second standard solder pad 30 need to be electrically connected, the compatible solder pad 20 can be soldered at the same time as the first standard solder pad 10 and the second standard solder pad 30. When the solder paste or components on the first standard solder pad 10 and the second standard solder pad 30 need to be electrically disconnected, the compatible solder pad is not processed. Compared with the method of requiring additional soldering wires in the related art, the difficulty of operating the solder paste or components on the solder pads to achieve electrical connection and disconnection is greatly reduced, thereby improving the convenience of operating the solder paste or components on the solder pads to achieve electrical connection and disconnection. In addition, the base of the first isosceles triangle 21 is parallel to the first side of the first standard pad 10 and the spacing is 0.18mm-0.22mm, and the base of the second isosceles triangle 22 is parallel to the second side of the second standard pad 30 and the spacing is 0.18mm-0.22mm. After soldering the compatible pad 20, based on the base of the first isosceles triangle 21 maintaining a certain distance from the first standard pad 10, and the base of the second isosceles triangle 22 maintaining a certain distance from the second standard pad 30, the occurrence of tombstone or suspension bridge phenomena can be avoided, thereby effectively reducing defective products and thereby improving the production efficiency and production quality of the circuit board.

[0040] Figure 3 This is a third schematic diagram of a circuit board provided in an embodiment of the present application, referring to Figure 3 , the circuit board includes a first standard pad 10, a second standard pad 30 and a compatible pad 20. The compatible pad 20 includes four triangular sub-pads 23, the circumscribed outlines of the four triangular sub-pads 23 are rectangular, and the four triangular sub-pads 23 are spaced apart along the diagonal lines of the rectangle. The spacing is 0.18mm-0.22mm. The circumscribed outlines of the four triangular sub-pads 23 are rectangular, and the rectangle is arranged parallel to the first standard pad 10 and the second standard pad 30, and does not overlap with each other. Exemplarily, the rectangle is arranged parallel to the first standard pad 10 and the spacing is 0.18mm-0.22mm, and the rectangle is arranged parallel to the second standard pad 30 and the spacing is 0.18mm-0.22mm. The width of the rectangle is the same as the width of the first standard pad 10 and the width of the second standard pad 30.

[0041] As described above, the solder paste on the first standard solder pad 10 and the solder paste on the second standard solder pad 30 can be short-circuited by soldering the compatible solder pad 20, and the solder paste on the first standard solder pad 10 and the solder paste on the second standard solder pad 30 can be open-circuited by not soldering the compatible solder pad 20. In the embodiment of the present application, electrical connection and electrical disconnection are achieved by whether the compatible solder pad 20 is soldered or not. According to actual circuit requirements, when the solder paste or components on the first standard solder pad 10 and the second standard solder pad 30 need to be electrically connected, the compatible solder pad 20 can be soldered while the first standard solder pad 10 and the second standard solder pad 30 are soldered. When the solder paste or components on the first standard solder pad 10 and the second standard solder pad 30 need to be electrically disconnected, the compatible solder pad is not processed. Compared with the method of requiring additional soldering wires in the related art, the difficulty of operating the solder paste or components on the solder pads to achieve electrical connection and electrical disconnection is greatly reduced, thereby improving the convenience of operating the solder paste or components on the solder pads to achieve electrical connection and electrical disconnection. In addition, the circumscribed outline of the four triangular sub-pads 23 is a rectangle, which maintains a certain distance from the first standard pad 10 and the second standard pad 30, thereby avoiding the occurrence of tombstone or suspension bridge phenomena, thereby effectively reducing defective products and improving the production efficiency and production quality of the circuit board.

[0042] In one embodiment, the circuit board further includes a conductive layer, on which the first standard pad, the second standard pad, and the compatible pad are disposed.

[0043] In one embodiment, the circuit board further comprises a conductive layer, wherein the first standard pad, the second standard pad, and the compatible pad are arranged on the conductive layer, and the conductive layer is a copper layer.

[0044] By providing a compatible pad between the first and second standard pads on the circuit board and connecting printed conductors via the compatible pad, circuit board space is saved, wiring is facilitated, and circuit board layout flexibility is increased. Furthermore, electrical connection can be achieved by soldering via the compatible pad, saving materials such as wires and reducing costs.

[0045] The embodiment of the present application further provides a display panel, comprising: a display substrate and the aforementioned circuit board. The display substrate is electrically connected to the circuit board and is used to display images.

[0046] An embodiment of the present application further provides a smart tablet comprising the aforementioned display panel and a processor.

[0047] An embodiment of the present application further provides a smart tablet comprising the aforementioned circuit board.

[0048] The beneficial effects of the display panel and smart tablet provided above can refer to the beneficial effects of the circuit board.

[0049] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0050] In this utility model, unless otherwise expressly specified or limited, terms such as "disposed," "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; they may refer to mechanical connection, direct connection, or indirect connection through an intermediate medium; they may refer to internal communication between two elements or interaction between two elements. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0052] It should be noted that, in the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0053] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A circuit board, characterized in that: include: A first standard pad, a second standard pad, and a compatible pad; The compatible pad is arranged between the first standard pad and the second standard pad, and is used to form an equivalent resistance of zero ohm resistance through solder paste, so that the solder paste on the first standard pad and the solder paste on the second standard pad are short-circuited.

2. The circuit board according to claim 1, wherein: The distance between the compatible pad and the first standard pad and the second standard pad is 0.18 mm to 0.22 mm.

3. The circuit board according to claim 1 or 2, characterized in that: The shape of the compatible pad is rectangular; The compatible pad is arranged in parallel with the first standard pad and the second standard pad, and they do not overlap with each other.

4. The circuit board according to claim 1 or 2, characterized in that: The shape of the compatible pad is a superposition of a first isosceles triangle and a second isosceles triangle; The base of the first isosceles triangle is parallel to the first side of the first standard pad, and the first side is the side facing the second standard pad; The base of the second isosceles triangle is parallel to the second side of the second standard pad, and the second side is the side facing the first standard pad; The vertex angle of the first isosceles triangle and the vertex angle of the second isosceles triangle are between the base of the first isosceles triangle and the base of the second isosceles triangle.

5. The circuit board according to claim 1 or 2, characterized in that: The compatible pad includes four triangular sub-pads, the circumscribed outlines of the four triangular sub-pads are rectangular, and the four triangular sub-pads maintain a spacing along the diagonal line of the rectangle.

6. The circuit board according to claim 1 or 2, characterized in that: The circuit board comprises: a conductive layer; The first standard pad, the second standard pad, and the compatible pad are disposed on the conductive layer.

7. The circuit board according to claim 6, wherein: The conductive layer is a copper layer.

8. A display panel, characterized in that: include: A display substrate and a circuit board according to any one of claims 1 to 7; The display substrate is electrically connected to the circuit board, and the display substrate is used to display images.

9. A smart tablet, characterized in that: include: The display panel and processor according to claim 8.

10. A smart tablet, characterized in that: A circuit board comprising any one of claims 1-7.

Images