Glue overflow prevention structure of printed circuit board

Abstract

The utility model relates to a printed circuit board glue overflow prevention structure, which comprises a circuit board body, the circuit board body comprises at least one bonding pad to be dispensed, the bonding pad is connected with at least one copper wire, and the copper wire extends outwards from the bonding pad and then is bent reversely. The extension path of the copper wire passes through one side of the bonding pad to form a first excessive glue cut-off line, and a dispensing area is formed between the first excessive glue cut-off line and the bonding pad. The glue dispensing device is simple in structure, the flowing range of glue can be controlled without increasing procedures, and the glue dispensing efficiency and quality are effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of printed circuit boards, in particular to a glue overflow prevention structure for printed circuit boards. Background Art

[0002] With the promotion of 5G technology, fast charging of mobile phones has also become a mainstream trend. Fast charging means a larger current, and the larger the current, the higher the accuracy requirement for temperature monitoring. Currently, there are fast charging solutions on the market that mount thermistors on circuit boards to monitor temperature. After mounting, the thermistors need to be fixed and protected by dispensing glue. Since the glue is fluid, the flow range of the glue needs to be controlled to avoid glue overflow and affect the circuit board structure and subsequent assembly.

[0003] In the prior art, there are generally two ways to control the glue range. One is to reduce the amount of glue, which can easily cause incomplete component wrapping, resulting in exposed pins or body of the component, and cannot effectively protect the component; the other is to replace the component package with a smaller one. However, when replacing the thermal component with a small package, the anti-static ability of the component itself is weakened, which cannot meet the performance requirements of the circuit board. Utility Model Content

[0004] The purpose of the utility model is to provide a printed circuit board anti-overflow glue structure, which has a simple structure and can control the flow range of glue without adding any steps, thereby effectively improving the efficiency and quality of glue dispensing.

[0005] A printed circuit board anti-glue overflow structure includes a circuit board body, the circuit board body includes at least one soldering pad to be glued, the soldering pad is connected to at least one copper wire, the copper wire extends outward from the soldering pad and then bends in the opposite direction, the extension path of the copper wire passes through one side of the soldering pad to form a first glue overflow cut-off line, and a glue dispensing area is formed between the first glue overflow cut-off line and the soldering pad.

[0006] In the above technical solution, the copper wire's path on the circuit board is adjusted so that the copper wire connecting the pad to be glued bends and passes along one side of the pad, thereby forming a first glue overflow cutoff line. Due to the copper wire's thickness, the surface of the circuit board where it is located protrudes above the surface of the glue dispensing area, effectively blocking the glue flow and confining the glue to the glue dispensing area, achieving precise control of the glue dispensing range. The copper wire is an integral part of the circuit board design. This solution only requires adjusting the copper wire's path to achieve the effect of controlling the glue dispensing area, without the need for additional processes or equipment investment, effectively saving manpower and costs.

[0007] Furthermore, a second glue overflow cutoff line is provided on a side of the first glue overflow cutoff line away from the solder pad, and the second glue overflow cutoff line is parallel to the first glue overflow cutoff line.

[0008] In the above technical solution, by setting the second glue overflow cut-off line, a double barrier can be formed in conjunction with the first glue overflow cut-off line, thereby further ensuring the accuracy of the glue dispensing range and preventing glue overflow.

[0009] Furthermore, the second glue overflow cut-off line is a copper line or an ink line.

[0010] In the above technical solution, setting copper wire and ink on the circuit board is one of the necessary processes for circuit board processing. Therefore, the second glue overflow cut-off line is preferably a copper wire or an ink line, which can avoid adding steps and achieve the purpose of limiting the dispensing range.

[0011] Furthermore, a reference line is provided on a side of the second glue overflow cut-off line away from the solder pad.

[0012] In the above technical solution, the reference line can provide an intuitive reference for judging whether the glue has overflowed, making it convenient to check whether the glue dispensing is poor.

[0013] Furthermore, the reference line is a copper line or an ink line.

[0014] In the above technical solution, setting copper wire and ink on the circuit board is one of the necessary processes for circuit board processing. Therefore, the reference line is preferably a copper wire or an ink line, which can avoid adding steps and achieve the purpose of limiting the dispensing range.

[0015] Furthermore, the height of the circuit board body corresponding to the position of the copper wire is greater than the height of the glue dispensing area.

[0016] In the above technical solution, since the copper wire has thickness, after the circuit board body is processed and formed, the height of the position corresponding to the copper wire is higher than the surface of the circuit board body, that is, higher than the height of the glue spotting area, so that a raised wall can be formed on the surface of the circuit board to block the glue.

[0017] Furthermore, there are two copper wires, and the two copper wires are respectively connected to two ends of the pad, and the extension paths of the two copper wires after being bent are respectively located on both sides of the pad.

[0018] In the above technical solution, the two copper wires connecting the pads are bent and extended to both sides of the pads to form a roughly annular glue dispensing area, so that both sides of the pads can form a barrier to the glue, further limiting the flow range of the glue.

[0019] Furthermore, an extension direction of the first glue overflow cut-off line is parallel to a length direction of the pad.

[0020] In the above technical solution, the extension direction of the first glue overflow cut-off line is parallel to the length direction of the pad, which can effectively block the glue and prevent glue from overflowing.

[0021] Compared with the prior art, the present invention has the following beneficial effects: by adjusting the copper wire path on the circuit board, the copper wire connecting the pad to be glued is bent and passes through one side of the pad, thereby forming a first glue overflow cutoff line. Due to the thickness of the copper wire, the surface of the circuit board where it is located protrudes above the surface of the glue dispensing area, forming a barrier to the glue, effectively blocking the flow of glue and confining the glue to the glue dispensing area, thus achieving accurate control of the glue dispensing range. The copper wire is an integral part of the circuit board design. This solution only requires adjusting the copper wire path to achieve the effect of controlling the glue dispensing area, without the need for additional processes and equipment investment, effectively saving manpower and costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a structural schematic diagram of the printed circuit board anti-glue overflow structure of the utility model.

[0023] Figure 2 This is a structural schematic diagram of a second embodiment of the printed circuit board glue overflow prevention structure of the present invention.

[0024] Description of Figure Numbers:

[0025] Circuit board body 1, solder pad 2, copper wire 3, first glue overflow cut-off line 4, glue dispensing area 5, second glue overflow cut-off line 6, reference line 7. DETAILED DESCRIPTION

[0026] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0027] Please refer to Figure 1 In the first embodiment of the present utility model, the printed circuit board anti-glue overflow structure mainly includes a circuit board body 1, the circuit board body 1 includes at least one solder pad 2 to be glued, the solder pad 2 is connected to at least one copper wire 3, the copper wire 3 extends outward from the solder pad 2 and then bends in the opposite direction, the extension path of the copper wire 3 passes through one side of the solder pad 2 to form a first glue overflow cut-off line 4, and a glue dispensing area 5 is formed between the first glue overflow cut-off line 4 and the solder pad 2.

[0028] Exemplarily, the circuit board body 1 can be an existing rigid circuit board or a flexible circuit board. The soldering pad 2 is exposed on the surface of the circuit board body 1 and is used for soldering thermal sensors or other electronic components that require glue protection. The copper wire 3 is part of the internal wiring of the circuit board body 1 and is used to connect and conduct the components soldered on the soldering pad 2. One end of the copper wire 3 is connected to the soldering pad 2, and the other end extends from the soldering pad 2 and bends in the opposite direction. The bent copper wire 3 extends along one side of the soldering pad 2, thereby forming a first glue overflow cutoff line 4. The area between the first glue overflow cutoff line 4 and the soldering pad 2 is the glue dispensing area 5. As a preferred embodiment, the extension direction of the first glue overflow cutoff line 4 is parallel to the length direction of the soldering pad 2, thereby effectively forming a barrier to the glue and preventing glue overflow.

[0029] As can be seen from the above technical solution, by adjusting the path of copper wire 3 on the circuit board, the path of copper wire 3 connecting to the solder pad 2 to be glued is bent and passes through one side of the solder pad 2, thereby forming a first glue overflow cutoff line 4. Due to its own thickness, the surface of the circuit board where copper wire 3 is located protrudes from the surface of the glue dispensing area 5, which can form a barrier to the glue, effectively blocking the flow of glue and confining the glue to the glue dispensing area 5, thereby achieving accurate control of the glue dispensing range. Copper wire 3 is part of the circuit board design. This solution only needs to adjust the path of copper wire 3 to achieve the effect of controlling the glue dispensing area 5, without adding additional processes and equipment investment, effectively saving manpower and costs.

[0030] In this embodiment, a second glue overflow cutoff line 6 is provided on the side of the first glue overflow cutoff line 4 away from the solder pad 2, and the second glue overflow cutoff line 6 is parallel to the first glue overflow cutoff line 4. By providing the second glue overflow cutoff line 6, a double barrier can be formed in conjunction with the first glue overflow cutoff line 4, further ensuring the accuracy of the glue dispensing range and preventing glue overflow.

[0031] The second glue overflow cutoff line 6 is a copper wire 3 or an ink line. Providing copper wire 3 and ink on the circuit board is one of the necessary processes for circuit board processing. Therefore, the second glue overflow cutoff line 6 is preferably a copper wire 3 or an ink line, which can avoid adding additional processes and achieve the purpose of limiting the glue dispensing range.

[0032] In this embodiment, a reference line 7 is provided on the side of the second glue overflow cut-off line 6 away from the pad 2. Specifically, the reference line 7 can be set to be parallel to the second glue overflow cut-off line 6. By setting the reference line 7, an intuitive reference can be provided for judging whether glue overflows, which facilitates the inspection of whether the glue dispensing is poor.

[0033] The reference line 7 is a copper line 3 or an ink line. Similar to the second glue overflow cut-off line 6, the reference line 7 is preferably a copper line 3 or an ink line, which can avoid adding steps and achieve the purpose of limiting the glue dispensing range.

[0034] In this embodiment, the height of the position corresponding to the copper wire 3 of the circuit board body 1 is greater than the height of the glue dispensing area 5. It is understandable that, due to the thickness of the copper wire 3, after the circuit board body 1 is processed and formed, the height of the position corresponding to the copper wire 3 is higher than the surface of the circuit board body 1, that is, higher than the height of the glue dispensing area 5, thereby forming a raised wall on the surface of the circuit board, thereby blocking the glue.

[0035] Please refer to Figure 2 , Figure 2 This is the second embodiment of the present invention. This embodiment differs from the first embodiment in that two copper wires 3 are provided, each connected to one end of the pad 2. The bent copper wires 3 extend to either side of the pad 2. By bending the two copper wires 3 connected to the pad 2 and extending them to either side of the pad 2, a generally annular glue dispensing area 5 is formed. This creates a barrier to the glue on both sides of the pad 2, further limiting the glue's flow.

[0036] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A printed circuit board anti-glue overflow structure, comprising a circuit board body, the circuit board body comprising at least one pad to be dispensed with glue, the pad being connected to at least one copper wire, characterized in that: The copper wire extends outward from the pad and then bends in the opposite direction. The extension path of the copper wire passes through one side of the pad to form a first glue overflow cutoff line. A glue dispensing area is formed between the first glue overflow cutoff line and the pad.

2. The printed circuit board anti-glue overflow structure according to claim 1, characterized in that: A second glue overflow cutoff line is provided on a side of the first glue overflow cutoff line away from the solder pad, and the second glue overflow cutoff line is parallel to the first glue overflow cutoff line.

3. The printed circuit board anti-glue overflow structure according to claim 2, characterized in that: The second glue overflow cut-off line is a copper line or an ink line.

4. The printed circuit board anti-glue overflow structure according to claim 2, characterized in that: A reference line is provided on a side of the second glue overflow cut-off line away from the solder pad.

5. The printed circuit board anti-glue overflow structure according to claim 4, characterized in that: The reference line is a copper line or an ink line.

6. The printed circuit board anti-glue overflow structure according to claim 1, characterized in that: The height of the circuit board body corresponding to the copper wire is greater than the height of the glue dispensing area.

7. The printed circuit board anti-glue overflow structure according to claim 1, characterized in that: There are two copper wires, and the two copper wires are respectively connected to two ends of the pad. The extension paths of the two copper wires after being bent are respectively located on two sides of the pad.

8. The printed circuit board anti-glue overflow structure according to claim 1, characterized in that: An extension direction of the first glue overflow cut-off line is parallel to a length direction of the pad.

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