Intelligent water affair terminal
The sealed design and the combined cooling system of water-cooling plates and semiconductor refrigeration sheets solve the problem of easy damage of smart water terminals in humid environments, and achieve stable cooling and data transmission.
Patent Information
- Application Number
- CN202421980252.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-08-15
AI Technical Summary
Smart water terminals are easily damaged in humid or high-temperature environments, resulting in unstable data transmission and affecting monitoring effects.
The box body and cover body structure adopt a sealed design, with a water-cooling plate and semiconductor refrigeration chip inside. Active cooling and heat dissipation are achieved through the combined cooling system of the water-cooling plate and semiconductor refrigeration chip.
Effective cooling in humid environments ensures stable operation of smart water terminals and improves data transmission reliability and monitoring effects.
Smart Images

Figure CN223402718U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of intelligent building management, in particular to an intelligent water terminal. Background Art
[0002] The patent application number CN201821544412.1 discloses an intelligent water terminal, which includes a processor, a computer-readable storage medium, a sensor component, and an interactive module, wherein the sensor component and the interactive module are respectively connected to the processor by signal, the computer-readable storage medium is used to store water function applications and hardware drivers, the processor executes the hardware driver to start the sensor component, the sensor component transmits the detection signal to the processor, the processor processes and analyzes the detection signal according to the executed water function application, generates corresponding detection information and displays it to the user through the interactive module, and the user can also input operation instructions to the processor through the interactive module. The utility model adopts a modular design, providing users and developers with a universal and customizable water terminal development platform, which facilitates developers to carry out customized development, meets the personalized needs of customers, and reduces development costs.
[0003] Patent application number CN202021047751.6 discloses a multi-sensor fusion smart water terminal, which includes an evaluation module and a water sensor connected thereto; the water sensor is located at the pipeline that the water terminal is responsible for monitoring; the evaluation module transmits pipeline operating data detected by the water sensor to the management agency; the evaluation module also evaluates the pipeline operating data, and when the evaluation result data contains pipeline fault characteristics, the evaluation module sends an alarm message to the management agency; this utility model solves the problem in the prior art that water supply network management cannot obtain multiple parameters at the same time, and can only judge the pipeline condition by a single parameter, with a high probability of error. In addition, in an emergency, the alarm can be immediately notified to the user, achieving the effect of real-time monitoring of the pipeline.
[0004] However, in the field of building intelligent management technology, water meters are mostly installed in basements or outdoors. Humid or high-temperature environments have a strong damaging effect on smart water terminals, making it difficult to transmit data back and causing monitoring problems.
[0005] Therefore, it is necessary to provide a new technical solution to overcome the above-mentioned defects. Utility Model Content
[0006] The purpose of the utility model is to provide an intelligent water terminal that can effectively solve the above technical problems.
[0007] In order to achieve the purpose of this utility model, the following technical solutions are adopted:
[0008] An intelligent water terminal, comprising:
[0009] A box body and a cover body, wherein the box body and the cover body are connected by a seal; a connection port is opened on the box body; a water cooling plate is provided inside the box body, and a water inlet pipe and a water outlet pipe are connected to the water cooling plate, and the water inlet pipe and the water outlet pipe extend out of the box body.
[0010] Furthermore: the water cooling plate has a first water cooling zone and a second water cooling zone, the second water cooling zone is in contact with the heating surface of the semiconductor refrigeration plate, and the cooling surface of the semiconductor refrigeration plate is connected to the heat conduction plate.
[0011] Furthermore: the heat conducting plate has a connection area and a heat conducting area, and the cooling surface of the semiconductor refrigeration plate contacts the connection area.
[0012] Furthermore: the water-cooling plate forms a first cooling zone, and the water-cooling plate cooperates with the heat conducting plate to form a second cooling zone.
[0013] Compared with the existing technology, the present invention has the following beneficial effects: The present intelligent water terminal, through its sealed design, can be used in humid environments, and the water-cooled plate provides excellent cooling. The first cooling zone dissipates heat through the water-cooled plate, achieving good heat dissipation. The second cooling zone, on the other hand, actively cools and refrigerates the semiconductor refrigeration plate, further improving heat dissipation. The water-cooled plate directly cools the semiconductor refrigeration plate, while the water-cooled plate cools the semiconductor refrigeration plate, ensuring continuous cooling. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention.
[0015] Figure 1 This is a schematic diagram of the intelligent water terminal of the utility model.
[0016] Figure 2 This is another state diagram of the intelligent water terminal of the utility model.
[0017] Figure 3 This is a partial structural diagram of the intelligent water terminal of the utility model.
[0018] In the figure: 1. cover; 2. box body; 31. first water cooling zone; 32. second water cooling zone; 41. connection zone; 42. heat transfer zone; 5. water inlet pipe; 6. water outlet pipe; 7. bracket; 8. protective cover; 9. cover plate. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the embodiments described are some embodiments of the present invention, not all embodiments.
[0020] In the description of the present invention, it should be understood that the terms "center", "transverse", "longitudinal", "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present invention. When a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a centered component. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centered component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centered component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0021] like Figures 1 to 3 As shown, the intelligent water terminal of the utility model includes: a cover body 1 and a box body 2, the box body 2 and the cover body 1 are connected by a seal, which is preferably a rubber ring, which plays a role of detachable sealing; a connection port is opened on the box body 2, and the connection port adopts a waterproof design; a water cooling plate is provided inside the box body 2, and a water inlet pipe 5 and a water outlet pipe 6 are connected to the water cooling plate, and the water inlet pipe 5 and the water outlet pipe 6 extend out of the box body 2.
[0022] The cooling water enters the water-cooled plate through the water inlet pipe 5 and flows out through the water outlet pipe 6. The application scenario of the present invention is a building, and generally grey water is used for water circulation. That is, the sealed design enables the present invention to be used in a humid environment, and the water-cooled plate has a good cooling effect.
[0023] The water cooling plate has a first water cooling zone 31 and a second water cooling zone 32. The second water cooling zone 32 contacts the heating surface of the semiconductor refrigeration plate. The water cooling plate forms a first cooling zone. The water cooling plate cooperates with the heat conducting plate to form a second cooling zone.
[0024] The first water cooling zone 31 and the second water cooling zone 32 are in a vertical relationship, which is convenient for the installation of the semiconductor refrigeration plate. The first cooling zone is most of the surface of the water cooling plate, and the second cooling zone is the area between the water cooling plate and the heat conduction plate. The first cooling zone dissipates heat through the water cooling plate, and the heat dissipation effect is better. The second cooling zone is actively cooled by the semiconductor refrigeration plate on the basis of the heat dissipation of the water cooling plate, and the heat dissipation effect is good.
[0025] On the one hand, the water-cooling plate performs direct cooling, and on the other hand, the water-cooling plate cools the semiconductor refrigeration piece, so that the semiconductor refrigeration piece can continue to cool.
[0026] The cooling surface of the semiconductor refrigeration plate is connected to a heat conduction plate. The heat conduction plate has a connection area 41 and a heat conduction area 42. The cooling surface of the semiconductor refrigeration plate contacts the connection area 41. The connection area 41 and the heat conduction area 42 are arranged perpendicularly. The heat conduction plate is made of aluminum and its alloys, which makes it have good thermal conductivity.
[0027] It should be noted here that the height of the heat transfer zone 42 is an important data. If it is too high, the heat exchange area will be larger, resulting in poor cooling effect, and even no cooling at the top; while a lower height will waste energy and resources. The height selection is related to the total power of the semiconductor refrigeration plate.
[0028] The box body 2 is fixedly connected to a hanger 7 for convenient placement of the application. The side of the box body 2 is detachably connected to a protective cover 8 to shield and protect the water inlet pipe 5 and the water outlet pipe 6 to prevent damage during transportation. The connection port is detachably connected to a cover plate 9 for protection.
[0029] Working principle:
[0030] The sealed design allows for use in humid environments, with the water-cooled plate providing excellent cooling. The first cooling zone dissipates heat via the water-cooled plate, achieving excellent heat dissipation. The second cooling zone also utilizes semiconductor refrigeration chips for active cooling, building upon the heat dissipation provided by the water-cooled plate. The water-cooled plate provides direct cooling while also cooling the semiconductor refrigeration chips, ensuring continuous cooling.
[0031] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology. It will not be described in detail here. The content not described in detail in this specification belongs to the existing technology known to professional and technical personnel in this field.
[0032] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.
Claims
1. An intelligent water terminal, characterized by: include: A box body and a cover body, wherein the box body and the cover body are connected by a seal; a connection port is opened on the box body; a water cooling plate is provided inside the box body, and a water inlet pipe and a water outlet pipe are connected to the water cooling plate, and the water inlet pipe and the water outlet pipe extend out of the box body.
2. The intelligent water terminal according to claim 1, wherein: The water cooling plate has a first water cooling area and a second water cooling area. The second water cooling area contacts the heating surface of the semiconductor refrigeration plate. The cooling surface of the semiconductor refrigeration plate is connected to the heat conducting plate.
3. The intelligent water terminal according to claim 2, wherein: The heat conducting plate has a connecting area and a heat conducting area, and the cooling surface of the semiconductor refrigeration plate contacts the connecting area.
4. The intelligent water terminal according to claim 2, wherein: The water-cooling plate forms a first cooling zone, and the water-cooling plate cooperates with the heat-conducting plate to form a second cooling zone.
Citation Information
Patent Citations
Intelligent water affair terminal
CN209230664U
Multi-sensor fusion intelligent water affair terminal
CN212644273U