Cooling fin for power supply mainboard

Abstract

The utility model discloses a cooling fin for a power supply mainboard. The cooling fin aims at solving the technical problems that in the prior art, cooling fins cannot be flexibly installed, and dust on the cooling fins is inconvenient to clean. Comprising a heat dissipation plate, mounting grooves are formed in the middle of the top end of the heat dissipation plate and the left side of the bottom end of the heat dissipation plate, heat dissipation fins are fixedly mounted in the four mounting grooves through screws, a cleaning mechanism is arranged at the top of each heat dissipation fin, and each cleaning mechanism comprises a U-shaped frame; according to the utility model, the mounting grooves are formed in the bottom plate, so that the radiating fins can be flexibly mounted and dismounted through screws, and the damaged radiating fins can be conveniently replaced; and meanwhile, the cleaning mechanism is installed at the tops of the heat dissipation fins, the heat dissipation effect of the heat dissipation fins is improved, a flow guide channel can be formed by the cleaning plate and the heat dissipation fins when the cleaning plate is in the horizontal state, the air flowing speed is increased, and therefore the heat dissipation effect of the heat dissipation fins is improved, and dust accumulation is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat sinks, and in particular relates to a heat sink for a power supply mainboard. Background Art

[0002] A heat sink is a device used to dissipate heat from heat-generating electronic components in electrical appliances. It is mostly made of aluminum alloy, brass, or bronze in the form of plates, sheets, or multiple sheets. When a power supply is working, the internal motherboard generates heat. Existing methods for dissipating heat from the power supply motherboard generally use a heat sink plus a fan outside the power supply housing to dissipate heat and cool the motherboard. However, the heat sink fins of existing power supply heat sinks are mostly integrated. When the heat sink fins are damaged, they need to be replaced as a whole, which causes waste. At the same time, dust will inevitably accumulate between the heat sink fins after long-term use, which is difficult to clean, resulting in a deterioration in the overall heat dissipation effect of the heat sink, thereby affecting the overall operation of the power supply. Therefore, a heat sink for a power supply motherboard is designed to overcome the above technical defects. Utility Model Content

[0003] (1) Technical problems to be solved

[0004] In view of the deficiencies of the prior art, the purpose of the present invention is to provide a heat sink for a power supply motherboard, which is intended to solve the technical problems in the prior art that the heat sink cannot be flexibly installed and the dust on the heat sink is difficult to clean.

[0005] (2) Technical solution

[0006] In order to solve the above technical problems, the utility model provides a heat sink for a power supply motherboard, including a heat sink, wherein mounting grooves are provided in the middle of the top and the left side of the bottom of the heat sink, and heat fins are fixedly installed inside the four mounting grooves by screws. A cleaning mechanism is provided on the top of each heat sink, and each cleaning mechanism includes a U-shaped frame, which is sleeved on the outer side of the top of the corresponding heat sink, and the cleaning plate is movably connected inside the U-shaped frame.

[0007] Preferably, two fixing bars are fixedly connected to the middle of one end of each heat dissipation fin on both sides away from the heat dissipation plate, and a space is left between the ends of the two fixing bars that are close to each other.

[0008] Furthermore, the size of each U-shaped frame is larger than the size of the corresponding heat sink fins, the bottoms of both ends of the U-shaped frame are in contact with the tops of the corresponding fixing bars, and limiting mechanisms are provided in the middle of the left and right sides of the U-shaped frame.

[0009] Furthermore, a plurality of avoidance holes are provided in the middle of the rear end of the U-shaped frame, and the inner walls of the avoidance holes are slidably connected to the side walls of the fins of the heat dissipation fins. Round rods are fixedly connected to the middle of the left and right sides of the cleaning plate and the positions corresponding to the inner walls of the avoidance holes. Slide grooves are provided in the middle of the left and right inner walls of the U-shaped frame, and the round rods are slidably connected to the inside of the slide grooves.

[0010] Furthermore, a plurality of arc-shaped grooves connected to the corresponding avoidance holes are provided on the lower surface of the front end of the cleaning plate, and the arc-shaped grooves are adapted to the top ends of the fins of the heat dissipation fins.

[0011] Furthermore, a limiting groove is opened at the front end of the lower surface of the cleaning plate, and the bottom end of the inner wall of the front end of the U-shaped frame is fixedly connected with a limiting strip adapted to the limiting groove, and the top of the limiting strip and the inner top wall of the limiting groove are fixedly connected with magnet strips that attract each other.

[0012] Furthermore, both limiting mechanisms include a support plate, which is fixedly connected to the lower surface of the side wall of the U-shaped frame. A screw rod is threaded through the middle of the support plate, one end of the screw rod is fixedly connected to a dial wheel, and the other end of the screw rod is rotatably connected to the limiting plate through a rotating shaft. The limiting plate is in contact with the heat dissipation fins, and the support plate is slidably connected to the space between the two fixed bars.

[0013] (3) Beneficial effects

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] The utility model discloses providing mounting grooves on the bottom plate so that the fins can be flexibly installed and disassembled by screws, thereby facilitating replacement of damaged fins; at the same time, a cleaning mechanism is installed on the top of the heat sink fins, and the cleaning plate is pushed and pulled when the cleaning plate is in a vertical state, so that the inner wall of the avoidance hole can scrape off the dust on the fins, which not only improves the heat dissipation effect of the heat sink fins, but also forms a guide channel between the cleaning plate and the heat sink fins when the cleaning plate is in a horizontal state, thereby increasing the flow rate of air therein, thereby improving the heat dissipation effect of the heat sink fins and reducing dust accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the main structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of one of the cleaning mechanisms of the present invention;

[0020] Figure 5 This is a schematic diagram of the explosion structure of one of the cleaning mechanisms of the present invention;

[0021] Figure 6 This is a schematic diagram of the three-dimensional structure of one of the cleaning plates of the present invention.

[0022] The marks in the attached figure are: 1. heat sink; 2. mounting groove; 3. heat sink fin; 4. cleaning mechanism; 5. fixing bar; 6. U-shaped frame; 7. support plate; 8. dial wheel; 9. limit plate; 10. cleaning plate; 11. avoidance hole; 12. arc-shaped groove; 13. round rod; 14. limit groove; 15. limit bar. DETAILED DESCRIPTION

[0023] This specific embodiment is a heat sink for a power supply motherboard, and its structural diagram is as follows Figures 1-6 The fins 3 are connected to the chassis 12 and the chassis 13 has two fins 12 on one side and two fins 13 on the other side so that the fins 3 can be connected to the chassis 13 by screws 2. The fins 3 are connected to the chassis 12 and the chassis 13 has two fins 12 on the other side so that the fins 3 can be connected to the chassis 13 by screws 2.

[0024] Among them, two fixing bars 5 are fixedly connected to both sides of each heat dissipating fin 3 and in the middle of one end away from the heat dissipating plate 1, and a space is left between the ends of the two fixing bars 5 that are close to each other; by setting the fixing bars 5, the U-shaped frame 6 can be supported and positioned, which facilitates the installation of the U-shaped frame 6.

[0025] In addition, the size of each U-shaped frame 6 is larger than the size of the corresponding heat dissipation fin 3, the bottom of both ends of the U-shaped frame 6 contacts the top of the corresponding fixing bar 5, and a limiting mechanism is provided in the middle of the left and right sides of the U-shaped frame 6; by putting the U-shaped frame 6 on the top of the corresponding heat dissipation fin 3, the bottom of the U-shaped frame 6 contacts the top of the fixing bar 5, and the U-shaped frame 6 is locked and limited by the limiting mechanism.

[0026] In addition, a plurality of avoidance holes 11 are provided in the middle of the rear end of the U-shaped frame 6, and the inner walls of the avoidance holes 11 are slidably connected to the side walls of the fins of the heat dissipation fins 3. Round rods 13 are fixedly connected to the middle of the left and right sides of the cleaning plate 10 and the positions corresponding to the inner walls of the avoidance holes 11. Slide grooves are provided in the middle of the left and right inner walls of the U-shaped frame 6, and the round rods 13 are slidably connected to the inside of the slide grooves; the round rods 13 slide and rotate in the slide grooves, so that the cleaning plate 10 can be flipped, so that the avoidance holes 11 on the cleaning plate 10 can contact and slide with the corresponding fins of the heat dissipation fins 3, and the round rods 13 are moved back and forth in the slide grooves by holding the front end of the cleaning plate 10 for reciprocating pushing and pulling, so that the round rods 13 move back and forth in the slide grooves, thereby making the avoidance holes 11 slide with the corresponding fins, and the inner walls of the avoidance holes 11 can clean the side walls of the fins, so that the dust accumulated on the fins is scraped off.

[0027] In addition, a plurality of arc-shaped grooves 12 connected to the corresponding avoidance holes 11 are provided on the lower surface of the front end of the cleaning plate 10, and the arc-shaped grooves 12 are adapted to the top ends of the fins of the heat dissipation fins 3; by setting the arc-shaped grooves 12, when the cleaning plate 10 is not in use, the cleaning plate 10 can be flipped in the horizontal direction so that the arc-shaped grooves 12 can cover the top ends of the fins, thereby making the cleaning plate 10 in a horizontal state, so that a channel for air circulation is formed between the cleaning plate 10 and the heat dissipation fins 3, thereby enhancing the air flow rate and improving the heat dissipation efficiency.

[0028] In addition, a limiting groove 14 is provided at the front end of the lower surface of the cleaning plate 10, and a limiting bar 15 that is adapted to the limiting groove 14 is fixedly connected to the bottom end of the inner wall of the front end of the U-shaped frame 6, and the top of the limiting bar 15 and the inner top wall of the limiting groove 14 are fixedly connected with mutually attracted magnet strips; when the cleaning plate 10 is on a horizontal turntable, the limiting groove 14 and the limiting bar 15 contact each other and are attracted by the magnet strip, so that the cleaning plate 10 is always in a horizontal state.

[0029] In addition, the two limiting mechanisms both include a support plate 7, which is fixedly connected to the lower surface of the side wall of the U-shaped frame 6. A screw rod is threaded through the middle of the support plate 7, one end of the screw rod is fixedly connected to a dial wheel 8, and the other end of the screw rod is rotatably connected to the limiting plate 9 through a rotating shaft. The limiting plate 9 contacts the heat dissipation fins 3, and the support plate 7 is slidably connected to the space between the two fixed bars 5; by aligning the support plate 7 with the space between the two fixed bars 5 and pressing down the U-shaped frame 6, the support plate 7 can enter the space, and by rotating the dial wheel 8 forward, the dial wheel 8 drives the screw rod to rotate, causing the screw rod to move inward, and the screw rod drives the dial wheel 8 and the limiting plate 9 to move inward until the limiting plate 9 abuts against the outermost fin, thereby limiting the position of the U-shaped frame 6.

[0030] Working principle: When in use, the heat sink fins 3 are installed into the corresponding mounting grooves 2 by screws, so that the heat sink fins 3 can be replaced when damaged. At the same time, when the heat sink fins 3 are replaced and installed, thermal grease can be applied to the lower surface of the heat sink fins 3 and the inner wall of the mounting groove 2 to enhance the thermal conductivity.

[0031] Then align the support plate 7 with the space between the two fixing bars 5 and press down the U-shaped frame 6, so that the U-shaped frame 6 slides and cooperates with the two outermost fins, and the support plate 7 can enter the space. By rotating the dial wheel 8 forward, the dial wheel 8 drives the screw rod to rotate, so that the screw rod moves inward, and the screw rod drives the dial wheel 8 and the limit plate 9 to move inward until the limit plate 9 abuts against the outermost fins, thereby limiting the position of the U-shaped frame 6; then flip the cleaning plate 10, and slide and rotate the round rod 13 in the slide groove so that the cleaning plate 10 can be flipped, so that the rear end of the cleaning plate 10 rotates downward to a vertical state. The avoidance holes 11 on the cleaning plate 10 can contact and slide with the corresponding fins of the heat dissipation fins 3. By holding the front end of the cleaning plate 10 and pushing and pulling it back and forth, the round rod 13 moves back and forth in the slide groove, so that the avoidance holes 11 and the corresponding fins slide. The inner wall of the avoidance hole 11 can clean the side walls of the fins, so that the dust accumulated on the fins is scraped off; then the cleaning plate 10 is reset to a horizontal state. At this time, the arc-shaped groove 12 covers the top of the corresponding fin, and the limit groove 14 on the cleaning plate 10 contacts the limit bar 15. The two are attracted by the magnet bar to keep the cleaning plate 10 in a horizontal state.

[0032] All technical features in this embodiment can be freely combined according to actual needs.

[0033] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A heat sink for a power supply motherboard, characterized in that: The invention comprises a heat dissipation plate (1), wherein a mounting groove (2) is provided at the middle of the top end and the left side of the bottom end of the heat dissipation plate (1), and heat dissipation fins (3) are fixedly installed inside the four mounting grooves (2) by screws, and a cleaning mechanism (4) is provided at the top of each heat dissipation fin (3), and each cleaning mechanism (4) comprises a U-shaped frame (6), wherein the U-shaped frame (6) is sleeved on the outer side of the top end of the corresponding heat dissipation fin (3), and a cleaning plate (10) is movably connected inside the U-shaped frame (6).

2. The heat sink for a power supply motherboard according to claim 1, characterized in that: Two fixing bars (5) are fixedly connected to the middle of one end of each heat dissipation fin (3) and on both sides away from the heat dissipation plate (1), and a space is left between the ends of the two fixing bars (5) that are close to each other.

3. The heat sink for a power supply motherboard according to claim 1, characterized in that: The size of each U-shaped frame (6) is larger than the size of the corresponding heat dissipation fin (3), the bottoms of both ends of the U-shaped frame (6) are in contact with the tops of the corresponding fixing bars (5), and limiting mechanisms are provided in the middle of the left and right sides of the U-shaped frame (6).

4. The heat sink for a power supply motherboard according to claim 1, characterized in that: A plurality of avoidance holes (11) are provided in the middle of the rear end of the U-shaped frame (6), and the inner walls of the avoidance holes (11) are slidably connected to the side walls of the fins of the heat dissipation fins (3). Round rods (13) are fixedly connected to the middle of the left and right sides of the cleaning plate (10) and at positions corresponding to the inner walls of the avoidance holes (11). Slide grooves are provided in the middle of the left and right inner walls of the U-shaped frame (6), and the round rods (13) are slidably connected to the inside of the slide grooves.

5. The heat sink for a power supply motherboard according to claim 4, characterized in that: The front lower surface of the cleaning plate (10) is provided with a plurality of arc-shaped grooves (12) connected to the corresponding avoidance holes (11), and the arc-shaped grooves (12) are adapted to the top ends of the heat dissipation fins (3).

6. The heat sink for a power supply motherboard according to claim 4, characterized in that: A limiting groove (14) is provided at the front end of the lower surface of the cleaning plate (10); a limiting strip (15) adapted to the limiting groove (14) is fixedly connected to the bottom end of the inner wall of the front end of the U-shaped frame (6); and magnet strips that attract each other are fixedly connected to the top of the limiting strip (15) and the inner top wall of the limiting groove (14).

7. The heat sink for a power supply motherboard according to claim 3, characterized in that: The two limiting mechanisms each include a support plate (7), the support plate (7) being fixedly connected to the lower surface of the side wall of the U-shaped frame (6), a screw rod being threaded through the middle of the support plate (7), one end of the screw rod being fixedly connected to a dial wheel (8), and the other end of the screw rod being rotatably connected to a limiting plate (9) via a rotating shaft, the limiting plate (9) being in contact with the heat dissipation fins (3), and the support plate (7) being slidably connected to the space between the two fixing bars (5).

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