Multi-layer radiation / reflection-heat storage / heat insulation cooling mulching film

Through the combination of multi-layer structure and phase change microcapsules, the problems of insufficient reflection and heat storage performance of the ground film are solved, and efficient soil temperature stabilization and cooling effects are achieved.

CN223402960UActive Publication Date: 2025-10-03NANJING TECH UNIV +1
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Patent Information

Application Number
CN202422684458.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2024-07-31
Filing Date
2024-11-05
Publication Date
2025-10-03
Estimated Expiration
2034-11-05

AI Technical Summary

Technical Problem

Existing ground films have limited performance in reflecting sunlight and dissipating heat, and lack effective heat storage structures, resulting in poor cooling effects.

Method used

It adopts a multi-layer structure, including a heat-insulating substrate layer, a heat-storage adhesive layer and a high-reflection layer, combined with a hollow structure and phase-change microcapsules. It uses the infrared radiation layer to emit high heat in the atmospheric window band, and stores excess heat through the heat-storage adhesive layer to block heat conduction.

Benefits of technology

It improves the reflectivity and heat dissipation capacity of the ground film, keeps the soil temperature stable, enhances the long-term cooling effect and thermal insulation performance, and reduces the soil temperature.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a multilayer radiation / reflection-heat storage / heat insulation cooling mulching film, which belongs to the technical field of mulching films, and sequentially comprises a heat insulation substrate layer, a heat storage adhesive layer, a high reflection layer and an infrared radiation layer from bottom to top, the heat insulation base material layer is a polymer bubble film with a hollow structure; the high-reflection layer is an aluminum foil sheet; the infrared radiation layer contains silicon dioxide; the heat storage adhesive layer contains phase change microcapsules dispersed in glue resin; sunlight can be reflected, and heat input is reduced; moreover, the heat dissipation can be increased by utilizing intermediate infrared high emission of an atmospheric window wave band; and heat conduction can be blocked through the hollow structure and the phase change effect, and the cooling effect is achieved.
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Description

Technical Field

[0001] The present invention relates to the technical field of ground films, and in particular to a multi-layer radiation / reflection-heat storage / heat insulation cooling ground film. Background Art

[0002] Ground film is a plastic film commonly used in agricultural technology. It is mainly used to cover the soil surface. It has the functions of maintaining soil temperature, retaining soil moisture, removing weeds, maintaining soil structure, preventing pests from invading crops, and promoting plant growth and increasing crop yields. It is an important type of agricultural facility.

[0003] Currently available thermal insulation and cooling ground films are typically silvery-white single-layer films. Compared to traditional black ground films, these films improve sunlight reflection and reduce heat input, exhibiting certain thermal insulation and cooling properties. In addition to reducing heat input by reflecting sunlight, increasing heat dissipation pathways is also an effective way to improve cooling performance. Infrared light with a wavelength range of 8-14μm is known as the "atmospheric window." Within this specific spectral region, the atmosphere exhibits exceptionally high transmittance, coinciding with the peak of blackbody radiation. Furthermore, a single-layer film structure implies weaker thermal insulation performance, ignoring the effect of heat conduction on soil temperature increases, thus weakening the cooling performance of the ground film.

[0004] In addition, Chinese patent CN202410272499.5 discloses a passive cooling material and its preparation method, which includes an upper reflective layer, a middle radiation layer and a lower polymer hollow membrane layer. It lacks a heat storage layer and cannot slow down the temperature change of the material itself.

[0005] Therefore, a ground film structure with a high heat conduction barrier rate can further improve the thermal insulation and cooling performance. At the same time, introducing a phase change heat storage structure into the ground film is conducive to increasing the heat capacity of the ground film and keeping the internal soil temperature in a stable state for a long time. Summary of the Invention

[0006] Purpose of the invention: The purpose of the present invention is to address the deficiencies of the existing technology and provide a multi-layer radiation / reflection-heat storage / insulation cooling ground film, which can not only reflect sunlight and reduce heat input; but also utilize the high mid-infrared emission in the atmospheric window band to increase heat dissipation; and can block heat conduction through the hollow structure and phase change effect to achieve the effect of cooling.

[0007] Technical Solution: The multi-layered radiation / reflection-heat storage / insulation cooling film described in this invention comprises, from bottom to top, a heat-insulating base layer, a heat-storage adhesive layer, a high-reflection layer, and an infrared radiation layer. The heat-insulating base layer is a hollow polymer bubble film; the high-reflection layer is aluminum foil; and the infrared radiation layer contains silicon dioxide. The thickness and hollow structure of the heat-insulating base layer enhance thermal insulation and reduce heat generation through thermal conduction. The high-reflection layer minimizes solar heat generation by reflecting sunlight.

[0008] Furthermore, the content of silicon dioxide in the infrared radiation layer accounts for 5% to 50% of the total mass of the infrared radiation layer. The infrared radiation layer can emit and dissipate heat in the form of infrared rays with a wavelength in the range of 8-14 μm.

[0009] Furthermore, the heat storage adhesive layer contains phase change microcapsules dispersed in the glue resin.

[0010] Furthermore, the content of the phase change microcapsules in the thermal storage adhesive layer is in the range of 5-50%.

[0011] Furthermore, the glue resin is one or more of epoxy resin, polyacrylate resin, polyamide resin, polyurethane resin, and fluororesin.

[0012] Furthermore, the thermal storage adhesive layer has adhesive properties, and the upper surface of the thermal storage adhesive layer is bonded to the high-reflective layer, and the lower surface is bonded to the thermal insulation substrate layer, thereby bonding the high-reflective layer, the thermal storage layer, and the thermal insulation substrate layer together. The thermal storage layer can store excess heat in the form of a phase change, slowing the rise in the ground film temperature and reducing the driving force of heat conduction.

[0013] Furthermore, the thickness of the thermal insulation substrate layer is in the range of 1000-2000 μm.

[0014] Furthermore, the thickness of the heat storage adhesive layer is in the range of 100-200 μm.

[0015] Furthermore, the thickness of the high reflective layer is in the range of 100-200 μm.

[0016] Furthermore, the infrared radiation layer has a thickness ranging from 50 to 100 μm.

[0017] Beneficial effects: Compared with the prior art, the advantages of the present invention are:

[0018] (1) The present invention constructs a multi-layer structure that integrates solar reflection, infrared radiation and heat insulation / heat storage properties, has high reflectivity, can effectively reflect sunlight and reduce solar heat input;

[0019] (2) Due to the setting of infrared radiation layer, it can have high emissivity in the atmospheric window (8-14 μm);

[0020] (3) Due to the provision of a heat storage adhesive layer containing phase change microcapsules, the film has a phase change heat storage function, which reduces the temperature fluctuation inside the film. In addition, the film has a hollow structure that can effectively block heat conduction, reduce the heating of the soil under the film, and keep the soil at a stable lower temperature. At the same time, the addition of the heat storage adhesive layer slows down the temperature change of the material itself, further weakening the influence of the external environment on the internal ambient temperature and enhancing the long-term effectiveness of the cooling effect.

[0021] (4) The preparation process of the present invention is simple, low-cost, easy to recycle, and has excellent heat insulation and cooling effects on the soil; the existing materials are used for structural assembly, and the production process is more convenient and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the present invention;

[0023] Figure 2 It is the sunlight reflection spectrum diagram of the present invention;

[0024] Figure 3 This is the temperature change over time under the solar simulator of the present invention. DETAILED DESCRIPTION

[0025] In the present invention, the PE-based bubble film is purchased from Zhenjiang Guanda Packaging Products; the phase change microcapsules are a type of product that can be purchased directly, purchased from Shanghai Xinya New Materials; the epoxy resin is purchased from Shenzhen Jitian Chemical; the polyacrylate resin is purchased from Shandong Aohui Paint Group Co., Ltd.; the polyamide resin is purchased from Shenzhen Jitian Chemical; the polyurethane resin is purchased from Anhui Yuanchen New Materials; the fluororesin is purchased from Daikin Fluorochemical; the aluminum foil is purchased from Shanghai Xincheng Aluminum; and the silica is purchased from MCC New Materials. The materials described in the present invention are all known existing materials, and do not involve improvements to the materials, but only involve structural innovations.

[0026] Example 1

[0027] like Figure 1 The multi-layer radiation / reflection-heat storage / insulation cooling film shown comprises, from bottom to top, a heat insulation substrate layer 4, a heat storage adhesive layer 3 and an infrared radiation layer 1.

[0028] The heat-insulating substrate layer 4 is made of a polymer bubble film with a hollow structure, such as a PE-based bubble film, and the thickness of the heat-insulating substrate layer 4 is 1000 μm.

[0029] The heat storage adhesive layer 3 is a glue resin, and the glue resin uniformly contains 30% phase change microcapsules. The glue resin is one or more of epoxy resin, polyacrylate resin, polyamide resin, polyurethane resin, and fluororesin; the thickness of the heat storage adhesive layer 3 is 150 μm.

[0030] The high reflective layer 2 is an aluminum foil with a thickness of 100 μm.

[0031] The infrared radiation layer 1 is a polyurethane resin containing silicon dioxide, wherein the silicon dioxide content accounts for 25% of the total mass of the infrared radiation layer 1; the thickness of the infrared radiation layer is 75 μm.

[0032] The heat storage adhesive layer 3 has an upper surface and a lower surface. The upper surface is bonded and fixed to the high reflective layer 2 , and the lower surface is bonded and fixed to the heat insulating base material layer.

[0033] The preparation method of this embodiment is as follows:

[0034] Step 1: Provide an aluminum foil as a high reflective layer 2 with a thickness of 100 μm.

[0035] Step 2: providing an infrared radiation coating 1, diluting silicon dioxide with polyurethane resin and evenly coating the aluminum foil and drying the mixture, so that the infrared radiation coating 1 is composited on top of the high reflective layer 2.

[0036] Step 3: Provide a PE-based bubble film as the heat-insulating substrate layer 4 with a thickness of 1000 μm.

[0037] Step 4: Provide a heat storage adhesive layer 3, dilute the phase change microcapsules with polyurethane resin and evenly coat them on the PE-based bubble film. Set the temperature to 25°C. After drying for 2 hours, place the high reflective layer 2 on top of the heat storage adhesive layer 3 and let it stand at room temperature until the heat storage adhesive layer is completely dried and solidified.

[0038] Step 5: Compound the heat storage adhesive layer 3 between the high reflective layer 2 and the heat insulation substrate layer 4.

[0039] Test Example 1

[0040] The multilayer radiation / reflection-heat storage / insulation cooling film prepared in Example 1 and the aluminum foil were placed in the wavelength range of 380-2500 nm to test the solar reflectivity. Figure 2 The results show that due to the presence of the top infrared radiation layer, the reflectivity of the multilayer radiation / reflection-thermal storage / insulation cooling membrane prepared in this example only decreases slightly, but still maintains a reflectivity of 87%. Furthermore, the presence of the infrared radiation layer increases the infrared emissivity of the multilayer radiation / reflection-insulation / thermal storage cooling membrane in the 8-14 μm range from nearly 0 for pure aluminum foil to 0.5.

[0041] Test Example 2

[0042] The multilayer radiation / reflection-heat storage / insulation cooling film prepared in Example 1 was placed under a solar simulator and the temperature change over time was recorded. Figure 3The results showed that the temperature rise rate slowed down significantly after covering the ground with film; after 4 hours of irradiation, the internal environment temperature after covering the ground with film dropped by about 15 ℃ compared with direct exposure to sunlight.

[0043] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A multi-layer radiation / reflection-heat storage / insulation cooling ground film, characterized by: From bottom to top, it comprises a heat-insulating substrate layer (4), a heat-storage adhesive layer (3), a high-reflection layer (2) and an infrared radiation layer (1); the heat-insulating substrate layer (4) is a polymer bubble film with a hollow structure; the high-reflection layer (2) is an aluminum foil; and the infrared radiation layer (1) contains silicon dioxide.

2. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The silicon dioxide content in the infrared radiation layer (1) accounts for 5% to 50% of the total mass of the infrared radiation layer (1).

3. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The heat storage adhesive layer (3) contains phase change microcapsules dispersed in the glue resin.

4. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 3, characterized in that: The content of the phase change microcapsules in the heat storage adhesive layer (3) is in the range of 5-50%.

5. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The heat storage adhesive layer (3) has an upper surface and a lower surface, the upper surface is bonded and fixed to the high reflective layer (2), and the lower surface is bonded and fixed to the heat insulation base material layer.

6. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The thickness of the thermal insulation substrate layer (4) ranges from 1000 to 2000 μm.

7. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The thickness of the heat storage adhesive layer (3) is in the range of 100-200 μm.

8. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The thickness of the high reflective layer (2) is in the range of 100-200 μm.

9. The multi-layer radiation / reflection-heat storage / insulation cooling ground film according to claim 1, characterized in that: The infrared radiation layer (1) has a thickness ranging from 50 to 100 μm.

Citation Information

Patent Citations

  • Passive cooling material and preparation method thereof

    CN118185103A