Silicon wafer surface pollution cleaning device

Abstract

The utility model relates to the field of cleaning devices, in particular to a silicon wafer surface pollution cleaning device which comprises a bottom plate. A cleaning box is fixedly connected to the left portion of the upper end of the bottom plate, and the upper end of the cleaning box is open. According to the utility model, the circular silicon wafer passes through the second groove body from top to bottom and is placed at the upper ends of the two supporting blocks, so that the lower end of the circular silicon wafer is supported by the upper ends of the two supporting blocks, and meanwhile, the front and rear ends of the circular silicon wafer are attached to the front and rear ends of the inner wall of the second groove body, so that the circular silicon wafer is limited; then the mounting blocks are placed on the inner walls of the first groove bodies, at the moment, the lower ends of the fixing blocks are attached to the inner walls of the lower ends of the first U-shaped plates, a row of mounting blocks can be placed on the inner walls of a row of first groove bodies, cleaning liquid capable of immersing the round silicon wafers is arranged in a bottom plate, and then a stirring assembly is started to stir an aqueous solution in a cleaning box; ultrasonic cleaning can be carried out on the circular silicon wafer immersed in the cleaning box by starting the energy converter.

Description

Technical Field

[0001] The utility model belongs to the field of cleaning devices, and in particular relates to a device for cleaning silicon wafer surface contamination. Background Art

[0002] In the field of semiconductor manufacturing, silicon wafers, as the core material of integrated circuits, have a crucial impact on subsequent processes and product performance due to their surface cleanliness. However, during the processing, transportation and storage of silicon wafers, they are inevitably exposed to various pollutants such as dust particles, metal ions, organic residues and natural oxide layers. If these pollutants are not effectively removed, they will lead to a series of problems such as circuit short circuits, increased leakage current, and reduced reliability.

[0003] Traditional silicon wafer surface contamination cleaning methods mainly include wet cleaning and dry cleaning. Wet cleaning usually uses chemical solutions such as deionized water, hydrofluoric acid, sodium hydroxide, etc., combined with ultrasonic or megasonic wave technology, to remove pollutants on the silicon wafer surface through chemical reactions and physical scouring. Dry cleaning mainly uses physical means such as gas or plasma to remove pollutants by bombarding the silicon wafer surface or generating chemical reactions. Although dry cleaning is environmentally friendly, it is not as effective as wet cleaning in removing certain stubborn pollutants. When using the silicon wafer surface contamination cleaning device in the existing technology, it is usually difficult to quickly clean silicon wafers placed in rows in batches, and it is not convenient to quickly dry silicon wafers placed in rows, and further improvement is needed.

[0004] Therefore, a silicon wafer surface contamination cleaning device is proposed. When used, the silicon wafer surface contamination cleaning device in the prior art is usually difficult to quickly clean silicon wafers placed in rows in batches, and it is not convenient to quickly dry the silicon wafers placed in rows. Utility Model Content

[0005] In order to overcome the problems in the prior art of silicon wafer surface contamination cleaning devices that it is usually difficult to quickly clean silicon wafers placed in rows in batches and it is inconvenient to quickly dry silicon wafers placed in rows, a silicon wafer surface contamination cleaning device is proposed.

[0006] The technical solution of the utility model is: a silicon wafer surface contamination cleaning device, comprising a bottom plate; a cleaning box is fixedly connected to the left upper end of the bottom plate, the upper end of the cleaning box is open, and the upper end of the cleaning box is provided with two grooves symmetrical to each other about the center of the cleaning box, and a first U-shaped plate is placed on the inner walls of the two grooves, the opening of the first U-shaped plate is upward, and stirring components are provided at both ends of the inner wall of the cleaning box, a drying component is provided at the right upper end of the bottom plate, and the lower end of the first U-shaped plate is penetrated by a first trough body evenly distributed, and the first trough body A mounting block is slidingly provided on the inner wall of the mounting block, and a second groove is penetrated at the upper end of the mounting block. The front and rear ends of the mounting block are both in an inverted U shape, and the lower ends of the two ends of the mounting block are fixedly connected to supporting blocks. A third groove is penetrated at the front and rear ends of the mounting block, and the inner wall of the third groove is arc-shaped. The end of the supporting block close to the center of the third groove is arc-shaped, and the upper parts of the left and right ends of the mounting block are fixed with fixed blocks, and a second through hole is penetrated at the front end of the fixed block. A long column is placed on the inner wall of the second through hole, and evenly distributed transducers are fixed to the left and right ends of the bottom plate.

[0007] Preferably, when in use, the circular silicon wafer is passed through the second trough body from top to bottom and placed on the upper ends of the two supporting blocks, so that the lower end of the circular silicon wafer is supported by the upper ends of the two supporting blocks, and at the same time, the front and rear ends of the circular silicon wafer will fit with the front and rear ends of the inner wall of the second trough body to limit the circular silicon wafer. Then, the mounting block is placed on the inner wall of the first trough body. At this time, the lower end of the fixing block and the lower inner wall of the first U-shaped plate fit together, and a row of mounting blocks can be placed on the inner wall of a row of first trough bodies. A cleaning liquid that can immerse the circular silicon wafers is provided in the bottom plate itself. Then, the stirring component can be turned on to stir the aqueous solution in the cleaning box, and the transducer can be turned on to ultrasonically clean the circular silicon wafers immersed in the cleaning box. Then, the row of mounting blocks can be moved to the drying component by a handheld long column, and the drying component can be turned on to dry the cleaned circular silicon wafers, which solves the problem that the silicon wafer surface contamination cleaning device in the prior art is usually difficult to quickly clean silicon wafers placed in rows in batches and inconvenient to quickly dry silicon wafers placed in rows when in use.

[0008] Preferably, a first through hole is opened through the front and rear edges of the upper center of the first U-shaped plate, a first stopper is placed on the inner wall of the first U-shaped plate near the front and rear edges, a first plug column is fixed to the lower end of the first stopper, the side wall of the first plug column is in contact with the inner wall of the first through hole, and a first handle is fixed to the upper end of the first stopper.

[0009] Preferably, the stirring assembly includes a supporting block, a motor, a rotating column and a stirring plate; two supporting blocks are fixed to the left and right ends of the inner wall of the cleaning box, the upper end of the supporting block is fixed to the motor, the lower end of the output shaft of the motor passes through the supporting block and is fixed to the rotating column, and the side wall of the rotating column is fixed to the stirring plate.

[0010] Preferably, there is a gap between an end of the stirring plate close to the center of the cleaning box and an end of the first U-shaped plate away from the center of the cleaning box.

[0011] Preferably, the drying component includes a drying box, a second U-shaped plate, a fourth trough, an air inlet pipe and an axial flow fan; the drying box is fixedly connected to the right upper end of the bottom plate, the second U-shaped plate is fixedly connected to the upper end of the drying box, the lower end of the second U-shaped plate is penetrated by a fourth trough with uniform distribution, the inner wall of the fourth trough is adapted to the side wall of the mounting block, the second U-shaped plate and the first U-shaped plate have the same structure, water outlet troughs are penetrated by the lower left and right ends of the drying box, two air inlet pipes are penetrated and fixedly connected to the rear end of the drying box, the rear end of the air inlet pipe is fixedly connected to the axial flow fan, a plurality of fixing seats are fixedly connected to the left and right ends of the inner wall of the drying box, and an air heating pipe is fixedly connected between the two corresponding fixing seats.

[0012] Preferably, the upper end of the second U-shaped plate is open, and a third through hole is provided through the upper end of the second U-shaped plate near the front and rear edges. A second stop block is placed on the inner wall of the second U-shaped plate near the front and rear edges. The upper end of the second stop block is fixedly connected to a second handle, and the lower end of the second stop block is fixedly connected to a second limiting column. The side wall of the second limiting column is in contact with the inner wall of the third through hole.

[0013] Preferably, both left and right ends of the bottom plate are fixedly connected to protective shells, and the transducer is located inside the protective shells.

[0014] The beneficial effects of the present invention are as follows: by passing the circular silicon wafer from top to bottom through the second trough body and placing it on the upper ends of the two supporting blocks, the lower end of the circular silicon wafer is supported by the upper ends of the two supporting blocks, and at the same time, the front and rear ends of the circular silicon wafer will fit with the front and rear ends of the inner wall of the second trough body to achieve the limitation of the circular silicon wafer, and then the mounting block is placed on the inner wall of the first trough body. At this time, the lower end of the fixed block and the lower inner wall of the first U-shaped plate fit together, and a row of mounting blocks can be placed on the inner wall of a row of first trough bodies. A cleaning liquid that can immerse the circular silicon wafers is provided in the bottom plate itself, and then the stirring component can be turned on to stir the aqueous solution in the cleaning box, and the transducer can be turned on to ultrasonically clean the circular silicon wafers immersed in the cleaning box, and then the row of mounting blocks can be moved to the drying component by a handheld long column, and the drying component can be turned on to dry the cleaned circular silicon wafers, which solves the problem that the silicon wafer surface contamination cleaning device in the prior art is usually difficult to quickly clean silicon wafers placed in rows in batches and inconvenient to quickly dry silicon wafers placed in rows when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shown is a schematic diagram of the three-dimensional structure of a silicon wafer surface contamination cleaning device of the present invention;

[0016] Figure 2Shown is a schematic diagram of the three-dimensional disassembled structure of the first U-shaped plate and the first stopper of a silicon wafer surface contamination cleaning device of the present invention;

[0017] Figure 3 Shown is a schematic diagram of the three-dimensional structure of a mounting block of a silicon wafer surface contamination cleaning device according to the present invention;

[0018] Figure 4 Shown is a schematic diagram of the three-dimensional disassembled structure of the stirring component and the drying component of a silicon wafer surface contamination cleaning device of the present invention;

[0019] Figure 5 Shown is a schematic diagram of the three-dimensional structure of a transducer of a silicon wafer surface contamination cleaning device of the present invention;

[0020] Figure 6 Shown is a schematic diagram of the three-dimensional structure of an air heating tube of a silicon wafer surface contamination cleaning device of the present invention.

[0021] The symbols in the accompanying drawings are: 1, bottom plate; 2, cleaning box; 3, groove; 4, first U-shaped plate; 401, first tank body; 402, first through hole; 403, first stopper; 404, first plug post; 405, first handle; 406, mounting block; 407, second tank body; 408, third tank body; 409, supporting block; 410, fixing block; 411, second through hole; 412, long column; 5, stirring assembly; 501, carrying block; 502, motor; 503, rotating column; 504, stirring plate; 6, drying assembly; 601, drying box; 602, second U-shaped plate; 603, fourth trough; 604, air inlet pipe; 605, axial flow fan; 606, water outlet trough; 607, third through hole; 608, second limiting column; 609, second stopper; 610, second handle; 611, fixing seat; 612, air heating tube; 7, transducer; 8, protective shell. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Example 1: Please refer to Figures 1-6, a silicon wafer surface contamination cleaning device, including a bottom plate 1; a cleaning box 2 is fixedly connected to the left upper end of the bottom plate 1, the upper end of the cleaning box 2 is open, and the upper end of the cleaning box 2 is provided with two grooves 3 symmetrical to each other about the center of the cleaning box 2, and the inner walls of the two grooves 3 are jointly placed with a first U-shaped plate 4, the opening of the first U-shaped plate 4 is upward, and the left and right ends of the inner wall of the cleaning box 2 are provided with a stirring assembly 5, and the upper right end of the bottom plate 1 is provided with a drying assembly 6, and the lower end of the first U-shaped plate 4 is penetrated by a uniformly distributed first trough body 401, and the inner wall of the first trough body 401 is slidably provided with a mounting block 406, and the mounting block 406 is provided with a mounting block 406. A second slot 407 is provided through the upper end, and the front and rear ends of the mounting block 406 are both in an inverted U shape. The lower ends of the two ends of the mounting block 406 are fixedly connected to a supporting block 409. A third slot 408 is provided through the front and rear ends of the mounting block 406, and the inner wall of the third slot 408 is arc-shaped. The end of the supporting block 409 close to the center of the third slot 408 is arc-shaped. The upper parts of the left and right ends of the mounting block 406 are fixedly connected to a fixing block 410, and a second through hole 411 is provided through the front end of the fixing block 410. A long column 412 is placed on the inner wall of the second through hole 411, and the left and right ends of the base plate 1 are fixedly connected to evenly distributed transducers 7.

[0024] During use, the circular silicon wafer is passed from top to bottom through the second trough body 407 and placed on the upper ends of the two supporting blocks 409, so that the lower end of the circular silicon wafer is supported by the upper ends of the two supporting blocks 409, and at the same time, the front and rear ends of the circular silicon wafer will fit with the front and rear ends of the inner wall of the second trough body 407 to limit the circular silicon wafer. Then the mounting block 406 is placed on the inner wall of the first trough body 401. At this time, the lower end of the fixing block 410 fits with the inner wall of the lower end of the first U-shaped plate 4, and a row of mounting blocks 406 can be placed on the inner wall of a row of first trough bodies 401. The bottom plate 1 itself is provided with a cleaning liquid that can immerse the circular silicon wafers. Then, the stirring component 5 is turned on to stir the aqueous solution in the cleaning box 2. The transducer 7 is turned on to ultrasonically clean the circular silicon wafers immersed in the cleaning box 2. Then, the row of mounting blocks 406 can be moved to the drying component 6 by holding the long column 412. The drying component 6 is turned on to dry the cleaned circular silicon wafers.

[0025] See also Figure 1-Figure 3In this embodiment, first through holes 402 are formed at the front and rear edges of the upper center of the first U-shaped plate 4, and first blocks 403 are placed on the inner wall of the first U-shaped plate 4 near the front and rear edges. The lower end of the first block 403 is fixedly connected to a first plug post 404, and the side wall of the first plug post 404 fits the inner wall of the first through hole 402. The upper end of the first block 403 is fixedly connected to a first handle 405. When clean water needs to be poured into the interior of the first U-shaped plate 4 so that the water rushes from the inside of the second trough 407 onto the circular silicon wafer supported by the two supporting blocks 409, the first block 403 is first placed on the inner wall of the first U-shaped plate 4 so that the side wall of the first plug post 404 fits the inner wall of the first through hole 402, thereby preventing water from flowing out of the interior of the first U-shaped plate 4.

[0026] See also Figure 4 In this embodiment, the stirring assembly 5 includes a supporting block 501, a motor 502, a rotating column 503 and a stirring plate 504; two supporting blocks 501 are fixedly connected to the left and right ends of the inner wall of the cleaning box 2, the upper end of the supporting block 501 is fixedly connected to the motor 502, the lower end of the output shaft of the motor 502 passes through the supporting block 501 and is fixedly connected to the rotating column 503, and the side wall of the rotating column 503 is fixedly connected to the stirring plate 504. When it is necessary to stir the aqueous solution in the cleaning box 2, the motor 502 is turned on to rotate the rotating column 503, and the stirring plate 504 can be used to disturb the water body, which can improve the cleaning effect of the round silicon wafer.

[0027] See also Figure 1 and Figure 4 In this embodiment, there is a gap between the end of the stirring plate 504 close to the center of the cleaning box 2 and the end of the first U-shaped plate 4 away from the center of the cleaning box 2. When the stirring plate 504 rotates, the first U-shaped plate 4 will not block the stirring plate 504.

[0028] Example 2: Please refer to Figure 4On the basis of Example 1, the present application provides a technical solution: the drying assembly 6 includes a drying box 601, a second U-shaped plate 602, a fourth trough 603, an air inlet pipe 604 and an axial flow fan 605; the drying box 601 is fixedly connected to the right upper end of the bottom plate 1, the second U-shaped plate 602 is fixedly connected to the upper end of the drying box 601, the lower end of the second U-shaped plate 602 is penetrated by a uniformly distributed fourth trough 603, the inner wall of the fourth trough 603 is adapted to the side wall of the mounting block 406, the second U-shaped plate 602 and the first U-shaped plate 4 have the same structure, the drying box 601 Water outlet troughs 606 are provided at the lower parts of the left and right ends, two air inlet pipes 604 are fixedly connected to the rear end of the drying box 601, and an axial flow fan 605 is fixedly connected to the rear end of the air inlet pipe 604. Multiple fixing seats 611 are fixedly connected to the left and right ends of the inner wall of the drying box 601, and an air heating pipe 612 is fixedly connected between the corresponding two fixing seats 611. Turning on the air heating pipe 612 and the axial flow fan 605 can form upward hot air, and placing the mounting block 406 on the inner wall of the fourth trough 603 can facilitate the rapid drying of the circular silicon wafers inside the mounting block 406.

[0029] See also Figure 1 and Figure 4 In this embodiment, the upper end of the second U-shaped plate 602 is open, and a third through hole 607 is formed through the upper end of the second U-shaped plate 602 near the front and rear edges. A second stopper 609 is placed on the inner wall of the second U-shaped plate 602 near the front and rear edges. The upper end of the second stopper 609 is fixedly connected to a second handle 610, and the lower end of the second stopper 609 is fixedly connected to a second limiting column 608. The side wall of the second limiting column 608 is in contact with the inner wall of the third through hole 607. The second limiting column 608 is placed on the inner wall of the third through hole 607 so that the left and right ends of the second stopper 609 are in contact with the left and right ends of the inner wall of the second U-shaped plate 602, thereby blocking the left and right edges of the upper end of the second U-shaped plate 602.

[0030] See also Figure 1 and Figure 5 In this embodiment, protective shells 8 are fixed to both left and right ends of the bottom plate 1 , and the transducer 7 is located inside the protective shells 8 . The protection of the transducer 7 can be improved by providing the protective shells 8 .

[0031] Working Principle: First, a circular silicon wafer is passed from top to bottom through the second trough 407 and placed on the upper ends of the two supporting blocks 409, so that the lower end of the circular silicon wafer is supported by the upper ends of the two supporting blocks 409. At the same time, the front and rear ends of the circular silicon wafer will fit into the front and rear ends of the inner wall of the second trough 407, thus limiting the position of the circular silicon wafer.

[0032] Then, the mounting block 406 is placed on the inner wall of the first trough 401. At this time, the lower end of the fixing block 410 is in contact with the lower inner wall of the first U-shaped plate 4. Then, a row of mounting blocks 406 can be placed on the inner wall of a row of first troughs 401. The bottom plate 1 itself is provided with a cleaning liquid that can immerse the circular silicon wafer.

[0033] Pour clean water into the first U-shaped plate 4 so that the water flows from the second trough 407 into the circular silicon wafer supported by the two support blocks 409. First, place the first stopper 403 on the inner wall of the first U-shaped plate 4 so that the side wall of the first plug post 404 fits into the inner wall of the first through hole 402, thereby preventing water from flowing out of the first U-shaped plate 4.

[0034] Then, the motor 502 is turned on to rotate the rotating column 503, and the stirring plate 504 is used to disturb the water to improve the cleaning effect of the circular silicon wafer. The transducer 7 is turned on to perform ultrasonic cleaning on the circular silicon wafer immersed in the cleaning box 2;

[0035] After cleaning is completed, a row of mounting blocks 406 can be moved into the drying assembly 6 by holding the long column 412. Specifically, the mounting blocks 406 are placed on the inner wall of the fourth trough 603, and then the air heating tube 612 and the axial flow fan 605 are turned on to form upward hot air, which can quickly dry the circular silicon wafers inside the mounting blocks 406.

[0036] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the purpose of the present invention.

Claims

1. A silicon wafer surface contamination cleaning device, comprising a bottom plate (1); characterized in that: A cleaning box (2) is fixedly connected to the left upper end of the bottom plate (1), and the upper end of the cleaning box (2) is open. Two grooves (3) are provided on the upper end of the cleaning box (2) and are symmetrical with each other about the center of the cleaning box (2). A first U-shaped plate (4) is placed on the inner walls of the two grooves (3). The opening of the first U-shaped plate (4) is upward. A stirring assembly (5) is provided on both the left and right ends of the inner wall of the cleaning box (2). A drying assembly (6) is provided on the right upper end of the bottom plate (1). The lower end of the first U-shaped plate (4) is penetrated by a first trough (401) evenly distributed. The inner wall of the first trough (401) is slidably provided with a mounting block (406). The upper end of the mounting block (406) is penetrated by a second The trough body (407), the front and rear ends of the mounting block (406) are both in an inverted U shape, the lower ends of the two ends of the mounting block (406) are fixedly connected to the supporting blocks (409), the front and rear ends of the mounting block (406) are both penetrated by a third trough body (408), the inner wall of the third trough body (408) is in an arc shape, the end of the supporting block (409) close to the center of the third trough body (408) is in an arc shape, the upper part of the left and right ends of the mounting block (406) are both fixedly connected to the fixing blocks (410), the front end of the fixing block (410) is penetrated by a second through hole (411), the inner wall of the second through hole (411) is provided with a long column (412), and the left and right ends of the bottom plate (1) are both fixedly connected to evenly distributed transducers (7).

2. The silicon wafer surface contamination cleaning device according to claim 1, characterized in that: A first through hole (402) is provided through the front and rear edges of the center of the upper end of the first U-shaped plate (4); a first stopper (403) is placed on the inner wall of the first U-shaped plate (4) near the front and rear edges; a first plug post (404) is fixed to the lower end of the first stopper (403); the side wall of the first plug post (404) is in contact with the inner wall of the first through hole (402); and a first handle (405) is fixed to the upper end of the first stopper (403).

3. The silicon wafer surface contamination cleaning device according to claim 1, characterized in that: The stirring assembly (5) comprises a bearing block (501), a motor (502), a rotating column (503) and a stirring plate (504); two bearing blocks (501) are fixedly connected to the left and right ends of the inner wall of the cleaning box (2); the upper end of the bearing block (501) is fixedly connected to the motor (502); the lower end of the output shaft of the motor (502) passes through the bearing block (501) and is fixedly connected to the rotating column (503); and the side wall of the rotating column (503) is fixedly connected to the stirring plate (504).

4. The silicon wafer surface contamination cleaning device according to claim 3, characterized in that: There is a gap between the end of the stirring plate (504) close to the center of the cleaning box (2) and the end of the first U-shaped plate (4) away from the center of the cleaning box (2).

5. The silicon wafer surface contamination cleaning device according to claim 1, characterized in that: The drying assembly (6) includes a drying box (601), a second U-shaped plate (602), a fourth trough (603), an air inlet pipe (604) and an axial flow fan (605); the drying box (601) is fixedly connected to the right upper end of the bottom plate (1), the second U-shaped plate (602) is fixedly connected to the upper end of the drying box (601), and the lower end of the second U-shaped plate (602) is penetrated by the fourth trough (603) which is evenly distributed. The inner wall of the fourth trough (603) is adapted to the side wall of the mounting block (406). The second U-shaped plate (602) and the first U-shaped plate (4) have the same structure. A water outlet trough (606) is provided through the lower portion of the left and right ends of the drying box (601). Two air inlet pipes (604) are fixedly connected to the rear end of the drying box (601). An axial flow fan (605) is fixedly connected to the rear end of the air inlet pipe (604). A plurality of fixing seats (611) are fixedly connected to the left and right ends of the inner wall of the drying box (601). An air heating pipe (612) is fixedly connected between two corresponding fixing seats (611).

6. The silicon wafer surface contamination cleaning device according to claim 5, characterized in that: The upper end of the second U-shaped plate (602) is open, and a third through hole (607) is provided through the upper end of the second U-shaped plate (602) near the front and rear edges. A second stopper (609) is placed on the inner wall of the second U-shaped plate (602) near the front and rear edges. The upper end of the second stopper (609) is fixedly connected to a second handle (610), and the lower end of the second stopper (609) is fixedly connected to a second limiting column (608). The side wall of the second limiting column (608) is in contact with the inner wall of the third through hole (607).

7. The silicon wafer surface contamination cleaning device according to claim 1, characterized in that: A protective shell (8) is fixedly connected to both left and right ends of the bottom plate (1), and the transducer (7) is located inside the protective shell (8).

Images