Die bonding mechanism and wafer repair equipment

Abstract

The utility model discloses a die bonding mechanism and wafer repair equipment, the die bonding mechanism comprises a laser welding assembly and a pressing assembly, the pressing assembly is provided with a pressing needle, the pressing needle is provided with a pressure applying part and a force conduction part, the pressure applying part is located in a welding work area of the laser welding assembly, and the force conduction part is located in the laser welding assembly. The pressing assembly can apply a pressing force to the pressure applying part through the force conduction part. When the laser welding assembly is used for welding, due to the fact that the pressure exerting part is located in the welding work area of the laser welding assembly, the force conduction part can conduct pressure to the pressure exerting part, the pressure exerting part can fix the wafer, the wafer is prevented from moving or being struck away by laser, and it is guaranteed that the wafer which is replaced subsequently can be smoothly fixed.

Description

Technical Field

[0001] The utility model relates to the field of repair of MicroLED or other tiny devices, and in particular to a crystal bonding mechanism and wafer repair equipment. Background Art

[0002] In the existing technology, it is difficult to achieve a 100% yield rate for the die bonding of a MicroLED panel in one die bonding process, and the panel usually needs to be repaired after production.

[0003] However, during the repair and die bonding process of the MircoLED wafer, when the laser energy acts on the wafer and the die bonding material, due to the high energy of the laser and the tiny nature of the MircoLED wafer, the wafer can easily shift or even be knocked away under the impact of the laser energy, which has an adverse effect on the repair. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a crystal fixing mechanism and a wafer repair device, which can solve the problem of inconvenience in prior art wafer fixing.

[0005] The technical solution adopted by the present invention to solve the technical problem is: on the one hand, a crystal bonding mechanism is provided, comprising:

[0006] Laser welding components;

[0007] And a pressing assembly, the pressing assembly has a pressing needle, the pressing needle has a pressure-applying part and a force-transmitting part, the pressure-applying part is located in the welding working area of ​​the laser welding assembly, and the pressing assembly can apply a pressing force to the pressure-applying part through the force-transmitting part.

[0008] As a further improvement of the above technical solution, the force transmission portion is arranged to be tilted relative to the optical axis of the laser welding assembly.

[0009] As a further improvement of the above technical solution, the inclination angle between the force transmission portion and the optical axis of the laser welding assembly is between 45° and 60°.

[0010] As a further improvement of the above technical solution, the pressing assembly further includes a pressure sensor, and the force transmission part is connected to the pressure sensor.

[0011] As a further improvement of the above technical solution, the pressing assembly further includes a plane calibration module, and the pressure sensor is arranged on a calibration position of the plane calibration module.

[0012] As a further improvement of the above technical solution, the pressing assembly further includes a height calibration module, and the plane calibration module is arranged on a calibration position of the height calibration module.

[0013] As a further improvement of the above technical solution, the pressing assembly further includes a pressing drive module, and the height calibration module is arranged on a drive position of the pressing drive module.

[0014] As a further improvement of the above technical solution, the pressing assembly further includes an angle calibration module, and the pressure sensor is arranged at a calibration position of the angle calibration module.

[0015] As a further improvement of the above technical solution, a cantilever is provided on the force measuring part of the pressure sensor, the free end of the cantilever extends toward the welding working area of ​​the laser welding assembly, and the force transmission part of the pressure needle is provided on the cantilever.

[0016] As a further improvement of the above technical solution, the pressing part includes a connecting plate and a probe, the connecting plate is connected to the pitch adjustment assembly, the probe is connected to the connecting plate, and the probe is set toward the laser assembly, and the pressure sensor is installed on the connecting plate.

[0017] On the other hand, a wafer repair device is also provided, characterized in that it includes the aforementioned crystal bonding mechanism.

[0018] The beneficial effect of the present invention is that the crystal fixing mechanism is provided with a pressing assembly, and when the laser welding assembly is welding, the pressing assembly can fix the wafer and prevent the wafer from shifting or being struck off by the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic structural diagram of a crystal bonding mechanism provided in a preferred embodiment of the present invention;

[0021] Figure 2 This is an enlarged view of the crystal bonding mechanism near the pressure pin provided in the preferred embodiment of the present invention;

[0022] Figure numerals: 1. Laser welding assembly, 2. Pressing assembly, 3. Plane calibration module, 4. Height calibration module, 5. Pressing drive module, 6. Angle calibration module, 21. Pressure needle, 22. Pressure sensor, 211. Pressure applying part, 212. Force transmission part, 221. Cantilever. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. For example, fixed connection / fixed installation can be selected from screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and other methods as needed. For detachable connection, screw connection, bolt connection, threaded connection, snap connection, mortise and tenon connection, Velcro connection and other methods can be selected as needed. The various technical features in the creation of the present invention can be combined interchangeably without conflicting with each other.

[0024] See Figure 1 and Figure 2 The preferred embodiment of the present invention provides a die-bonding mechanism, comprising a laser welding assembly 1 and a pressing assembly 2. The pressing assembly 2 includes a pressing pin 21, which has a pressure portion 211 and a force transmission portion 212. The pressure portion 211 is located in the welding working area of ​​the laser welding assembly 1. The pressing assembly 2 can apply a pressing force to the pressure portion 211 through the force transmission portion 212. The die-bonding mechanism is provided with the pressing assembly 2. When the laser welding assembly 1 is welding, the pressing assembly 2 can fix the wafer and prevent the wafer from shifting or being struck by the laser.

[0025] The force transmission portion 212 is tilted relative to the optical axis of the laser welding assembly 1 to avoid coaxial vision and reduce the obstruction of the laser and vision by the pressing needle 21.

[0026] Specifically, the inclination angle between the force transmission part 212 and the optical axis of the laser welding assembly 1 is between 45° and 60°. Within this range, the pressure transmission effect can be ensured while reducing the obstruction of the laser and vision by the pressure needle 21.

[0027] The pressing assembly 2 also includes a pressure sensor 22, a plane calibration module 3, a height calibration module 4, a pressing drive module 5, and an angle calibration module 6. The force conduction part 212 is connected to the pressure sensor 22 to increase pressure detection so that the pressure can be controlled within a set range during the pressing process; the pressure sensor 22 is arranged on the calibration position of the plane calibration module 3 to realize the position calibration of the pressure needle 21 in the XY plane, so that the pressure-applying part 211 of the pressure needle 21 can act on the central area of ​​the wafer to be pressed; the plane calibration module 3 is arranged on the calibration position of the height calibration module 4 to increase height calibration to adjust the pressure-applying part 211 of the pressure needle 21 to the focal area of ​​the laser to ensure that the pressure needle 21 can press the wafer during the welding process; the height calibration module 4 is arranged on the driving position of the pressing drive module 5 to increase pressing drive. In this embodiment, the pressing direction is set along the perpendicular direction of the wafer plane; the pressure sensor 22 is arranged on the calibration position of the angle calibration module 6 to increase the angle adjustment of the pressure needle 21 to be compatible with the pressing of different devices in different scenarios.

[0028] Specifically, the angle calibration module 6 includes a first pitch displacement platform and a second pitch displacement platform. The pitch adjustment direction of the first pitch displacement platform and the pitch adjustment direction of the second pitch displacement platform are perpendicular to each other. The pressure needle 21 is installed at the output end of the first pitch displacement platform, and the first pitch displacement platform is installed at the output end of the second pitch displacement platform. During the laser welding process, the first pitch displacement platform and the second pitch displacement platform are used to control the angle of the pressure needle 21 relative to the wafer to ensure that the pressure needle 21 presses the wafer at a suitable angle, further facilitating the pressure needle 21 to accurately press the wafer to prevent the wafer from being knocked off during the laser welding process.

[0029] The plane calibration module 3 includes a first translation stage and a second translation stage. The second pitch stage is installed at the output end of the first translation stage, and the first translation stage is installed at the output end of the second translation stage. The output ends of the first translation stage and the second translation stage move in the X direction and the Y direction respectively. The specific position of the pressure needle 21 in the X direction and the Y direction can be adjusted through the first translation stage and the second translation stage so that the pressure needle 21 can accurately press the wafer in the X direction and the Y direction.

[0030] The height calibration module 4 includes a lifting platform, and a second translation platform is installed at the output end of the lifting platform. The lifting platform can precisely adjust the height of the pressing needle 21 so that the pressing needle 21 can accurately press the wafer in the vertical direction.

[0031] The pressing drive module 5 includes a linear motor, and the lifting platform is installed on the mover of the linear motor. The height of the pressing needle 21 is controlled by the linear motor. After the laser welding is completed, the linear motor can quickly control the pressing needle 21 away from the wafer to prepare for the rework process of the next wafer.

[0032] The force-measuring portion of the pressure sensor 22 is equipped with a cantilever 221, the free end of which extends toward the welding area of ​​the laser welding assembly 1. The force-transmitting portion 212 of the pressure pin 21 is located on the cantilever 221. The addition of the cantilever 221 moves the installation location of the pressure pin 21 from the pressure sensor 22 toward the welding area, facilitating the placement of the pressure pin 21 and the selection of the pressure sensor 22.

[0033] The preferred embodiment of the present utility model also provides a wafer rework equipment, including a grinding component, a mounting plate, a sliding component and the crystal fixing mechanism of the above embodiment, wherein a sliding component is provided on the mounting plate, and the sliding component is connected to the laser welding component 1, and the sliding component is also connected to the grinding component, and the sliding component is used to make the laser welding component 1 and the grinding component slide relative to the mounting plate, and the grinding component is used to grind the wafer pad, and the laser welding component 1 heats the welding pad while heating the LED wafer, so that the grinding component can more easily clean the tin layer on the pad when grinding the wafer pad during rework, thereby making the pad surface smoother and reducing the tin-free residue between the pads, thereby improving the rework quality, and when the laser welding component 1 is welding, the pressing component 2 can fix the wafer, and can prevent the wafer from shifting or being hit by the laser.

[0034] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

[0035] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A die-bonding mechanism, characterized in that: include: Laser welding components; And a pressing assembly, the pressing assembly has a pressing needle, the pressing needle has a pressure-applying part and a force-transmitting part, the pressure-applying part is located in the welding working area of ​​the laser welding assembly, and the pressing assembly can apply a pressing force to the pressure-applying part through the force-transmitting part.

2. The die bonding mechanism according to claim 1, wherein: The force transmission portion is arranged obliquely relative to the optical axis of the laser welding assembly.

3. The die bonding mechanism according to claim 2, wherein: The inclination angle between the force transmission portion and the optical axis of the laser welding assembly is between 45° and 60°.

4. The die bonding mechanism according to claim 1, wherein: The pressing assembly further includes a pressure sensor, and the force conducting portion is connected to the pressure sensor.

5. The die bonding mechanism according to claim 4, characterized in that: The pressing assembly further includes a plane calibration module, and the pressure sensor is arranged on a calibration position of the plane calibration module.

6. The die-bonding mechanism according to claim 5, characterized in that: The pressing assembly further includes a height calibration module, and the plane calibration module is arranged on a calibration position of the height calibration module.

7. The die-bonding mechanism according to claim 6, wherein: The pressing assembly further includes a pressing driving module, and the height calibration module is arranged on a driving position of the pressing driving module.

8. The die bonding mechanism according to claim 4, wherein: The pressing assembly further includes an angle calibration module, and the pressure sensor is disposed on a calibration position of the angle calibration module.

9. The die-bonding mechanism according to claim 4, characterized in that: A cantilever is provided on the force measuring portion of the pressure sensor, the free end of the cantilever extends toward the welding working area of ​​the laser welding assembly, and the force transmission portion of the pressure needle is provided on the cantilever.

10. A wafer repair equipment, characterized in that: The invention comprises a crystal bonding mechanism as described in any one of claims 1 to 9.

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