Silicon wafer steering transportation device

By designing a combination of the first transmission component and the second transmission component, combined with the guide rod, pressure wheel and air knife in the pressure plate assembly, the problem of low transmission efficiency of silicon wafers during the cleaning process is solved, and stable transmission and automatic steering of silicon wafers are achieved.

CN223408818UActive Publication Date: 2025-10-03SHANGHAI FUCHUAN AUTOMATION EQUIP CO LTD
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Patent Information

Application Number
CN202422613358.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-28
Publication Date
2025-10-03
Estimated Expiration
2034-10-28

AI Technical Summary

Technical Problem

Silicon wafers can easily slip off the conveyor belt during the cleaning process, resulting in low transfer efficiency.

Method used

The combined design of the first transmission component and the second transmission component, combined with the pressure plate component, uses structures such as guide rods, pressure wheels and air knives to ensure the stability and direction conversion of silicon wafers during the transmission process.

Benefits of technology

It improves the stability and efficiency of silicon wafer transmission, realizes automatic vertical separation and steering of silicon wafers, avoids slipping, and improves the continuity of the transmission process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of reversing conveying, in particular to a silicon wafer steering conveying device which comprises a first conveying assembly used for conveying silicon wafers to be soaked in liquid. The second conveying assembly is located at the discharging end of the first conveying assembly, and the second conveying assembly is used for receiving the incoming materials of the first conveying assembly and conveying the incoming materials in the direction perpendicular to the plane where the conveying direction of the first conveying assembly is located; the pressing plate assembly comprises at least one first abutting piece used for abutting the silicon wafers on the first transmission assembly and at least one second abutting piece used for abutting the silicon wafers on the second transmission assembly, and the second abutting piece is movably arranged on the second transmission assembly so as to adjust the relative position of the second abutting piece and the second transmission assembly; according to the invention, the first abutting piece and the second abutting piece are arranged above the transmission assembly, so that the silicon wafer always moves along the transmission assembly in the transmission process, and the transmission stability and transmission efficiency of the silicon wafer are improved.
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Description

Technical Field

[0001] The present application relates to the technical field of reversing transmission, and in particular to a silicon wafer reversing transport device. Background Art

[0002] Silicon wafers are lightweight, thin sheets that are hard but brittle. After the wafer's front-end processing is complete, the wafers are grouped together in rows. The subsequent processing step requires the wafers to be removed one by one. Therefore, a switching mechanism is required to steadily and regularly remove the wafers from the rows.

[0003] Traditional wafer inserters are located at the front of the cleaning machine, primarily inserting silicon wafers into a basket for cleaning. After the machine is started, the operator places the wafer carrier onto the feed mechanism's carrier plate. Pressing the "Start" button on the front of the machine causes the carrier plate to move beneath the absorbent plate. The absorbent plate then picks up the wafers and transports them via a conveyor line to the loading station's basket. During transport, the wafers undergo a series of inspections, and only those that pass these tests are placed in the basket. After cleaning, the wafers, submerged in liquid, are prone to slipping off the conveyor belt during transportation, resulting in inefficient wafer transfer. Utility Model Content

[0004] The technical problem to be solved by the utility model is that the transmission efficiency of silicon slices is low.

[0005] To this end, the utility model provides a silicon wafer steering and transportation device.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A silicon wafer steering and transportation device, comprising:

[0008] A first transport component is provided, wherein the first transport component is used to transport the silicon wafer to be immersed in the liquid.

[0009] a second transmission assembly, the second transmission assembly being located at the discharge end of the first transmission assembly, and being used to receive the incoming material from the first transmission assembly and transport it in a direction perpendicular to the plane in which the transmission direction of the first transmission assembly lies;

[0010] A pressure plate assembly, the pressure plate assembly includes at least one first pressing member for pressing the silicon wafer against the first transmission assembly, and at least one second pressing member for pressing the silicon wafer against the second transmission assembly, wherein the second pressing member is movably arranged on the second transmission assembly to adjust its relative position with the second transmission assembly.

[0011] Furthermore, the first transmission component includes a support frame, a water absorption plate, a rotating shaft and a primary belt. The water absorption plate is arranged on the support frame. There are multiple rotating shafts along the transmission direction of the first transmission component. The rotating shaft is rotatably connected to the water absorption plate. A roller is coaxially connected to the rotating shaft. The rollers on the multiple rotating shafts are connected together through a primary belt to realize transmission.

[0012] Furthermore, a plurality of rollers are provided along the axial direction of the rotating shaft, the number of the primary belts is consistent with the number of rollers on one rotating shaft, and the primary belts are sleeved on the relative rollers.

[0013] Furthermore, the first pressing member is a pressure wheel, which is connected to the support frame via a rotating arm. The axial direction of the pressure wheel is parallel to the axial direction of the rotating shaft, and the rotating arm is movably connected to the support frame.

[0014] Furthermore, one end of the rotating arm is hinged to the mounting frame, at least one mounting arm is hinged to the rotating arm, and the second pressing member is connected to the mounting arm.

[0015] Furthermore, the rotating arm is bent toward the first transmission assembly.

[0016] Furthermore, the second pressing member is an air knife.

[0017] Furthermore, guide rods are provided on opposite side walls of the support frame, and the guide rods are located on both sides of the primary belt.

[0018] Furthermore, the second transmission component includes a mounting frame, a support block, a secondary belt and a driving source, the support block is connected between the mounting frames, and two support shafts are rotatably connected to the mounting frame, the support shafts are located at both ends of the support block, and the secondary belt is wound around the two support shafts. The top surface of the support block is arc-shaped, and the secondary belt moves in contact with the top surface of the support block. The transmission direction of the secondary belt close to the first transmission component is the same as the transmission direction of the first transmission component, and the transmission direction of the secondary belt away from the first transmission component is perpendicular to the plane where the transmission direction of the first transmission component is located.

[0019] Furthermore, a sensor is connected to the mounting frame, and the sensor is arranged at a position close to the first transmission component. The sensor is used to detect whether the silicon wafer is normally transported to the belt.

[0020] The beneficial effects of this utility model are as follows: after cleaning, silicon wafers are transported via primary and secondary belts. Guide rods provide positioning and guidance for the silicon wafers, while a pressure wheel presses against the wafers to maintain stable transmission. An air knife blows air toward the secondary belt, pressing the wafers against it and maintaining stable transmission. The wide secondary belt improves transmission efficiency. By rotating the rotating arm, the first mounting arm, and the second mounting arm, the angle and distance between the pressure wheel and the primary belt, and between the air knife and the secondary belt, can be adjusted to suit different working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 It is a structural schematic diagram of the silicon wafer steering and transportation device in the utility model.

[0023] Figure 2 It is a structural diagram of the first transmission component in the utility model.

[0024] Figure 3 It is a structural schematic diagram of the medium pressure plate assembly of the utility model.

[0025] In the figure: 1. First transmission component; 11. Water absorption plate; 12. Support frame; 13. Rotating shaft; 14. Roller; 15. Primary belt; 16. Guide rod; 17. Guide wheel; 18. Motor; 19. Conveyor belt; 2. Second transmission component; 21. Mounting frame; 22. Support block; 23. Secondary belt; 24. Driving source; 25. Mounting side plate; 26. Support shaft; 27. Sensor; 28. Sensor; 3. Pressure plate assembly; 31. Rotating arm; 32. First mounting arm; 33. Second mounting arm; 34. Pressure wheel; 35. Air knife; 4. Silicon wafer. DETAILED DESCRIPTION

[0026] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0028] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0029] Reference Figure 1-3 A silicon wafer steering and transportation device includes a first transmission component 1, a second transmission component 2 and a pressure plate component 3. The first transmission component 1 is located at the feeding end of the second transmission component 2, and the first transmission component 1 is immersed in water. The second transmission component 2 is used to receive the incoming material from the first transmission component 1 and transport it in a direction perpendicular to the plane where the transmission direction of the first transmission component 1 is located.

[0030] The second transmission component 2 includes a mounting frame 21, a support block 22, a secondary belt 23 and a driving source 24. The support block 22 is connected between the mounting frames 21. Two support shafts 26 are rotatably connected to the mounting frame 21. The support shafts 26 are located at both ends of the support block 22, and the secondary belt 23 is wound around the two support shafts 26.

[0031] It should be noted that the top surface of the support block 22 is curved, and the secondary belt 23 moves in contact with the top surface of the support block 22. The transmission direction of the secondary belt 23 at the end closest to the first transmission assembly 1 is the same as that of the first transmission assembly 1, while the transmission direction of the secondary belt 23 at the end away from the first transmission assembly 1 is perpendicular to the plane of the transmission direction of the first transmission assembly 1. A mounting side plate 25 is provided on one side of the mounting frame 21, and a drive source 24 is connected to the mounting side plate 25. The drive source 24 is connected to a support shaft 26 located away from the first transmission assembly 1.

[0032] The first transmission assembly 1 includes a water absorption plate 11, a support frame 12, a rotating shaft 13, a roller 14, and a primary belt 15. The support frame 12 is connected to the mounting frame 21, and the water absorption plate 11 is connected between the support frames 12. The plane on which the water absorption plate 11 is located is a vertical surface. The water absorption plate 11 is a water-permeable plate. The vertical plane on the top of the water absorption plate 11 near the end of the secondary belt 23 near the first transmission assembly 1 is the transmission surface. A water absorption pipe is connected to the support frame 12, and the water absorption end of the water absorption pipe is arranged toward the side wall opposite the transmission surface.

[0033] There are multiple rotating shafts 13, and the axial direction of the rotating shafts 13 is parallel to the axial direction of the support shaft 26. The rotating shafts 13 are rotatably connected to the water absorption plate 11. One of the rotating shafts 13 is located near the second transmission assembly 2. The mounting side plate 25 is connected to a motor 18 for driving the rotating shaft 13. The output shaft of the motor 18 is connected to the rotating shaft 13 located near the second transmission assembly 2 via a transmission belt 19. Each rotating shaft 13 is coaxially fixedly connected to multiple rollers 14. The rollers 14 on each rotating shaft 13 are positioned relative to each other. The primary belt 15 is mounted on the opposite rollers 14. The width of the primary belt 15 is relatively narrow.

[0034] Guide rods 16 are mounted on opposing side walls of support frame 12. Positioned on either side of primary belt 15, guide rods 16 provide positioning and guidance for the silicon wafers 4 being transported along primary belt 15. Guide pulleys 17 are also connected to the lower end of absorbent plate 11 to guide the transport of silicon wafers 4. Nylon sleeves are fitted over guide rods 16, further increasing transfer efficiency by ensuring line contact between the wafers 4 and the conveyor.

[0035] The pressure plate assembly 3 includes a rotating arm 31, a first mounting arm 32, a second mounting arm 33, at least one first pressure member, and at least one second pressure member. One end of the rotating arm 31 is hinged to the outer wall of the mounting frame 21, and the other end is connected to a connecting rod, the axial direction of which is aligned with the axial direction of the rotating shaft 13. A first pressure member is disposed on the connecting rod, opposite the primary belt 15, and is used to press the silicon wafer 4 against the primary belt 15. In this embodiment, the first pressure member is a pressure wheel 34, which is coaxially connected to the connecting rod for rotation.

[0036] One end of the first mounting arm 32 and the second mounting arm 33 are both hinged on the rotating arm 31. Preferably, the rotating arm 31 can be bent toward the first transmission component 1. The hinge point between the first mounting arm 32, the second mounting arm 33 and the rotating arm 31 is located at the bending point of the rotating arm 31, and the bending point is preferably set in the middle position of the rotating arm 31.

[0037] The first mounting arm 32 and the second mounting arm 33 are both connected to a mounting rod at one end away from the rotating arm 31. The second pressure member is a wind knife 35, which is connected to the mounting rod. The first mounting arm 32 and the second mounting arm 33 are rotated to adjust the angle and distance between the wind knife 35 and the secondary belt 23.

[0038] The mounting frame 21 is connected to a sensor 27 and a sensor 28. The sensor 27 is set at a position close to the first transmission component 1. The purpose of setting the sensor seat is to detect whether the silicon wafer 4 is transported to the belt normally, so as to facilitate timely adjustment when problems occur. The sensor 28 is set on the mounting frame 21. Finally, the silicon wafer 4 passes through the sensor 28. The sensor 28 is used to detect whether the silicon wafer 4 is skewed, which is also convenient for adjustment to ensure the continuity of the transportation of the silicon wafer 4.

[0039] The implementation principles of this application are:

[0040] After the silicon wafer 4 is cleaned, it is transported upward toward the second transmission component 2 through the primary belt 15 on the transmission surface of the water absorption plate 11. The guide rod 16 provides limitation and guidance for the silicon wafer 4. The water absorption pipe adsorbs the silicon wafer 4 on the primary belt 15, and the pressure wheel 34 presses the silicon wafer 4 to maintain the stability of the transmission of the silicon wafer 4.

[0041] The silicon wafer 4 is transported along the primary belt 15 toward the secondary belt 23. The secondary belt 23 changes its direction of transport, switching from vertical to horizontal. During this process, to prevent the silicon wafer 4 from sliding, an air knife 35 blows air toward the secondary belt 23, pressing the silicon wafer 4 against it and maintaining its stability. The wide secondary belt 23 improves transfer efficiency, thus achieving automatic vertical diversion.

[0042] Based on the above-described preferred embodiments of the present invention, and in accordance with the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon wafer steering and transporting device, characterized in that: include, A first transport component (1), the first transport component (1) being used to transport a silicon wafer (4) to be immersed in a liquid; a second transmission component (2), the second transmission component (2) being located at the discharge end of the first transmission component (1), the second transmission component (2) being used to receive the incoming material from the first transmission component (1) and to transport the material in a direction perpendicular to the plane where the transmission direction of the first transmission component (1) is located; A pressure plate assembly (3), the pressure plate assembly (3) comprising at least one first pressing member for pressing a silicon wafer (4) against a first transmission assembly (1), and at least one second pressing member for pressing a silicon wafer (4) against a second transmission assembly (2), wherein the second pressing member is movably arranged on the second transmission assembly (2) to adjust its relative position with the second transmission assembly (2).

2. The silicon wafer steering and transporting device according to claim 1, characterized in that: The first transmission component (1) comprises a support frame (12), a water absorption plate (11), a rotating shaft (13) and a primary belt (15); the water absorption plate (11) is arranged on the support frame (12); a plurality of rotating shafts (13) are arranged along the transmission direction of the first transmission component (1); the rotating shaft (13) is rotatably connected to the water absorption plate (11); a roller (14) is coaxially connected to the rotating shaft (13); and the rollers (14) on the plurality of rotating shafts (13) are connected together through the primary belt (15) to realize transmission.

3. The silicon wafer steering and transporting device according to claim 2, characterized in that: A plurality of rollers (14) are arranged along the axial direction of the rotating shaft (13), the number of the primary belts (15) is consistent with the number of rollers (14) on one rotating shaft (13), and the primary belts (15) are sleeved on the relative rollers (14).

4. The silicon wafer steering and transporting device according to claim 2, characterized in that: The first pressing member is a pressure wheel (34), which is connected to the support frame (12) through a rotating arm (31). The axial direction of the pressure wheel (34) is parallel to the axial direction of the rotating shaft (13), and the rotating arm (31) is movably connected to the support frame (12).

5. The silicon wafer steering and transporting device according to claim 4, characterized in that: One end of the rotating arm (31) is hinged to the mounting frame (21), at least one mounting arm is hinged to the rotating arm (31), and the second pressing member is connected to the mounting arm.

6. The silicon wafer steering and transporting device according to claim 4, characterized in that: The rotating arm (31) is bent toward the first transmission component (1).

7. The silicon wafer steering and transporting device according to claim 1, characterized in that: The second pressing member is an air knife (35).

8. The silicon wafer steering and transporting device according to claim 2, wherein: Guide rods (16) are provided on opposite side walls of the support frame (12), and the guide rods (16) are located on both sides of the primary belt (15).

9. The silicon wafer steering and transporting device according to claim 1, characterized in that: The second transmission component (2) includes a mounting frame (21), a support block (22), a secondary belt (23) and a driving source (24), wherein the support block (22) is connected between the mounting frames (21), and two support shafts (26) are rotatably connected to the mounting frame (21), and the support shafts (26) are located at both ends of the support block (22). The secondary belt (23) is wound around the two support shafts (26), and the top surface of the support block (22) is arc-shaped. The secondary belt (23) moves in contact with the top surface of the support block (22), and the transmission direction of the secondary belt (23) at one end close to the first transmission component (1) is the same as the transmission direction of the first transmission component (1), and the transmission direction of the secondary belt (23) at one end away from the first transmission component (1) is perpendicular to the plane where the transmission direction of the first transmission component (1) is located.

10. The silicon wafer steering and transporting device according to claim 9, characterized in that: The mounting frame (21) is connected to a sensor (27), which is arranged at a position close to the first transmission component (1). The sensor (27) is used to detect whether the silicon wafer (4) is normally transported to the belt.