Glass through hole etching device

Abstract

The utility model belongs to a glass through hole etching device in the technical field of glass production. The device body (1) comprises a liquid conveying part (2) and a liquid pumping part (3), the liquid pumping part (3) is located in the middle of the liquid conveying part (2), a liquid conveying cavity (4) is formed between the liquid pumping part (3) and the liquid conveying part (2), a liquid pumping cavity (5) is formed in the liquid pumping part (3), a liquid conveying nozzle (7) is arranged on an etching end face (6) of the device body (1), and a liquid pumping pipe opening (9) is formed in a liquid pumping lower end face (8) of the device body (1). The glass through hole etching device provided by the utility model is simple in structure, can effectively inhibit diffusion etching of liquid medicine and prevent over etching when etching glass to be etched, ensures that the side wall of a glass through hole is smooth, flat and vertical, improves the product quality, can complete etching of a plurality of through holes at one time, improves the etching efficiency, and reduces the production cost. Meanwhile, the universality is improved by replacing local parts, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of glass production, and more specifically relates to a glass through-hole etching device. Background Art

[0002] In recent years, my country's modern science and technology has developed rapidly, and the demand for various electronic products has increased rapidly. Among them, glass has a very wide range of applications, involving all walks of life. The packaging of electronic products and electronic chips is also gradually introducing glass substrates. The glass substrate packaging industry is currently developing a new technology, Through Glass Via (TGV), which primarily uses physical or chemical methods to create a matrix of uniformly sized holes on the glass surface. This facilitates subsequent metal filling and other operations, and has become a rapidly developing technology in the market. Several TGV technologies exist, each with its own drawbacks: 1. Sandblasting: This method uses dry powder sandblasting to etch glass wafers. However, the resulting holes are very rough and can only produce TGLs with larger diameters (>200μm) and larger spacing. 2. Photosensitive Glass: This method uses ultraviolet light to define the pattern on the photosensitive glass, causing a targeted chemical reaction. After exposure, it undergoes a subsequent high-temperature sintering process, transforming the UV-exposed areas into a ceramic material. Finally, hydrofluoric acid etching removes the ceramic material. However, this method is: 1. expensive, both in terms of the material price of the photosensitive glass itself and the process price. 2. The etching accuracy of patterns of different sizes, especially blind vias or blind grooves, can vary significantly due to different etching rates. Furthermore, the high-temperature treatment required can cause the glass to move while semi-cured, resulting in structural offset. 3. Focused discharge method: Glass is placed between two electrodes and a controlled discharge is used to melt a localized area of ​​the glass. Joule heating generates high stress within the glass, causing internal high voltage and dielectric breakdown. This method can produce high-density through-holes with good uniformity and no cracks; however, the through-hole shapes are not very vertical when sliced. 4. Plasma etching method; 5. Laser ablation method; 6. Electrochemical discharge machining method; 7. Laser-induced etching method; etc. Existing processes generally involve high costs, long time periods, or poor hole uniformity, making them difficult to meet actual market needs.

[0003] In the prior art, there is a technology named "A method and etching device for processing through-glass holes based on alternating electric fields" and a publication (announcement) number "CN114605080A". This technology relates to the technical field of manufacturing three-dimensional integrated packaging adapter boards, and in particular, to a method and etching device for processing through-glass holes based on alternating electric fields. A method for processing through-glass holes based on alternating electric fields comprises the following steps: step S1, using a laser to process a target area of ​​a glass wafer to preset etching holes; step S2, cleaning the glass wafer; step S3, after heating the etching solution to the target temperature, placing the glass wafer into the etching solution so that the etching solution covers the glass wafer. The method for processing through-glass holes based on alternating electric fields has a smooth surface, high verticality and precision, a small internal taper of the through-glass holes, and high processing efficiency. It has the characteristics of high efficiency and low cost, and solves the problems of poor processing effect of through-glass holes obtained by existing ultrasonic-assisted etching, as well as the problems of noise pollution and high processing cost.

[0004] However, this technology does not involve the technical problems and technical solutions of the present application. Utility Model Content

[0005] The technical problem to be solved by the utility model is: in view of the deficiencies in the prior art, a glass through-hole etching device is provided which has a simple structure and can effectively suppress the diffusion etching of the chemical solution when etching the glass to be etched, prevent excessive etching, ensure that the side walls of the glass through-hole are smooth, flat and vertical, improve product quality, can complete etching of multiple through-holes at one time, improve etching efficiency, and at the same time can replace local components to improve versatility and reduce the manufacturing cost of the device.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is:

[0007] The utility model is a glass through-hole etching device. The device body comprises an infusion part and a liquid extraction part. The liquid extraction part is located in the middle of the infusion part. An infusion cavity is formed between the liquid extraction part and the infusion part. The interior of the liquid extraction part is a liquid extraction cavity. An infusion nozzle is provided on the etching end face of the device body, and a liquid extraction pipe port is provided on the lower liquid extraction end face of the device body.

[0008] The infusion part is an annular structure, and the extraction part is a cylindrical structure.

[0009] The infusion end surface of the upper end of the device body is connected to the infusion pipeline, and the extraction end surface of the device body is connected to the extraction pipeline.

[0010] The etched end surface of the device body is an annular structure, and a plurality of infusion nozzles are arranged at intervals on the etched end surface.

[0011] The lower end surface of the device body is provided with a plurality of liquid extraction pipe openings at intervals.

[0012] A plurality of connecting through holes are arranged on the etched end surface of the device body, and the threaded portion of each connecting through hole is respectively screwed with an infusion nozzle.

[0013] A plurality of liquid extraction connecting through holes are arranged on the liquid extraction lower end surface of the device body, and the threaded portion of each liquid extraction connecting through hole is respectively screwed with a liquid extraction pipe mouth.

[0014] When the glass through-hole etching device performs glass through-hole etching, the glass to be etched is arranged in a structure capable of being located below the infusion nozzle and the liquid extraction pipe port.

[0015] The infusion pipeline is provided with an infusion pump, and the extraction pipeline is provided with a extraction pump.

[0016] The technical solution of this utility model is adopted, and the working principle and beneficial effects are as follows:

[0017] The glass through-hole etching device described in the utility model is structurally arranged so that the device body is an integral structure, including an infusion part and a liquid extraction part, the liquid extraction part being located in the middle of the infusion part, the upper ends of the infusion part and the liquid extraction part having an upper end face, the lower ends of the infusion part and the liquid extraction part having a lower end face, an infusion cavity being between the liquid extraction part and the infusion part, the interior of the liquid extraction part being the liquid extraction cavity, the lower end face of the infusion part being an infusion area (a liquid spraying area) of an annular structure, the lower end face of the liquid extraction part being a liquid extraction area of ​​a circular structure, an infusion nozzle being arranged on the etching end face of the device body, the infusion nozzle being used for spraying liquid onto the etching area of ​​the glass to be etched, and a liquid extraction pipe opening being arranged on the liquid extraction lower end face of the device body, the liquid extraction pipe opening being used for extracting liquid from the glass to be etched. Such a structure can satisfy the requirements of etching the local position of the glass to be etched (annular structure) while pumping out liquid from the local reaction position (circular structure), timely pumping out the liquid and reactants, inhibiting the liquid from diffusing and etching, ensuring that the side walls of the through-hole are smooth, flat and vertical, and preventing excessive etching (over-engraving) in the non-etching area; the etching of the utility model mainly uses the chemical principle of the reaction between the liquid and the glass, and the process is simple; according to the glass through-hole processing size requirements of different products, nozzles of different diameters and spacings can be adjusted to meet the glass through-hole processing requirements of different products, thereby improving the versatility of the device and eliminating the need to manufacture too many devices; and multiple through-holes can be etched and formed in one operation, thereby improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following is a brief description of the contents and symbols in the drawings of this specification:

[0019] Figure 1 This is a schematic structural diagram of the glass through-hole etching device described in the present invention;

[0020] Figure 2 This is a structural schematic diagram of the lower end surface of the glass through-hole etching device of the present invention;

[0021] Figure 3 This is a structural schematic diagram of the lower end surface of the glass through-hole etching device of the present invention;

[0022] The following are marked in the accompanying drawings: 1. Device body; 2. Infusion site; 3. Extraction site; 4. Infusion cavity; 5. Extraction cavity; 6. Etching end face; 7. Infusion nozzle; 8. Extraction lower end face; 9. Extraction tube mouth; 10. Infusion end face; 11. Infusion pipeline; 12. Extraction upper end face; 13. Extraction pipeline; 14. Glass to be etched; 15. Infusion area; 16. Extraction area. DETAILED DESCRIPTION

[0023] The following is a detailed description of the embodiments of the present invention, such as the shapes, structures, positions and connections of the various components involved, the functions and working principles of the various components, etc., by referring to the accompanying drawings.

[0024] As attached Figure 1 -Attached Figure 3As shown, the present invention is a through-glass hole etching device. The device body 1 includes an infusion portion 2 and a liquid extraction portion 3. The liquid extraction portion 3 is located in the middle of the infusion portion 2. An infusion cavity 4 is formed between the liquid extraction portion 3 and the infusion portion 2. A liquid extraction cavity 5 is formed within the liquid extraction portion 3. An infusion nozzle 7 is provided on the etching end surface 6 of the device body 1, and a liquid extraction nozzle 9 is provided on the lower liquid extraction end surface 8 of the device body 1. The above structure addresses the shortcomings of the existing technology and provides an improved technical solution. When the structure is set, the device body 1 is an integral structure, including an infusion part 2 and a liquid extraction part 3, the liquid extraction part 3 is located in the middle position of the infusion part 2, the upper ends of the infusion part 2 and the liquid extraction part 3 have upper end surfaces, and the lower ends of the infusion part 2 and the liquid extraction part 3 have lower end surfaces. There is an infusion cavity 4 between the liquid extraction part 3 and the infusion part 2, and a liquid extraction cavity 5 inside the liquid extraction part 3. The lower end surface of the infusion part 2 is an infusion area 15 (spraying liquid area) with an annular structure, and the lower end surface of the liquid extraction part 3 is a liquid extraction area 16 with a circular structure. The etching end surface 6 of the device body 1 is provided with an infusion nozzle 7, and the infusion nozzle 7 is used to spray liquid to the etching area of ​​the glass to be etched 14. The liquid extraction lower end surface 8 of the device body 1 is provided with a liquid extraction pipe mouth 9, and the liquid extraction pipe mouth is used to extract liquid from the glass to be etched 14. Such a structure can satisfy the requirements of etching the local position of the glass (product) to be etched (annular structure) while simultaneously pumping out liquid from the local reaction position (circular structure), timely pumping out the liquid (reaction liquid) and reactants, inhibiting the liquid from diffusing and etching, ensuring that the side walls of the through-hole are smooth, flat and vertical, and preventing over-etching (over-engraving) of the non-etched area; the etching of the utility model mainly uses the chemical principle of the reaction between the liquid and the glass, and the process is simple; nozzles of different diameters and spacings can be adjusted according to the glass through-hole processing size requirements of different products to meet the glass through-hole processing requirements of different products, improve the versatility of the device, and do not need to make too many devices; and can etch and form multiple through-holes in one operation, thereby improving efficiency. The glass through-hole etching device described in the utility model has a simple structure. When etching the glass to be etched, it can effectively inhibit the liquid from diffusing and etching, prevent over-etching, ensure that the side walls of the glass through-hole are smooth, flat and vertical, improve product quality, complete multiple through-hole etching at one time, improve etching efficiency, and replace local components to improve versatility and reduce manufacturing costs.

[0025] The infusion part 2 is an annular structure, and the liquid extraction part 3 is a cylindrical structure. In the above structure, the annular structure forms the infusion area 15, and the circular structure at the lower end of the cylindrical structure is the liquid extraction area.

[0026] The infusion end surface 10 at the upper end of the device body 1 is connected to the infusion pipeline 11, and the upper end surface 12 of the device body 1 is connected to the withdrawal pipeline 13. In the above structure, the infusion pipeline is used to continuously supply liquid medicine to the infusion site, and the withdrawal pipeline is used to continuously withdraw liquid medicine from the withdrawal site.

[0027] The etched end surface 6 of the device body 1 is annular in structure, and a plurality of infusion nozzles 7 are provided at intervals on the etched end surface 6. In the above structure, the plurality of infusion nozzles 7 are used to spray liquid medicine.

[0028] The lower end surface 8 of the device body 1 is provided with a plurality of liquid extraction nozzles 9 at intervals. In the above structure, the plurality of liquid extraction nozzles 9 are used to extract the liquid from the glass 14 to be etched.

[0029] The etched end face 6 of the device body 1 is provided with multiple infusion connection holes, each threaded portion of which is threadably connected to an infusion nozzle 7. With this structure, the infusion nozzles 7 are threadedly connected to the threaded portions of the infusion connection holes on the etched end face 6, allowing for convenient replacement of infusion nozzles 7 with different diameters as needed. Furthermore, the spacing between the infusion nozzles 7 can be adjusted by connecting some of the infusion connection holes to the nozzles 7 while threading plugs to other holes. This effectively accommodates the etching of glass of varying sizes and types.

[0030] The lower end face 8 of the device body 1 is provided with a plurality of liquid extraction connection holes, each of which has a threaded portion threadedly connected to a liquid extraction nozzle 9. This structure allows the liquid extraction nozzles 9 to be flexibly connected to the lower end face 8, allowing for convenient replacement of nozzles 9 with different diameters as needed. Furthermore, some of the liquid extraction connection holes can be connected to the liquid extraction nozzles 9, while others can be threaded with plugs. This allows for the installation of varying numbers of liquid extraction nozzles 9, allowing for adjustable spacing between the nozzles 9. This effectively accommodates the extraction of glass of varying sizes and types.

[0031] When etching through-glass holes, the glass to be etched 14 is positioned below the infusion nozzle 7 and the extraction nozzle 9. An infusion pump is provided on the infusion line 11, and a withdrawal pump is provided on the withdrawal line 13. This structure allows the delivery pump to reliably deliver the drug solution under pressure, while the withdrawal pump allows for pressure withdrawal of the drug solution.

[0032] The glass through-hole etching device described in the present invention has an integral structure, including an infusion part 2 and a liquid extraction part 3, the liquid extraction part 3 is located in the middle of the infusion part 2, the upper ends of the infusion part 2 and the liquid extraction part 3 have an upper end surface, the lower ends of the infusion part 2 and the liquid extraction part 3 have a lower end surface, an infusion cavity 4 is between the liquid extraction part 3 and the infusion part 2, the interior of the liquid extraction part 3 is a liquid extraction cavity 5, the lower end surface of the infusion part 2 is an infusion area 15 (spraying liquid area) of an annular structure, the lower end surface of the liquid extraction part 3 is a liquid extraction area 16 of a circular structure, an etching end surface 6 of the device body 1 is provided with an infusion nozzle 7, the infusion nozzle 7 is used to spray liquid to the etching area of ​​the glass to be etched 14, and a liquid extraction pipe mouth 9 is provided on the liquid extraction lower end surface 8 of the device body 1, and the liquid extraction pipe mouth is used to extract liquid from the glass to be etched 14. Such a structure can satisfy the requirements of etching the local position of the glass (product) to be etched (annular structure) while pumping liquid from the local reaction position (circular structure), timely pumping out the liquid (reaction liquid) and reactants, inhibiting the liquid from diffusing and etching, ensuring that the side walls of the through-hole are smooth, flat and vertical, and preventing excessive etching (over-engraving) in the non-etching area; the etching of the utility model mainly uses the chemical principle of the reaction between the liquid and the glass, and the process is simple; according to the glass through-hole processing size requirements of different products, nozzles of different diameters and spacings can be adjusted to meet the glass through-hole processing requirements of different products, thereby improving the versatility of the device and eliminating the need to manufacture too many devices; and multiple through-holes can be etched and formed in one operation, thereby improving efficiency.

[0033] The above is an exemplary description of the present invention in conjunction with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the scope of protection of the present invention.

Claims

1. A through-glass hole etching device, characterized in that: The device body (1) comprises an infusion portion (2) and a liquid extraction portion (3), wherein the liquid extraction portion (3) is located in the middle of the infusion portion (2), an infusion cavity (4) is formed between the liquid extraction portion (3) and the infusion portion (2), and a liquid extraction cavity (5) is formed inside the liquid extraction portion (3). An infusion nozzle (7) is provided on an etched end surface (6) of the device body (1), and a liquid extraction tube port (9) is provided on a liquid extraction lower end surface (8) of the device body (1).

2. The through-glass hole etching device according to claim 1, wherein: The infusion part (2) is an annular structure, and the extraction part (3) is a cylindrical structure.

3. The through-glass hole etching device according to claim 1 or 2, characterized in that: The infusion end surface (10) at the upper end of the device body (1) is connected to the infusion pipeline (11), and the extraction upper end surface (12) of the device body (1) is connected to the extraction pipeline (13).

4. The through-glass hole etching device according to claim 2, wherein: The etched end surface (6) of the device body (1) is an annular structure, and a plurality of infusion nozzles (7) are arranged at intervals on the etched end surface (6).

5. The through-glass hole etching device according to claim 1 or 2, characterized in that: The lower end surface (8) of the device body (1) is provided with a plurality of liquid extraction pipe openings (9) at intervals.

6. The through-glass hole etching device according to claim 1 or 2, characterized in that: A plurality of infusion connection through holes are provided on the etched end surface (6) of the device body (1), and an infusion nozzle (7) is screwed onto the threaded portion of each infusion connection through hole.

7. The through-glass hole etching device according to claim 1 or 2, characterized in that: A plurality of liquid extraction connection through holes are provided on the liquid extraction lower end surface (8) of the device body (1), and a liquid extraction pipe opening (9) is screwed onto the threaded portion of each liquid extraction connection through hole.

8. The through-glass hole etching device according to claim 1, wherein: When the glass through-hole etching device performs glass through-hole etching, the glass to be etched (14) is configured to be located below the infusion nozzle (7) and the liquid extraction tube port (9).

9. The through-glass hole etching device according to claim 3, wherein: The infusion pipeline (11) is provided with an infusion pump, and the extraction pipeline (13) is provided with a extraction pump.

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