Pressing module and electronic equipment
By using a layered pressing module structure and adhesive fasteners, the high cost problem caused by the complex pressing module structure is solved, enabling low-cost manufacturing of multifunctional pressing modules and electronic devices.
Patent Information
- Application Number
- CN202423106881.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-16
AI Technical Summary
The existing pressing module has a complex structure, resulting in high manufacturing costs.
The stacked pressing module structure includes a first circuit board, a pressing component, a pressure sensing component, a second circuit board, a support component, a connector, and a switch component. The components are fixed together by adhesive components to achieve capacitive touch, pressure sensing, and tactile feedback functions.
It reduces the manufacturing cost of pressing modules and electronic devices, improves assembly efficiency and component lifespan, and enhances appearance quality and sensing accuracy.
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Figure CN223665335U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of pressing devices, in particular to a pressing module and an electronic device. BACKGROUND
[0002] The keys in the electronic device can realize multiple functions, such as focusing, recording, taking pictures, etc. These functions are mainly realized by the pressing module where the keys are located in the form of capacitive touch, pressure sensing and tactile feedback. However, the structure of the current pressing module is relatively complex, which makes the manufacturing cost of the pressing module high. CONTENT OF THE UTILITY MODEL
[0003] In view of the above, it is necessary to provide a pressing module and an electronic device to reduce the manufacturing cost on the basis of meeting multiple functions.
[0004] The embodiment of the present application provides a pressing module, comprising:
[0005] A first circuit board is used for being mounted on the inner side of the shell of an electronic device;
[0006] A pressing piece is used for being embedded in the shell, and part of the pressing piece protrudes from the shell;
[0007] A pressure sensing piece is arranged on the side of the first circuit board away from the pressing piece and is electrically connected with the first circuit board;
[0008] A second circuit board is in communication with the first circuit board and is arranged on the side of the pressure sensing piece away from the first circuit board;
[0009] A supporting piece is arranged between the second circuit board and the pressure sensing piece;
[0010] A connecting piece is arranged on the side of the second circuit board away from the supporting piece and is used for being mounted in the shell;
[0011] A switch piece is arranged on the side of the connecting piece facing the second circuit board and is electrically connected with the second circuit board;
[0012] When the pressing piece is pressed, the pressing piece pushes the first circuit board, so that the pressure sensing piece, the supporting piece, the second circuit board and the switch piece are sequentially pushed, so that the switch piece and the second circuit board form a conductive loop.
[0013] The press module has multiple functions when installed on the electronic device, including capacitive touch, pressure sensing, and tactile feedback.
[0014] In some embodiments, the press module further comprises:
[0015] A first adhesive member is connected between the first circuit board and the pressing member to fix the first circuit board and the pressing member.
[0016] Therefore, the first adhesive member can fix the first circuit board and the pressing member, thereby reducing the assembly difficulty of the press module and lowering the manufacturing cost of the press module. In addition, the first adhesive member can fix the first circuit board and the pressing member, thereby reducing the separation difficulty of the first circuit board and the pressing member and lowering the replacement cost of the first circuit board and the pressing member.
[0017] In some embodiments, the surface of the pressing member facing the first circuit board and the surface of the first circuit board facing the pressing member are shaped to match each other, and the projection area of the first adhesive member on the pressing member in the direction from the first circuit board to the pressing member is smaller than the area of the surface of the pressing member facing the first circuit board.
[0018] Therefore, the projection area of the first adhesive member on the pressing member in the direction from the first circuit board to the pressing member is smaller than the area of the surface of the pressing member facing the first circuit board, so that a gap is formed between the first adhesive member and the periphery of the pressing member, thereby preventing the first adhesive member from overflowing from the periphery of the pressing member during curing and extrusion, and improving the appearance quality of the electronic device installed with the press module.
[0019] In some embodiments, the pressure sensing member comprises at least one of ink and piezoelectric ceramic.
[0020] Therefore, the sensitivity of ink and piezoelectric ceramic is higher than that of other pressure sensing members, and setting the pressure sensing member as ink or piezoelectric ceramic can improve the sensing accuracy of the pressure sensing member.
[0021] In some embodiments, the pressure sensing member is two, and the two pressure sensing members correspond to the two ends of the pressing member in the direction from the second circuit board to the first circuit board.
[0022] Therefore, the two pressure sensing members correspond to the two ends of the pressing member in the direction from the second circuit board to the first circuit board, thereby improving the sensing accuracy of the press module to pressure.
[0023] In some embodiments, the support member comprises:
[0024] a reinforcing body arranged on the second circuit board;
[0025] a flexible body arranged on the reinforcing body and carrying the pressure sensing member.
[0026] Therefore, the pressure sensing member can be flexibly supported by the flexible body, so as to avoid damage of the pressure sensing member caused by excessive force of the first circuit board, and the service life of the pressure sensing member is improved.
[0027] In some embodiments, the pressing module further comprises:
[0028] a second adhesive member connected between the support member and the second circuit board, so as to fix the second circuit board and the support member.
[0029] Therefore, the support member and the second circuit board can be fixed by the second adhesive member, so as to reduce the assembly difficulty of the pressing module, and the manufacturing cost of the pressing module is reduced, and the second circuit board and the support member can be separated by the second adhesive member, so as to reduce the replacement cost of the second circuit board and the support member.
[0030] In some embodiments, the connecting member comprises:
[0031] a main body carrying the switch member and used for being installed in the housing;
[0032] two support bodies respectively connected to opposite ends of the main body and each used for supporting the second circuit board.
[0033] Therefore, the two support bodies are respectively connected to the opposite ends of the main body, so that the connecting member is substantially in a U-shaped structure, and the two support bodies can support the second circuit board respectively, so as to reduce the pressure of the second circuit board on the switch member, and the service life of the switch member is improved.
[0034] In some embodiments, the first circuit board and the second circuit board are connected by a connector, and the end of the first circuit board and the end of the second circuit board are each fixed with a reinforcing member.
[0035] Therefore, the reinforcing member can reduce the collision of external components on the first circuit board and the second circuit board, so as to improve the service life of the first circuit board and the second circuit board.
[0036] The embodiments of the present application also provide an electronic device comprising:
[0037] a housing;
[0038] The first circuit board is mounted on the inner side of the shell, and the pressing member is embedded in the shell and partially protrudes from the shell.
[0039] The pressing module of the electronic device has multiple functions, including capacitive touch, pressure sensing, and tactile feedback. Furthermore, the multiple components in the pressing module are arranged in a stacked manner, which simplifies the structure and reduces the installation difficulty, thereby reducing the manufacturing cost of the electronic device. BRIEF DESCRIPTION OF DRAWINGS
[0040] Figure 1 FIG. 1 is a structural schematic diagram of a pressing module according to an embodiment of the present application.
[0041] Figure 2 FIG. 2 is an exploded schematic diagram of the pressing module shown in FIG. 1. Figure 1
[0042] Figure 3 FIG. 4 is a structural schematic diagram of an electronic device according to an embodiment of the present application.
[0043] Main element symbol explanation: pressing module 100, first circuit board 110, pressing member 120, pressure sensing member 130, second circuit board 140, support member 150, reinforcing body 151, flexible body 152, connecting member 160, main body 161, support body 162, switch member 170, first adhesive 180, second adhesive 190, connector 191, reinforcing member 192, electronic device 1000, shell 200. DETAILED DESCRIPTION
[0044] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, in which the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are for the purpose of explanation only, and should not be understood as limiting the present application.
[0045] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be fixed connection, detachable connection, or integral connection; it can be mechanical connection, electrical connection, or communication with each other; it can be direct connection or indirect connection through an intermediate medium; it can be internal connection of two elements or interaction relationship between two elements. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0046] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0047] Please refer to Figure 1 and Figure 2 The present application provides a pressing module 100, comprising a first circuit board 110, a pressing piece 120, a pressure sensing piece 130, a second circuit board 140, a supporting piece 150, a connecting piece 160 and a switch piece 170. The first circuit board 110 is used to be installed on the inner side of the shell of an electronic device, the pressing piece 120 is used to be embedded in the shell of the electronic device, and part of the pressing piece 120 protrudes from the shell of the electronic device. The pressure sensing piece 130 is arranged on the side of the first circuit board 110 away from the pressing piece 120 and is electrically connected with the first circuit board 110. The second circuit board 140 is in communication with the first circuit board 110 and is arranged on the side of the pressure sensing piece 130 away from the first circuit board 110. The supporting piece 150 is arranged between the second circuit board 140 and the pressure sensing piece 130. The connecting piece 160 is arranged on the side of the second circuit board 140 away from the supporting piece 150 and is used to be installed in the shell of the electronic device. The switch piece 170 is arranged on the side of the connecting piece 160 facing the second circuit board 140 and is electrically connected with the second circuit board 140. When the pressing piece 120 is pressed, the pressing piece 120 pushes the first circuit board 110, so that the pressure sensing piece 130, the supporting piece 150, the second circuit board 140 and the switch piece 170 are sequentially pushed, thereby forming a conductive loop between the switch piece 170 and the second circuit board 140.
[0048] Exemplarily, the switch piece 170 is a metal spring piece. When the switch piece 170 is pushed by the second circuit board 140, the center of the switch piece 170 is concave downward to contact the circuit on the second circuit board 140, so that the switch piece 170 and the second circuit board 140 form a conductive loop, and a flowing current is generated between the second circuit board 140 and the switch piece 170, thereby starting the preset function of the electronic device where the pressing module 100 is arranged.
[0049] When the pressing module 100 is installed on the electronic device, the capacitive touch is realized through the first circuit board 110, the pressure sensing is realized through the pressure sensing piece 130, and the tactile feedback is realized through the switch piece 170 and the second circuit board 140, so that the pressing module 100 has multiple functions. Further, the multiple components in the pressing module 100 are arranged in a stacked manner, which is simple in structure and low in installation difficulty, and is conducive to reducing the manufacturing cost of the pressing module 100.
[0050] Please refer to Figure 2In some embodiments, the pressing module 100 further comprises a first adhesive 180. The first adhesive 180 is connected between the first circuit board 110 and the pressing member 120 to fix the first circuit board 110 and the pressing member 120. For example, the first adhesive 180 can be a double-sided adhesive tape or a cured adhesive formed by injection.
[0051] Therefore, the first circuit board 110 and the pressing member 120 are fixed by the first adhesive 180, which can reduce the assembly difficulty of the pressing module 100, and is conducive to reducing the manufacturing cost of the pressing module 100. In addition, the first circuit board 110 and the pressing member 120 are fixed by the first adhesive 180, which can reduce the separation difficulty of the first circuit board 110 and the pressing member 120, and is conducive to reducing the replacement cost of the first circuit board 110 and the pressing member 120.
[0052] In some embodiments, the surface of the pressing member 120 facing the first circuit board 110 and the surface of the first circuit board 110 facing the pressing member 120 are matched in shape, and the projection area of the first adhesive 180 on the pressing member 120 in the direction from the first circuit board 110 to the pressing member 120 is smaller than the area of the surface of the pressing member 120 facing the first circuit board 110.
[0053] Therefore, the projection area of the first adhesive 180 on the pressing member 120 in the direction from the first circuit board 110 to the pressing member 120 is smaller than the area of the surface of the pressing member 120 facing the first circuit board 110, which can form a gap between the first adhesive 180 and the periphery of the pressing member 120 to avoid the overflow of the first adhesive 180 from the periphery of the pressing member 120 during curing and extrusion, thereby improving the appearance quality of the electronic device installed with the pressing module 100.
[0054] In some embodiments, the pressure sensing member 130 comprises at least one of ink and piezoelectric ceramic. When the ink is stressed, the surface of the ink will deform, thereby causing a change in resistance. When the piezoelectric ceramic is stressed, the surface of the piezoelectric ceramic will deform, thereby causing a change in electric charge. The working process and principle of pressure detection by ink and piezoelectric ceramic can be directly obtained from the published documents, and will not be described here.
[0055] Therefore, the sensitivity of the ink and the piezoelectric ceramic is higher than that of other pressure sensing members 130, and setting the pressure sensing member 130 as ink or piezoelectric ceramic is conducive to improving the sensing accuracy of the pressure sensing member 130.
[0056] Please refer to Figure 2In some embodiments, the pressure sensing pieces 130 are two, and the two pressure sensing pieces 130 correspond to the two ends of the pressing piece 120 respectively along the direction in which the second circuit board 140 points to the first circuit board 110. For example, the two pressure sensing pieces 130 are both ink, or both piezoelectric ceramics, or include one ink and one piezoelectric ceramic. To ensure the sensing accuracy of the pressure sensing pieces 130, it is preferred that the two pressure sensing pieces 130 are both ink, or both piezoelectric ceramics.
[0057] Therefore, the two pressure sensing pieces 130 correspond to the two ends of the pressing piece 120 respectively along the direction in which the second circuit board 140 points to the first circuit board 110, which is beneficial to improve the sensing accuracy of the pressing module 100 to the pressure.
[0058] Please refer to Figure 1 and Figure 2 In some embodiments, the support 150 includes a reinforcing body 151 and a flexible body 152. The reinforcing body 151 is arranged on the second circuit board 140, and the flexible body 152 is arranged on the reinforcing body 151 and carries the pressure sensing pieces 130. For example, the reinforcing body 151 can be a steel sheet, and the flexible body 152 can be silica gel. In the present embodiment, the flexible body 152 is two, and the two flexible bodies 152 are arranged correspondingly to the two pressure sensing pieces 130.
[0059] Therefore, the flexible body 152 can flexibly support the pressure sensing pieces 130, so as to avoid damage of the pressure sensing pieces 130 caused by excessive force of the first circuit board 110 on the pressure sensing pieces 130, which is beneficial to improve the service life of the pressure sensing pieces 130.
[0060] Please refer to Figure 2 In some embodiments, the pressing module 100 further includes a second adhesive 190. The second adhesive 190 is connected between the reinforcing body 151 of the support 150 and the second circuit board 140, so as to fix the second circuit board 140 and the support 150. For example, the second adhesive 190 can be a finished double-sided adhesive, or a solidified adhesive formed by injection molding.
[0061] Therefore, the second adhesive 190 can fix the reinforcing body 151 and the second circuit board 140, which is beneficial to reduce the assembly difficulty of the pressing module 100, and thus reduce the manufacturing cost of the pressing module 100. In addition, the second adhesive 190 can fix the second circuit board 140 and the reinforcing body 151, which is beneficial to reduce the separation difficulty of the second circuit board 140 and the support 150, and thus reduce the replacement cost of the second circuit board 140 and the support 150.
[0062] Please refer to Figure 2In some embodiments, the connecting member 160 comprises a main body 161 and two supporting bodies 162. The main body 161 carries the switch member 170 and is used to be mounted in the shell. The two supporting bodies 162 are respectively connected to opposite ends of the main body 161 and are used to support the second circuit board 140.
[0063] Therefore, the two supporting bodies 162 are respectively connected to opposite ends of the main body 161, so that the connecting member 160 is substantially in a U-shaped structure. The two supporting bodies 162 can respectively support the second circuit board 140, which can reduce the pressure of the second circuit board 140 on the switch member 170, and is conducive to improving the service life of the switch member 170.
[0064] In the embodiment, the main body 161 and the two supporting bodies 162 are in an integrated structure, so that the connecting member 160 is substantially in a U-shaped structure. The U-shaped connecting member 160 can be mounted with the electronic device on the basis of supporting the switch member 170, which is conducive to the miniaturization of the pressing module 100. Exemplarily, the main body 161 and the supporting bodies 162 can be plastic members.
[0065] In some embodiments, the first circuit board 110 and the second circuit board 140 are connected through the connector 191, and the end of the first circuit board 110 and the end of the second circuit board 140 are fixed with the reinforcing member 192.
[0066] Therefore, the reinforcing member 192 can reduce the collision of external components on the first circuit board 110 and the second circuit board 140, so as to improve the service life of the first circuit board 110 and the second circuit board 140.
[0067] Please refer to Figure 1 and Figure 2 In the embodiment, the end of the first circuit board 110 away from the pressing member 120 is provided with the connector 191 and the reinforcing member 192, and the opposite ends of the second circuit board 140 are respectively provided with the connector 191 and the reinforcing member 192. The connector 191 and the reinforcing member 192 on the first circuit board 110 correspond to each other and are respectively arranged on opposite sides of the first circuit board 110. The connector 191 and the reinforcing member 192 on the second circuit board 140 correspond to each other and are respectively arranged on opposite sides of the second circuit board 140. Exemplarily, the reinforcing member 192 can be adhered on the first circuit board 110 and the second circuit board 140 through double-sided adhesive tape.
[0068] Please refer to Figure 3 The application also provides an electronic device 1000, which comprises a shell 200 and the above-mentioned pressing module 100 (as shown in Figure 1 The first circuit board 110 is mounted on the inner side of the shell 200, and the pressing member 120 is embedded in the shell 200 and partially protrudes from the shell 200. The electronic device 1000 can be a mobile phone, a tablet computer, etc.
[0069] In the pressing module 100 of the electronic device 1000, the capacitive touch is realized by the first circuit board 110, the pressure sensing is realized by the pressure sensing piece 130, and the tactile feedback is realized by the switch piece 170 and the second circuit board 140, so that the pressing module 100 has multiple functions. Further, the multiple components in the pressing module 100 are arranged in a stacked manner, which is simple in structure and low in installation difficulty, and is conducive to reducing the manufacturing cost of the electronic device 1000.
[0070] It is apparent for those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, and the scope of the present application is defined by the appended claims rather than the foregoing description, and it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims.
[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application but not limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the present application.
Claims
1. A press module, characterized by, The press module comprises: a first circuit board for being mounted on the inner side of the shell of the electronic device; a pressing piece for being embedded in the shell, and part of the pressing piece protrudes out of the shell; a pressure sensing piece arranged on the side of the first circuit board away from the pressing piece and electrically connected with the first circuit board; a second circuit board in communication with the first circuit board and arranged on the side of the pressure sensing piece away from the first circuit board; a supporting piece arranged between the second circuit board and the pressure sensing piece; a connecting piece arranged on the side of the second circuit board away from the supporting piece and for being mounted in the shell; a switch piece arranged on the side of the connecting piece facing the second circuit board and electrically connected with the second circuit board; wherein, when the pressing piece is pressed, the pressing piece pushes the first circuit board, so that the pressure sensing piece, the supporting piece, the second circuit board and the switch piece are sequentially pushed, thereby forming a conductive loop between the switch piece and the second circuit board.
2. The press module of claim 1, wherein, The press module further comprises: a first adhesive piece connected between the first circuit board and the pressing piece to fix the first circuit board and the pressing piece.
3. The press module of claim 2, wherein, The surface of the pressing piece facing the first circuit board and the surface of the first circuit board facing the pressing piece are adapted in shape, and the projection area of the first adhesive piece on the pressing piece in the direction of the first circuit board pointing to the pressing piece is smaller than the area of the surface of the pressing piece facing the first circuit board.
4. The press module of claim 1, wherein, The pressure sensing piece comprises at least one of ink and piezoelectric ceramic.
5. The press module of claim 4, wherein, The pressure sensing piece is two, and the two pressure sensing pieces correspond to the two ends of the pressing piece in the direction of the second circuit board pointing to the first circuit board.
6. The press module of claim 1, wherein, The supporting piece comprises: a reinforcing body arranged on the second circuit board; a flexible body arranged on the reinforcing body and carrying the pressure sensing piece.
7. The press module of claim 1, wherein, The press module further comprises: a second adhesive piece connected between the supporting piece and the second circuit board to fix the second circuit board and the supporting piece.
8. The press module of claim 1, wherein, The connecting piece comprises: a main body carrying the switch piece and for being mounted in the shell; two supporting bodies respectively connected to the opposite ends of the main body and both for supporting the second circuit board.
9. The press module of claim 1, wherein, The first circuit board and the second circuit board are connected through a connector, and the end portions of the first circuit board and the second circuit board are both fixed with reinforcing pieces.
10. An electronic device, comprising: The press module comprises: a shell; the press module according to any one of claims 1 to 9, the first circuit board being mounted on the inner side of the shell, and the pressing piece being embedded in the shell, and part of the pressing piece protruding out of the shell.
Citation Information
Cited By
Key module and electronic product
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