Edge correcting device of heating cavity of sputter coating machine

Abstract

The utility model provides an edge correcting device of a heating cavity of a sputter coating machine, which comprises a laser emitting head, a receiving device arranged at the lower part of the laser emitting head and used for receiving laser emitted by the laser emitting head, a trimming edge arranged on one side of a wafer, and a laser emitting head and a receiving end of the receiving device are arranged on the trimming edge when the trimming edge is positioned between the laser emitting head and the receiving end of the receiving device. The receiving device receives laser emitted by the laser emitting head and transmits a signal to the rotating tray control structure, the wafer control structure controls the rotating tray to stop rotating, and when the edge cutting position deviates from the position between the laser emitting head and the receiving end of the receiving device, the edge cutting position is blocked by the non-edge-cutting position of the wafer. The receiving device cannot receive the laser emitted by the laser emitting head, so that a signal cannot be transmitted to the rotating tray control structure, the control motor rotates to drive the rotating shaft to rotate, the rotating tray is driven to rotate, and the position of the wafer is finely adjusted. And the receiving device receives the laser emitted by the laser emitting head and transmits a signal to the rotary tray control structure.

Description

Technical Field

[0001] The utility model relates to the technical field of sputtering coating, and more specifically to an edge correction device of a heating chamber of a sputtering coating machine. Background Art

[0002] Sputtering is the process of bombarding a target material with ions. The process of dislodging atoms from the target is called sputtering, and the deposition of these atoms on the substrate to form a film is called sputtering coating. To produce high-quality optical thin films, a magnetron sputtering device is filled with a certain amount of working gas. The target gun is ignited to ionize the gas. The ions, under the influence of electric and magnetic fields, strike the target material, sputtering atoms that are deposited on the substrate to form a film. Accurately controlling parameters such as the reaction gas pressure, the distance between the target and the substrate, and the sputtering power allows for precise control of the deposition rate to achieve high-quality optical thin film materials.

[0003] However, the existing sputtering coating machine is prone to inaccurate monitoring of the wafer position during heating. Therefore, it is necessary to provide an edge correction device for the heating chamber of the sputtering coating machine that can accurately monitor and correct the position of the wafer 4. Utility Model Content

[0004] In view of this, in order to solve the above problems, the utility model proposes an edge correction device for the heating chamber of a sputtering coating machine, in which an edge correction device 5 is provided, and a laser emitting head 54 is provided in the edge correction device 5. The laser emitting head 54 emits laser to transmit signals with the receiving device 6 below, detects the position of the cut edge 41 of the wafer 4 and corrects the edge, adjusts the position of the wafer 4 for easy positioning, and makes the cut edge position of each wafer consistent, which is convenient for subsequent clamping.

[0005] A side correction device for a heating chamber of a sputtering coating machine, wherein the heating chamber comprises a shell 1, a connecting plate 11 is provided at the bottom of the shell 1, a through hole 12 is provided at the connecting plate 11, a rotating tray 21 is provided in the shell 1, the rotating tray 21 is used to place a wafer 4, a rotating shaft 22 is provided at the bottom of the rotating tray 21, the rotating shaft 22 passes through the through hole 12 and is connected to the motor 3, and the rotation of the motor 3 drives the rotating shaft 22 to rotate, characterized in that: an side of the upper side of the shell 1 is provided with a side correction device 5, the side correction device 5 comprises a laser emitting head 54, a receiving device 6 is provided at the lower part of the laser emitting head 54, and the receiving end of the receiving device 6 is fixedly located in the shell 1, the output end of the receiving device 6 is fixedly located outside the shell 1 and is electrically connected to the rotating tray control structure, the receiving device 6 is used to receive the laser emitted by the laser emitting head 54, a cutting edge 41 is provided on one side of the wafer 4, and when the cutting edge 41 is in the When it is between the laser emitting head 54 and the receiving end of the receiving device 6, the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, and the wafer 4 control structure controls the rotating tray 21 to stop rotating. When the cutting edge 41 position deviates from the position between the laser emitting head 54 and the receiving end of the receiving device 6, due to the obstruction of the non-cutting edge 41 position of the wafer 4, the receiving device 6 cannot receive the laser emitted by the laser emitting head 54, and therefore cannot transmit the signal to the rotating tray control structure. Therefore, the control motor 3 is controlled to rotate to drive the rotating shaft 22 to rotate, thereby driving the rotating tray 21 to rotate, and fine-tuning the position of the wafer 4 until the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, and fine-tuning the position of the wafer 4 for easy positioning, so that the cutting edge position of each wafer is consistent in direction, which is convenient for subsequent clamping.

[0006] Furthermore, the edge correction device 5 also includes a support column 51 and a laser head fixing plate 52. One end of the support column 51 is detachably connected to the top of the shell 1, and the other end is provided with a laser head fixing plate 52. The end of the laser head fixing plate 52 away from the support column 51 is provided with a mounting hole 521, and a laser emitting head 54 is provided in the mounting hole 521 for emitting laser.

[0007] Furthermore, a PCB board 56 is provided on the laser head fixing plate 52 , and a protective cover 59 is provided on the outer edge of the laser head fixing plate 52 to insulate the PCB board 56 .

[0008] Furthermore, a groove 522 is provided below one end of the laser head fixing plate 52, a fixing buckle 53 is provided in the groove 522, the laser emitting head 54 is provided above the fixing buckle 53 and placed in the mounting hole 521, a clamping member 55 is provided above the laser emitting head 54, the clamping member 55 is connected to the mounting hole 521, and the laser emitting head 54 is connected to the laser head fixing plate 52 through the clamping member 55 and the fixing hole.

[0009] Furthermore, a mirror barrel 57 is provided under the laser emitting head 54, and the mirror barrel 57 eliminates ambient light. One end of the mirror barrel 57 is connected to the laser head fixing plate 52, and a lens limiting tube 571 is provided inside the mirror barrel 57. One end of the lens limiting tube 571 is provided with an upper lens, and the other end is provided with a lower lens 575. The laser emitted by the laser emitting head 54 is collimated by the upper lens and the lower lens 575.

[0010] Furthermore, the upper lens includes a first upper lens 572 and a second upper lens 573 , both of which are hemispherical, and the end faces of the first upper lens 572 and the second upper lens 573 are tangent, and the first upper lens 572 and the second upper lens 573 disperse the laser beam onto the lower lens 575 .

[0011] Furthermore, an upper lens protection block 574 is provided between the first upper lens 572 and the fixing buckle 53 .

[0012] Furthermore, the lower lens 575 is a convex lens that protrudes downward and is used to align the laser beam before the laser beam enters the chamber. A lower lens protection block 576 is provided under the lower lens 575, and the edge of the lower lens protection block 576 is connected to the bottom of the lens barrel 57 by bolts.

[0013] Furthermore, a protective barrel 58 is provided on the outside of the mirror barrel 57 near the bottom, for protecting the mirror barrel 57 and the lower lens 575 .

[0014] Beneficial effects of the present utility model: A correction device for a heating chamber of a sputtering coating machine, the heating chamber comprising a shell 1, a connecting plate 11 being provided at the bottom of the shell 1, a through hole 12 being provided at the connecting plate 11, a rotating tray 21 being provided in the shell 1, the rotating tray 21 being used to place a wafer 4, a rotating shaft 22 being provided at the bottom of the rotating tray 21, the rotating shaft 22 passing through the through hole 12 and being connected to a motor 3, the rotation of the motor 3 drives the rotating shaft 22 to rotate, an edge correction device 5 being provided on one side above the shell 1, the edge correction device 5 comprising a laser emitting head 54, a receiving device 6 being provided at the lower part of the laser emitting head 54 and a receiving end of the receiving device 6 being fixed in the shell 1, an output end of the receiving device 6 being fixed outside the shell 1 and being electrically connected to a rotating tray control structure, the receiving device 6 being used to receive the laser emitted by the laser emitting head 54, and one side of the wafer 4 A cutting edge 41 is provided. When the cutting edge 41 is located between the laser emitting head 54 and the receiving end of the receiving device 6, the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure. The wafer 4 control structure controls the rotating tray 21 to stop rotating. When the position of the cutting edge 41 deviates from the position between the laser emitting head 54 and the receiving end of the receiving device 6, due to the obstruction of the non-cutting edge 41 position of the wafer 4, the receiving device 6 cannot receive the laser emitted by the laser emitting head 54, and therefore cannot transmit the signal to the rotating tray control structure. Therefore, the control motor 3 is controlled to rotate to drive the rotating shaft 22 to rotate, thereby driving the rotating tray 21 to rotate, and fine-tuning the position of the wafer 4 until the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, thereby fine-tuning the position of the wafer 4. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is the overall structural diagram of the heating chamber of the sputtering coating machine of the present invention.

[0016] Figure 2 This is a partial structural diagram of the internal structure of the heating chamber of the sputtering coating machine of the present invention.

[0017] Figure 3 This is a plan view of the wafer of the present invention.

[0018] Figure 4 This is a partial elevation view of the interior of the heating chamber of the sputtering coating machine of the present invention.

[0019] Figure 5 This is a cross-sectional view of the edge correction device of the heating chamber of the sputtering coating machine of the present invention.

[0020] Figure 6 This is an exploded view of the laser head fixing plate of the edge correction device of the heating chamber of the sputtering coating machine of the present invention.

[0021] Figure 7 This is a partial exploded view of the edge correction device of the heating chamber of the sputtering coating machine of the present invention.

[0022] Description of main component symbols

[0023] Shell 1, connecting plate 11, through hole 12, rotating tray 21, rotating shaft 22, motor 3, wafer 4, trimming 41, edge correction device 5, support column 51, laser head fixing plate 52, mounting hole 521, groove 522, fixing buckle 53, laser emitting head 54, pressing part 55, PCB board 56, protective cover 59, mirror barrel 57, lens limiting tube 571, first upper lens 572, second upper lens 573, upper lens protection block 574, lower lens 575, lower lens protection block 576, protective barrel 58, receiving device 6.

[0024] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0025] like Figure 1 As shown in FIG, it is the overall structure diagram of the heating chamber of the sputtering coating machine of the present invention; Figure 2 As shown in FIG, it is a partial internal structure diagram of the heating chamber of the sputtering coating machine of the present invention; Figure 3 As shown, it is a plan view of the wafer of the present invention; Figure 4 As shown, it is a partial elevation view of the interior of the heating chamber of the sputtering coating machine of the present invention; Figure 5 As shown, it is a cross-sectional view of the edge correction device of the heating chamber of the sputtering coating machine of the present invention; Figure 6 As shown, it is an exploded view of the laser head fixing plate of the edge correction device of the heating chamber of the sputtering coating machine of the present invention; Figure 7 The figure shows a partial exploded view of the edge correction device of the heating chamber of the sputtering coating machine of the present invention. Example 1:

[0026] A side correction device for a heating chamber of a sputtering coating machine, wherein the heating chamber comprises a shell 1, a connecting plate 11 is provided at the bottom of the shell 1, a through hole 12 is provided at the connecting plate 11, a rotating tray 21 is provided in the shell 1, the rotating tray 21 is used to place a wafer 4, a rotating shaft 22 is provided at the bottom of the rotating tray 21, the rotating shaft 22 passes through the through hole 12 and is connected to the motor 3, and the rotation of the motor 3 drives the rotating shaft 22 to rotate, characterized in that: an side of the upper side of the shell 1 is provided with a side correction device 5, the side correction device 5 comprises a laser emitting head 54, a receiving device 6 is provided at the lower part of the laser emitting head 54, and the receiving end of the receiving device 6 is fixedly located in the shell 1, the output end of the receiving device 6 is fixedly located outside the shell 1 and is electrically connected to the rotating tray control structure, the receiving device 6 is used to receive the laser emitted by the laser emitting head 54, a cutting edge 41 is provided on one side of the wafer 4, and when the cutting edge 41 is in the When it is between the laser emitting head 54 and the receiving end of the receiving device 6, the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, and the wafer 4 control structure controls the rotating tray 21 to stop rotating. When the cutting edge 41 position deviates from the position between the laser emitting head 54 and the receiving end of the receiving device 6, due to the obstruction of the non-cutting edge 41 position of the wafer 4, the receiving device 6 cannot receive the laser emitted by the laser emitting head 54, and therefore cannot transmit the signal to the rotating tray control structure. Therefore, the control motor 3 is controlled to rotate to drive the rotating shaft 22 to rotate, thereby driving the rotating tray 21 to rotate, and fine-tuning the position of the wafer 4 until the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, and fine-tuning the position of the wafer 4 for easy positioning, so that the cutting edge position of each wafer is consistent in direction, which is convenient for subsequent clamping.

[0027] The edge correction device 5 also includes a support column 51 and a laser head fixing plate 52. One end of the support column 51 is detachably connected to the top of the shell 1, and the other end is provided with a laser head fixing plate 52. The end of the laser head fixing plate 52 away from the support column 51 is provided with a mounting hole 521, and a laser emitting head 54 is provided in the mounting hole 521 for emitting laser.

[0028] A PCB board 56 is further provided on the laser head fixing plate 52 , and a protective cover 59 is provided on the outer edge of the laser head fixing plate 52 for insulating the PCB board 56 .

[0029] A groove 522 is provided below one end of the laser head fixing plate 52, a fixing buckle 53 is provided in the groove 522, the laser emitting head 54 is provided above the fixing buckle 53 and placed in the mounting hole 521, a pressing member 55 is provided above the laser emitting head 54, the pressing member 55 is connected to the mounting hole 521, and the laser emitting head 54 is connected to the laser head fixing plate 52 through the pressing member 55 and the fixing hole.

[0030] A mirror barrel 57 is provided under the laser emitting head 54. The mirror barrel 57 eliminates ambient light. One end of the mirror barrel 57 is connected to the laser head fixing plate 52. A lens limiting tube 571 is provided inside the mirror barrel 57. An upper lens is provided at one end of the lens limiting tube 571, and a lower lens 575 is provided at the other end. The laser emitted by the laser emitting head 54 is collimated by the upper lens and the lower lens 575.

[0031] The upper lens includes a first upper lens 572 and a second upper lens 573 . The first upper lens 572 and the second upper lens 573 are both hemispherical, and the end faces of the first upper lens 572 and the second upper lens 573 are tangent. The first upper lens 572 and the second upper lens 573 disperse the laser beam onto the lower lens 575 .

[0032] An upper lens protection block 574 is provided between the first upper lens 572 and the fixing buckle 53 .

[0033] The lower lens 575 is a convex lens that bulges downward. A lower lens protection block 576 is provided below the lower lens 575. The edge of the lower lens protection block 576 is connected to the bottom of the lens barrel 57 by bolts.

[0034] A protective barrel 58 is provided on the outside of the mirror barrel 57 near the bottom to protect the mirror barrel 57 and the lower lens 575.

[0035] Beneficial effects of the present utility model: A correction device for a heating chamber of a sputtering coating machine, the heating chamber comprising a shell 1, a connecting plate 11 being provided at the bottom of the shell 1, a through hole 12 being provided at the connecting plate 11, a rotating tray 21 being provided in the shell 1, the rotating tray 21 being used to place a wafer 4, a rotating shaft 22 being provided at the bottom of the rotating tray 21, the rotating shaft 22 passing through the through hole 12 and being connected to a motor 3, the rotation of the motor 3 drives the rotating shaft 22 to rotate, an edge correction device 5 being provided at one side above the shell 1, the edge correction device 5 comprising a laser emitting head 54, a receiving device 6 being provided at the lower part of the laser emitting head 54 and a receiving end of the receiving device 6 being fixed in the shell 1, an output end of the receiving device 6 being fixed outside the shell 1 and being electrically connected to a rotating tray control structure, the receiving device 6 being used to receive a laser emitted by the laser emitting head 54, a cutting edge 41 being provided on one side of the wafer 4, when the cutting edge 4 When 1 is located between the laser emitting head 54 and the receiving end of the receiving device 6, the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, and the wafer 4 control structure controls the rotating tray 21 to stop rotating. When the cutting edge 41 position deviates from the position between the laser emitting head 54 and the receiving end of the receiving device 6, due to the obstruction of the non-cutting edge 41 position of the wafer 4, the receiving device 6 cannot receive the laser emitted by the laser emitting head 54, and therefore cannot transmit the signal to the rotating tray control structure. Therefore, the control motor 3 is controlled to rotate to drive the rotating shaft 22 to rotate, thereby driving the rotating tray 21 to rotate, and fine-tuning the position of the wafer 4 until the receiving device 6 receives the laser emitted by the laser emitting head 54 and transmits the signal to the rotating tray control structure, and fine-tuning the position of the wafer 4 for easy positioning, so that the cutting edge position of each wafer is consistent in direction, which is convenient for subsequent clamping.

[0036] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A device for correcting the edge of a heating chamber of a sputtering coating machine, the heating chamber comprising a shell (1), a connecting plate (11) being provided at the bottom of the shell (1), a through hole (12) being provided at the connecting plate (11), a rotating tray (21) being provided in the shell (1), the rotating tray (21) being used to place wafers (4), a rotating shaft (22) being provided at the bottom of the rotating tray (21), the rotating shaft (22) passing through the through hole (12) and being connected to a motor (3), the rotation of the motor (3) driving the rotating shaft (22) to rotate, characterized in that: An edge correction device (5) is provided on one side above the shell (1), and the edge correction device (5) includes a laser emitting head (54). A receiving device (6) is provided at the bottom of the laser emitting head (54), and the receiving end of the receiving device (6) is fixedly located inside the shell (1). The output end of the receiving device (6) is fixedly located outside the shell (1) and is electrically connected to the rotating tray control structure. The receiving device (6) is used to receive the laser emitted by the laser emitting head (54). A cutting edge (41) is provided on one side of the wafer (4). When the cutting edge (41) is located between the laser emitting head (54) and the receiving end of the receiving device (6), the receiving device (6) receives the laser emitted by the laser emitting head (54). The signal is transmitted to the rotating tray control structure, and the wafer (4) control structure controls the rotating tray (21) to stop rotating. When the cutting edge (41) position deviates from the position between the laser emitting head (54) and the receiving end of the receiving device (6), the receiving device (6) cannot receive the laser emitted by the laser emitting head (54) due to the obstruction of the non-cutting edge (41) position of the wafer (4), and therefore cannot transmit the signal to the rotating tray control structure. Therefore, the control motor (3) is rotated to drive the rotating shaft (22) to rotate, thereby driving the rotating tray (21) to rotate, and fine-tuning the position of the wafer (4) until the receiving device (6) receives the laser emitted by the laser emitting head (54) and transmits the signal to the rotating tray control structure.

2. The edge correction device of the heating chamber of the sputtering coating machine according to claim 1, characterized in that: The edge correction device (5) further comprises a support column (51) and a laser head fixing plate (52), wherein one end of the support column (51) is detachably connected to the upper portion of the housing (1), and the other end is provided with a laser head fixing plate (52), and an end of the laser head fixing plate (52) away from the support column (51) is provided with a mounting hole (521), and a laser emitting head (54) is provided in the mounting hole (521) for emitting laser light.

3. The edge correction device of the heating chamber of the sputtering coating machine according to claim 2, characterized in that: A PCB board (56) is also provided on the laser head fixing plate (52), and a protective cover (59) is provided on the outer edge of the laser head fixing plate (52) for insulating the PCB board (56).

4. The edge correction device of the heating chamber of the sputtering coating machine according to claim 2, characterized in that: A groove (522) is provided below one end of the laser head fixing plate (52), a fixing buckle (53) is provided in the groove (522), the laser emitting head (54) is provided above the fixing buckle (53) and placed in the mounting hole (521), a pressing member (55) is provided above the laser emitting head (54), the pressing member (55) is connected to the mounting hole (521), and the laser emitting head (54) is connected to the laser head fixing plate (52) through the pressing member (55) and the fixing hole.

5. The edge correction device of the heating chamber of the sputtering coating machine according to claim 1, characterized in that: A mirror barrel (57) is provided below the laser emitting head (54), one end of the mirror barrel (57) is connected to the laser head fixing plate (52), a lens limiting tube (571) is provided inside the mirror barrel (57), one end of the lens limiting tube (571) is provided with an upper lens, and the other end of the lens limiting tube (571) is provided with a lower lens (575), and the laser emitted by the laser emitting head (54) is collimated by the upper lens and the lower lens (575).

6. The edge correction device of the heating chamber of the sputtering coating machine according to claim 5, characterized in that: The upper lens comprises a first upper lens (572) and a second upper lens (573), wherein the first upper lens (572) and the second upper lens (573) are both hemispherical, and the end faces of the first upper lens (572) and the second upper lens (573) are tangent.

7. The edge correction device of the heating chamber of the sputtering coating machine according to claim 6, characterized in that: An upper lens protection block (574) is provided between the first upper lens (572) and the fixing buckle (53).

8. The edge correction device of the heating chamber of the sputtering coating machine according to claim 5, characterized in that: The lower lens (575) is a convex lens that bulges downwards. A lower lens protection block (576) is provided below the lower lens (575). The edge of the lower lens protection block (576) is connected to the bottom of the lens barrel (57) via bolts.

9. The edge correction device of the heating chamber of the sputtering coating machine according to claim 5, characterized in that: A protective barrel (58) is sleeved on the outside of the mirror barrel (57) near the bottom.

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