Tuning fork type quartz wafer corrosion device

Abstract

The utility model discloses a tuning fork type quartz wafer corrosion device which comprises a corrosion box, a sealing cover is rotatably connected above the corrosion box, the sealing cover is conical, guide plates which are symmetrically arranged are connected to positions, corresponding to an opening of the corrosion box, below the interior of the sealing cover, and an angle of 45 degrees is formed between each guide plate and the horizontal plane; the top of the sealing cover is connected with a collecting pipe corresponding to the upper part of the corrosion box; after the sealing cover rotates by 180 degrees, the conical tip of the sealing cover is located at the lowest position of the sealing cover, so that the residual hydrofluoric acid solution can be concentrated in the middle of the sealing cover under the action of the gravity of the residual hydrofluoric acid solution and enters the corrosion box again through the collecting pipe, and the purpose of fully utilizing the hydrofluoric acid solution is achieved; after the sealing cover seals the corrosion box, the hydrofluoric acid solution can be prevented from being lost, waste is avoided, and harmful gas generated by volatilization of the hydrofluoric acid solution cannot flow out after the corrosion box is sealed, so that workers cannot inhale the harmful gas, and the body health of the workers can be guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of etching equipment, and in particular relates to a tuning fork type quartz wafer etching device. Background Art

[0002] A tuning fork quartz crystal is a piezoelectric resonator component composed of a quartz crystal and metal electrodes. It is also called a tuning fork crystal oscillator because the quartz crystal inside resembles a tuning fork. It utilizes the piezoelectric effect and resonance of a quartz crystal. By applying an external electric field, the quartz crystal oscillates and produces a stable, high-precision frequency output.

[0003] The tuning fork quartz wafer etching device is a high-precision processing device designed specifically for processing and shaping tuning fork quartz wafers. Utilizing the principles of electrochemical etching, the device uses a specially formulated etching solution with precisely controlled temperature and concentration to perform fine and uniform etching on the quartz wafer to achieve the desired shape, size, and properties.

[0004] Patent CN220999957U discloses a tuning fork wafer etching device, which effectively improves production efficiency by replacing manual labor with the device. However, during the wafer etching process, the storage chamber is not sealed with a cover. Since the hydrofluoric acid solution is heated to increase the etching rate during the etching of the wafer, the volatilization rate of the hydrofluoric acid solution will be greatly accelerated when the hydrofluoric acid solution reaches 60°. The lack of a cover to seal the storage chamber will cause a large amount of hydrofluoric acid solution to be lost, and the hydrofluoric acid solution will produce harmful gases when volatilizing, which will cause harm to the workers if inhaled. Utility Model Content

[0005] In order to solve the technical problem of large-scale loss of hydrofluoric acid solution and harm to workers, the utility model provides a tuning fork type quartz wafer etching device.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A tuning fork-type quartz wafer etching device includes an etching box, a conical cover rotatably connected to the top of the etching box, and a symmetrically arranged guide plate connected to the bottom of the cover at a position corresponding to the opening of the etching box, with the guide plate at a 45-degree angle to the horizontal plane.

[0008] A collecting pipe is connected to the top of the cover corresponding to the upper side of the corrosion box;

[0009] A fixing block is connected to the middle of a side of the sealing cover away from the collecting pipe, and a fixing rod is connected to the middle of the lower surface of the fixing block.

[0010] Preferably, the corrosion box is connected to the position of the fixed rod corresponding to the position of the fixed rod with symmetrically arranged U-shaped positioning pieces, the fixed rod is located in the positioning pieces, a rotating block is provided between the positioning pieces, and the end of the rotating block away from the corrosion box is connected to a triangular stopper.

[0011] Preferably, one end of the rotating block away from the stopper is connected to a symmetrically arranged hollow rotating rod, and a positioning groove is provided on the positioning piece corresponding to the position of the hollow rotating rod, and the hollow rotating rod is rotatably connected in the positioning groove.

[0012] Preferably, a torsion spring is connected between the rotating block and the positioning piece, and the torsion spring is located in the hollow rotating rod and the positioning groove.

[0013] Preferably, the side of the stopper close to the positioning piece is arc-shaped, a right-angled side of the stopper corresponds to the inside of the positioning piece, and the arc-shaped surface of the stopper is close to the fixing rod.

[0014] Preferably, symmetrically arranged moving plates are provided in the corrosion box, and a plurality of guard plates are connected between the moving plates.

[0015] Preferably, a T-shaped slide is connected to the middle of one side of the movable plate close to the inner wall of the corrosion box, and a symmetrically arranged slide rail is connected to the position corresponding to the T-shaped slide inside the corrosion box, and the T-shaped slide is slidably connected in the slide rail.

[0016] Preferably, a placement box is provided between the guard plates, and a plurality of groups of symmetrically arranged partitions are connected in the placement box.

[0017] Preferably, an inclined chute is provided on one side of one of the movable plates close to the inner wall of the corrosion box, a slide rod is slidably connected in the chute, and an end of the slide rod away from the movable plate is rotatably connected to a rotating plate.

[0018] Preferably, one end of the rotating plate away from the sliding rod is connected to a rotating shaft, and the rotating shaft passes through the corrosion box and is connected to a motor fixed to the outside of the corrosion box.

[0019] Beneficial effects of the utility model:

[0020] After the hydrofluoric acid solution is heated, it will evaporate, and the gas formed by the evaporation of the hydrofluoric acid solution will come into contact with the inside of the cover. When the cover is opened after the etching of the raw material wafer is completed, the gas formed by the evaporation of the hydrofluoric acid solution will be liquefied by cooling and attached to the cover. By rotating the cover, during the process of rotating the cover 0°-45°, 80% of the liquefied hydrofluoric acid solution will flow into the etching box along the guide plate under the action of the guide plate. When the cover is rotated 45°-180°, the guide plate will block the remaining hydrofluoric acid solution, leaving the remaining hydrofluoric acid solution in the cover. The cover prevents the hydrofluoric acid solution from flowing out. After the cover is rotated 180 degrees, the cone tip of the cover is at the bottom of the cover, so that the remaining hydrofluoric acid solution will be concentrated in the middle of the cover under the action of its own gravity and enter the corrosion box again through the collection pipe, thereby achieving the purpose of fully utilizing the hydrofluoric acid solution. After the cover is sealed on the corrosion box, the hydrofluoric acid solution can be prevented from being lost and wasted. Moreover, after the corrosion box is sealed, harmful gases generated by the volatilization of the hydrofluoric acid solution will not flow out, so that the staff will not inhale the harmful gases, thereby ensuring the health of the staff.

[0021] By setting the cover into a cone shape, the hydrofluoric acid solution can be effectively collected, and the cone design makes the top area of ​​the cover gradually decrease and converge towards the center. Under the guidance of the cone, the gas formed after the hydrofluoric acid solution evaporates will float downward along the inner wall of the cover, preventing it from accumulating on the top of the cover, and preventing the gas formed after the hydrofluoric acid solution evaporates from cooling and liquefying to form a large amount of liquid after the cover is opened.

[0022] After the etching of the raw material wafer is completed, when the cover needs to be opened to take out the tuning fork wafer, the stopper is toggled to make the stopper and the rotating block rotate around the hollow rotating rod, so that the stopper is away from the positioning piece. At this time, the fixed rod loses its obstruction and the cover can be opened by rotating the cover; after the raw material wafer is placed in the etching box, when the raw material wafer needs to be etched, the cover is rotated to make the cover close to the etching box. In the process of the cover approaching the etching box, the fixed rod will simultaneously approach the stopper and contact the stopper. After the fixed rod contacts the stopper, it will squeeze the stopper, so that the stopper and The rotating block rotates away from the positioning piece with the hollow rotating rod as the center. During the rotation process, the stopper and the rotating block will twist the torsion spring. After being twisted, the torsion spring will store a restoring force. After the fixed rod passes over the stopper, the stopper loses the squeezing force of the fixed rod. Under the action of the restoring force of the torsion spring, the stopper and the rotating block will reset. Through the cooperation of the stopper, the fixed rod can be fixed, thereby fixing the sealing cover and preventing the sealing cover from rotating. It is more convenient to fix and open the sealing cover, which can reduce the operation steps and the sealing cover can be opened effortlessly.

[0023] By placing the raw material wafers into the placement box, and then placing the placement box into the guard plate, closing the cover and starting the motor, the motor drives the rotating shaft to rotate, causing the rotating plate and the slide rod to rotate with the rotating shaft as the center of the circle. Because the movable plate is limited by the T-shaped slide plate and the slide rail, the slide rod drives the movable plate to move back and forth horizontally during the rotation process, and drives the placement box to move back and forth horizontally, so that the placement box is shaken, which accelerates the corrosion rate of the raw material wafers, improves production efficiency, and does not require manpower. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 This is a three-dimensional diagram of a tuning fork type quartz wafer etching device of the present invention;

[0026] Figure 2 This is a three-dimensional diagram of the other side of a tuning fork type quartz wafer etching device of the present invention;

[0027] Figure 3 This is a cross-sectional view of a tuning fork type quartz wafer etching device of the present invention;

[0028] Figure 4 This is a three-dimensional diagram of a cover in a tuning fork type quartz wafer etching device of the present invention;

[0029] Figure 5 This is a three-dimensional diagram of a placement box in a tuning fork type quartz wafer etching device of the present invention;

[0030] Figure 6 This is an exploded view of the positioning plate in a tuning fork type quartz wafer etching device of the present invention;

[0031] Figure 7 This is a three-dimensional diagram of the movable plate in a tuning fork type quartz wafer etching device of the present invention.

[0032] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0033] 1. Corrosion box; 2. Moving plate; 3. Placement box; 4. Chute; 5. Liquid inlet pipe;

[0034] 11. Sealing cap; 110. Guide plate; 111. Collecting tube; 12. Fixing block; 13. Fixing rod; 14. Positioning piece; 15. Rotating block; 16. Stopper; 17. Hollow rotating rod; 18. Positioning slot; 19. Torsion spring;

[0035] 21. T-shaped slide; 22. Slide rail; 23. Guard plate;

[0036] 31. Partition;

[0037] 41. Sliding rod; 42. Rotating plate; 43. Motor; 44. Rotating shaft;

[0038] 51. Liquid outlet pipe. DETAILED DESCRIPTION

[0039] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] See also Figure 1 - Figure 7 As shown, a tuning fork type quartz wafer etching device includes an etching box 1 for containing hydrofluoric acid solution and etching the raw material wafer.

[0041] A cover 11 is rotatably connected above the corrosion box 1. The cover 11 is used to seal the corrosion box 1 to prevent the loss of hydrofluoric acid solution and avoid waste. After the corrosion box 1 is sealed, harmful gases generated by the volatilization of the hydrofluoric acid solution will not flow out, so that the staff will not inhale the harmful gases, which can ensure the health of the staff.

[0042] The cover 11 is conical. By setting the cover 11 into a cone, the hydrofluoric acid solution can be effectively collected, and the conical design makes the top area of ​​the cover 11 gradually decrease and converge toward the center. Under the guidance of the cone, the gas formed after the evaporation of the hydrofluoric acid solution will float downward along the inner wall of the cover 11, preventing it from accumulating on the top of the cover 11, and preventing the gas formed after the evaporation of the hydrofluoric acid solution from being cooled and liquefied to form a large amount of liquid after the cover 11 is opened.

[0043] A symmetrically arranged guide plate 110 is connected to the position at the bottom of the cover 11 corresponding to the opening of the corrosion box 1. The guide plate 110 is at a 45° angle to the horizontal plane and is used to guide the hydrofluoric acid solution formed after liquefaction so that the hydrofluoric acid solution can flow into the corrosion box 1 along the guide plate 110.

[0044] A collecting pipe 111 is connected to the top of the cover 11 corresponding to the top of the corrosion box 1. The collecting pipe 111 is used to add the hydrofluoric acid solution collected by the cover 11 into the corrosion box 1 to avoid waste of the hydrofluoric acid solution and prevent the hydrofluoric acid solution from falling onto the bottom plate or external equipment, causing corrosion of the bottom plate or external equipment.

[0045] It is worth noting here that: after the hydrofluoric acid solution is heated, the hydrofluoric acid solution will evaporate, and the gas formed by the evaporation of the hydrofluoric acid solution will contact the inside of the cover 11. When the cover 11 is opened after the etching of the raw material wafer is completed, the gas formed by the evaporation of the hydrofluoric acid solution will liquefy and adhere to the cover 11 due to cooling. By rotating the cover 11, during the process of rotating the cover 11 by 0°-45°, the hydrofluoric acid solution formed after liquefaction will flow into the etching area along the guide plate 110 under the action of the guide plate 110, and 80% of the hydrofluoric acid solution will flow into the etching area along the guide plate 110. In the etching box 1, when the cover 11 rotates 45°-180°, the guide plate 110 blocks the remaining hydrofluoric acid solution, retaining the remaining hydrofluoric acid solution in the cover 11 to prevent the hydrofluoric acid solution from flowing out. After the cover 11 rotates 180°, the cone tip of the cover 11 is at the bottom of the cover 11. As a result, the remaining hydrofluoric acid solution is concentrated in the middle of the cover 11 under the action of its own gravity and re-enters the etching box 1 through the collection pipe 111, achieving the purpose of fully utilizing the hydrofluoric acid solution.

[0046] If a flat cover 11 is used, it is difficult to concentrate the hydrofluoric acid solution when collecting it, and some may remain after collection. When the cover 11 is rotated, the hydrofluoric acid solution may fall onto the bottom plate or external equipment under the action of its own gravity, causing corrosion of the bottom plate or external equipment and damage to the bottom plate or external equipment. By setting the cover 11 into a cone shape, with the cooperation of the guide plate, it is convenient to collect the hydrofluoric acid solution and the hydrofluoric acid solution will not remain on the cover 11, which can effectively solve the problem of hydrofluoric acid solution falling onto the bottom plate or external equipment, causing corrosion of the bottom plate or external equipment and causing damage.

[0047] A fixing block 12 is connected to the middle of the side of the cover 11 away from the collecting tube 111 , and a fixing rod 13 is connected to the middle of the lower surface of the fixing block 12 . The fixing rod 13 is used to assist in fixing the cover 11 .

[0048] The corrosion box 1 is connected to a symmetrically arranged U-shaped positioning piece 14 at a position corresponding to the fixing rod 13 . The fixing rod 13 is located inside the positioning piece 14 . The positioning piece 14 is used to define the position of the fixing rod 13 .

[0049] A rotating block 15 is provided between the positioning pieces 14 , and a triangular stopper 16 is connected to one end of the rotating block 15 away from the corrosion box 1 , which is used to block the fixing rod 13 and prevent the cover 11 from rotating after the cover 11 closes the corrosion box 1 .

[0050] The side of the stopper 16 close to the positioning piece 14 is arc-shaped, and one right-angled side of the stopper 16 corresponds to the inside of the positioning piece 14. The arc-shaped surface of the stopper 16 is close to the fixing rod 13. Through this setting, the cover 11 can be effectively fixed. Through force analysis, after the stopper 16 blocks the fixing rod 13, when the fixing rod 13 attempts to rotate, the fixing rod 13 cannot push the stopper 16 to shift the stopper 16.

[0051] One end of the rotating block 15 away from the stop block 16 is connected to a symmetrically arranged hollow rotating rod 17, and a positioning groove 18 is provided on the positioning piece 14 corresponding to the position of the hollow rotating rod 17. The hollow rotating rod 17 is rotatably connected in the positioning groove 18. Through the cooperation between the hollow rotating rod 17 and the positioning groove 18, the position of the rotating block 15 and the stop block 16 can be limited, so that the rotating block 15 and the stop block 16 rotate with the hollow rotating rod 17 as the center of the circle.

[0052] A torsion spring 19 is connected between the rotating block 15 and the positioning piece 14 . The torsion spring 19 is located in the hollow rotating rod 17 and the positioning slot 18 . The torsion spring 19 is used to reset the rotating block 15 .

[0053] In specific use, after the etching of the raw material wafer is completed, when it is necessary to open the cover 11 and take out the tuning fork wafer, the stopper 16 is moved so that the stopper 16 and the rotating block 15 rotate around the hollow rotating rod 17, so that the stopper 16 is away from the positioning piece 14. At this time, the fixed rod 13 is no longer blocked, and the cover 11 can be opened by rotating.

[0054] After the raw material wafer is placed in the etching box 1, when the raw material wafer needs to be etched, the cover 11 is rotated to make the cover 11 close to the etching box 1. In the process of the cover 11 approaching the etching box 1, the fixed rod 13 will simultaneously approach the stopper 16 and contact the stopper 16. After the fixed rod 13 contacts the stopper 16, it will squeeze the stopper 16, so that the stopper 16 and the rotating block 15 rotate away from the positioning piece 14 with the hollow rotating rod 17 as the center of the circle. In the process of rotation, the stopper 16 and the rotating block 15 will twist the torsion spring 19. After being twisted, the torsion spring 19 will store a restoring force. After the fixing rod 13 passes over the stopper 16, the stopper 16 loses the squeezing force of the fixing rod 13. Under the action of the restoring force of the torsion spring 19, the stopper 16 and the rotating block 15 will be reset. Through the cooperation of the stopper 16, the fixing rod 13 can be fixed, thereby fixing the cover 11, so that the cover 11 cannot be rotated. It is more convenient to fix and open the cover 11, which can reduce the operating steps and the cover 11 can be opened effortlessly.

[0055] Symmetrically arranged moving plates 2 are provided in the corrosion box 1 , and a plurality of guard plates 23 are connected between the moving plates 2 . The moving plates 2 cooperate with the guard plates 23 to support the placement box 3 .

[0056] A T-shaped slide 21 is connected to the middle of one side of the movable plate 2 close to the inner wall of the corrosion box 1. A symmetrically arranged slide rail 22 is connected to the position corresponding to the T-shaped slide 21 inside the corrosion box 1. The T-shaped slide 21 is slidably connected to the slide rail 22. Through the cooperation between the T-shaped slide 21 and the slide rail 22, the movable plate 2 and the guard plate 23 can drive the placement box 3 to move horizontally.

[0057] A placement box 3 is provided between the guard plates 23 for placing raw material wafers.

[0058] The placement box 3 is connected to a plurality of symmetrically arranged partitions 31 for separating the raw material wafers to prevent the raw material wafers from colliding with each other and being damaged when the placement box 3 is shaken.

[0059] An inclined slide groove 4 is provided on one side of the movable plates 2 close to the inner wall of the corrosion box 1, and a slide rod 41 is slidably connected in the slide groove 4. The end of the slide rod 41 away from the movable plate 2 is rotatably connected to a rotating plate 42, and the end of the rotating plate 42 away from the slide rod 41 is connected to a rotating shaft 44. The rotating shaft 44 passes through the corrosion box 1 and is connected to a motor 43 fixed to the outside of the corrosion box 1.

[0060] During specific use, the raw material wafers are placed in the placement box 3, and then the placement box 3 is placed in the guard plate 23. By closing the cover 11 and starting the motor 43, the motor 43 drives the rotating shaft 44 to rotate, so that the rotating plate 42 and the slide rod 41 rotate with the rotating shaft 44 as the center. Because the movable plate 2 is limited by the T-shaped slide plate 21 and the slide rail 22, the slide rod 41 drives the movable plate 2 to move back and forth horizontally during the rotation process, and drives the placement box 3 to move back and forth horizontally, so that the placement box 3 is shaken, which accelerates the corrosion rate of the raw material wafers, improves production efficiency, and does not require manpower.

[0061] A liquid inlet pipe 5 and a liquid outlet pipe 51 are connected to the bottom of the corrosion box 1. The liquid inlet pipe 5 and the liquid outlet pipe 51 are respectively connected to the circulating heat pump. Through the cooperation of the circulating heat pump, the liquid inlet pipe 5 and the liquid outlet pipe 51, the circulating heat pump draws the hydrofluoric acid solution in the corrosion box 1 into the circulating heat pump through the liquid outlet pipe 51. The circulating heat pump heats the hydrofluoric acid solution and then adds the heated hydrofluoric acid solution into the corrosion box 1 through the liquid outlet pipe 51, thereby achieving the purpose of heating the hydrofluoric acid solution.

[0062] Throughout the specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0063] The above content is merely an example and explanation of the structure of the present utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the utility model or exceed the scope defined by the claims, they should fall within the scope of protection of the present utility model.

Claims

1. A tuning fork type quartz wafer etching device, characterized in that: The invention comprises a corrosion box (1), wherein a cover (11) is rotatably connected to the upper portion of the corrosion box (1), the cover (11) is conical, and a symmetrically arranged guide plate (110) is connected to the lower portion of the cover (11) at a position corresponding to the opening of the corrosion box (1), and the guide plate (110) is at a 45° angle to the horizontal plane; The top of the cover (11) is connected to a collecting pipe (111) corresponding to the top of the corrosion box (1); A fixing block (12) is connected to the middle of the side of the sealing cover (11) away from the collecting pipe (111), and a fixing rod (13) is connected to the middle of the lower surface of the fixing block (12).

2. The tuning fork type quartz wafer etching device according to claim 1, characterized in that: The corrosion box (1) is connected to symmetrically arranged U-shaped positioning pieces (14) at positions corresponding to the fixing rods (13); the fixing rods (13) are located inside the positioning pieces (14); a rotating block (15) is provided between the positioning pieces (14); and a triangular stopper (16) is connected to one end of the rotating block (15) away from the corrosion box (1).

3. The tuning fork type quartz wafer etching device according to claim 2, characterized in that: One end of the rotating block (15) away from the stopper (16) is connected to a symmetrically arranged hollow rotating rod (17); a positioning groove (18) is provided on the positioning piece (14) at a position corresponding to the hollow rotating rod (17); and the hollow rotating rod (17) is rotatably connected in the positioning groove (18).

4. The tuning fork type quartz wafer etching device according to claim 3, characterized in that: A torsion spring (19) is connected between the rotating block (15) and the positioning piece (14), and the torsion spring (19) is located in the hollow rotating rod (17) and the positioning groove (18).

5. The tuning fork type quartz wafer etching device according to claim 4, characterized in that: The side of the stopper (16) close to the positioning piece (14) is arc-shaped, a right-angled side of the stopper (16) corresponds to the inside of the positioning piece (14), and the arc-shaped surface of the stopper (16) is close to the fixing rod (13).

6. The tuning fork type quartz wafer etching device according to claim 5, characterized in that: The corrosion box (1) is provided with symmetrically arranged moving plates (2), and a plurality of guard plates (23) are connected between the moving plates (2).

7. The tuning fork type quartz wafer etching device according to claim 6, characterized in that: A T-shaped slide plate (21) is connected to the middle of one side of the movable plate (2) close to the inner wall of the corrosion box (1); a symmetrically arranged slide rail (22) is connected to a position corresponding to the T-shaped slide plate (21) inside the corrosion box (1); and the T-shaped slide plate (21) is slidably connected to the slide rail (22).

8. The tuning fork type quartz wafer etching device according to claim 7, characterized in that: A placement box (3) is provided between the guard plates (23), and a plurality of groups of symmetrically arranged partitions (31) are connected inside the placement box (3).

9. The tuning fork type quartz wafer etching device according to claim 8, characterized in that: One of the movable plates (2) is provided with an inclined chute (4) on one side close to the inner wall of the corrosion box (1), a slide rod (41) is slidably connected in the chute (4), and an end of the slide rod (41) away from the movable plate (2) is rotatably connected to a rotating plate (42).

10. The tuning fork type quartz wafer etching device according to claim 9, characterized in that: One end of the rotating plate (42) away from the slide bar (41) is connected to a rotating shaft (44), and the rotating shaft (44) passes through the corrosion box (1) and is connected to a motor (43) fixed to the outside of the corrosion box (1).

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