Steel formwork device with cooling pipeline
By designing S-shaped cooling pipes and heat-conducting components on the steel formwork, the problems of poor thermal conductivity and increased weight of traditional construction molds are solved, achieving efficient heat dissipation without affecting construction convenience.
Patent Information
- Application Number
- CN202422738456.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-11
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-11-11
AI Technical Summary
The contact area between the cooling pipe and the mold of traditional construction molds is small, resulting in poor thermal conductivity. Filling with thermal conductive materials will increase the weight of the mold, affecting the convenience of construction.
A steel formwork device with built-in cooling pipes is designed. It adopts S-shaped cooling pipes and heat conduction components. The contact area is increased by strengthening rib supports and heat conduction strips, and circulating cooling is achieved in combination with a heat dissipation water tank.
It improves the thermal conductivity and heat dissipation effects, avoids the increase of mold weight, and maintains the convenience of construction.
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Figure CN223410483U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of building moulds, in particular to a steel template device with a cooling pipe. Background Art
[0002] After concrete pouring, the internal initial temperature and hydration heat temperature rise, and then cool down through natural and forced measures.
[0003] Traditional forced cooling measures include adding coolant, covering the surface with soaking materials, setting up ventilation channels, setting up cooling pipes, etc.
[0004] Cooling pipes come in both internal and external types. External cooling pipes are typically installed within a mold on the concrete surface. Unlike solid forging and injection molds, construction molds are typically hollow structures made of spliced steel plates. Cooling pipes are tubular rather than porous, resulting in a small contact surface between the cooling pipe and the construction mold, leading to suboptimal thermal conductivity. While some industry solutions involve filling the cavity of the construction mold with thermally conductive material, this approach significantly increases the mold's weight, compromising transportation and construction convenience. Summary of the Invention
[0005] In order to overcome the problem in the above background technology that "traditional construction molds cannot take into account both heat dissipation and portability", the utility model provides a steel template device with a built-in cooling pipe.
[0006] The technical solution adopted by the present invention to solve the above technical problems is:
[0007] 18. The heat dissipation device of claim 17, wherein the cooling pipe is an arc-shaped pipe having a first end and a second end, and the cooling pipe is an arc-shaped pipe having a first end and a second end. The cooling pipe is an arc-shaped pipe having a first end and a second end. The cooling pipe is an arc-shaped pipe having a first end and a second end. The cooling pipe is an arc-shaped pipe having a first end and a second end. The cooling pipe is an arc-shaped pipe having a first end and a second end.
[0008] As a further optimization solution of the present invention, the heat conductive strip is provided with two vertically arranged mounting surfaces, one of which is arranged in contact with the plate body, and the other is arranged in contact with the cross-bracing rib.
[0009] As a further optimization solution of the present invention, the vertical support rib is provided with a first mounting hole, and the first tube body is inserted into the first mounting hole.
[0010] As a further optimization solution of the present invention, the transverse rib is provided with a second mounting hole, and the second tube body is inserted into the second mounting hole.
[0011] As a further optimization solution of the present invention, the return water pipe is placed upright, the cross-bracing rib is provided with a third mounting hole, and the return water pipe is inserted into the third mounting hole.
[0012] As a further optimization solution of the present invention, the vertical support ribs and the horizontal support ribs are cross-arranged in a grid shape.
[0013] As a further optimization scheme of the present utility model, the heat dissipation water tank includes a box body, a plurality of upright semiconductor heat sinks are provided on the top surface of the box body, a heat dissipation fan is provided on the top of the semiconductor heat sink, a guide plate group is provided on the bottom surface of the inner cavity of the box body, the guide plate group includes a plurality of upright guide plates, and the guide plates are plugged into the bottom of adjacent semiconductor heat sinks; an S-shaped fluid channel is formed between the semiconductor heat sink and the guide plate.
[0014] As a further optimization solution of the present invention, the two end surfaces of the box body are respectively connected and communicated with a return pipe and a water outlet pipe, and a liquid pump is provided in the middle of the water outlet pipe.
[0015] As a further optimization solution of the present invention, the two side edges of the lower portion of the semiconductor heat sink are respectively arranged to fit with the left and right side walls of the inner cavity of the box.
[0016] As a further optimization solution of the present invention, the edges on both sides of the guide plate are respectively arranged to fit the left and right side walls of the inner cavity of the box.
[0017] In summary, the benefits of the present invention are:
[0018] (1) The utility model has a simple structure and reliable functions. The reinforcing ribs are used to support the plate body so that the plate body can resist the expansion force when the concrete hardens. At the same time, the reinforcing ribs are used to provide structural support for the cooling pipes and the heat-conducting components so that the cooling pipes and the heat-conducting components can be installed on the side walls of the plate body to achieve excellent heat conduction effect, thereby avoiding the problem of a significant increase in mold weight caused by large-scale filling.
[0019] (2) The thermal strip can increase the contact area between the first tube and the plate, thereby improving the heat conduction efficiency and further improving the heat dissipation efficiency. The space between the thermal strip and the first tube is filled with thermal conductive gel or water to avoid the problem of insufficient straightness between the thermal strip and the first tube causing a gap and thus reducing the heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present application is further described below with reference to the accompanying drawings:
[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0022] Figure 2 It is a structural diagram of the reinforcement rib and the cooling pipe;
[0023] Figure 3 It is a schematic diagram of the structure of the heat conducting component in a vertical cross-sectional side view;
[0024] Figure 4 This is a front view diagram of the installation position of the thermal strip;
[0025] Figure 5 Schematic diagram of the position and structure of the concave part and the vertical part;
[0026] Figure 6 This is a schematic diagram of the cross-sectional structure of the radiator.
[0027] Description of reference numerals:
[0028] In the figure,
[0029] 1. Board body;
[0030] 2. Strengthening ribs; 21. Vertical supporting ribs; 22. Horizontal supporting ribs;
[0031] 3. Cooling pipe; 31. First pipe body; 32. Second pipe body;
[0032] 4. Return pipe;
[0033] 5. Heat-conducting assembly; 51. Heat-conducting strip; 511. Fitting groove; 5111. Concave portion; 5112. Vertical portion;
[0034] 6. Radiating water tank; 61. Box body; 62. Semiconductor heat sink; 63. Radiating fan; 64. Guide plate assembly; 65. Return pipe; 66. Outlet pipe; 67. Liquid pump. DETAILED DESCRIPTION
[0035] Based on the above structural features of the present application, the implementation methods of the present application are further described:
[0036] Reference Figures 1 and 2This embodiment provides a steel formwork device with built-in cooling pipes, comprising a plate 1, reinforcing ribs 2, cooling pipes 3, return pipes 4, and a heat conduction assembly 5. One side of the plate 1 serves as the cavity wall for forming concrete components; the other side is used to mount the reinforcing ribs 2, thereby increasing the structural strength of the plate 1 and preventing bending and deformation during concrete hardening and expansion.
[0037] Reference Figures 1 and 2 The reinforcing ribs 2 include a plurality of vertical supporting ribs 21 and a plurality of horizontal supporting ribs 22; the vertical supporting ribs 21 and the horizontal supporting ribs 22 are fixedly connected to the plate body 1; the vertical supporting ribs 21 and the horizontal supporting ribs 22 are cross-arranged in a grid shape, so as to apply a uniform supporting force to the plate body 1.
[0038] Reference Figures 1 and 2 The cooling pipe 3 is S-shaped and evenly arranged on the side of the plate body 1, thereby uniformly cooling the plate body 1. The cooling pipe 3 includes a plurality of first pipes 31 and a plurality of second pipes 32, which are arranged alternately and connected. The first pipes 31 are straight and arranged horizontally, and the plurality of first pipes 31 are arranged parallel to each other. The second pipes 32 are C-shaped and fixedly connected to the ends of the first pipes 31 by integral bending or threaded connection.
[0039] Reference Figures 1 and 2 The end of the cooling pipe 3 is connected to the return pipe 4 and communicates with each other (for example, via an elbow or an integrally bent fixed connection). The starting end of the cooling pipe 3 and the end of the return pipe 4 are respectively connected to the heat dissipation tank 6 via hoses. The heat dissipation tank 6 can pressurize the cooling water within into the cooling pipe 3, thereby removing heat from the panel 1 and the concrete surface, thereby cooling the concrete. After flowing through the cooling pipe 3, the cooling water returns to the heat dissipation tank 6 through the return pipe 4, completing the circulation.
[0040] Reference Figures 1 to 3 The horizontal support ribs 22 are arranged perpendicularly to the plate body 1, and the horizontal support ribs 22 are fixedly connected to the plate body 1 by welding. The vertical support ribs 21 are arranged perpendicularly to the plate body 1, and the vertical support ribs 21 are fixedly connected to the plate body 1 by welding.
[0041] Reference Figures 3 and 4 The heat-conducting assembly 5 includes a heat-conducting strip 51, which is generally triangular in shape and has a right-angled triangle cross-section. The heat-conducting strip 51 is fixedly attached to and positioned at the perpendicular connection between the cross-bracing rib 22 and the plate 1. The heat-conducting strip 51 is provided with a fitting groove 511 that fits the outer surface of the first tube 31. The fitting groove 511 has a semicircular cross-section. The first tube 31 is fitted into the fitting groove 511, thereby achieving excellent thermal conductivity between the plate 1, the heat-conducting strip 51, and the first tube 31.
[0042] Reference Figure 3 The thermal conductive strip 51 is provided with two vertically arranged mounting surfaces, one of which is fitted with the plate body 1 (for example, fixedly connected by bolts and the gap is filled with thermal conductive gel), and the other mounting surface is fitted with the cross bracing rib 22 (for example, fixedly connected by bolts and the gap is filled with thermal conductive gel).
[0043] Reference Figure 5 The fitting groove 511 of the thermally conductive strip 51 located above the cross-bracing rib 22 is provided with a lower recess 5111 and a vertical portion 5112. The lower recess 5111 is located at the lowest end of the fitting groove 511 and opens upward. The lower recess 5111 is used to store thermally conductive gel or water. Since a gap is inevitably formed between the outer wall of the first tube body 31 and the fitting groove 511, thermally conductive gel or water is arranged in the gap (the thermally conductive gel is retained at the lower recess 5111 and the vertical portion 5112 due to its own viscosity, and part of the water flows from the lower recess 5111 to the vertical portion 5112 due to tension), thereby increasing thermal conductivity and improving heat dissipation speed; the lower recess 5111 is used to reduce the speed of the longitudinal flow of the thermally conductive gel or water in the gap, thereby extending the heat dissipation time and reducing the frequency of water replenishment.
[0044] Reference Figure 4 The heat conducting strip 51 is in the shape of a strip with a constant cross section, and a plurality of heat conducting strips 51 are provided; the length of the heat conducting strip 51 is adapted to the spacing between adjacent supporting ribs 21 .
[0045] Reference Figure 1 and Figure 2 The vertical support rib 21 defines a first mounting hole, into which the first tube 31 is inserted. The first mounting hole supports and limits the first tube 31. The horizontal support rib 22 defines a second mounting hole, into which the second tube 32 is inserted. The second mounting hole supports and limits the second tube 32. The return pipe 4 is positioned vertically, and the horizontal support rib 22 defines a third mounting hole, into which the return pipe 4 is inserted.
[0046] Reference Figure 6The heat dissipation water tank 6 includes a housing 61, with a plurality of semiconductor heat sinks 62 disposed on the top surface of the housing 61. The heat absorbing ends of the semiconductor heat sinks 62 are located within the interior of the housing 61, and the heat dissipating ends are located above and outside the housing 61. The semiconductor heat sinks 62 are vertically arranged, with the heat absorbing ends at the bottom and the heat dissipating ends at the top. A heat dissipation fan 63 is bolted to the top of the semiconductor heat sink 62. The heat dissipation fan 63 is used to accelerate the heat dissipation from the heat dissipation ends to the air, thereby increasing the cooling rate of the cooling water within the housing 61. A guide plate group 64 is disposed on the bottom surface of the interior of the housing 61. The guide plate group 64 includes a plurality of vertical guide plates that are plugged into the bottoms of adjacent semiconductor heat sinks 62, forming a fluid channel between the semiconductor heat sink 62 and the guide plates. The fluid channel is vertically S-shaped, causing the cooling water to tumble as it flows along the fluid channel, increasing the contact area between the cooling water and the semiconductor heat sink 62, further enhancing the heat dissipation effect and speed. The bottom end of the guide plate is fixedly connected to the bottom surface of the inner cavity of the box body 61 by bolts.
[0047] Reference Figure 2 and Figure 6 A return pipe 65 and an outlet pipe 66 are connected and communicated with each other at both end surfaces of the casing 61. The return pipe 65 communicates with the inner cavity of the casing 61, and the outlet pipe 66 communicates with the inner cavity of the casing 61. A liquid pump 67 is provided in the middle of the outlet pipe 66. The return pipe 65 is connected and communicated with the return pipe 65 through a hose, and the end of the hose is detachably connected to the return pipe 65 via a water pipe joint. The outlet pipe 66 is connected and communicated with the front end of the first tube body 31 of the first section through a hose, and the end of the hose is detachably connected to the first tube body 31 via a water pipe joint.
[0048] The two side edges of the lower part of the semiconductor heat sink 62 are respectively fitted with the left and right side walls of the inner cavity of the box body 61; the two side edges of the guide plate are respectively fitted with the left and right side walls of the inner cavity of the box body 61; thereby avoiding the formation of branch flow channels at the position of the fluid channel, to ensure that the cooling water can flow unidirectionally in the fluid channel without diversion.
[0049] The heat conducting strip 51 is made of copper-containing metal or aluminum-containing metal, so as to have excellent heat conducting performance.
[0050] The semiconductor heat sink 62 is an electrically driven semiconductor heat conducting sheet (for example, a Bi2Te3-Sb2Te3 or Bi2Te3-Bi2Se3 semiconductor cooler based on bismuth telluride).
[0051] The utility model also includes a battery, which is fixedly mounted on the outer wall of the box body 61 by bolts; the semiconductor heat sink 62 and the liquid pump 67 are respectively connected to the battery by wires; the semiconductor heat sink 62 and the liquid pump 67 are respectively provided with independent power switches.
[0052] The cross sections of the first tube body 31 and the second tube body 32 are both circular.
[0053] This utility model has a simple structure and reliable functionality. The reinforcing ribs 2 support the plate body 1, enabling the plate body 1 to resist the expansion force of the concrete during hardening. Simultaneously, the reinforcing ribs 2 provide structural support for the cooling pipe 3 and the heat-conducting assembly 5, allowing them to be snugly installed on the side wall of the plate body 1 to achieve excellent heat conduction, thereby avoiding the problem of a significant increase in mold weight caused by large-scale filling. The vertical support ribs 21 support and limit the first tube 31, and the horizontal support ribs 22 support and limit the middle of the second tube 32, allowing the cooling pipe 3 to be fixedly installed on the side wall of the plate body 1. The reinforcing ribs 2 help the cooling pipe 3 resist accidental external collisions, thereby increasing the service life of the utility model. The thermal strips 51 increase the (indirect) contact area between the first tube 31 and the plate body 1, thereby improving heat conduction efficiency and further enhancing heat dissipation efficiency. Thermally conductive gel or water is filled between the thermally conductive strip 51 and the first tube body 31 to avoid the problem of insufficient straightness between the thermally conductive strip 51 and the first tube body 31 causing a gap and thus reducing the heat conduction efficiency.
[0054] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "up", "down", "left" and "right" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.
[0055] It should also be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "installed," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.
[0056] To sum up, for those skilled in the art, according to the guidance of this utility model, without departing from the principles and spirit of this utility model, changes, modifications, replacements and deformations made to this utility model still fall within the scope of protection of this utility model.
Claims
1. A steel formwork device with built-in cooling pipe, characterized by: It comprises a plate body (1), reinforcing ribs (2), a cooling pipe (3), a return pipe (4) and a heat conducting component (5); The reinforcing ribs (2) include a plurality of vertical supporting ribs (21) and a plurality of horizontal supporting ribs (22); the vertical supporting ribs (21) and the horizontal supporting ribs (22) are both fixedly connected to the plate body (1); The cooling pipe (3) is S-shaped; the cooling pipe (3) comprises a plurality of first pipe bodies (31) and a plurality of second pipe bodies (32), the first pipe bodies (31) and the second pipe bodies (32) being alternately arranged and connected; the first pipe body (31) is straight and arranged transversely, and the second pipe body (32) is C-shaped; the plurality of first pipe bodies (31) are arranged parallel to each other; The end of the cooling pipe (3) is connected to and communicates with the return pipe (4); the starting end of the cooling pipe (3) and the end of the return pipe (4) are respectively connected to the heat dissipation water tank (6) through a hose; The transverse supporting rib (22) is arranged perpendicularly to the plate body (1); the heat-conducting assembly (5) includes a heat-conducting strip (51), and the heat-conducting strip (51) is fitted and fixedly arranged at a position where the transverse supporting rib (22) and the plate body (1) are vertically connected; the heat-conducting strip (51) is provided with a fitting groove (511) adapted to the outer surface of the first tube body (31), and the first tube body (31) is fitted with the fitting groove (511).
2. The steel formwork device with built-in cooling pipe according to claim 1 is characterized in that: The heat conducting strip (51) is provided with two vertically arranged mounting surfaces, one of which is arranged in contact with the plate body (1), and the other of which is arranged in contact with the transverse supporting rib (22).
3. The steel formwork device with built-in cooling pipe according to claim 2 is characterized in that: The vertical support rib (21) is provided with a first mounting hole, and the first tube (31) is inserted into the first mounting hole.
4. The steel formwork device with built-in cooling pipe according to claim 3 is characterized in that: The cross-bracing rib (22) is provided with a second mounting hole, and the second tube (32) is inserted into the second mounting hole.
5. The steel formwork device with built-in cooling pipe according to claim 4 is characterized in that: The return water pipe (4) is placed upright, the cross-bracing rib (22) is provided with a third mounting hole, and the return water pipe (4) is inserted into the third mounting hole.
6. The steel formwork device with built-in cooling pipe according to claim 5 is characterized in that: The vertical support ribs (21) and the horizontal support ribs (22) are cross-arranged in a grid shape.
7. The steel formwork device with built-in cooling pipe according to claim 6, characterized in that: The heat dissipation water tank (6) comprises a box body (61), a top surface of the box body (61) is provided with a plurality of upright semiconductor heat sinks (62), a top end of the semiconductor heat sink (62) is provided with a heat dissipation fan (63), a guide plate group (64) is provided at the bottom surface of the inner cavity of the box body (61), the guide plate group (64) comprises a plurality of upright guide plates, and the guide plates are plugged and arranged at the bottom of adjacent semiconductor heat sinks (62); an S-shaped fluid channel is formed between the semiconductor heat sink (62) and the guide plate.
8. The steel formwork device with built-in cooling pipe according to claim 7, characterized in that: The two end surfaces of the box body (61) are respectively connected and communicated with a return pipe (65) and a water outlet pipe (66), and a liquid pump (67) is provided in the middle of the water outlet pipe (66).
9. The steel formwork device with built-in cooling pipe according to claim 8, characterized in that: The two side edges of the lower portion of the semiconductor heat sink (62) are respectively arranged in contact with the left and right side walls of the inner cavity of the box body (61).
10. The steel formwork device with built-in cooling pipe according to claim 9, characterized in that: The edges on both sides of the guide plate are respectively arranged to fit the left and right side walls of the inner cavity of the box body (61).