Circuit board structure for improving welding quality of array type power supply module

Abstract

The utility model discloses a circuit board structure for improving the welding quality of an array type power supply module, which comprises the array type power supply module arranged on a circuit board, the power supply module comprises a plurality of pin bonding pads, the pin bonding pads are connected with signal via holes through signal wires, and the pin bonding pads are connected with the signal via holes through signal wires. And the signal wires of the adjacent pin bonding pads with the same signal are connected in a cross-shaped manner. According to the utility model, the signal wires of the pin pads with the same signal are connected in a cross manner, so that the pin pads with the same signal are effectively connected in series, the wiring structure of the power supply is enhanced, and the use of traditional copper sheet connection is avoided; therefore, the problem of poor welding possibly occurring in the welding process of the array type power supply module is effectively solved, and the overall quality and stability of the power supply are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more particularly to a circuit board structure for improving the welding quality of array-type power modules. Background Art

[0002] A printed circuit board (PCB), also known as a printed circuit board, is a crucial electronic component that supports and connects electronic components. Because it's manufactured using electronic printing technology, it's called a "printed" circuit board. Encapsulation involves connecting the circuit pins on a silicon chip to external connectors with wires for connection to other devices. The schematic circuit is reflected on the PCB through the encapsulation and routing, with one encapsulation corresponding to one component.

[0003] BGA is a ball grid array packaging technology, which is a high-density surface mount packaging technology. At the bottom of the package, the pins are spherical and arranged in a grid-like pattern, hence the name BGA. Motherboard control chipsets mostly use this type of packaging technology, and the materials are mostly ceramic. Memory packaged with BGA technology can increase the memory capacity by two to three times without changing the volume. Compared with TSOP, BGA has a smaller size and better heat dissipation and electrical performance. BGA packaging technology has greatly increased the storage capacity per square inch. Memory products using BGA packaging technology have a volume of only one-third of TSOP packaging at the same capacity. Conventional BGA pins are arranged in a matrix, while diamond BGA has two adjacent rows of pins staggered.

[0004] Ball grid array (BGA) power modules are widely used due to their high efficiency and compact design, particularly in systems requiring high-density power distribution and management. Ball grid array (BGA) power modules typically utilize BGA packaging technology to provide a large number of input, output, and ground (GND) pins to meet complex power distribution requirements.

[0005] A common practice is to use copper routing technology on circuit boards, connecting pins with the same electrical network through copper sheets to form a wide current path. This approach not only helps increase the current-carrying area, reduces resistance and heat generation, but also improves overall electrical performance. In practical applications, copper routing technology has significantly enhanced the current-carrying capacity of array power modules, ensuring stable system operation.

[0006] However, BGA package pins are typically coated with solder mask to prevent short circuits and overflow during soldering. However, in the copper-filled areas, this solder mask comes into direct contact with the copper sheet. During soldering, solder can flow onto the copper sheet, causing uneven solder distribution across the pin pads, which should be evenly distributed. Solder paste will be thicker on the pin pads in areas without copper. Pins with excessively thin solder paste can suffer from insufficient solder joint strength, leading to cold joints or open circuits, seriously impacting the power module's electrical performance and reliability. Utility Model Content

[0007] In order to overcome the problem that the array power module of the existing circuit board adopts copper wiring technology, the pins with the same electrical network are connected by copper foil. The copper foil is in direct contact with the solder mask layer around the BGA package pins. During the soldering process, the solder will flow onto the copper foil, causing the solder that should be evenly distributed on the pin pads to become uneven, resulting in poor soldering. The utility model provides a circuit board structure that improves the soldering quality of the array power module.

[0008] The technical solution of this utility model is as follows:

[0009] A circuit board structure for improving the welding quality of an array power module includes an array of power modules arranged on a circuit board. The power modules include a plurality of pin pads, wherein the pin pads are connected to signal vias through signal traces, and the signal traces of adjacent pin pads of the same signal are interconnected in a cross shape.

[0010] According to the above solution of the present invention, the widths of the signal traces led out from the pin pads of the same signal are the same.

[0011] According to the above solution of the present invention, the width of the signal traces led out from each pin pad is the same.

[0012] According to the above solution of the present invention, the width of the signal line is greater than or equal to half the diameter of the pin pad.

[0013] According to the above solution of the present invention, the width of the signal line is less than or equal to the diameter of the pin pad.

[0014] According to the above solution of the present invention, the width of the signal trace is equal to half the diameter of the pin pad.

[0015] According to the above solution of the present invention, the diameter of the pin pad is 0.5mm to 0.8mm.

[0016] According to the above solution of the present invention, the diameter of the pin pad is 0.5 mm, and the width of the signal line is 0.5 mm.

[0017] According to the above solution of the present invention, the lateral distance between each signal via and the corresponding pin pad is 19-20 mil, and the longitudinal distance between each signal via and the corresponding pin pad is 12-13 mil.

[0018] According to the above solution of the present invention, the aperture of the signal via is 7-9 mil.

[0019] The beneficial effect of the present invention according to the above scheme is that the present invention realizes effective series connection between the pin pads of the same signal by cross-interconnecting the signal routing of the pin pads of the same signal, which not only enhances the wiring structure of the power supply, but also avoids the use of traditional copper foil connection, thereby effectively solving the problem of poor welding that may occur in the welding process of the array power supply module and ensuring the overall quality and stability of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural diagram of the present utility model.

[0021] In the drawings, the reference numerals are as follows:

[0022] 100, circuit board; 10, pin pad; 20, signal trace; 30, signal via; 40, signal area. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0024] It should be noted that the terms "including" and "having," as well as any variations thereof, in the specification and claims of the present invention are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to the process, method, product, or device. Terms such as "disposed" should be interpreted broadly, for example, and may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, internal connections between two elements, or interactions between two elements, unless otherwise expressly defined. Terms such as "upper," "lower," "left," "right," "front," "back," and "bottom" indicate directions or positions based on those shown in the accompanying drawings. These are for ease of description only and should not be construed as limitations on the present invention.

[0025] It's important to note that a common practice on circuit boards is to use copper wiring technology to connect pins with the same electrical network through copper sheets, creating a wide current path. This approach not only helps increase the current-carrying area, reduces resistance and heat generation, but also improves overall electrical performance. In practical applications, copper wiring technology significantly enhances the current-carrying capacity of array power modules, ensuring stable system operation.

[0026] However, BGA package pins are typically coated with solder mask to prevent short circuits and overflow during soldering. However, in the copper-filled areas, this solder mask comes into direct contact with the copper sheet. During soldering, solder can flow onto the copper sheet, causing uneven solder distribution across the pin pads, which should be evenly distributed. Solder paste will be thicker on the pin pads in areas without copper. Pins with excessively thin solder paste can suffer from insufficient solder joint strength, leading to cold joints or open circuits, seriously impacting the power module's electrical performance and reliability.

[0027] like Figure 1 As shown, this embodiment provides a circuit board structure for improving the welding quality of the array power supply module. By cross-interconnecting the signal traces of the pin pads of the same signal, effective series connection between the pin pads of the same signal is achieved, which not only enhances the wiring structure of the power supply, but also avoids the use of traditional copper foil connections, thereby effectively solving the problem of poor welding that may occur in the welding process of the array power supply module and ensuring the overall quality and stability of the power supply.

[0028] Specifically, it includes an array power module arranged on a circuit board, the power module includes a plurality of pin pads, wherein the pin pads are connected to signal vias through signal traces, and the signal traces of adjacent pin pads of the same signal are cross-interconnected.

[0029] By adopting a cross-interconnected signal routing layout, the connection between adjacent pin pads is tighter and more uniform, which increases the width of signal transmission and improves the current carrying capacity. In addition, the signal routing interconnection reduces the concentration of thermal stress during the welding process, effectively disperses the welding stress, avoids problems such as pad falling off and cold soldering caused by excessively high welding temperature or excessively long time, and reduces the risk of open circuit or short circuit caused by poor welding.

[0030] It should be noted that several pin pads form different signal areas, and the signal in each signal area is the same signal.

[0031] In one embodiment, the signal traces extending from the pin pads of the same signal have the same width. Maintaining traces of the same width helps reduce signal attenuation and interference, improving signal integrity and transmission efficiency. Furthermore, traces of the same width facilitate even heat distribution during soldering, thereby reducing the risk of soldering defects caused by localized overheating.

[0032] In one embodiment, the signal traces extending from each pin pad have the same width, which applies not only to pin pads for the same signal but also to pin pads for different signals. Although traces for different signals may carry different currents and frequencies, maintaining consistent trace widths helps simplify the design and production process of the circuit board and reduces manufacturing costs. This design also helps improve the overall reliability and consistency of the circuit board, as uniform trace widths can reduce soldering or connection problems caused by local overheating or stress concentration.

[0033] In one embodiment, the signal trace width is greater than or equal to half the diameter of the pin pad, and the signal trace width is less than or equal to the diameter of the pin pad. This signal trace width setting can ensure that the heat dissipation of all pin pads is basically uniform, solving the problem of poor device soldering caused by uneven heat dissipation, while also taking into account the current carrying capacity of the power ground.

[0034] Preferably, the signal trace width is equal to half the diameter of the pin pad. The setting of the signal trace width can ensure that the heat dissipation of all pin pads is basically consistent to solve the problem of poor device welding caused by uneven heat dissipation, and can also take into account the current carrying problem of the power ground.

[0035] In one embodiment, the pin pad diameter is 0.5mm to 0.8mm. When the pin pad diameter is 0.5mm, the signal trace width can be 0.5mm; or when the pin pad diameter is 0.8mm, the signal trace width can be 0.4mm; or when the pin pad diameter is 0.6mm, the signal trace width can be 0.5mm, and so on. The above-mentioned setting of the pin pad diameter and signal trace width ensures that the heat dissipation of all pads is basically uniform, solving the problem of poor device welding caused by uneven heat dissipation, while also taking into account the current carrying problem of the power ground.

[0036] In one embodiment, the lateral distance between each of the signal vias and the corresponding pin pad is 19 to 20 mils, and the lateral distance between each of the signal vias and the corresponding pin pad can be designed to be 19 mils. Of course, in actual design, the lateral distance between each of the signal vias and the corresponding pin pad can be designed according to actual conditions. The longitudinal distance between each of the signal vias and the corresponding pin pad is 12 to 13 mils, and the longitudinal distance between each of the signal vias and the corresponding pin pad can be designed to be 12 mils. Of course, in actual design, the longitudinal distance between each of the signal vias and the corresponding pin pad can be designed according to actual conditions.

[0037] In this embodiment, the aperture of the signal via is 7-9 mils, and the aperture of the signal via can be designed to be 8 mils. Of course, in actual design, the aperture of the signal via can be designed according to actual conditions. In addition, a via pad is provided on the outside of the signal via to facilitate connection between the pin pad and the external pad. In addition, the outer diameter of the via pad is 14 mils. Of course, in actual design, the outer diameter of the via pad can be designed according to actual conditions.

[0038] In one embodiment, the aperture of the signal via is 7-9 mils, and the aperture of the signal via can be designed to be 9 mils. Of course, in actual design, the aperture of the signal via can be designed according to actual conditions. In addition, a via pad is provided on the outside of the signal via to facilitate connection between the pin pad and the external pad. In addition, the outer diameter of the via pad is 14 mils. Of course, in actual design, the outer diameter of the via pad can be designed according to actual conditions.

[0039] In one embodiment, the aperture of the signal via is 7-9 mils, and the aperture of the signal via can be designed to be 7 mils. Of course, in actual design, the aperture of the signal via can be designed based on actual conditions. In addition, a via pad is provided on the outside of the signal via to facilitate connection between the pin pad and the external pad. In addition, the outer diameter of the via pad is 14 mils. Of course, in actual design, the outer diameter of the via pad can be designed based on actual conditions.

[0040] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0041] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A circuit board structure for improving the welding quality of an array power module, characterized in that: The invention comprises an array power supply module arranged on a circuit board, wherein the power supply module comprises a plurality of pin pads, wherein the pin pads are connected to signal vias through signal traces, and the signal traces of adjacent pin pads of the same signal are interconnected in a cross shape.

2. The circuit board structure for improving the welding quality of array power modules according to claim 1, characterized in that: The widths of the signal traces led out from the pin pads of the same signal are the same.

3. The circuit board structure for improving the welding quality of array power modules according to claim 2, characterized in that: The width of the signal traces led out from each of the pin pads is the same.

4. A circuit board structure for improving welding quality of array power modules according to any one of claims 1 to 3, characterized in that: The signal line width is greater than or equal to half the diameter of the pin pad.

5. The circuit board structure for improving the welding quality of array power modules according to claim 4, characterized in that: The signal line width is smaller than or equal to the pin pad diameter.

6. The circuit board structure for improving the welding quality of array power modules according to claim 4, characterized in that: The signal line width is equal to half the diameter of the pin pad.

7. The circuit board structure for improving the welding quality of array power modules according to claim 5, characterized in that: The pin pad has a diameter of 0.5 mm to 0.8 mm.

8. The circuit board structure for improving the welding quality of array power modules according to claim 7, characterized in that: The pin pad diameter is 0.5 mm, and the signal line width is 0.5 mm.

9. A circuit board structure for improving welding quality of array power modules according to claim 1 or 7, characterized in that: The horizontal distance between each of the signal vias and the corresponding pin pad is 19-20 mils, and the vertical distance between each of the signal vias and the corresponding pin pad is 12-13 mils.

10. The circuit board structure for improving the welding quality of array power modules according to claim 1, characterized in that: The aperture of the signal via is 7-9 mil.

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