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87 results about "Rouging" patented technology

Rouging is a form of corrosion found in stainless steel. It can be due to iron contamination of the stainless steel surface due to welding of non-stainless steel for support columns, or other temporary means, which when welded off leaves a low chromium area.

Board-level packaging structure and method

The invention discloses a board-level packaging structure and method, and the method comprises the following steps: providing a chip with a welding pad and a photosensitive region, and forming a protection glue layer on the photosensitive region; forming photoresist on the chip, and forming a window; filling the windowing position with a metal rewiring layer; providing a temporary carrier plate; forming a metal welding pad on the temporary support plate, and forming a black insulating layer; mounting a chip on the temporary carrier plate; performing plastic packaging; forming a windowing structure on the plastic packaging protection layer; forming a rewiring layer at the position of the windowing structure; forming an insulating protection layer, and forming a corresponding photosensitive window in the photosensitive area; removing the metal rewiring layer and the temporary support plate; a metallic tin layer is formed under the metal pads. According to the invention, a board-level fan-out packaging RDL wiring mode is utilized, the photosensitive area is ingeniously protected in the packaging process, and then the photosensitive area is opened after packaging is basically finished, so that the packaging cost is greatly reduced while the performance required by packaging of the photosensitive chip is satisfied.
Owner:JIANGSU PANGU SEMICONDUCTOR TECHNOLOGY CO LTD

Detachable mobile toilet based on modular design

The invention discloses a detachable mobile toilet based on modular design, relates to the technical field of mobile toilets, and solves the technical problems that an existing mobile toilet depends on welding in installation, the transportation cost is high, accessories have no interchangeability and are easy to rust. The mobile toilet comprises a frame formed by riveting / bolting vertical beams and cross beams, the top of the frame is provided with a clamping groove structure for installing a water purifying tank, a closed space with a bathroom device and a door is formed in the middle of the frame, and the bottom of the frame is provided with a cavity structure for installing a sewage tank in a drawing mode; the volume ratio of the clean water tank to the sewage tank is 1: (1.2-1.8), the clean water tank and the sewage tank are modularized steel structure sealed water tanks, the top of the clean water tank is provided with a photovoltaic module and is connected with an energy storage battery, and the sewage tank is provided with a U-shaped pipe and an inclined upward excrement pumping opening; a bottom cavity between the frame and the sewage tank can be provided with wires and filled with foaming materials. The whole process is free of welding installation, parts are modularized and interchangeable, transportation is convenient and fast, corrosion resistance is achieved, heat insulation and noise reduction are achieved, and the device is suitable for water-resource-deficient areas, ocean transportation and other scenes.
Owner:ANHUI BOYUE CABIN INTELLIGENT ENVIRONMENTAL PROTECTION TECHNOLOGY CO LTD

Cabling rack with porous U-shaped steel structure

The utility model relates to the technical field of machine room wiring equipment, and discloses a cabling rack with a porous U-shaped steel structure, which comprises a transverse frame I and a transverse frame II, the transverse frame II is arranged at the top end of the transverse frame I, a vertical frame I is vertically arranged between the transverse frame I and the transverse frame II, and a transverse frame III is arranged on the right side of the transverse frame II. When the cabling rack with the porous U-shaped steel structure is installed and used, the right side fixing plates I of the transverse rack I and the transverse rack II of one group of cabling rack are correspondingly attached to the left side fixing plates II of the transverse rack III and the transverse rack IV of the other group of cabling rack; then, a connecting bolt can penetrate through the interiors of the second fixing plate and the first fixing plate on the right side of the second fixing plate, and a locking ring is screwed into the left side of the exterior of the connecting bolt, so that auxiliary splicing combination can be performed between the two groups of cabling racks, the length of the cabling racks is prolonged, and the integral structure of the cabling racks can be improved; the problem that combination, connection, installation and extension of cabling racks are inconvenient is solved.
Owner:NINGBO GAME COMM EQUIP CO LTD

Clamping tool for left frame and right frame of liquid cooling cabinet

The embodiment of the utility model discloses a clamping tool for a left frame and a right frame of a liquid cooling cabinet, which comprises a first clamping mechanism, a second clamping mechanism and a third clamping mechanism, the first clamping mechanism comprises a support, a first clamping cylinder, a mounting seat, a second clamping cylinder and a third clamping cylinder, the support is used for supporting a cross rod on the frame, the first clamping cylinder is used for clamping and fixing the cross rod, and the mounting seat is used for mounting the cross rod on the frame; the second clamping air cylinder is fixedly installed on the installation base and used for clamping and fixing the wiring plate, and the third clamping air cylinder is used for clamping and fixing the second supporting rod. And the second clamping mechanism is used for fixing the first supporting rod. According to the clamping tool for the left frame and the right frame of the liquid cooling cabinet, through accurate positioning and multi-point clamping, the deformation risk in the welding process is reduced, the welding size consistency and the structural stability of the frames are improved, meanwhile, the production efficiency and the assembly quality are improved, and the follow-up correction working time is shortened.
Owner:JUNGANG (NINGBO) METAL PRECISION PARTS CO LTD

USB female seat connector with screw hole

The utility model provides a USB female seat connector with a screw hole, which belongs to the technical field of USB female seat connection and comprises a metal shell. According to the utility model, under the double-row arrangement of the two groups of the first terminals and the second terminals, the subsequent welding is facilitated, the PCB wiring space is saved, all the first terminals and the second terminals are formed by 90-degree bending of an automatic machine, the stamping process production is facilitated, the electroplating cost is saved, and under the arrangement of the limiting raised lines, the limiting openings, the buckling positions, the buckling points and the elastic clamping pieces, the production efficiency is improved. Compared with the prior art, the USB female seat connector has high retaining force, the stability of the USB female seat connector in use is guaranteed, under the arrangement of the screw plate, the threaded holes and the welding spots, the high-strength screw plate and the shell of the client side can be connected and fixed together through the M3 screws through the threaded holes, and then locking of the metal shell and the interior of the client side shell support is completed. And meanwhile, a plurality of groups of welding spots are welded on the metal shell combination line by laser, so that the impact strength of the metal shell is improved, and the applicability of the USB female seat connector is further improved.
Owner:SHENZHEN JIANDUAN TECH

Phase shifter cavity structure and phase shifter

The present disclosure relates to the technical field of antennas, and in particular to a phase shifter cavity structure and a phase shifter. The phase shifter cavity structure comprises: a cavity, wherein the cavity is a non-electroplated metal cavity; grounding members, wherein a surface of each grounding member is provided with an electroplated layer, the grounding member is spaced apart from the cavity, the grounding member is provided with a wiring structure, and the wiring structure comprises wire grooves; and welding members, wherein the welding members are connected between the grounding members and the cavity, and are configured to fix the grounding members and the cavity. The connection between the grounding members and the cavity can be realized by means of a laser welding process, and large-area planar laser welding is not required, thereby reducing the welding area, reducing production costs, improving the connection quality between the grounding members and the cavity, and reducing the risk of intermodulation. In addition, the wire grooves on the grounding members extend in a direction perpendicular to the thickness direction of the grounding members, and coaxial cables can run along the outer side surface of the cavity during wiring, thereby avoiding bending at the roots of outer conductors of the coaxial cables, and improving the stability of the connection structure between the coaxial cables and the cavity.
Owner:WUHAN HONGXIN TELECOMM TECH CO LTD

Magnetic apparatus with sheet-shaped pin assemblies, power module, and method of making

A method includes disposing a substrate layer on a copper layer to form a pin assembly and adhering the pin assembly to a side surface of an inductor with bonding pads on either of the upper and lower surfaces, wherein welding surfaces are coplanarly aligned. An assembled magnetic apparatus including sheet-shaped pin assembly or pin assemblies and an inductor is thereby manufactured. A power module includes the magnetic apparatus, IPM units, a wiring board and output capacitors. The pin assembly may meet a PCB process specification for panel production, and the pin pitch is configured to be lessened.
Owner:SHANGHAI METAPWR ELECTRONICS CO LTD

Packaging structure and forming method thereof

PendingCN121398624AInterconnection densityMechanical engineering
The invention provides a packaging structure and a forming method thereof, a bridging chip in a wiring insertion layer is in bonding connection with a chip packaging assembly through a first organic interconnection layer and a second organic interconnection layer, and the first organic interconnection layer and the second organic interconnection layer are bonded to form an organic hybrid bonding structure. The bridging chip does not need to be connected with the chip packaging assembly through soldering tin, so that the reliability problem of the packaging structure caused by defects (cavities or cracks) of welding points does not exist, and the packaging structure provided by the invention has good reliability; moreover, the interconnection density of the bridging chip and the devices in the chip packaging assembly can be improved, the denser I / O interconnection is realized, the transmission density is improved, and the delay is reduced.
Owner:JCET MICROELECTRONICS (JIANGYIN) CO LTD

Large caisson hoist

ActiveCN224279537UEffective accommodationefficient storageLoad-engaging elementsRubber matCaisson
This utility model discloses a large caisson lifting device, including a caisson body, lifting lugs, cables, a lifting hole, and a steel pipe. The lifting lugs are fixed to the upper end of the caisson body. The lifting hole is located on the outer side wall of the caisson body. The steel pipe is located on the outer wall of the caisson body, with one end of the steel pipe slidably inserted into the lifting hole. A first rubber pad is fixedly connected to the inner side wall of the steel pipe. A wiring groove is provided on the upper side wall of the steel pipe and at the edge of the end inserted into the lifting hole. A second rubber pad is fixedly connected to the inner side wall and bottom of the wiring groove. A guide block is fixedly connected to the lower side wall of the steel pipe. A guide groove is provided between the outer wall of the caisson body and the bottom of the lifting hole. This utility model utilizes the guide block and wiring groove structure to effectively store the cable, reduce wear between the cable and the caisson and steel pipe, and prevent the steel pipe from rotating during operation, thus improving practicality and convenience.
Owner:SHANGHAI BAOLING ALUMINUM PROD CO LTD

Wiring structure of welding robot

A wiring structure of a welding robot comprises a main body capable of moving in the six-axis direction, the main body comprises a base and six joint mechanical arms movably connected, a first mounting cavity is formed in the base, and a first speed reducer is rotationally connected into the first mounting cavity; a first wire accommodating space is defined by the first speed reducer and the inner wall of the first mounting cavity; the first joint mechanical arm is fixedly connected to the first speed reducer, a first driving motor is further fixedly arranged on the first joint mechanical arm, and the first driving motor is in transmission connection with the first speed reducer; the first wire harness is used for transmitting electric signals, and the first wire harness penetrates out of the first outlet to be electrically connected with the first driving motor after being wound in a roundabout mode along the first wire containing space. According to the wiring structure provided by the utility model, under the condition that the rotation precision is improved, the wiring harness is ensured not to influence the rotary motion during the rotary motion.
Owner:东莞市大研自动化设备有限公司

A welding torch nozzle device with self-powered and self-diagnostic functions

This invention discloses a welding torch nozzle device with self-powered and self-diagnostic functions, including a nozzle body, a thermoelectric conversion unit, an impedance sensing unit, and a signal processing unit. The signal processing unit is electrically connected to both the impedance sensing unit and the thermoelectric conversion unit, and the thermoelectric conversion unit supplies power to the signal processing unit. The signal processing unit receives impedance change signals from the impedance sensing unit and determines whether the nozzle is clogged. By placing the thermoelectric conversion unit on the outer wall of the nozzle body to recover welding waste heat and convert it into electrical energy, and placing the impedance sensing unit on the inner wall of the nozzle body to directly detect impedance changes caused by spatter adhesion, combined with the signal processing unit, in-situ real-time monitoring under self-powered conditions is achieved, forming a nozzle structure that integrates power supply and sensing. This eliminates the dependence on external power sources and complex wiring, improves the reliability and adaptability of the system in harsh welding environments, and significantly enhances the stability of the welding process and the quality of the weld.
Owner:SOUTHEAST UNIV

Preparation method of 2.5 D packaging structure

PendingCN121463841AThermal dilatationUndermatching
According to the preparation method of the 2.5 D packaging structure provided by the invention, in the process of preparing the 2.5 D packaging structure, the large-size substrate is directly and electrically connected with the rewiring layer, so that compared with a traditional technological process of packaging first and then carrying out substrate mounting, the warping problem of a high-performance and large-size chip packaging structure can be effectively solved, and the reliability of the packaging structure is improved. The problem of pseudo soldering caused by mismatching of thermal expansion coefficients is avoided; according to the preparation method of the 2.5 D packaging structure, the three supporting substrates are respectively and simultaneously subjected to process operation and then combined through bonding, so that the electrical connection quality can be improved, the process time can be effectively shortened, the process yield can be improved, and the thermal stress accumulation problem of the process structure can be improved.
Owner:SJ SEMICONDUCTOR (JIANGYIN) CORP

2.5 D packaging structure and preparation method thereof

PendingCN121463851AThermal dilatationUndermatching
According to the 2.5 D packaging structure and the preparation method thereof provided by the invention, in the process of preparing the 2.5 D packaging structure, the large-size substrate is directly and electrically connected with the rewiring layer, so that compared with a traditional technological process of packaging first and then carrying out substrate mounting, the warping problem of a high-performance and large-size chip packaging structure can be effectively solved, and the reliability of the packaging structure is improved. The problem of pseudo soldering caused by mismatching of thermal expansion coefficients is avoided; according to the 2.5 D packaging structure and the preparation method thereof, the two supporting substrates are respectively and simultaneously subjected to process operation, and then are combined through bonding, so that the electrical connection quality can be improved, the process time can be effectively shortened, the process yield can be improved, and the thermal stress accumulation problem of the process structure can be improved.
Owner:SJ SEMICONDUCTOR (JIANGYIN) CORP

Steel bar strain gauge system and method for testing internal force of pile body based on wireless transmission

The invention discloses a steel bar strain gauge system and method for testing internal force of a pile body based on wireless transmission, and belongs to the field of pile foundation engineering monitoring. The system comprises a wireless steel bar strain gauge and an intelligent frequency acquisition and conversion instrument which work cooperatively through a wireless communication network. The wireless steel bar strain gauge is fixed to a steel bar through a non-welding type mechanical clamp, and the connecting rod is provided with a surface structure for enhancing the bond stress of concrete. A pile body internal force calculation model is arranged in the intelligent frequency acquisition and conversion instrument, and real-time acquisition, analysis and exception handling of data are achieved. Through deep cooperation of mechanical connection fidelity, reliable wireless transmission and efficient intelligent processing, the problems that a traditional wired testing system is complex in wiring, prone to interference and low in efficiency are solved, the measurement precision is improved by more than or equal to 15%, the data processing efficiency is improved by 60%, and the system is particularly suitable for pile foundation internal force testing in a complex engineering scene.
Owner:SHENZHEN INVESTIGATION & RES INST

Three-phase power bridge preparation process based on multi-row chip series welding technology

The invention relates to the technical field of chip series welding, and discloses a three-phase power bridge preparation process based on a multi-row chip series welding technology, and the preparation process comprises the following steps: S1, design and layout, S2, multi-beat chip mounting, S3, reflow soldering and silver sintering, S4, housing assembly and potting, and S5, testing and screening. A wiring pattern of a copper-clad ceramic substrate is designed, then a current path is optimized, loop inductance is minimized, the current distribution uniformity between parallel chips is ensured, enough safe creepage distances and electrical gaps between different potentials are ensured, and the electrical gaps comprise DC +, DC-and output U / V / W of each phase. Optimizing chip arrangement and copper layer thickness to facilitate conduction of heat to a radiator, balancing thermal coupling, space utilization rate and process feasibility, designing low-inductance routing for a gate drive signal, and forming a required copper circuit pattern through active metal brazing; and cleaning and surface treatment are carried out to improve the reliability of subsequent welding and bonding.
Owner:CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD

Wiring type flexible circuit board

The utility model relates to the technical field of circuit board devices, and discloses a wiring type flexible circuit board, which comprises a circuit board main body assembly, two sides of the circuit board main body assembly are provided with quick positioning assemblies, and the quick positioning assemblies are arranged on two sides of a quick dismounting assembly. The quick positioning component is mounted on the device, so that when the device is used, the temporary positioning and fixing mounting effect can be provided, and in the temporary mounting work, the dismounting complexity, the destructiveness and the like of a traditional welding mode are avoided.
Owner:TONGGU HUAYI DISPLAY TECHNOLOGY CO LTD

Underfloor wiring structure and underfloor wiring method

To improve fire resistance performance of underfloor wiring.SOLUTION: An underfloor wiring structure includes a fireproof wall 1AA that is laminated with heat-resistant material 1AAa and insulation material 1AAb in the direction of thickness, is installed standing on a concrete floor 101, and is capable of compartmentalizing cables of a plurality of systems and a heat-resistant shielding material 1AB that closes a gap between an upper floor plate 103 placed on the fireproof wall 1AA and the fireproof wall 1AA by elastic deformation.SELECTED DRAWING: Figure 3
Owner:MITSUBISHI HEAVY IND LTD +1

Electroplating method for BUMP of metals with different heights in chip packaging

The invention discloses an electroplating method for chip packaging different-height metal BUMP, which relates to the technical field of chips, and comprises the following steps: S1, coating photoresist on the surface of a rewiring layer on which a conductive seed layer is deposited to form a PR layer; s2, forming a plurality of electroplating holes in the PR layer, wherein the diameters of at least two electroplating holes are different; s3, metal materials are deposited in all the electroplating holes through the electroplating technology, and metal bumps BUMP of different heights are formed; s4, removing the residual photoresist; s5, performing Bound bonding on the metal bumps of the wafer and the metal bumps on the rewiring layer; s6, carrying out plastic packaging Molding on the bonded wafer; the diameters of different electroplating holes are controlled, and the holes are formed in one-time photoresist, so that the metal bumps BUMP with different heights can be prepared through one-time electroplating; different from the condition that one photo-etching process and one plating process need to be implemented for one height dimension when the BUMPs with different heights are prepared in the traditional technology, the method improves the efficiency of preparing the BUMPs with different heights to the maximum extent.
Owner:CHENGDU ESWIN SYST IC CO LTD

Steel structure anchoring block for external prestressing reinforcement

The utility model discloses a steel structure anchoring block for external prestressing reinforcement, which comprises a wiring mechanism, a pressing mechanism and a locking mechanism, and the wiring mechanism comprises a steel cable sleeve, a plurality of through holes arranged on the steel cable sleeve, and a detachable steel cable connected with the steel cable sleeve. According to the utility model, after the steel cable is introduced into the steel cable sleeve, the extrusion block is inserted into the steel cable sleeve, at the moment, the plugging plate and the inner wall of the steel cable sleeve form a matched clamping structure under the thrust action of the extrusion block, and the extrusion block is locked through a plurality of bolts, so that the preliminary fixation of the steel cable is completed; the steel cable fixing device has the advantages that the steel cable fixing device is simple in structure and convenient to use, bolts are inserted to sequentially penetrate through the arc portions of the penetrating openings, nuts are tightly attached to the bottom of the base plate for screwing operation, secondary fixing of the steel cable is achieved, and the double fixing mechanism can effectively improve the pull-off resistance and safety redundancy of a steel cable system through mechanical complementary design.
Owner:SUZHOU DAKANG CONSTR TECH CO LTD

Sealed wire outlet device of marine permanent magnet motor

The utility model relates to a sealed wire outlet device of a marine permanent magnet motor. The sealed wire outlet device is characterized by comprising a stainless steel cable waterproof joint, a junction box seat, a grounding device, a wiring copper bar, an insulator, a wiring sealing plate and a junction box cover, the wiring copper bar is connected to a transverse strip in the junction box seat through an insulator; the insulator is made of an insulating material, and threads are drilled at two ends; the wiring sealing plate is a rectangular plate, and a plurality of through holes for threading are drilled in the middle of the wiring sealing plate; a sealing gasket is arranged at the bottom of the wiring sealing plate and is fixed on the junction box seat through screws; a grounding device is arranged on one side in the junction box seat; a plurality of stainless steel cable waterproof joints are arranged on one side outside the junction box seat; and a multi-layer sealing structure is arranged among the junction box seat, the junction box cover and the base. According to the utility model, space is effectively saved, debugging and installation in a narrow space of a ship are facilitated, and electromagnetic interference is effectively inhibited; the safety performance of the motor is improved, and the service life of the motor is prolonged; potential safety hazards are avoided; and the protection level is improved.
Owner:CHINA CHANGJIANG NAT SHIPPING GROUP MOTOR FACTORY

Printed circuit board and electronic device

The utility model relates to the technical field of printed circuits, and provides a printed circuit board and an electronic device, the printed circuit board comprises a substrate, a bonding pad and a first channel, the bonding pad comprises at least two welding areas arranged on the surface of the substrate at intervals, the first channel is arranged between the welding area and the adjacent welding area, and the first channel is arranged on the surface of the substrate. A wire is arranged in the first channel, and an insulating coating is laid on the first channel. The printed circuit board provided by the utility model is used for overcoming the defect that a large bonding pad compresses available wiring space in the prior art, and the bonding pads are reasonably segmented, so that the first channel for laying wires is limited between the welding area and the adjacent welding area, thereby not only providing wiring space, but also reducing wiring detour caused by narrow space, and improving the wiring quality. Moreover, a high-density interconnection technology does not need to be introduced or the area of the substrate does not need to be enlarged, the wiring efficiency can be effectively improved, and the wiring cost is reduced.
Owner:ZHEJIANG UNIVIEW TECH CO LTD

An infrared wave-transmitting based penetrating airtight bonding method

PendingCN122270195AAvoid the risk of lifespan lossHighly reliable airtight bondingInfraredGrating
The present application relates to a kind of based on infrared wave-penetrating penetration type hermetic bonding method, comprising the following steps: according to the wiring design of hermetic component, micro-bump preparation is carried out to upper layer plate and lower layer plate based on standard RDL process in TSV process;Utilize high-precision alignment interconnection system, realize the accurate alignment of upper and lower layer plate interconnection point and sealing ring position;Infrared generator is moved to the upper of sample, switch grating to the grating customized according to the required welding position, adjust focal length to the surface position of upper layer plate film layer, up-regulate certain height, then utilize high-precision alignment system fine adjustment sample position, realize the high-precision alignment of light spot and bonding point;Open infrared generator, hermetic bonding;Discharge.The present application is absorbed by micro-bump of specific design metal matching system to infrared light, assisted with basic heat, realize the high-reliability hermetic bonding of controllable position, controllable temperature signal upper and lower interconnection and sealing ring.
Owner:NANJING RES INST OF ELECTRONICS TECH

Ceramic adapter substrate and surface BGA manufacturing method thereof

PendingCN122161472AProcess designRouging
The present application relates to a kind of ceramic adapter substrate and its surface BGA manufacturing method, the back surface of the ceramic adapter substrate is BGA pad structure, the BGA pad structure includes via pad and ball pad, it is characterized in that, the top surface height of the via pad is higher than the top surface height of the ball pad, and the process design height difference of overhang between the two is formed.The present application sets up overhang height difference in the BGA pad structure of ceramic adapter substrate, so that the top surface height of via pad is higher than the top surface height of ball pad, in subsequent front surface multilayer wiring process, equipment mesa and suction disc are only contacted with the higher height via pad, effectively avoid ball pad and its surface plating layer from being abraded, completely solve the problem of ball pad easy to damage and poor welding reliability from structure.
Owner:MAXONE SEMICON CO LTD

A sandwich-type color steel wall panel structure with integrated cable routing function

ActiveCN224431794UCable trayElectric cables
This utility model discloses a sandwich-type color steel wall panel structure with integrated cable routing function, including an outer color steel plate, an inner color steel plate, a sandwich filling layer, and a cable tray layer disposed within the sandwich filling layer. The outer and inner color steel plates are arranged opposite each other and connected and fixed by a frame frame. The sandwich filling layer fills the space between the outer and inner color steel plates. The cable tray layer is disposed in the middle area inside the sandwich filling layer and is pre-embedded along the length or width of the wall panel. The cable tray layer has one or more cable tray channels for concealed routing of power lines, data lines, network cables, etc. This structure can complete concealed wiring simultaneously during wall panel installation, avoiding later grooving or surface conduit construction, improving construction efficiency and the aesthetic integrity of the wall, and is suitable for quick-assembly building scenarios such as factories, mobile homes, and lightweight buildings.
Owner:JIANGMEN ZHANJIAN COLOR STEEL STRUCTURE CO LTD

Welding power supply device with short circuit protection function

The application discloses a welding power supply device with short-circuit protection function, which comprises a welding box, a power supply unit, a voltage and current display, a transformer, a fuse, an overcurrent relay and a thermistor unit, the power supply unit is installed on the inner upper side of the welding box, a control panel is arranged in the welding box, the voltage and current display is connected with the control panel, a main circuit is connected outside the transformer, the fuse is arranged in the main circuit, a connecting port is arranged outside the welding box, the main circuit is connected with the connecting port through internal wiring, and the overcurrent relay is arranged in series on the main circuit; the thermistor unit is installed in parallel with the overcurrent relay on the same section of the main circuit; the welding power supply device can realize double short-circuit protection, the thermistor unit arranged in parallel on the main circuit can freely adjust the series or parallel monitoring of the variable resistance unit with different resistance values, effectively cope with the problems of instantaneous large current and overheating, and reduce the possibility of false triggering.
Owner:RUIBAO (CHANGZHOU) WELDING & CUTTING TECH CO LTD

A new type of free-wood formwork reinforcing device

The application belongs to the technical field of building construction, and discloses a novel wood-encumbrance-free formwork supporting and reinforcing device, which comprises a supporting disc, one end of the supporting disc is threadedly connected with a bolt, an adjusting mechanism is installed in the supporting disc, one end of the adjusting mechanism is installed with a dismounting mechanism, and one end of the dismounting mechanism is installed with a wiring pipe. The cooperation of the screw rod, hand lever, first connecting seat and other structures enables the device to integrate the internal support of the wood-encumbrance-free formwork and the permanent limiting function of the wiring pipe, solves the core problems that the existing formwork system and the wiring pipe pre-embedding system are independent of each other, the wiring pipe fixing point position is not adjustable, and the wiring pipe is prone to displacement during concrete vibrating, the hand lever drives the screw rod to rotate, drives the adjusting seat to move along the axial direction, adapts to the wiring pipe pre-embedding requirements of different wall thicknesses and pouring areas, simultaneously provides internal support for the formwork, and finally achieves the effects of simplifying the formwork and wiring pipe pre-embedding process, precisely controlling the wiring pipe elevation and trend, and avoiding the displacement of the wiring pipe during concrete vibrating.
Owner:CHINA RAILWAY CONSTR ENG GRP FOURTH CONSTR CO LTD +1

An automatic welding device for automobile sheet metal processing

The application relates to the technical field of automobile sheet metal machining, in particular to an automatic welding device for automobile sheet metal machining, which comprises a base; a pneumatic clamping device is arranged at the top of the outer wall of the base; a supporting column is fixedly connected to the top of the outer wall of the base; a driving device is fixedly connected to the top of the outer wall of the supporting column through a fixing block; a threaded rotating shaft is arranged at the output end of the driving device; when the threaded rotating shaft is rotated to drive the threaded plate to descend, the threaded rod is rotated through a linkage mechanism, the moving plate, the square block, the rotating rod, the circular plate and the cleaning layer are moved, and the workpiece is cleaned; because the workpiece is cleaned, the welding effect of the welding device is better; because the cleaning mechanism and the welding mechanism realize cooperative work through the linkage mechanism, independent power sources and driving control systems need not be respectively arranged for the two, the hardware cost and the occupied space are reduced, the electrical wiring, control programming and maintenance of the whole system are more simple, and the maintenance cost and difficulty are reduced.
Owner:JIANGXI RUISHENG TECH CO LTD

Plating method and method for manufacturing a wiring circuit board

The present invention provides a plating method and a method for manufacturing a wiring circuit board that can reduce the cost required for the plating process. [Solution] In the plating method, a laminate 1 of stainless steel and copper or copper alloy is prepared, and a nickel underplating layer is simultaneously formed on a first plated portion provided on the stainless steel and a second plated portion provided on the copper or copper alloy using a hydrochloric acid-based electrolyte. In the manufacturing method of a wiring circuit board, a laminate of stainless steel and a conductor layer made of copper or copper alloy is prepared, and a first connection terminal and a second connection terminal are simultaneously formed on the laminate. In the formation of the first connection terminal, a nickel underplating layer is formed on the first terminal portion provided on the stainless steel using a hydrochloric acid-based electrolyte. In the formation of the second connection terminal, a nickel underplating layer is formed on the second terminal portion provided on the stainless steel using a hydrochloric acid-based electrolyte.
Owner:NITTO DENKO CORP