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Printed circuit board with high-speed differential signal wiring structure

A printed circuit board, high-speed differential technology, applied in the direction of printed circuit components, electrical connection printed components, etc., can solve the problems of inability to share, increase the cost of the motherboard, and achieve the effect of saving costs

Inactive Publication Date: 2012-07-11
YANTAI POWER SUPPLY COMPANY OF STATE GRID SHANDONG ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, even though the chip can support connectors of four specifications, only one kind of production can be selected during production, that is, a motherboard that supports connectors of the first specification, or a motherboard that supports connectors of the second specification, or a motherboard that supports connectors of the third specification. Motherboards with form factor connectors, or boards that support 4th form factor connectors, cannot be shared
Therefore, according to the requirements of different manufacturers, it is necessary to redesign the motherboard wiring, which increases the cost of motherboard design

Method used

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  • Printed circuit board with high-speed differential signal wiring structure
  • Printed circuit board with high-speed differential signal wiring structure
  • Printed circuit board with high-speed differential signal wiring structure

Examples

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Embodiment Construction

[0025] Please also refer to figure 1 and figure 2 A preferred embodiment of the printed circuit board 100 with a high-speed differential signal wiring structure of the present invention includes a high-speed differential signal control chip 10, first to eighth coupling capacitor pads 21-28, first to fourth connector pads 31-34, transmission lines 110, 120, 210, 220, 230, 240, 250, 260, 270, and 280, first to fourth shared pads 12, 14, 16, and 18. Wherein, the first and second connector pads 31 and 32, the transmission lines 210, 220, 230 and 240, the first to fourth coupling capacitor pads 21-24, the first and second shared pads 12, 14 are all arranged on the upper layer of the printed circuit board, the third and fourth connector pads 33 and 34, the transmission lines 250, 260, 270 and 280, the fifth to eighth coupling capacitor pads 25-28, the first The third and fourth shared pads 16, 18 are all arranged on the lower layer of the printed circuit board, and the transmissi...

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Abstract

A printed circuit board with a high-speed differential signal wiring structure comprises a high-speed differential signal control chip, a first to eighth coupling capacitor welding pad, a first to fourth connector welding pad, a plurality of transmission lines and a first to fourth shared welding pad, wherein the high-speed differential signal control chip is selectively connected with the first to fourth connector welding pad through the first to fourth shared welding pad. The printed circuit board with the high-speed differential signal wiring structure can be selectively connected with a plurality of connectors.

Description

technical field [0001] The invention relates to a printed circuit board with a high-speed differential signal wiring structure. Background technique [0002] Existing general personal computer mainboard, except central processing unit, chipset, also has several connectors that are used to install adapter card. With the development of the electronic industry, the function of the chip is further improved. The same chip can support different connectors. For example, a peripheral component interconnection (PCI) chip can support the connector of the first specification, such as SAS (Serial Attached SCSI). The hard disk of the transmission specification can also support the connector of the second specification at the same time, for example, a hard disk supporting the SATA (SerialATA) transmission specification. Different motherboard products will choose to install different connectors. For example, some manufacturers require only connectors of the first specification to be insta...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/11
Inventor 李政宪陈永杰许寿国严欣亭
Owner YANTAI POWER SUPPLY COMPANY OF STATE GRID SHANDONG ELECTRIC POWER
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