CSOP type ceramic shell, amplification filter and manufacturing method
A ceramic shell and filter technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems that do not conform to the development trend of large-scale, high-density data transmission, and the signal transmission density is low. The assembly process is highly reliable, the processing difficulty is reduced, and the processing cost is reduced.
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[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0037] Please also refer to Figure 1 to Figure 6 , the CSOP type ceramic shell provided by the present invention is now described. The CSOP type ceramic shell includes: a ceramic substrate 3, a metal wall 4, a metal chassis 1 and a lead frame 2, the ceramic substrate 3 is provided with an interconnection hole, and a metal tungsten column 9 is arranged in the interconnection hole; the metal wall 4 is arranged on the front of the ceramic substrate 3 to form a package cavity with the ceramic substrate 3; the metal chassis 1 is arranged on the back of the ceramic sub...
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