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CSOP type ceramic shell, amplification filter and manufacturing method

A ceramic shell and filter technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems that do not conform to the development trend of large-scale, high-density data transmission, and the signal transmission density is low. The assembly process is highly reliable, the processing difficulty is reduced, and the processing cost is reduced.

Pending Publication Date: 2022-02-15
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since this connection method needs to dig holes in the metal box and weld glass insulators, the number of input and output signals will be limited, and the signal transmission density is low, which does not conform to the development trend of large-scale and high-density data transmission.

Method used

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  • CSOP type ceramic shell, amplification filter and manufacturing method
  • CSOP type ceramic shell, amplification filter and manufacturing method
  • CSOP type ceramic shell, amplification filter and manufacturing method

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Embodiment Construction

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Please also refer to Figure 1 to Figure 6 , the CSOP type ceramic shell provided by the present invention is now described. The CSOP type ceramic shell includes: a ceramic substrate 3, a metal wall 4, a metal chassis 1 and a lead frame 2, the ceramic substrate 3 is provided with an interconnection hole, and a metal tungsten column 9 is arranged in the interconnection hole; the metal wall 4 is arranged on the front of the ceramic substrate 3 to form a package cavity with the ceramic substrate 3; the metal chassis 1 is arranged on the back of the ceramic sub...

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Abstract

The invention provides a CSOP type ceramic shell, an amplification filter and a manufacturing method, and belongs to the technical field of ceramic packaging, the CSOP type ceramic shell comprises a ceramic substrate, a metal wall body, a metal chassis and a lead frame; the ceramic substrate is provided with interconnection holes, and metal tungsten columns are arranged in the interconnection holes; the metal wall body is arranged on the front surface of the ceramic substrate and forms a packaging cavity with the ceramic substrate; the metal chassis is arranged on the back surface of the ceramic substrate; the lead frame is connected to the back surface of the ceramic substrate and is connected with the metal tungsten columns; the ceramic substrate is made of aluminum oxide high-temperature co-fired ceramic. According to the CSOP type ceramic shell provided by the embodiment of the invention, the high-temperature co-fired ceramic is adopted to replace low-temperature co-fired ceramic, the high-temperature co-fired ceramic substrate and the lead frame are welded together during welding, and then the ceramic substrate, the metal chassis and the metal wall body are welded together by adopting the high-temperature welding flux, so that the processing cost and the processing difficulty are reduced; and the requirements of high-density wiring, batch, miniaturization, low cost, high reliability of an assembly process and the like can be met.

Description

technical field [0001] The invention belongs to the technical field of ceramic packaging, and in particular relates to a CSOP type ceramic shell, an amplification filter and a manufacturing method of the amplification filter. Background technique [0002] The amplifier filter module is a typical representative of high-density circuit integration technology. It encapsulates multiple chips with different functions, capacitors, resistors, inductors, filters, sensors and other devices in one housing, and assembles them into a single standard package that can realize signal amplification and filtering. [0003] With the continuous development of electronic equipment and products in the direction of miniaturization, high frequency, multi-function and high performance, higher requirements are placed on the size and weight of the amplifier filter module. The traditional processing scheme is the combination of low-temperature co-fired ceramic substrate and metal box body, which has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/15H01L23/13H01L23/06H01L23/49H01L23/495H01L23/498H01L25/16H01L21/50H01L21/52H01L21/60H03H9/05H03H9/10
CPCH01L23/15H01L23/13H01L23/06H01L23/49H01L23/495H01L23/49866H01L25/16H01L25/165H01L23/49827H01L21/52H01L21/50H01L24/13H03H9/05H03H9/10
Inventor 杨振涛高岭于斐刘林杰张志庆王东生任赞刘旭程换丽路聪阁
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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