Airtight wafer level packaging structure and process of surface acoustic wave device
A surface acoustic wave device and wafer-level packaging technology, which is applied to electrical components, impedance networks, etc., can solve the problems of increasing size, achieve the effects of improved air tightness, high shear strength, and improved processing efficiency
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[0031] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0032] The packaging technology is applied in the technical field of packaging of high-reliability surface acoustic wave devices. Specifically, the functional chip of the surface acoustic wave device and the capping wafer are bonded together by wafer packaging technology to form an airtight seal.
[0033] The structure of the surface acoustic wave device targeted by this packaging process is as follows: figure 2 As shown, it can be seen from the figure that the surface acoustic wave device includes a functional chip 1 and a capping wafer 2, a circle of bonding layer metal 3 is plated on the periphery of the working surface of the functional chip 1, and the capping wafer 2 A circle of bonding layer metal 3 is also plated on the corresponding position of each chip bonding layer metal, and the functional chip 1 and the capping wafer 2 are bonde...
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