Array substrate, display panel and display device

A technology for array substrates and display panels, which is applied in the fields of array substrates, display panels and display devices, can solve problems such as reducing the lower frame, and achieve the effects of increasing space, meeting layout requirements, and avoiding wiring difficulties

Pending Publication Date: 2020-11-13
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For the COG bonding solution, since both the driver chip (IC) and the flexible circuit board (FPC) need to be bound to the lower frame of the display panel, and the IC and the FPC need to be connected by wiring, the lower frame needs to be further reduced more difficult

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  • Array substrate, display panel and display device
  • Array substrate, display panel and display device
  • Array substrate, display panel and display device

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Embodiment Construction

[0038] The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

[0039] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation...

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Abstract

The invention discloses an array substrate, a display panel and a display device. The array substrate is provided with a binding area. The binding area comprises a driving chip binding area and flexible circuit board binding areas, the driving chip binding area is distributed in the middle of the binding area, the flexible circuit board binding areas are distributed on the two sides of the drivingchip binding area in the second direction, the driving chip binding area is provided with a first bonding pad, a wiring area and a second bonding pad which are successively distributed in a first direction, the first bonding pad is arranged close to the first area, the second bonding pad comprises a second welding spot group and an isolation area, the second welding spot group is located on two sides of the isolation area in the second direction, second welding spots of the second welding spot group are connected with the flexible circuit board binding areas through wires, and the wires passthrough the wiring area. According to the invention, the layout requirement of the wire for connecting the flexible circuit board binding areas and the second welding spot group can be met, the problems of difficult wiring, easy interference between signals and the like caused by insufficient wiring space are avoided, and implementation of the narrow frame design of the display panel is facilitated.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a display panel and a display device. Background technique [0002] In recent years, the full screen has become the mainstream design solution in the display field and is favored by consumers. In order to increase the screen-to-body ratio, the narrower the lower border of the display screen, the better. [0003] At present, there are three kinds of bonding solutions for the lower frame of the display screen: COG (chip on glass), COF (chip on FPC) and COP (chip on plastic). Although the frame is getting smaller and smaller, the cost is also getting higher and higher. Based on Considering the cost, the lower frame of the display screen currently on the market mainly adopts the COG (chip on glass) lamination scheme. For the COG bonding solution, since both the driver chip (IC) and the flexible circuit board (FPC) need to be bound on the lower frame of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30G02F1/1345H01L27/32
CPCG09F9/30G02F1/13458H10K59/00H05K1/118H05K1/189H05K2201/10128H01L27/124
Inventor 许传志谢正芳吴勇
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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