152 results about "Chip on glass" patented technology

The electrostatic discharge (ESD) protection device for a liquid crystal display using a chip on glass (COG) package is provided. The ESD protection device includes a plurality of gate lines and data lines each of which has an output pad at its end. A plurality of gate line input pads and data line input pads are formed opposite to the output pads of the gate lines and data lines, respectively. A common electrode is formed between the plurality of gate line input pads and output pads and between the data line input pads and output pads. A plurality of electrostatic discharge protection circuits are connected between the input pads and the common electrodes to protect the input pads from electrostatic discharge.

A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

A COG type LCD device includes a first substrate including a display area and first, second, third and fourth non-display areas, gate and data lines in the display area on the first substrate and defining pixel regions, switching thin film transistor at each crossing portion of the gate and data lines and connected to the gate and data lines, a pixel electrode in each pixel region and connected to the thin film transistor, first testing thin film transistors in the second non-display area connected to the data lines and spaced apart from each other with a constant interval therebetween, first, second and third data testing lines connected to one ends of the data lines through the first testing thin film transistors, first, second and third data testing pads connected to the first, second and third data testing lines, respectively, data link lines in the first non-display area and connected to another ends of the data lines, second testing thin film transistors in the first non-display area and connected to the data link lines, gate link lines connected to the gate lines, third testing thin film transistors connected to the gate link lines, gate testing lines connected to the gate lines through the third testing thin film transistors, gate testing pads connected to the gate testing lines, a common testing line and a common pad in the non-display area, a second substrate spaced apart from the first substrate, a color filter layer and a common electrode sequentially formed on the second substrate, wherein the common electrode is connected to the common testing line, and a liquid crystal layer between the first and second substrates, wherein a driving IC is attached in the first non-display area.

A pad area and a method of fabricating the same, wherein the pad area is formed on a substrate to contact a chip on glass (COG) or a chip on flexible printed circuit (COF) with the substrate. Changing a lower structure of the pad area increases contact points between conductive balls and an interconnection layer or reduces a step difference between an interconnection layer and a passivation layer to enhance and ensure electrical connection.

A driving integrated circuit (driving IC) connected to a display panel by a chip on glass (COG) method includes a pair of bumps electrically coupled to a test pad of the display panel; a power source electrically coupled to a first bump of the pair of bumps; a circuit device electrically coupled between a ground terminal and a second bump of the pair of bumps; and a node measuring unit for measuring a voltage at a node between the second bump and the circuit device.

The invention discloses an ultraviolet (UV)/moisture dual-cured laminated adhesive and a preparation method thereof. The UV/moisture dual-cured laminated adhesive is prepared by mixing ultraviolet-curable (methyl) acrylate resin, moisture-curable modified (methyl) acrylate resin, a (methyl) acrylic reactive diluent, a moisture-curable (methyl) acrylic reactive diluent, a photoinitiator and a catalyst in an appropriate formula ratio. Compared with a moisture-cured laminated adhesive, the invention has the advantages that: the UV/moisture dual-cured laminated adhesive is quickly cured, the efficiency is high, and the production cost is reduced. Compared with a UV-cured laminated adhesive, the UV/moisture dual-cured laminated adhesive has the advantages that: the disadvantage that a shaded part cannot be cured is overcome; and the protection effect of glue is improved. According to the results, the adhesive fully meets the production process requirements of laminated adhesives which are applied to the protection of printed circuit boards (PCB) and laminated adhesives for the protection of chip on glass (COG).

The invention discloses UV (Ultraviolet)/moisture double cured silicon rubber, which consists of the following components in parts by weight: 25-80 parts of methacrylic acid modified organic silicon, 10-30 parts of an active diluted monomer, 3-5 parts of a filler, 2-5 parts of a photo-initiator, 0.2-0.5 part of a catalyst, 5-10 parts of a silane coupling agent and 0-1 parts of other additives. The UV/moisture double cured silicon rubber has the advantages of quick curing, high efficiency and reduction in production cost. An adhesive fully meets the process requirements of protection production of a laminated adhesive for protecting a PCB (Printed Circuit Board) and a COG (Chip on Glass) chip.

A display device includes a display panel having a glass substrate, a first input pad formed on the glass substrate and a second input pad formed on the glass substrate, and a driver integrated circuit mounted on the glass substrate of the display panel using a chip-on-glass (COG) method. The driver integrated circuit includes first and second input bumps respectively coupled to the first and second input pads, and an internal ground line coupled to the first and second input bumps. The first input bump of the driver IC receives a test signal through the first input pad when a COG bonding test is performed, and receives a ground voltage when the display device operates.

Disclosed is an LCD driver integrated circuit package and a chip on glass type LCD device using the package. The LCD driver integrated circuit package includes a mold that has signal output bumps and signal input bumps formed thereon, wherein the signal output bumps and the signal input bumps have different surface areas that contact the mold and an adjacent conductive film. Due to the different contact surface areas, different amounts of pressure are applied to different parts on the conductive film when a force is applied to the mold. One or more bump pressure control patterns are formed on the mold compensate for the difference in pressure caused by this difference between the total contact areas. Accordingly, the LCD driver integrated circuit package can be mounted on a chip on glass type LCD panel without causing device failure.

The invention discloses a COG (Chip On Glass) bonding method. The COG bonding method comprises attaching a Polaroid to a glass panel after the glass panel is cleaned and fixing an ACF (Anisotropic Conductive adhesive Film) on the glass panel; performing the pre-bonding treatment of the COG bonding process and fixing an IC (Integrated Circuit) on the ACF; performing the segment main bonding treatment of the COG bonding process and performing the complete curing on the IC and the glass panel. The invention also provides a temperature control device. According to the technical scheme of the COG bonding method and the temperature control device, the process of the COG bonding process is achieved through the segment main bonding process and accordingly the IC and the glass panel can have the same swelling amount and accordingly the badness can be avoided.

A chip-on-glass (COG) type liquid crystal display device minimizes a reflected wave from an input terminal of a source driver IC, regardless of the resistance value of a transmission line on a glass substrate, through the use of impedance matching at a front terminal of an LOG and impedance matching at an output terminal of a timing controller, thereby enhancing the frequency characteristic while maintaining a slim and lightweight design, so that it is possible to express a high-resolution high-quality image.

Using thin film transistors (TFTs), an active matrix circuit, a driver circuit for driving the active matrix circuit or the like are formed on one substrate. Circuits such as a central processing unit (CPU) and a memory, necessary to drive an electric device, are formed using single crystalline semiconductor integrated circuit chips. After the semiconductor integrated circuit chips are adhered to the substrate, the chips are connected with wirings formed on the substrate by a chip on glass (COG) method, a wire bonding method or the like, to manufacture the electric device having a liquid crystal display (LCD) on one substrate.

A method for transmitting control signals of a liquid crystal display is provided. The LCD includes a timing controller. The method packs the control signals of the timing controller into a control packet which comprises a header field and a control item having a control field and a data field. The header field indicates the start of the control packet, the control field records a type of an event, and the data field records a parameter of the event. The control packet is transmitted on one or a limited number of transmission lines.

The invention discloses a dielectric ceramic composite and a manufacturing method of an electronic element thereof. The dielectric ceramic composite comprises a principal crystalline phase, a modified additive and a sintering aid. The structural formula of the principal crystalline phase is (Mg[gamma]Sr[alpha]Ca(1-alpha-gamma))m(Ti[beta]Zr[1-beta])O3, wherein 0 <= alpha <=1, 0 <= beta <=1, 0 <= gamma <= 1 and 0.9 <= m <= 1.1,. The modified additive is one or more of MnCo3, MgCO3 and Re2O3, wherein Re2O3 is a rare earth oxide, and the sintering aid comprises one or more of BaCO3, CaCO3, SiO2, Li2CO3, B2O3 and Al2O3. The dielectric ceramic composite provided by the invention meets the media characteristics of COG (Chip On Glass), the dielectric constant is between 20-30 and an ROHS (Restriction of Hazardous Substances) demand is satisfied. An MLCC (Multiplayer Ceramic Chip Capacitor) prepared by the dielectric ceramic material is lower in dielectric loss, and excellent in dielectric constant temperature coefficient and dielectric frequency characteristic.

The invention relates to a profiled screen panel. The upper end of the profiled screen panel has a longitudinal groove formed by opening/notch design. The bonding pad area of the panel is disposed inthe groove and is provided with a connection terminal. The connection terminal is electrically connected to a driving chip and a flexible circuit board. The flexible circuit board is bent to the backof the panel. The driving chip is pressed against the flexible circuit board by a chip-on-film sealing method, or the driving chip is pressed against a circuit binding region around the connecting terminal by a chip-on-glass packaging method. The width of the lower frame of the profiled screen panel can be effectively reduced; and the ratio of the screen of a terminal is increased.

The invention relates to an aim detecting structure, which comprises an aim picture on the basic plate, and a frame with known width on the periphery of said picture. The invention can be used in COG (Chip-On-Glass) technique, that with the aim mark of chip, after COG pressing, judging the deflection amount via the relative position of aim mark and the frame; therefore, the invention can directly calculate the deflection after compressing chip to adjust the machine after COG process.

An image sensor package structure is proposed, in which an image sensor is fixed on a substrate having metallization traces and an adhesion layer. Electric paths of the package structure are changed from the COG (chip on glass) process to the CIS (CMOS image sensor) process to improve electric characteristics. Moreover, spacers are formed at appropriate positions to prevent glue overflow from contaminating the sensing regions and solder balls. The proposed package structure can also shrink the package area to greatly enhance the yield and quality.

The invention discloses a fully automatic COG (Chip On Glass) bonder pre-pressing pressing head unit, which comprises a stand, a servo motor, a rolling guide rail intelligent combined unit and an adapter plate, wherein the adapter plate is provided with a cylinder, a cylinder connecting rod and a pressing head adjusting component; the servo motor is used for driving the rolling guide rail intelligent combined unit to move the adapter plate up and down; the pressing head adjusting component is fixed on the lower part of the adapter plate; an adjusting end part of the pressing head adjusting component is provided with a high-rigidity rolling needle guide component and a pressing head component; and the pressing head adjusting component is used for performing forward and backward adjustment and leftward and rightward adjustment on the pressing head component through the high-rigidity rolling needle guide component. According to the mode, the fully automatic COG bonder pre-pressing pressing head unit can be positioned above and below Z axis with high accuracy, and the pressing head can be used for continuously and stably adsorbing an IC (Integrated Circuit) chip and then attaching the IC chip to an LCD (Liquid Crystal Display) screen.