The invention relates to the technical field of electronic packaging, in particular to a packaging method for board level fan-out structures. The method includes the steps of copper foil pressing fit, chip surface mounting, medium layer pressing fit, blind hole manufacturing, circuit manufacturing, installed and welded layer pressing fit, ball attachment, stripping and others. According to the packaging method for the board level fan-out structure, two fan-out packaging structures are symmetrically designed on the upper side and the lower side of a core board, and in the manufacturing process, because the upper end and the lower end of the core board are symmetrically and evenly stressed, and a high-temperature annealing mode is adopted for eliminating internal stress before a first double-layer copper foil structure and a second double-layer copper foil structure are stripped, the problem of warping and other mechanical deformation problems will not occur, and the quality and performance of the fan-out structures are guaranteed. In addition, the packaging method for the board level fan-out structures can be used for manufacturing the two fan-out structures at the same time, and therefore production efficiency is improved.