Technology for manufacturing flat enamel-cover copper wire with large width-to-thickness ratio

A technology of enameled copper wire and production process, applied in flat/ribbon cables, manufacturing wire harnesses, insulating conductors/cables, etc., can solve the problems of low uniformity, affecting conductivity, poor consistency, etc. , Improve product uniformity and ensure the effect of width-to-thickness ratio requirements

Active Publication Date: 2017-10-10
WELL ASCENT ELECTRONIC (GANZHOU) CO LTD
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Nowadays, the width-thickness ratio of flat enamelled copper produced by general process methods can reach 50-60:1, but with the development of society, the demand for flat enameled copper wire with large width-thickness ratio is getting higher and higher. For 70: 1 Even requires a larger width-to-thickness ratio, constantly testing the limit of the flat enameled copper wire production process. The flat enameled copper with a large width-to-thickness ratio produced by the existing process method has low uniformity and poor consistency, which affects the overall conductivity. performance
With the development of science and technology, the current production process of flat enamelled copper wire can no longer meet the production requirements of flat enamelled copper wire with large aspect ratio, so it is necessary to carry out process development

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] A production process for flat enamelled copper wires with a large width-to-thickness ratio. Copper rods are used as raw materials to produce flat enameled copper wires with a width-to-thickness ratio of 90:1. The specific process steps are:

[0027] A. Lay out and straighten the wire; put the copper rod and straighten the copper rod;

[0028] B. Extrusion to make round wire; heat the copper rod to 60°C to make it extruded through the cold extruder Ⅰ, the exit of the die of the cold extruder Ⅰ is cir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention belongs to the conductive wire manufacturing field and more particularly, to a technology for manufacturing flat enamel-cover copper wire with a large width-to-thickness ratio. The invention aims to solve the technical problems that the flat enamel-cover copper with a large width-to-thickness ratio manufactured by the existing technology has a low uniformity and poor consistency, which compromises the overall conductivity and cannot meet the manufacturing requirement for the flat enamel-cover copper wire with a large width-to-thickness ratio. The manufacturing technology comprises the following steps: A) releasing and correcting straight the wire; B) squeezing to make a round wire; C) squeezing to make a flat wire I; D) squeezing to make a flat wire II; E) squeezing to make a flat wire III; F) cooling; G) performing ultrasonic cleaning; H) annealing; I) cleaning and baking; J) painting and baking; and K) cooling, attracting and collecting the wires. With the technology proposed by the invention, the manufacturing for a flat enamel-cover copper wire with a large width-to-thickness ratio can be realized easily so that the manufactured flat enamel-cover copper wire has better conductivity and consistency.

Description

technical field [0001] The invention belongs to the field of wire production, and in particular relates to a production process of a flat enameled copper wire with a large aspect ratio. Background technique [0002] Enameled wire is a main variety of winding wire, which is composed of conductor and insulating layer. The bare wire is annealed and softened, and then painted and baked many times. However, it is not easy to produce products that meet both standard requirements and customer requirements, because it is affected by factors such as raw material quality, process parameters, production equipment, and the environment. Therefore, the quality characteristics of various enameled wires are different, but they are all It has four major properties: mechanical properties, chemical properties, electrical properties and thermal properties. [0003] At present, the cross-sectional shape of enameled wire is mostly circular, but circular enameled wire has the disadvantage of low ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/16H01B7/08H01B13/012
CPCH01B7/08H01B13/01254H01B13/16
Inventor 朱祚茂毛雷
Owner WELL ASCENT ELECTRONIC (GANZHOU) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products