Packaging method for board level fan-out structures
A packaging method and fan-out technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of mechanical warpage manufacturing efficiency of board-level fan-out structure, low board-level fan-out structure, etc., to ensure quality and performance, the effect of improving production efficiency
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[0029] See figure 1 An embodiment of the present invention provides a packaging method of a board-level fan-out structure, including:
[0030] Step 1: See figure 1 , Press-fit the first double-layer copper foil 2 on the upper side of the core board 1 (using a prepreg or double-sided copper-clad organic substrate), and press the second double-layer copper foil 3 on the lower side of the core board 1; The layer copper foil 2 and the second double layer copper foil 3 have a peelable structure. The thickness of the outer copper foil in the first double-layer copper foil 2 is greater than the thickness of the inner copper foil; the thickness of the outer copper foil in the second double-layer copper foil 3 is greater than the thickness of the inner copper foil.
[0031] Step 2: See figure 2 , The first chip 4 is attached to the outside of the first double-layer copper foil 2, and the second chip 5 is attached to the outside of the second double-layer copper foil 3, with the active surf...
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