Fully automatic COG (Chip On Glass) bonder pre-pressing pressing head unit

A bonding machine and head unit technology, applied in nonlinear optics, instruments, optics, etc., can solve problems such as inconvenient operation, decreased stability of the whole machine, and low processing accuracy, and achieve humanized design, stable structure, and stability good sex effect

Active Publication Date: 2012-07-04
江苏凯立智能制造有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current COG bonding machine needs to adjust the flatness of the indenter in the pre-pressing head unit. During the adjustment process, there will be disadvantages such as inconvenien

Method used

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  • Fully automatic COG (Chip On Glass) bonder pre-pressing pressing head unit
  • Fully automatic COG (Chip On Glass) bonder pre-pressing pressing head unit
  • Fully automatic COG (Chip On Glass) bonder pre-pressing pressing head unit

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Embodiment Construction

[0019] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0020] see figure 1 and figure 2 , the embodiment of the present invention includes: a fully automatic COG bonding machine pre-pressing head unit, including: a frame 1, a servo motor 2, a rolling guide intelligent combination unit 3 and an adapter plate 4, and the adapter plate 4 is provided with Cylinder 40, cylinder connecting rod 41 and pressure head adjustment assembly 5, servo motor 2 drives rolling guide rail intelligent combination unit 3 to move adapter plate 4 up and down, pressure head adjustment assembly 5 is fixed on the lower part of adapter plate 4, pressure head adjustment assembly 5 A high rigidity needle roller guide assembly 6...

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Abstract

The invention discloses a fully automatic COG (Chip On Glass) bonder pre-pressing pressing head unit, which comprises a stand, a servo motor, a rolling guide rail intelligent combined unit and an adapter plate, wherein the adapter plate is provided with a cylinder, a cylinder connecting rod and a pressing head adjusting component; the servo motor is used for driving the rolling guide rail intelligent combined unit to move the adapter plate up and down; the pressing head adjusting component is fixed on the lower part of the adapter plate; an adjusting end part of the pressing head adjusting component is provided with a high-rigidity rolling needle guide component and a pressing head component; and the pressing head adjusting component is used for performing forward and backward adjustment and leftward and rightward adjustment on the pressing head component through the high-rigidity rolling needle guide component. According to the mode, the fully automatic COG bonder pre-pressing pressing head unit can be positioned above and below Z axis with high accuracy, and the pressing head can be used for continuously and stably adsorbing an IC (Integrated Circuit) chip and then attaching the IC chip to an LCD (Liquid Crystal Display) screen.

Description

technical field [0001] The invention relates to the field of electronic communication technology manufacturing, in particular to a pre-pressing head unit of a fully automatic COG bonding machine. Background technique [0002] Generally speaking, in the field of electronic communication manufacturing technology, IC (Integrated Circuit) chips are integrated circuits formed by placing a large number of microelectronic components, such as transistors, resistors, capacitors and diodes, on a plastic base to form a chip. Almost all chips seen at present can be called IC chips, liquid crystal displays (Liquid Crystal Display, LCD for short). [0003] In the prior art, COG (chip on glass) is to directly bind the IC chip on the liquid crystal display screen, which is collectively called COG bonding machine. In the manufacture of liquid crystal displays, the COG bonding machine is to position the drive IC chip of the liquid crystal sheet and the liquid crystal display with high precis...

Claims

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Application Information

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IPC IPC(8): G02F1/13
Inventor 丁志民陆豪亮王建明
Owner 江苏凯立智能制造有限公司
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