Mobile terminal with fingerprint sensor packaging structure

Abstract

The invention discloses a mobile terminal with a fingerprint sensor packaging structure. A capacitive semiconductor fingerprint sensor COG (Chip On Glass) packaging technology is adopted. The mobile terminal comprises a case, a display screen, a touch screen cover plate and a semiconductor capacitive fingerprint sensor. A touch screen module comprises the touch cover plate and a touch inductive sensor film. The touch screen cover plate covers the semiconductor capacitive fingerprint sensor through an anisotropic conductive film. Therefore, the semiconductor capacitive fingerprint sensor is arranged below the non-display area of the touch screen so as to achieve the objective of hiding the fingerprint sensor. The fingerprint sensor has extremely high detection sensitivity and can acquire a fingerprint image through the touch screen cover plate of a few hundred microns. Besides, the manufacturing technology of the standard COG packaging technology is adopted with no requirement for more modification of the touch screen production technology so that processing difficulty is reduced and efficiency is enhanced, and satisfaction of users in using the fingerprint identification sensor is enhanced.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, in particular, to a fingerprint sensor packaging technology and a related method, and more particularly, to a mobile terminal with a semiconductor capacitive fingerprint sensor packaging structure. Background technique [0002] Thanks to the rapid development of modern electronic technology, fingerprint recognition technology has begun to enter our daily life and has become the most widely used technology in biometrics. Fingerprint identification technology is to match a person with his fingerprint, and verify his real identity by comparing his fingerprint with the pre-saved fingerprint. Each person's skin texture (including fingerprints) is different in patterns, breakpoints and intersections, that is to say, fingerprint patterns are unique and remain unchanged throughout life. [0003] In recent years, with the rise of Apple's iphone5S fingerprint recognition device TouchID, ther...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a packaging structure and method for semiconductor capacitive fingerprint sensors applied to mobile terminals and equipment. It adopts a new type of chip-on-glass packaging (ChipOnGlass for short COG) packaging technology, so that it can be used in mobile phones, tablet computers, etc. Terminal and other manufacturers do not need to slot the fingerprint sensor in the front panel or rear shell of the mobile phone, but place the fingerprint sensor under the touch panel. COG technology does not change the ID style of the original design of the mobile phone, and does not require users to change the Android Mobile phone usage habits, and solve the problem of insufficient detection sensitivity of the current technology for semiconductor capacitive fingerprint sensors

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