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Display panel, display device and method for making display panel

A technology for display panels and manufacturing methods, applied to instruments, semiconductor devices, circuits, etc.

Active Publication Date: 2017-08-11
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of this, an embodiment of the present invention provides a display panel, a display device, and a method for manufacturing a display panel to solve the existing problems in the prior art of how to obtain a display panel with a narrow border while ensuring high resolution. question

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  • Display panel, display device and method for making display panel
  • Display panel, display device and method for making display panel
  • Display panel, display device and method for making display panel

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Embodiment Construction

[0050] The specific implementation manners of the display panel, the display device and the manufacturing method of the display panel provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0051] The shape and size of each film layer in the drawings do not reflect their true proportions in the display panel, but are only intended to schematically illustrate the content of the present invention.

[0052] A display panel provided by an embodiment of the present invention, such as Figure 2a to Figure 2h As shown, it includes: a display substrate 201, a chip-on-chip film 202 arranged on the side away from the display surface of the display substrate 201, an insulating glue 203 arranged between the display substrate 201 and the chip-on-chip film 202, and fixed on the chip-on-chip film 202 The integrated circuit chip 204 on the side away from the display substrate 201; wherein,

[0053] The chip-on-chip...

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Abstract

The invention discloses a display panel, a display device and a method for manufacturing the display panel. The display panel includes a display substrate, a chip covering film and an integrated circuit chip, wherein the chip covering film is fixed on the side, away from a display surface, of the display substrate through insulation paste, and the integrated circuit chip is fixed on the side, away from the display substrate, of the chip covering film; the first side and the second side of the display surface are provided with a plurality of connecting holes at least penetrating through the display substrate and the insulation paste, and conductive materials with which the connecting holes are filled respectively; a signal line located on the first side and a signal line located on the second line are connected with a connecting terminal arranged on the chip covering film through the conductive materials respectively. The large quantity of signal lines required by the high-resolution display panel are arranged on the first side and the second side respectively, the signal lines are connected with the connecting terminal through the conductive materials in the connecting holes in the first side and the second side, and therefore the quantity of the connecting holes in each single side is reduced and the narrow bezel design of the high-resolution display panel is achieved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a display device and a method for manufacturing the display panel. Background technique [0002] With the continuous advancement of display technology, display panels are more and more widely used in display products. A display panel with a narrow bezel (Narrow Bezel) has attracted a large number of consumers because it can enable users to obtain a better viewing experience. [0003] Currently, the connection terminal bending (Pad Bending) process is the only solution to realize a display panel with a narrow frame. However, the display panel manufactured by the connecting terminal bending process has many defective problems. For example, if Figure 1a As shown, cracks occur in the inorganic insulating layer connecting the bending region P of the terminal, which will lead to display failure. In the prior art, a mask (Mask) process is added to remove th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1345H01L23/50
CPCH01L23/50G02F1/13452G06F1/1637G06F1/1652H01L25/0753H01L33/0095H01L33/62H01L2933/0066
Inventor 董向丹高永益胡明
Owner BOE TECH GRP CO LTD
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