Array substrate, display panel and display device

A technology for array substrates and display panels, which is applied in the fields of display panels, display devices, and array substrates, and can solve problems such as reducing the lower frame, achieving the effect of realizing narrow frame, reducing the space of wiring area, and realizing narrow frame design
CN112180643AActive Publication Date: 2021-01-05KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
Publication Date
2021-01-05

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Abstract

The invention discloses an array substrate, a display panel and a display device. A binding area of the array substrate comprises a driving chip binding area and a flexible circuit board binding area,the driving chip binding area is provided with a first bonding pad, the first bonding pad comprises a welding spot set and an isolation area, the welding spot set comprises a first welding spot set and a second welding spot set, the first welding spot set comprises a plurality of first welding spots arranged side by side in the first direction, the second welding spot set comprises a plurality ofsecond welding spots arranged side by side in the second direction, the second welding spot set is located between the first welding spot set and the isolation area, and the first welding spot set and the second welding spot set are connected with the flexible circuit board binding area through wires. And only the lead connected with the second welding spot set passes through the wiring area. Thelayout requirement of the wire for connecting the binding area of the flexible circuit board and the welding spot set can be met, the problems of difficult wiring, easy interference between signals and the like caused by insufficient wiring space are avoided, and the narrow frame design of the display panel is realized.
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Description

technical field

[0001] The present invention relates to the field of display technology, in particular to an array substrate, a display panel and a display device. Background technique

[0002] In recent years, the full screen has become the mainstream design solution in the display field and is favored by consumers. In order to increase the screen-to-body ratio, the narrower the lower border of the display screen, the better.

[0003] At present, there are three kinds of bonding solutions for the lower frame of the display screen: COG (chip on glass), COF (chip on FPC) and COP (chip on plastic). Although the frame is getting smaller and smaller, the cost is also getting higher and higher. Based on Considering the cost, the lower frame of the display screen currently on the market mainly adopts the COG (chip on glass) lamination scheme. For the COG bonding solution, since both the driver chip (IC) and the flexible circuit board (FPC) need to be bound on the lower frame of t...

Claims

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