Packaging structure for transferring chip bonding stress and production method thereof

Abstract

The invention discloses a packaging structure for transferring chip bonding stress and a production method thereof. The packaging structure comprises a functional chip and a cover board made of the same material as a substrate thereof, wherein a function surface of the functional chip is provided with a functional zone and a plurality of conductive welding pads arranged at the periphery of the functional zone; the cover board is provided with a first surface with a cavity and a second surface opposite to the first surface; the first surface of the cover board is bonded with the function surface of the functional chip; the second surface of the cover board is subjected to re-wiring to form a metal line layer which extends to the conductive welding pads; and a metal line cannot extend to a cutting path position. Through changing the previous design structure adopting chip back wiring to a design structure adopting front wiring, the influence of the stress which is generated by back operation on the chip functional zone is reduced; and furthermore, the material of which the substrate of the functional chip is made is used to make the cover board and wiring is carried out on the cover board, so that a problem of mismatching of a coefficient of thermal expansion between the cover board and the chip is avoided, and the packaging process steps are simple.

Description

technical field [0001] The invention relates to a wafer-level chip package, in particular to a package structure for transferring chip mounting stress and a manufacturing method thereof. Background technique [0002] Micro Electro Mechanical Systems (MEMS: Micro Electro Mechanical Systems) is a new type of multidisciplinary cutting-edge technology developed since the 1980s. The combination of processing technology and micromachining technology in the mechanical industry produces various sensors, actuators, drives and microsystems with excellent performance, low price and miniaturization. Due to its miniaturization advantages, MEMS has broad application prospects in electronics, automobiles, electromechanical, sensors, military and other fields. Currently commercialized MEMS devices include inertial devices (gyroscopes, accelerometers, etc.), RF devices, and pressure sensors. , Microphone, Micro-mirror, etc. [0003] After decades of technological development, some MEMS chi...

AI Technical Summary

Problems solved by technology

[0003] After decades of technological development, some MEMS chips with high demand have been quite mature, but because the unique movable / sensitive structure of MEMS devices puts forward higher requirements for packaging, it is necessary to reduce the impact of the packaging process on the packaged chips At the same time, the diversity of MEMS devices also makes the development of corresponding packaging technology face many challenges, such as airtightness / filling with special gas, high vacuum and long-term maintenance, zero external stress transmission, and communication with the external environment and many more

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