Chip element heat dissipation bonding pad capable of preventing tin leakage

Abstract

The utility model discloses a tin leakage prevention chip element heat dissipation pad, which comprises a chip element heat dissipation pad body, a PCB central part, a strong structure wrapping edge and a steel mesh opening area, the PCB central part is arranged at the central part of the chip element heat dissipation pad body, a plurality of verification hole positions are arranged in the PCB central part, and the strong structure wrapping edge is arranged in the steel mesh opening area. The outer edge of the central part of the PCB is wrapped by the strong-structure wrapping edge, and the edge structure strength of the central part of the PCB can be improved through the arrangement of the strong-structure wrapping edge. According to the utility model, the holes are expanded outwards by 0.15 mm in the hole opening area of the optimized steel mesh, the tin amount is increased and verified by 100 pcs, the bubble rate is intensively controlled within 20%, and the problem of tin leakage is effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a tin leakage-proof chip component heat dissipation pad. Background Art

[0002] PCB (Printed Circuit Board) is a printed circuit board. As a carrier for electrical connections of components, it is the basic support for electronic components.

[0003] The PCB design has a total of 61 holes with a diameter of 0.25mm. The actual measured hole size is about 0.27-0.28mm. During the reflow process, tin leaks into the PCB through-holes, resulting in insufficient tin and urgent need for development. Utility Model Content

[0004] The purpose of the utility model is to provide a chip component heat dissipation pad that prevents tin leakage, so as to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions: a tin leakage-proof chip component heat dissipation pad, comprising a chip component heat dissipation pad body, a PCB center portion, a strong structural edging, and a steel mesh opening area, wherein the center portion of the chip component heat dissipation pad body is provided with a PCB center portion, a plurality of verification holes are provided within the PCB center portion, and the outer edge of the PCB center portion is provided with a strong structural edging, which can improve the edge structural strength of the PCB center portion;

[0006] A steel mesh opening area is provided at the connection between the central part of the PCB and the strong structure edge. Heat dissipation holes are evenly spaced on both sides, top and bottom of the chip component heat dissipation pad body. The heat dissipation holes are located on both sides, top and bottom of the central part of the PCB, and the heat dissipation holes play an auxiliary heat dissipation effect.

[0007] Preferably, the number of verification holes is 61 in total.

[0008] Preferably, the heat dissipation through hole has a diameter of 0.25 mm, and the actual measured hole size is about 0.27-0.28 mm.

[0009] Preferably, the original opening area of ​​the steel mesh opening zone is controlled at 24.4619 mm², and the opening volume is controlled at 4.84383 mm³.

[0010] Preferably, the opening area of ​​the steel mesh opening zone can be controlled at 27.4932 mm² or 30.6964 mm², and the opening volume can be controlled at 5.49864 mm³ or 6.13898 mm³.

[0011] Preferably, the spacing between the original openings in the steel mesh opening area and the heat dissipation through-holes is controlled at 1.0740 mm, and the spacing between the current openings in the steel mesh opening area and the heat dissipation through-holes is preferably controlled at 0.7730 mm.

[0012] Preferably, the distance between the original opening and the current opening in the steel mesh opening area is controlled to be 0.1500mm-0.3mm, and most preferably controlled to be 0.15mm.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] (1) This type of tin leakage-proof chip component heat dissipation pad is verified by expanding the opening area of ​​the optimized steel mesh by 0.15mm and increasing the tin amount to 100 pieces. The bubble rate is controlled within 20%, effectively avoiding the problem of tin leakage;

[0015] (2) In order to improve the probability of tin leakage, the diameter of the 61 holes on the PCB can be preferably changed to 0.175-0.25mm.

[0016] (3) This type of tin-leakage-proof chip component heat dissipation pad meets its heat dissipation needs by setting up heat dissipation holes, thereby preventing the processor chip from continuing to heat up and causing failure in operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the heat dissipation pad structure of the original chip component of the utility model;

[0018] Figure 2 This is a schematic diagram of the position distribution structure of the steel mesh opening area in the heat dissipation pad body of the original chip component of the utility model;

[0019] Figure 3 This is the first scheme for expanding the opening area of ​​the steel mesh of the utility model;

[0020] Figure 4 This is the second scheme for expanding the opening area of ​​the steel mesh in the utility model.

[0021] In the figure: 1. Chip component heat dissipation pad body; 2. PCB center; 3. Verification hole position; 4. Strong structure edge; 5. Steel mesh opening area; 6. Heat dissipation through hole. DETAILED DESCRIPTION

[0022] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-4 The utility model provides an embodiment of a tin leakage-proof chip component heat dissipation pad, comprising a chip component heat dissipation pad body 1, a PCB center part 2, a strong structural edge 4, and a steel mesh opening area 5. The center part of the chip component heat dissipation pad body 1 is provided with a PCB center part 2, a plurality of verification holes 3 are provided inside the PCB center part 2, the outer edge of the PCB center part 2 is provided with a strong structural edge 4, and a steel mesh opening area 5 is provided at the connection between the PCB center part 2 and the strong structural edge 4. The opening of the steel mesh opening area 5 is optimized to expand by 0.15mm, increase the tin amount verification 100pcs, and centrally control the bubble rate within 20%, effectively avoiding the problem of tin leakage.

[0024] Heat dissipation holes 6 are evenly spaced on both sides, top and bottom of the chip component heat dissipation pad body 1 , and the heat dissipation holes 6 are located on both sides, top and bottom of the PCB center part 2 .

[0025] Verify that there are 61 holes in total at position 3. To improve the probability of tin leakage, the diameters of the 61 holes on the PCB can be preferably changed to 0.175-0.25 mm.

[0026] The diameter of the heat dissipation through hole 6 is 0.25 mm, and the actual measured hole size is about 0.27-0.28 mm.

[0027] The original opening area of ​​the steel mesh opening zone 5 is controlled at 24.4619 mm², and the opening volume is controlled at 4.84383 mm³.

[0028] The opening area of ​​the steel mesh opening zone 5 can be preferably controlled at 27.4932 mm² or 30.6964 mm², and the opening volume can be preferably controlled at 5.49864 mm³ or 6.13898 mm³.

[0029] The spacing between the original openings in the steel mesh opening area 5 and the heat dissipation through-holes 6 is controlled at 1.0740 mm, and the spacing between the current openings in the steel mesh opening area 5 and the heat dissipation through-holes 6 is preferably controlled at 0.7730 mm.

[0030] The distance between the original opening and the current opening of the steel mesh opening area 5 is controlled to be 0.1500mm-0.3mm, and most preferably controlled to be 0.15mm.

[0031] When using the embodiment of the present application: the stencil opening area 5 is optimized to expand outward by 0.15mm, the tin amount is increased to verify 100pcs, the bubble rate is centrally controlled within 20%, and the problem of tin leakage is effectively avoided. In order to improve the probability of tin leakage, the diameter of the 61 holes on the PCB can be preferably changed to 0.175-0.25mm.

Claims

1. A tin-leakage-proof chip component heat dissipation pad, characterized in that: The invention comprises a chip component heat dissipation pad body (1), a PCB center part (2), a strong structural edge (4) and a steel mesh opening area (5), wherein the center part of the chip component heat dissipation pad body (1) is provided with a PCB center part (2), a plurality of verification holes (3) are provided inside the PCB center part (2), the outer edge of the PCB center part (2) is provided with a strong structural edge (4), a steel mesh opening area (5) is provided at the connection between the PCB center part (2) and the strong structural edge (4), and heat dissipation holes (6) are provided at equal intervals on both sides and the top and bottom of the chip component heat dissipation pad body (1), and the heat dissipation holes (6) are located on both sides and the top and bottom of the PCB center part (2).

2. The tin leakage-proof chip component heat dissipation pad according to claim 1, characterized in that: The verification holes (3) are provided in a total of 61 in number.

3. The tin leakage-proof chip component heat dissipation pad according to claim 1, characterized in that: The diameter of the heat dissipation through hole (6) is 0.25 mm, and the actual measured hole size is about 0.27-0.28 mm.

4. The tin leakage-proof chip component heat dissipation pad according to claim 1, characterized in that: The original opening area of ​​the steel mesh opening area (5) is controlled at 24.4619 mm², and the opening volume is controlled at 4.84383 mm³.

5. The tin leakage-proof chip component heat dissipation pad according to claim 1, characterized in that: The opening area of ​​the steel mesh opening zone (5) can be controlled at 27.4932 mm² or 30.6964 mm², and the opening volume can be controlled at 5.49864 mm³ or 6.13898 mm³.

6. The tin leakage-proof chip component heat dissipation pad according to claim 1, characterized in that: The spacing between the original openings of the steel mesh opening area (5) and the heat dissipation through-holes (6) is controlled at 1.0740 mm, and the spacing between the current openings of the steel mesh opening area (5) and the heat dissipation through-holes (6) is controlled at 0.7730 mm.

7. The tin leakage-proof chip component heat dissipation pad according to claim 1, characterized in that: The distance between the original opening and the current opening of the steel mesh opening area (5) is controlled to be 0.1500mm-0.3mm, and the maximum distance is controlled to be 0.15mm.

Images