Miniature conical nail and microfilament connecting structure comprising same
The micro-cone nail structure simplifies the connection between the conductive microwire and the conductive hole, solving the problem of complex connection and easy short circuit or open circuit in the existing technology, realizing the reliable collection of high-throughput neuronal activity data and reducing costs.
Patent Information
- Application Number
- CN202422194656.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-09-09
AI Technical Summary
Existing electrode connection technology is complex and prone to short circuits or open circuits, making it difficult to meet the needs of high-throughput neuronal activity data acquisition. In addition, commercial electrodes are expensive, which limits technological progress in the fields of in vivo electrophysiological recording and brain-computer interfaces.
A micro-cone nail structure is adopted, including a nut and a screw, which is used to fix and connect the conductive microwires and the conductive holes. The screw gradually becomes thicker from the tip to the bottom. Combined with the plating design, a reliable electrical connection of the conductive microwire is achieved. By rotating the micro-cone nail, the insulating layer is gradually polished to form a stable electrical connection.
The electrode connection process is simplified, the operation difficulty is reduced, the reliability and stability of the connection are improved, the production cost is reduced, and it is suitable for high-throughput neuronal activity data acquisition.
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Figure CN223416241U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of neural signal detection, in particular to a micro-cone nail and a micro-wire connection structure containing the micro-cone nail. Background Art
[0002] The brain is the most sophisticated organ in mammals. Since ancient times, humans have never stopped exploring its mysteries. Since the proposal of the China Brain Project in 2021, my country has increasingly explored brain-computer interfaces and brain science.
[0003] The brain's physiological structure is incredibly complex, comprised of hundreds of billions of nerve cells, divided into at least thousands of different types. The fundamental building block of the brain is the nerve cell, or neuron. Neurons operate primarily through action potentials (spikes), while groups of neurons function through local field potentials (LFPs). Individual neurons are connected through synapses, forming a complex neural network. Uncovering the mysteries of the brain and its workings relies heavily on advances in precision technology, from dissection to microscopy to molecular biochemistry and electrophysiology.
[0004] Since its application in the field of brain science, electrophysiological technology has been widely used in all aspects of neuroscience research and has become an irreplaceable research tool. Today, electrophysiological technology has been continuously refined and applied to the study of specialized neuroscience problems, from in vitro to in vivo, from low-throughput to high-throughput, and from non-invasive to invasive. In the industry, electrophysiological technology has also been continuously innovated and developed, and has been gradually applied to the research field of brain-computer interfaces.
[0005] In vivo electrophysiology techniques typically use invasive electrodes to detect and record the activity of brain neurons, using them as probes to collect electrical signals. Because the brain's structure is extremely delicate and neurons are extremely small, the collection electrodes must be extremely small, which in turn requires a very precise connection between the electrode wire and the connector.
[0006] The fields of neuroscience research and brain-computer interfaces require the collection of larger quantities of neuronal activity data with higher signal-to-noise ratios, which requires more effective tools and more sophisticated acquisition techniques. To date, acquisition electrodes have evolved from single-channel to multi-channel, and from low-throughput to high-throughput, with smaller electrode sizes and better acquisition performance. Since the last century, the most representative electrode types include single electrodes, silicon-based electrodes, Utah arrays, flexible electrodes, Neruopiexls electrodes, and step-by-step multi-channel electrodes. Among them, step-by-step multi-channel electrode technology is the most widely used in vivo electrophysiological acquisition electrode. However, this technology requires connecting multiple ultra-microelectrode wires to microconnectors one by one. This operation is very complex and the process is extremely precise, causing great inconvenience to researchers and users.
[0007] In the existing technology, electrical impedance is usually used to weld ultra-micro electrode wires to the pins on the micro connector, but it is extremely easy to weld adjacent pins together, thereby forming a short circuit. For example, the invention patent with publication number CN114886429A discloses "a multi-channel independently adjustable array electrode", which is extremely easy to cause a circuit short circuit by directly welding dozens of channels to the connector. Another technical route is to manually wrap the electrode wire around the connector pin under a microscope and then fix it with conductive silver paint, but this technical route has extremely high technical requirements for the operator, requires years of practice, and is prone to breakage due to unskilled operation. Currently, this technical route is widely used in neuroscience laboratories. In addition, the commercialized electrodes are expensive due to the complex manufacturing process and cannot be popularized to every neuroscience laboratory and user.
[0008] In short, the existing technical routes and production processes can no longer meet the high-throughput requirements of a single electrode, which in turn restricts technological progress in the fields of in vivo electrophysiological recording research and brain-computer interfaces. Utility Model Content
[0009] The purpose of the present invention is to overcome the above-mentioned defects of the prior art. In a first aspect, the present invention provides a micro-cone nail for fixing and conductively connecting a conductive microwire to a conductive hole. The micro-cone nail comprises a nut and a screw, wherein the screw comprises a tip and a bottom end, the bottom end being connected to the nut, and the diameter of the screw gradually increases along the length direction from the tip to the bottom end.
[0010] The base material of the micro-cone nail is a metal material, the surface of the micro-cone nail is provided with a coating, and the resistance from the tip to the bottom along the length direction is less than 50mΩ.
[0011] Preferably, the cone angle formed by the screw is 2 degrees to 10 degrees.
[0012] Preferably, the cone angle formed by the screw is 6 degrees.
[0013] Preferably, the base material of the micro-cone nail is copper, the surface of the micro-cone nail is provided with a nickel plating layer, and a gold plating layer is further provided on the nickel plating layer in the screw area.
[0014] Preferably, the substrate of the micro-cone nail is lead-free copper C6801, the thickness of the nickel plating layer is 60-80 um, and the thickness of the gold plating layer is 10-30 um.
[0015] Preferably, the nut is a straight-shaped, cross-shaped, or hexagonal-shaped nut.
[0016] Preferably, the tip is provided with a rounded corner, and / or the nut is provided with a chamfered corner.
[0017] A second aspect of the present invention provides a microwire connection structure, comprising a conductive through-hole, a conductive microwire, and a micro-cone nail provided by the first aspect installed in the conductive through-hole;
[0018] The conductive via has a diameter smaller than that of the base end and larger than that of the tip end;
[0019] The conductive microwire is squeezed between the micro-cone nail and the inner wall of the conductive through hole, and the conductive microwire and the conductive through hole form an electrical connection.
[0020] Preferably, the inner wall of the conductive through hole is provided with a silver coating.
[0021] Preferably, the conductive microwire comprises a conductive inner layer and an insulating layer, and the insulating layer wraps the outer side of the conductive inner layer;
[0022] Among them, after the conductive microwire is extended into the conductive through hole, the micro-cone nail is inserted into the conductive through hole, and the micro-cone nail is rotated several times until the microwire connection structure is formed, so that at least part of the insulating layer is polished off, thereby realizing an electrical connection between the conductive inner layer and the conductive through hole.
[0023] The beneficial effects of the present invention are: the diameter of the tip changes along the length direction to the bottom end, which makes it easy to gradually increase the squeezing force on the conductive microwire during the process of tightening the micro-cone nail to fix the conductive microwire after the conductive microwire is placed in the conductive hole. At the same time, a gap is left between the micro-cone nail and the conductive hole, so that the insulating layer of the conductive microwire can be continuously polished off during the process of tightening the micro-cone nail; the limited cone angle range achieves ideal polishing and fixing effects; the resistance from the tip to the bottom end along the length direction is less than a preset value, which ensures a reliable electrical connection between the conductive microwire and the conductive hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a schematic structural diagram of a micro-cone nail according to a preferred embodiment of the present invention;
[0025] Figure 2 This is a schematic structural diagram of a conductive through hole in a microwire connection structure according to a preferred embodiment of the present invention;
[0026] Figure 3 This is a schematic diagram of the assembled structure of a microwire connection structure according to a preferred embodiment of the present invention, wherein the micro-cone pins have not yet been tightened into the conductive through-holes.
[0027] Description of reference numerals:
[0028] Conductive via 30
[0029] Conductive microwire 40
[0030] Micro cone nail 50
[0031] Nut 20
[0032] Screw 10
[0033] Rounded Corner 1001
[0034] Bevel 2002
[0035] Cutting-Edge 101
[0036] Bottom 102
[0037] Cone angle θ DETAILED DESCRIPTION
[0038] In order to make the purpose, technical solutions and advantages of the embodiments of this patent clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.
[0039] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings.
[0040] As shown in Figures 1-3, the first aspect of the present invention provides a micro-cone nail 50 for fixing and conductively connecting a conductive microwire 40 to a conductive hole. The micro-cone nail 50 includes a nut 20 and a screw 10. The screw 10 includes a tip 101 and a bottom 102. The bottom 102 is connected to the nut 20. The diameter of the screw 10 gradually increases along the length direction from the tip 101 to the bottom 102.
[0041] The base material of the micro-cone nail 50 is a metal material. The surface of the micro-cone nail 50 is provided with a coating. The resistance along the length direction from the tip 101 to the bottom end 102 is less than 50 mΩ.
[0042] Please combine Figure 1It is understood that, in the embodiment, the diameter of the tip 101 is 0.2 mm, the diameter of the bottom end 102 is 0.41 mm, and the diameter of the screw rod 10 gradually increases from the tip 101 to the bottom end 102. The micro taper nail 50 has good conductive properties, and the resistance from the tip 101 to the bottom end 102 is less than 50 mΩ during operation, and can withstand a maximum DC power of 12 V and a maximum current of 1.0 A.
[0043] In some preferred embodiments, as shown in Figure 1 The taper angle θ formed by the screw rod 10 is 2-10 degrees.
[0044] In some preferred embodiments, as shown in Figure 1 The taper angle θ formed by the screw rod 10 is 6 degrees.
[0045] In some preferred embodiments, the base material of the micro taper nail 50 is copper material, the surface of the micro taper nail 50 is provided with a nickel plating layer, and the nickel plating layer in the screw rod 10 area is further provided with a gold plating layer.
[0046] In some preferred embodiments, the base material of the micro taper nail 50 is lead-free copper C6801, the thickness of the nickel plating layer is 60-80 um, and the thickness of the gold plating layer is 10-30 um. Specifically, the base material of the micro taper nail 50 uses a solid type of lead-free copper C6801, and after the base material is processed, the surface of the micro screw is electroplated, first electroplated with a layer of nickel with a thickness of 75 um, and then electroplated with a layer of gold with a thickness of 20 um.
[0047] In some preferred embodiments, the nut 20 is a one-letter type, or a cross type, or an internal hexagonal type. In the embodiment, the nut 20 is a one-letter type, and the head diameter of the nut 20 is 0.56 mm, which can be rotated by a 0.5 mm one-letter screwdriver.
[0048] In some preferred embodiments, the tip 101 is provided with a round corner 1001, and / or the nut 20 is provided with an inverted bevel 2002. As Figure 1 In the embodiment, the tip 101 is provided with a round corner 1001, and the nut 20 is provided with an inverted bevel 2002, the diameter of the tip 101 is 0.2 mm, the diameter of the bottom end 102 is 0.41 mm, the total length of the screw rod 10 including the round corner 1001 is 2.03 mm, the head diameter of the nut 20 is 0.56 mm, and the total length of the micro taper nail 50 is 2.29 mm.
[0049] A micro wire connecting structure includes a conductive through hole 30, a conductive micro wire 40, and a micro taper nail 50 according to the first aspect installed in the conductive through hole 30;
[0050] The diameter of the conductive through hole 30 is less than the diameter of the bottom end 102 and greater than the diameter of the tip 101.
[0051] The conductive microwire 40 is squeezed between the micro-cone nail 50 and the inner wall of the conductive through-hole 30 , and the conductive microwire 40 and the conductive through-hole 30 form an electrical connection.
[0052] In some preferred embodiments, the inner wall of the conductive through hole 30 is provided with a silver coating.
[0053] In some preferred embodiments, the conductive microwire 40 comprises a conductive inner layer and an insulating layer, with the insulating layer surrounding the conductive inner layer. Specifically, in some embodiments, the conductive microwire 40 is a 13 μm nickel-chromium alloy wire with a 2 μm insulating coating on the surface. This coating typically requires high-temperature melting or physical extrusion to melt. In other embodiments, the conductive microwire 40 is a stimulation electrode wire with a diameter of no less than 50 μm.
[0054] Among them, after the conductive microwire 40 is extended into the conductive through-hole 30, the micro-cone nail 50 is inserted into the conductive through-hole 30, and the micro-cone nail 50 is rotated several times until a microwire connection structure is formed, so that at least part of the insulating layer is polished off, thereby realizing an electrical connection between the conductive inner layer and the conductive through-hole 30.
[0055] The following describes in detail the formation process of a specific microfilament connection structure:
[0056] like Figure 1 As shown, the tip 101 of the micro-cone nail 50 used is provided with a rounded corner 1001, and the nut 20 is provided with a chamfered corner 2002. The diameter of the tip 101 is 0.2 mm, the diameter of the bottom 102 is 0.41 mm, the total length of the screw 10 including the rounded corner 1001 is 2.03 mm, the head diameter of the nut 20 is 0.56 mm, and the total length of the micro-cone nail 50 is 2.29 mm.
[0057] like Figure 2 As shown, the diameter of the conductive through hole 30 is 0.35 mm, and the inner wall of the conductive through hole 30 is provided with a silver coating;
[0058] The conductive microwire 40 is made of 13um nickel-chromium alloy wire with a 2um insulating coating on the surface. This coating generally needs to be melted at high temperature or physically extruded;
[0059] Combine Figure 3 Please understand that after the above materials are prepared,
[0060] S1: inserting the conductive microwire 40 into the conductive through hole 30;
[0061] S2: Use fine tweezers to place the micro screw into the conductive via 30;
[0062] S3: Use a micro screwdriver to rotate and fix the micro screw, and rotate the micro screw 3-5 times until the micro screw is completely rotated into the conductive through hole 30.
[0063] After steps S1-S3 are completed, a specific microwire connection structure is obtained.
[0064] In some preferred embodiments, after steps S1-S3 are completed, impedance testing is further performed and / or the ends of the conductive microwires 40 are gold plated, so that the impedance between the ends of the conductive microwires 40 and the inner wall of the electrical via is controlled within a preset range.
[0065] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations may be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the claims. Furthermore, the present invention described herein may have other embodiments and may be implemented or carried out in a variety of ways.
Claims
1. A micro-cone nail, characterized in that: Used for fixing and conductively connecting the conductive microwires and the conductive holes, the micro-cone nail includes a nut and a screw, the screw includes a tip and a bottom, the bottom is connected to the nut, and the diameter of the screw gradually increases from the tip to the bottom along the length direction; The base material of the micro-cone nail is a metal material, the surface of the micro-cone nail is provided with a coating, and the resistance from the tip to the bottom along the length direction is less than 50mΩ.
2. The micro-cone nail according to claim 1, characterized in that: The cone angle formed by the screw is 2 degrees to 10 degrees.
3. The micro-cone nail according to claim 1, characterized in that: The cone angle formed by the screw is 6 degrees.
4. The micro-cone nail according to claim 1, characterized in that: The base material of the micro-cone nail is copper material. The surface of the micro-cone nail is provided with a nickel-plated layer, and a gold-plated layer is further provided on the nickel-plated layer in the screw area.
5. The micro-cone nail according to claim 4, characterized in that: The substrate of the micro-cone nail is lead-free copper C6801, the thickness of the nickel plating layer is 60-80 μm, and the thickness of the gold plating layer is 10-30 μm.
6. The micro-cone nail according to claim 1, characterized in that: The nut is a straight-shaped, cross-shaped, or hexagonal-shaped nut.
7. The micro-cone nail according to claim 1, characterized in that: The tip is provided with a rounded corner, and / or the nut is provided with a chamfered corner.
8. A microwire connection structure, characterized in that: A micro-cone nail according to any one of claims 1 to 7, comprising a conductive through-hole, a conductive micro-wire and the micro-cone nail installed in the conductive through-hole; The conductive via has a diameter smaller than that of the base end and larger than that of the tip end; The conductive microwire is squeezed between the micro-cone nail and the inner wall of the conductive through hole, and the conductive microwire and the conductive through hole form an electrical connection.
9. The microwire connection structure according to claim 8, characterized in that: The inner wall of the conductive through hole is provided with a silver coating.
10. The microwire connection structure according to claim 8, characterized in that: The conductive microwire comprises a conductive inner layer and an insulating layer, wherein the insulating layer wraps around the outer side of the conductive inner layer; Among them, after the conductive microwire is extended into the conductive through hole, the micro-cone nail is inserted into the conductive through hole, and the micro-cone nail is rotated several times until the microwire connection structure is formed, so that at least part of the insulating layer is polished off, thereby realizing an electrical connection between the conductive inner layer and the conductive through hole.
Citation Information
Patent Citations
Multi-channel independent adjustable array electrode
CN114886429A