Pin bending device for diode production

Abstract

The utility model discloses a pin bending device for diode production, which relates to the field of diode production and comprises a bottom plate, a placing plate fixedly mounted in the middle of the top end of the bottom plate, a cover plate arranged at the top end of the placing plate, mounting racks mounted on the front side and the rear side of the bottom plate, and fixing rods fixedly connected to the top ends of the mounting racks. Supports are fixedly connected to the left side and the right side of the top of the mounting frame, telescopic electric cylinders are mounted at the tops of the two supports, movable rods are fixedly connected to the bottom ends of the two telescopic electric cylinders, the movable rods and the fixed rods are staggered, a first motor is fixedly connected to the front side of the top end of the bottom plate, and a two-way lead screw is fixedly connected to the output end of the first motor; according to the pin bending device, the first motor works to drive the two-way lead screw to rotate, the rotating two-way lead screw drives the mounting frames on the two sides to move oppositely, the positions of the mounting frames are changed, the bending positions of pins are controlled, and the bending positions of the pins can be flexibly adjusted according to production requirements.

Description

Technical Field

[0001] The utility model relates to the field of diode production, in particular to a pin bending device for diode production. Background Art

[0002] Diodes are one of the most commonly used electronic components. They conduct current unidirectionally, allowing it to flow in only one direction and blocking it in the reverse direction. Therefore, diodes can be used as electronic check valves and are widely used in various circuits, including rectifiers and detectors.

[0003] A Chinese patent (publication number: CN212733912U) discloses a pin bending device for diode production, comprising a fixing base and a workbench; the fixing base is provided with a plurality of tube body grooves matching the diodes, and both ends of the tube body grooves are provided with through grooves for the pins to pass through; a detachable pressure plate is installed above the tube body grooves; a bending groove is provided on the workbench, and a gap for bending the pins is left between the bending groove and the fixing base; the fixing base is simply pressed downward along the bending groove, and the pins extending from both sides of the fixing base can be bent using the bending groove. This is convenient to operate, improves production efficiency, and ensures bending quality; however, the device can only process specific pin bending distances and cannot be flexibly adjusted according to production needs.

[0004] In order to solve the above problems, we have made improvements and proposed a pin bending device for diode production. Utility Model Content

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The utility model provides a pin bending device for diode production, comprising a base plate, a placement plate fixedly installed on the middle part of the top end of the base plate, and a diode placed inside the placement plate, a cover plate provided on the top end of the placement plate, mounting brackets installed on the front and rear sides of the base plate, the top end of the mounting bracket is fixedly connected to a fixing rod, the left and right sides of the top of the mounting bracket are fixedly connected to brackets, telescopic electric cylinders are installed on the tops of the two brackets, the bottom ends of the two telescopic electric cylinders are fixedly connected to movable rods, and the movable rods are staggered with the fixed rods, the front side of the top end of the base plate is fixedly connected to a first motor, the output end of the first motor is fixedly connected to a bidirectional lead screw, and the outer sides of the bidirectional lead screw are threadedly connected to the bottoms of the two mounting brackets.

[0007] As a preferred technical solution of the present invention, the right side of the top end of the placement plate is rotatably connected to a mounting shaft, and the mounting shaft is fixedly mounted on the right side of the cover plate.

[0008] As an optimal technical solution of the present invention, a second motor is fixedly connected to the right side of the placement plate, the output end of the second motor is fixedly connected to a driving gear, the outer side of the driving gear is meshed with a driven gear, and the driven gear is fixedly connected to the rear side of the mounting shaft.

[0009] As a preferred technical solution of the present invention, a plurality of suction nozzles are fixedly connected to the bottom of the cover plate, and the suction nozzles are in contact with the surface of the diode, and a branch pipe is fixedly connected to the top of the suction nozzle.

[0010] As a preferred technical solution of the present invention, the top ends of the plurality of branch pipes are fixedly connected with connecting pieces, the top ends of the connecting pieces are fixedly connected with connecting pipes, and the connecting pipes are connected to the air pump.

[0011] As a preferred technical solution of the present invention, the suction nozzle protrudes from the cover plate and is elastic.

[0012] The beneficial effects of the utility model are:

[0013] 1. In the present invention, the first motor drives the bidirectional lead screw to rotate, and the rotating bidirectional lead screw drives the mounting frames on both sides to move toward each other, thereby changing the position of the mounting frames and controlling the bending position of the pins. The bending position of the pins can be flexibly adjusted according to production requirements.

[0014] 2. In the utility model, the vacuum pump draws away the air at the suction nozzle through the connecting pipe, the connecting piece and the branch pipe. The suction nozzle is adsorbed on the surface of the diode. As the cover is opened, the diode is taken out from the placement plate, which assists in taking out the material and is more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is a left-side stereogram of the present utility model;

[0017] Figure 2 It is a right side perspective view of the present invention;

[0018] Figure 3 It is a partial enlarged view of the utility model;

[0019] In the figure: 1. Base plate; 2. Placement plate; 3. First motor; 4. Bidirectional screw; 5. Mounting frame; 6. Fixed rod; 7. Bracket; 8. Telescopic electric cylinder; 9. Movable rod; 10. Cover plate; 11. Mounting shaft; 12. Second motor; 13. Driving gear; 14. Driven gear; 15. Connecting pipe; 16. Connecting piece; 17. Branch pipe; 18. Suction nozzle. DETAILED DESCRIPTION

[0020] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0021] Example: Figure 1-3 As shown, a pin bending device for diode production includes a base plate 1, a placement plate 2 is fixedly installed on the middle part of the top of the base plate 1, and a diode is placed inside the placement plate 2, a cover plate 10 is provided on the top of the placement plate 2, mounting frames 5 are installed on the front and back sides of the base plate 1, the top of the mounting frame 5 is fixedly connected to a fixing rod 6, the left and right sides of the top of the mounting frame 5 are fixedly connected to brackets 7, telescopic electric cylinders 8 are installed on the top of the two brackets 7, the bottom ends of the two telescopic electric cylinders 8 are fixedly connected to movable rods 9, and the movable rods 9 are staggered with the fixed rods 6, the front side of the top of the base plate 1 is fixedly connected to a first motor 3, the output end of the first motor 3 is fixedly connected to a bidirectional lead screw 4, and the outer side of the bidirectional lead screw 4 is threadedly connected to the bottom of the two mounting frames 5, and the bidirectional lead screw 4 is rotatably connected to the top of the base plate 1;

[0022] The diode is placed in the placement plate 2, and then the cover plate 10 is placed on the top of the placement plate 2 to fix the diode. The first motor 3 drives the bidirectional screw 4 to rotate, and the rotating bidirectional screw 4 drives the mounting frames 5 on both sides to move towards each other, so that the fixed rod 6 and the movable rod 9 are on both sides of the diode pin. The telescopic electric cylinder 8 works to make the movable rod 9 move downward, and cooperate with the fixed rod 6 to bend the diode pin. The bending position changes, and the position of the mounting frame 5 is adjusted by the bidirectional screw 4 for adjustment.

[0023] Specifically, such as Figure 1 and Figure 2 As shown, the right side of the top end of the placement plate 2 is rotatably connected to the installation shaft 11, and the installation shaft 11 is fixedly installed on the right side of the cover plate 10. The right side of the placement plate 2 is fixedly connected to the second motor 12, and the output end of the second motor 12 is fixedly connected to the driving gear 13. The outer side of the driving gear 13 is meshed with the driven gear 14, and the driven gear 14 is fixedly connected to the rear side of the installation shaft 11. The second motor 12 drives the driving gear 13 to rotate, and the rotating driving gear 13 rotates the installation shaft 11 through the driven gear 14, so that the cover plate 10 can be opened and closed.

[0024] Specifically, such as Figure 2 and Figure 3As shown, the bottom of the cover 10 is fixedly connected with a plurality of suction nozzles 18, and the suction nozzles 18 are in contact with the surface of the diode, the top of the suction nozzle 18 is fixedly connected with a branch pipe 17, the tops of the plurality of branch pipes 17 are fixedly connected with a connector 16, the top of the connector 16 is fixedly connected with a connecting pipe 15, and the connecting pipe 15 is connected to the vacuum pump, the cover 10 is closed on the top of the placement plate 2, the suction nozzle 18 is in contact with the surface of the diode, and the vacuum pump works to remove the air at the suction nozzle 18 through the connecting pipe 15, the connector 16 and the branch pipe 17, and the suction nozzle 18 is adsorbed on the surface of the diode. As the cover 10 is opened, the diode is taken out from the placement plate 2, which assists in material removal and is more convenient to use.

[0025] Specifically, such as Figure 3 As shown, the suction nozzle 18 protrudes from the cover plate 10, and the suction nozzle 18 is elastic. The suction nozzle 18 protrudes from the cover plate 10 to better contact the diode. The suction nozzle 18 is elastic. During the process of opening the cover plate 10, the suction nozzle 18 is deformed, which can move the diode out of the placement plate 2.

[0026] Working principle: The diode is placed on the placement plate 2, and then the cover plate 10 is placed on the top of the placement plate 2. The suction nozzle 18 is attached to the surface of the diode to fix the diode. The first motor 3 drives the bidirectional screw 4 to rotate. The rotating bidirectional screw 4 drives the mounting frames 5 on both sides to move towards each other, so that the fixed rod 6 and the movable rod 9 are on both sides of the diode pin. The telescopic electric cylinder 8 works to make the movable rod 9 move downward, cooperating with the fixed rod 6 to bend the diode pin;

[0027] After the pins are bent, the vacuum pump draws out the air from the suction nozzle 18 through the connecting pipe 15, the connecting piece 16 and the branch pipe 17. The suction nozzle 18 is adsorbed on the surface of the diode. As the cover 10 is opened, the diode is taken out from the placement plate 2 to assist in material removal.

[0028] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A pin bending device for diode production, comprising a base plate (1), characterized in that: A placement plate (2) is fixedly installed at the middle of the top of the base plate (1), and a diode is placed inside the placement plate (2). A cover plate (10) is provided at the top of the placement plate (2). Mounting frames (5) are installed on both the front and rear sides of the base plate (1). The top of the mounting frame (5) is fixedly connected to a fixed rod (6). The left and right sides of the top of the mounting frame (5) are fixedly connected to brackets (7). Telescopic electric cylinders (8) are installed on the tops of the two brackets (7). The bottom ends of the two telescopic electric cylinders (8) are fixedly connected to movable rods (9), and the movable rods (9) are offset from the fixed rods (6). The front side of the top of the base plate (1) is fixedly connected to a first motor (3). The output end of the first motor (3) is fixedly connected to a bidirectional lead screw (4), and the outer sides of the bidirectional lead screw (4) are threadedly connected to the bottoms of the two mounting frames (5).

2. A diode production pin bending device according to claim 1, characterized in that: The top right side of the placement plate (2) is rotatably connected to a mounting shaft (11), and the mounting shaft (11) is fixedly mounted on the right side of the cover plate (10).

3. The pin bending device for diode production according to claim 1, characterized in that: A second motor (12) is fixedly connected to the right side of the placement plate (2), an output end of the second motor (12) is fixedly connected to a driving gear (13), an outer side of the driving gear (13) is meshedly connected to a driven gear (14), and the driven gear (14) is fixedly connected to the rear side of the mounting shaft (11).

4. The pin bending device for diode production according to claim 1, characterized in that: A plurality of suction nozzles (18) are fixedly connected to the bottom of the cover plate (10), and the suction nozzles (18) are in contact with the surface of the diode, and a branch pipe (17) is fixedly connected to the top of the suction nozzle (18).

5. The pin bending device for diode production according to claim 4, characterized in that: The top ends of the plurality of branch pipes (17) are fixedly connected to a connecting piece (16), the top ends of the connecting pieces (16) are fixedly connected to a connecting pipe (15), and the connecting pipe (15) is connected to an air pump.

6. The pin bending device for diode production according to claim 4, characterized in that: The suction nozzle (18) protrudes from the cover plate (10), and the suction nozzle (18) is elastic.

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