Mold for preparing plastic carrying disc

Abstract

The utility model discloses a mold for preparing a plastic carrying disc, which comprises a mold base, a lower mold plate, a lower mold block, an upper mold block, an upper mold plate, an injection molding plate, an ejector pin assembly which is arranged in the mold base, is vertical to the lower mold plate and is matched with the lower mold plate in a penetrating manner, and a plurality of groups of heat preservation assemblies and temperature regulation assemblies which are arranged in the upper surface of a mold cavity of the upper mold plate, an upper mold cavity face of a product to be formed is arranged on the lower end face of the upper mold block, heat preservation assemblies are arranged at the position, right facing a large-area plane bracket of the product to be formed, of the product to be formed in an attached mode, and a temperature adjusting assembly is arranged at the position, right facing the center of the bracket, of the product to be formed in an attached mode. The temperature of the hot cavity is kept appropriate, high-temperature plastic is fully matched to fill the interior of the cavity of the bracket part, and the bracket part is subjected to temperature regulation and shaping from the center to the outside in cooperation with the temperature regulation assembly, so that tearing in the forming and shaping process is prevented, good forming quality can be guaranteed, and the yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of mold equipment, in particular to a mold for preparing a plastic carrier plate. Background Art

[0002] Injection molded parts are ubiquitous in our daily lives and are widely used in industrial production. A PCB board with a chip soldered on it needs to be supported and transplanted to facilitate the transfer between different processes. Since the PCB board with the chip soldered on it cannot be bent or deformed, the quality of the supporting tray is required to be high. Although the traditional practical blister tray production process is simple and practical, it is necessary to find another way to solve the problem of the PCB board with the chip soldered on it not being able to bend or droop in the center. Other production processes are needed to make the supporting tray structure more stable. Figure 5 , the center of the supporting plate is required to have a stable plane support, and no bending, deformation or center sagging will occur.

[0003] Therefore, our company needs to specially design and manufacture a mold to meet the needs of customers. While ensuring the technical requirements of large-scale and low-cost production of support carriers, it can maintain the sufficient flow of plastic into each runner cavity during the molding process of the bracket in the center of the support carrier, and use insulation and temperature control methods to quickly mold the bracket and finalize the bracket structure. Therefore, for the molding mold of such large-area bracket products, it is necessary to specially design effective cavity insulation and temperature control components to ensure the molding quality and yield rate of the product. Utility Model Content

[0004] The purpose of this utility model is to meet the quality requirements of a supporting tray product with a large-area flat bracket to ensure that there is no bending and center sagging when supporting materials, as well as the technical requirements that the cavity for forming the large-area flat bracket needs to be quickly and completely poured with plastic, and quickly fixed after molding. We design a mold for preparing a plastic carrier, which covers and fits the large-area flat bracket part through multiple sets of insulation components to maintain a suitable temperature of the hot cavity, fully cooperates with the high-temperature plastic pouring to fill the interior of the bracket part cavity, and then cooperates with the temperature control component to adjust the temperature of the bracket part from the center outward to fix it, so as to prevent molding tearing, and achieve good molding quality and high yield rate.

[0005] The technical solutions adopted to solve the above problems are:

[0006] A mold for preparing a plastic carrier plate includes a mold base, a lower mold plate, a lower die block, an upper die block, an upper mold plate, and an injection molding plate, as well as an ejector pin assembly built into the mold base, perpendicular to the lower mold plate, and perforated to fit the mold base, and also includes several groups of heat preservation components and temperature control components built into the upper surface of the upper mold plate cavity.

[0007] The mold base, lower template, lower module, upper module, upper template and injection plate are stacked in sequence, and the guide pillar and guide sleeve assemblies at the four corners are inserted and matched to realize the lifting and linear sliding action. The lower module is matched above the lower template, and the upper module is matched below the upper template. Several cooling pipes and insulation pipes are opened in the lower and upper modules at a certain distance from the cavity surface of the molded product.

[0008] The lower end face of the upper module is provided with the upper cavity surface of the product to be molded, and a heat preservation component is fitted on the large-area flat bracket part of the product to be molded, and a temperature regulating component is fitted on the center of the bracket. The heat preservation component includes a heat conducting block fitted on the upper cavity surface, a heating tube and a power-carrying wire. A runner connected to the cavity is provided at the center of the heat conducting block. The heating tube is O-shaped and fitted on the upper end face of the heat conducting block, and is energized to obtain a heating and heat preservation effect. The heat conducting block is screwed to the lower end face of the upper module by screws. The temperature regulating component is arranged at the center of the bracket part, and includes a temperature regulating block and a temperature regulating tube. A temperature regulating pipe is provided inside the temperature regulating block, and the temperature regulating pipe is connected to the temperature regulating tube. The temperature regulating fluid or cooling fluid is connected to the inside of the temperature regulating tube to adjust the temperature of the temperature regulating block, thereby controlling the plastic heat preservation circulation and filling in various places in the cavity, and controlling the molding and shaping of the product to be injection molded, and preventing the finished product from being torn due to dispersed shrinkage.

[0009] Furthermore, the upper end surface of the lower module is provided with a lower cavity surface of the product to be formed, and an overflow slag cavity is provided along the periphery of the cavity parting surface.

[0010] Furthermore, the runner port of the heat-conducting block is connected to the thermal insulation runner tube, and the thermal insulation runner tube is electrically heated to maintain smooth plastic flow in the internal circulation pipe, and all the thermal insulation runner tubes converge at the injection port.

[0011] Furthermore, air release plates are evenly spaced on the outer periphery of the upper end surface of the temperature regulating block to balance the air pressure in the mold cavity.

[0012] The beneficial effects of the utility model are:

[0013] The mold for preparing the plastic carrier plate cooperates with multiple groups of insulation components and temperature control components to cover and fit the large-area flat bracket area, maintain the appropriate temperature of the hot cavity, and fully cooperate with the high-temperature plastic infusion to fill the interior of the bracket cavity. The temperature control component then cooperates with the bracket area to adjust the temperature from the center outward to shape it, so as to prevent tearing during the molding and shaping process, thereby ensuring good molding quality and improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a side plan view of a mold for preparing a plastic carrier tray in an embodiment;

[0015] Figure 2This is a side plan view of a mold for preparing a plastic carrier tray in an embodiment with the upper template, upper module, and lower module removed;

[0016] Figure 3 A side plan view of the heat preservation assembly and the temperature regulating assembly described in the embodiment;

[0017] Figure 4 for Figure 3 A partial enlarged view of point A in the middle;

[0018] Figure 5 A side plan view of the product to be formed according to the embodiment;

[0019] Among them, 1-lower template, 2-lower module, 3-upper module, 4-upper template, 5-injection plate, 6-injection port, 7-lower cooling line, 8-heat conduction block, 9-insulation runner tube, 10-upper cover, 11-horizontal runner tube, 12-upper cooling line, 13-product to be molded, 14-guide column and guide sleeve assembly, 15-ejector assembly, 16-temperature regulating block, 17-product reinforcement rib, 18-blocking, 19-venting piece, 20-liquid inlet, 21-screw hole, 22-liquid outlet, 23-heating tube, 24-runner gate, 25-horizontal frame, 26-longitudinal frame, 27-bracket. DETAILED DESCRIPTION

[0020] The technical solution of the present invention will be described clearly and completely in the following by way of embodiments in conjunction with the accompanying drawings.

[0021] See also Figure 1 and Figure 3 This embodiment proposes a mold for preparing a plastic carrier, including a mold base, a lower mold plate 1, a lower module 2, an upper module 3, an upper mold plate 4 and an injection molding plate 5, as well as an ejector pin assembly 15 built into the mold base, perpendicular to the lower mold plate 1 and perforated to fit, and also including four groups of insulation components and temperature control components built into the upper surface of the cavity of the upper mold plate 4.

[0022] Referring to the layout rules of traditional mold equipment, the mold base, lower template 1, lower module 2, upper module 3, upper template 4 and injection plate 5 are stacked in sequence, and the guide column and guide sleeve assemblies 14 at the four corners are fitted together to realize the lifting and sliding linear movements. The lower module 2 is fitted above the lower template 1, and the upper module 3 is fitted below the upper template 4. The lower module 2 and the upper module 3 are both provided with a number of cooling pipes and insulation pipes at a certain distance from the cavity surface of the molded product. A cooling fluid circulates in the cooling pipe to accelerate the gradual cooling and shaping process after the filling in the cavity is completed. An insulation fluid circulates in the insulation pipe to maintain the fluid form in the cavity during the plastic filling process and gradually fill the entire cavity space.

[0023] See Figure 3 and Figure 4The lower end face of the upper module 3 is provided with the upper cavity surface of the product to be formed 13, and the large-area flat bracket 27 of the product to be formed 13 is fitted with a heat preservation component, and the center of the bracket 27 is fitted with a temperature regulating component 16. The heat preservation component includes a heat conduction block 8 fitted with the upper cavity surface, a heating pipe 23 and a power conducting wire (not shown in the figure). The center of the heat conduction block 8 is provided with a runner 24 connected to the cavity. The heating pipe 23 is O-shaped and fitted on the upper end face of the heat conduction block, and is energized to obtain heating. In order to improve the heat preservation effect, the heat conducting block 8 is screwed to the lower end surface of the upper module 3 by screws. The temperature regulating assembly is arranged at the center of the bracket 27, including a temperature regulating block 16 and a temperature regulating pipe. A temperature regulating pipe is provided inside the temperature regulating block 16, and the temperature regulating pipe is connected to the temperature regulating pipe. The temperature regulating pipe is connected to the heat preservation fluid or the cooling fluid to adjust the temperature of the temperature regulating block, thereby controlling the heat preservation and circulation of the plastic in the cavity to fill everywhere, and controlling the molding and shaping of the product to be injection molded, thereby preventing the occurrence of tearing of the finished product caused by dispersed cold shrinkage.

[0024] A further embodiment is that the upper end surface of the lower module 2 is provided with a lower cavity surface of the product to be formed 13, and an overflow slag cavity is provided along the periphery of the cavity parting surface.

[0025] See Figure 4 The runner port 24 of the heat-conducting block 8 is connected to the insulation runner tube 9 , and the insulation runner tube 9 is electrically heated to maintain smooth plastic flow in the internal circulation pipe. All insulation runner tubes 9 converge at the injection port 6 .

[0026] See Figure 4 In order to remove the air gaps between the multiple heat-conducting blocks and the temperature-regulating block inside the cavity and the upper cavity surface, air release sheets 19 are evenly spaced at the outer periphery of the upper end surface of the temperature-regulating block 16 to balance the air pressure in the mold cavity.

[0027] The above describes the embodiments of the present invention in detail in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by ordinary technicians in this field, various changes, modifications, substitutions and variations can be made without departing from the purpose of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A mold for preparing a plastic carrier, comprising a mold base, a lower mold plate (1), a lower die block (2), an upper die block (3), an upper mold plate (4), and an injection molding plate (5), and an ejector pin assembly (15) built into the mold base, perpendicular to the lower mold plate (1), and having a perforated fit, characterized in that: It also includes several groups of heat preservation components and temperature regulating components built into the upper surface of the cavity of the upper template (4), The lower end face of the upper module (3) is provided with the upper cavity face of the product to be formed (13), and a heat preservation component is provided in contact with the large-area planar bracket (27) of the product to be formed (13), and a temperature regulating component is provided in contact with the center of the bracket (27). The heat preservation component includes a heat conducting block (8) in contact with the upper cavity face, a heating pipe (23) and an electric wire. The center of the heat conducting block (8) is provided with a runner (24) communicating with the cavity, and the heating pipe (23) is in an O-shape and in contact with the upper end face of the heat conducting block (8). The heating and heat preservation effect is obtained by turning on the power. The heat conducting block (8) is screwed to the lower end face of the upper module (3) by screws. The temperature regulating component is arranged at the center of the bracket (27), including a temperature regulating block (16) and a temperature regulating pipe. The temperature regulating pipe is provided inside the temperature regulating block (16). The temperature regulating pipe is connected to the temperature regulating pipe. The temperature of the temperature regulating block (16) is regulated by the heat preservation fluid or the cooling fluid connected to the inside of the temperature regulating pipe, thereby controlling the heat preservation and circulation of the plastic in the cavity to fill various places, and controlling the molding and shaping of the product to be injection molded.

2. The mold for preparing a plastic carrier according to claim 1, characterized in that: The mold base, the lower mold plate (1), the lower module (2), the upper module (3), the upper mold plate (4) and the injection molding plate (5) are stacked in sequence, and the guide column and guide sleeve assemblies (14) at the four corners are sleeved together to realize the lifting and straight sliding movements. The lower module (2) is matched above the lower mold plate (1), and the upper module (3) is matched below the upper mold plate (4). A plurality of cooling pipes and heat preservation pipes are opened in the lower module (2) and the upper module (3) at a certain distance from the mold cavity surface of the molded product.

3. The mold for preparing a plastic carrier according to claim 1, characterized in that: The runner port (24) of the heat-conducting block (8) is connected to the heat-insulating runner pipe (9), and the heat-insulating runner pipe (9) is electrically heated to maintain smooth plastic flow in the internal circulation pipe. All heat-insulating runner pipes (9) converge at the injection port (6).

4. The mold for preparing a plastic carrier according to claim 1, characterized in that: The upper end surface of the temperature regulating block (16) is evenly spaced with air release sheets (19) on the periphery.

5. The mold for preparing a plastic carrier according to claim 1, characterized in that: The upper end surface of the lower module (2) is provided with a lower cavity surface of the product (13) to be formed, and an overflow slag cavity is provided along the periphery of the cavity parting surface.

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