Assembled heating and spraying disc mechanism and thin film deposition equipment thereof

Abstract

The utility model discloses an assembled heating and spraying disc mechanism which comprises a heating disc base, a heating wire embedded in the heating disc base, a baffle connected to the top of the heating disc base and a pore plate connected to the top of the heating disc base. Wherein an input hole is formed in the heating disc base, the baffle covers the input hole, the pore plate and the heating disc base jointly define a spraying cavity, the baffle is arranged in the spraying cavity, and the pore plate is detachably connected with the heating disc base. According to the assembly type heating and spraying disc mechanism, the pore plate and the heating disc base are detachably connected through the screws, the baffle and the heating disc base are detachably connected through the screws, compared with an existing welding mode, the assembly type heating and spraying disc mechanism can be disassembled, assembled, replaced and the like according to needs, meanwhile, follow-up disassembling of all components is facilitated for internal cleaning treatment, and the assembly type heating and spraying disc mechanism is simple in structure and convenient to use. The problems of complex welding process and high cost are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of spray plates in semiconductor equipment, in particular to an assembled heating spray plate mechanism and thin film deposition equipment thereof. Background Art

[0002] The spray pan is a critical component of semiconductor processing equipment. In existing heating basins, the orifice plate, baffle, and cover plate are typically joined together using electron beam welding. This welding method complicates the manufacturing process and increases costs. After welding, the orifice plate, baffle, or cover plate cannot be disassembled or replaced, and the spray pan is also inconvenient to disassemble and clean. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and to provide an assembled heating spray plate mechanism and a thin film deposition device thereof, so as to solve the technical problems that the existing welded spray plates are difficult to disassemble and clean.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] In the first aspect, an embodiment of the present invention provides an assembled heating spray plate mechanism, which includes: a heating plate base, a heating wire embedded in the heating plate base, a baffle connected to the top of the heating plate base, and a orifice plate connected to the top of the heating plate base; wherein, an input hole is provided in the heating plate base, the baffle cover is provided on the input hole, a spray chamber is enclosed between the orifice plate and the heating plate base, the baffle is provided in the spray chamber, and the orifice plate and the heating plate base are detachably connected.

[0006] Wherein, the orifice plate and the heating plate base are detachably connected via screws.

[0007] Therein, a plurality of through holes are provided on the periphery of the orifice plate, and a plurality of screw holes are provided on the base of the heating plate corresponding to the through holes, and the screws pass through the through holes and are screwed to the screw holes.

[0008] Wherein, a sinking groove is further provided at the outer end of the through hole, and a ceramic cover piece is provided in the sinking groove.

[0009] Wherein, the baffle is detachably connected to the heating plate base.

[0010] The baffle is provided with a connecting hole, the heating plate base is provided with a screw hole aligned with the connecting hole, the screw hole is arranged around the periphery of the input hole, and the baffle is connected to the screw hole by a screw passing through the connecting hole.

[0011] The heating plate base has a docking surface, the docking surface is concavely provided with an annular groove, the heating wire is sunken in the annular groove, and a cover plate covering the heating wire is provided above the annular groove.

[0012] Wherein, the cover plate is fixed to the annular groove by abutting against the butting surfaces of the orifice plate and the heating plate base.

[0013] Wherein, the orifice plate is a circular orifice plate, the baffle is a circular baffle, the heating disk base is a disc-shaped base, and the orifice plate, the baffle and the heating disk base are coaxially arranged.

[0014] In a second aspect, an embodiment of the present invention further provides a thin film deposition device, which includes an assembled heating spray plate mechanism as described in any one of the above items.

[0015] The assembled heating spray plate mechanism of this embodiment uses screws to detachably connect the orifice plate and the heating plate base, as well as the baffle and the heating plate base. Compared with the existing welding method, it can be disassembled and replaced as needed, and it is also convenient for the subsequent disassembly of various components for internal cleaning. Its structure is simple, which solves the problems of complex welding process and high cost.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 and Figure 2 Schematic diagram of the overall structure of the assembled heating spray plate mechanism from different perspectives of an embodiment of the present invention.

[0018] Figure 3 and Figure 4 Exploded views from different angles of the assembled heating spray plate mechanism of an embodiment of the present invention.

[0019] Figure 5 This is a cross-sectional view of an assembled heating spray plate mechanism according to an embodiment of the present invention.

[0020] Figure 6 This is a structural schematic diagram of the assembled heating spray plate mechanism without the orifice plate portion according to an embodiment of the present invention.

[0021] Figure 7 This is a structural schematic diagram of the assembled heating spray plate mechanism without the orifice plate and baffle plate according to an embodiment of the present invention.

[0022] Figure 8 This is a structural schematic diagram of the heating plate base portion of the assembled heating spray plate mechanism according to an embodiment of the present utility model.

[0023] Figure 9 This is a structural schematic diagram of the orifice plate portion of the assembled heating spray plate mechanism according to an embodiment of the present utility model.

[0024] Figure 10 for Figure 1 The enlarged structural diagram of local A is shown.

[0025] Figure 11 for Figure 5 The enlarged structural diagram of local B is shown.

[0026] Description of reference numerals:

[0027] Assembled heating spray plate mechanism 100, heating plate base 1, heating wire 2, cover plate 3, baffle 4, orifice plate 5, support part 11, heating plate part 12, annular groove 121, input hole 122, screw hole 123, docking surface 120, disc body 51, spray chamber 52, spray hole 521, through hole 53, sinking groove 531. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] In addition, the terms "first", "second", "third", etc. are used herein only to describe various circumstances, and should not be construed as indicating or implying relative importance or an indicated number of the technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0032] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be connected, or it can be detachable, or it can be integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] In the present application, unless otherwise specifically defined and limited, the first feature "on" or "under" the second feature can include direct contact between the first and second features, or indirect contact between the first and second features through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0034] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The spray disc is one of the important units in semiconductor processing equipment. In the existing heating disc mechanism, the hole plate, baffle and cover plate are connected as a whole by electron beam welding. The welding connection leads to complex processing technology and high cost. After welding, the hole plate, baffle or cover plate cannot be disassembled and replaced, and it is also not convenient to disassemble and clean the spray disc. Based on the above needs, the present embodiment proposes an assembled heating spray disc mechanism 100.

[0036] See also Figures 1 to 11 The present embodiment discloses an assembled heating spray plate mechanism 100, which includes: a heating plate base 1, a heating wire 2 embedded in the heating plate base 1, a baffle 4 connected to the top of the heating plate base 1, and a orifice plate 5 connected to the top of the heating plate base 1; wherein, an input hole 122 is provided in the heating plate base 1, the baffle 4 is provided above the outlet end of the input hole 122, and is used to disperse the gas source input from the input hole 122, a spray chamber 52 is enclosed between the orifice plate 5 and the heating plate base 1, the baffle 4 is provided in the spray chamber 52, and the orifice plate 5 and the heating plate base 1 are detachably connected.

[0037] In this embodiment, a detachable connection assembly design is adopted between the orifice plate 5 and the heating plate base 1. Compared with the existing welding process, the processing technology is simpler and the subsequent disassembly and assembly can be conveniently performed for component replacement or internal cleaning.

[0038] In this embodiment, the orifice plate 5 and the heating plate base 1 are detachably connected via screws 6 .

[0039] Specifically, a plurality of through holes 53 are provided on the periphery of the orifice plate 5, and a plurality of screw holes 123 are provided on the heating plate base 1 corresponding to the through holes 53. The screws 6 pass through the through holes 53 and are screwed to the screw holes 123, thereby assembling the orifice plate 5 on the heating plate base 1.

[0040] Please refer again Figure 9 The outer end of the through hole 53 is further provided with a recessed groove 531, in which a ceramic cover plate 7 is disposed. Since the ends of the screws 6 are exposed after being screwed to the heating plate base 1 and are susceptible to fluoride corrosion, a recessed groove 531 is provided at the outer end of the through hole 53, and a ceramic cover plate 7 is disposed in the recessed groove 531 to cover the ends of the screws 6 and prevent them from being corroded by fluoride.

[0041] Furthermore, the baffle 4 is detachably connected to the heating plate base 1 .

[0042] The baffle plate 4 is provided with a connection hole, and the heating plate base 1 is provided with screw holes aligned with the connection holes. The screw holes are arranged around the periphery of the input hole 122, and the baffle plate 4 is connected to the screw holes via screws 8 passing through the connection holes. The input hole 122 is located at the center of the baffle plate 4. The external input reaction source is dispersed by the baffle plate 4 and evenly distributed into the spray chamber 52. After being heated by the heating wire 2 in the spray chamber 52, it is output from the spray hole 521 on the orifice plate 5 to the semiconductor thin film deposition chamber.

[0043] The heating plate base 1 has a docking surface 120 , and the docking surface 120 is recessed with an annular groove 121 . The heating wire 2 is sunken in the annular groove 121 , and a cover plate 3 covering the heating wire 2 is provided above the annular groove 121 .

[0044] The cover plate 3 is fixed to the annular groove 121 by the butt joint surface 120 of the orifice plate 5 and the heating plate base 1, that is, the cover plate 3 is fixed by the butt joint surface of the heating plate base 1 and the orifice plate 5, thereby facilitating the subsequent disassembly of the cover plate 3.

[0045] The heating plate base 1 comprises a heating plate portion 12 and a bottom central support portion 11 connected to the heating plate portion 12. The support portion 11 defines a longitudinally extending through cavity 111, through which the external process gas pipe and the two electrical connection ends of the heating wire 2 are led. The heating plate portion 12 is a circular plate, and the support portion 11 is a cylindrical structure.

[0046] The orifice plate 5 includes a disc body 51, a spray cavity 52 is recessed at the bottom of the disc body 51, and uniform spray holes 521 are provided on the disc surface of the disc body 51. The edge of the disc body 51 is assembled on the heating plate base 1 by screws 6 provided therethrough.

[0047] In this embodiment, the orifice plate 5 is a circular orifice plate, the baffle 4 is a circular baffle, the heating disk base 1 is a disc-shaped base, and the orifice plate 5, the baffle 4 and the heating disk base 1 are coaxially arranged.

[0048] An embodiment of the present invention further provides a thin film deposition device, which includes the assembled heating spray plate mechanism 100 as described in any one of the above.

[0049] The assembled heating spray plate mechanism of this embodiment uses screws to detachably connect the orifice plate and the heating plate base, as well as the baffle and the heating plate base. Compared with the existing welding method, it can be disassembled and replaced as needed, and it is also convenient for the subsequent disassembly of various components for internal cleaning. Its structure is simple, which solves the problems of complex welding process and high cost.

[0050] The above examples are merely used to further illustrate the technical content of the present invention for easier understanding by the reader. However, they do not limit the implementation of the present invention to these examples. Any technical extension or reinvention based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. An assembled heating spray plate mechanism, characterized in that: include: A heating plate base, a heating wire embedded in the heating plate base, a baffle connected to the top of the heating plate base, and a orifice plate connected to the top of the heating plate base; wherein, an input hole is provided in the heating plate base, the baffle is provided above the outlet end of the input hole, a spray chamber is enclosed between the orifice plate and the heating plate base, the baffle is provided in the spray chamber, and the orifice plate and the heating plate base are detachably connected.

2. The assembled heating spray plate mechanism according to claim 1, characterized in that: The orifice plate and the heating plate base are detachably connected via screws.

3. The assembled heating spray plate mechanism according to claim 2, characterized in that: A plurality of through holes are provided on the periphery of the orifice plate, and a plurality of screw holes are provided on the base of the heating plate corresponding to the through holes. The screws pass through the through holes and are screwed into the screw holes.

4. The assembled heating spray plate mechanism according to claim 3, characterized in that: A sinking groove is further provided at the outer end of the through hole, and a ceramic cover piece is provided in the sinking groove.

5. The assembled heating spray plate mechanism according to any one of claims 1 to 4, characterized in that: The baffle is detachably connected to the heating plate base.

6. The assembled heating spray plate mechanism according to claim 5, characterized in that: The baffle is provided with a connecting hole, and the heating plate base is provided with a screw hole aligned with the connecting hole. The screw hole is arranged around the periphery of the input hole, and the baffle is connected to the screw hole by a screw passing through the connecting hole.

7. The assembled heating spray plate mechanism according to claim 5, characterized in that: The heating plate base has a docking surface, the docking surface is concavely provided with an annular groove, the heating wire is sunken in the annular groove, and a cover plate covering the heating wire is further provided in the annular groove.

8. The assembled heating spray plate mechanism according to claim 7, characterized in that: The cover plate is fixed in the annular groove by abutting against the butting surfaces of the orifice plate and the heating disk base.

9. The assembled heating spray plate mechanism according to claim 5, characterized in that: The orifice plate is a circular orifice plate, the baffle is a circular baffle, the heating disk base is a disc-shaped base, and the orifice plate, the baffle and the heating disk base are coaxially arranged.

10. A thin film deposition device, characterized in that: The thin film deposition apparatus comprises the assembled heating spray plate mechanism according to any one of claims 1 to 9.

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