Semiconductor refrigeration device
By introducing the bracket cooling slope and heat dissipation cavity design into the semiconductor refrigeration device, combined with the width-enhanced heat dissipation block and cold storage block, the problem of low cooling efficiency of small semiconductor refrigeration devices is solved, and efficient cold air output and heat dissipation are achieved.
Patent Information
- Application Number
- CN202423003947.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-12-06
AI Technical Summary
The refrigeration efficiency of existing small-scale semiconductor refrigeration devices is low.
The bracket design includes a cooling slope and a heat dissipation cavity, combined with a heat dissipation block and a cold storage block with a wide design to enhance the cooling output and heat dissipation efficiency. The heat dissipation block and the cold storage block are folded using metal plates and are equipped with centrifugal or axial fans for heat dissipation.
The refrigeration efficiency of the semiconductor refrigeration device is improved, and efficient cold air output and heat dissipation are achieved.
Smart Images
Figure CN223425467U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration device. Background Art
[0002] Semiconductor refrigeration has the characteristics of small size and portability, and is suitable for temperature regulation in small outdoor spaces. However, when the size of existing semiconductor refrigeration devices is reduced, their cooling effect is also reduced, resulting in low cooling efficiency of existing small semiconductor refrigeration devices. Utility Model Content
[0003] The purpose of the utility model is to provide a semiconductor refrigeration device.
[0004] The utility model aims to solve the problem of low refrigeration efficiency in existing semiconductor refrigeration devices.
[0005] In order to achieve the purpose of this utility model, this utility model adopts the following technical solutions:
[0006] A semiconductor refrigeration device comprises a semiconductor refrigeration plate, a cold storage block, a heat dissipation block, a heat dissipation fan, a bottom shell, and an upper shell. The semiconductor refrigeration plate has a cooling surface on one side and a heat dissipation surface on the other. The cold storage block is attached to the cooling surface of the semiconductor refrigeration plate to form a cooling end, and the heat dissipation block is attached to the heat dissipation surface of the semiconductor refrigeration plate to form a heat dissipation end. The bottom shell is provided with a heat dissipation fan, and the upper shell covers the bottom shell. The bottom shell is mounted with a bracket, which has a heat dissipation cavity on the outside, a cooling inclined surface on the inside, and legs on the bottom. The cooling end and the heat dissipation end of the semiconductor refrigeration plate are mounted on the bracket. The inner edge of the upper portion of the cold storage block of the cooling end is attached to the lower edge of the cooling inclined surface, and the upper portion of the heat dissipation block of the heat dissipation end faces the heat dissipation cavity. The upper side of the heat dissipation cavity is provided with a heat dissipation port. The upper shell is provided with a heat dissipation grille and an air inlet channel. The heat dissipation port faces the heat dissipation grille, and the heat dissipation cavity is connected to the heat dissipation grille via the heat dissipation port.
[0007] Preferably, a cooling channel is provided in the cold storage block, and a heat dissipation channel is provided in the heat dissipation block.
[0008] Preferably, the width L1 of the cold storage block is the same as the width L of the semiconductor refrigeration plate; the width L2 of the heat dissipation block is wider than the width L of the semiconductor refrigeration plate to increase the cooling effect of the semiconductor refrigeration plate; the outside of the cold storage block is provided with a thermal insulation plate, and the outside of the heat dissipation block is provided with a heat insulation plate.
[0009] Preferably, an air guide channel is provided in the bottom shell, the lower portion of the cooling channel of the cooling block faces the air guide channel, and the lower portion of the heat dissipation channel of the heat dissipation block faces the air guide channel.
[0010] Preferably, the bracket is provided with a rear abutting edge and a front abutting edge. After the upper shell is covered on the bottom shell, the rear abutting edge of the bracket is abutted against the inner wall of the upper shell.
[0011] Preferably, a cooling grid hole is provided on the upper portion of the bottom shell, an air hood is provided outside the cooling grid hole, and a locking ring is screwed onto the air hood.
[0012] Preferably, after the bracket is installed on the bottom shell, the front fitting edge of the bracket fits against the inner wall of the bottom shell and the upper part of the fitting edge is located above the cooling grid hole of the bottom shell, so that the cooling grid hole is connected to the cooling channel of the cold storage block.
[0013] Preferably, the bottom shell is further provided with a mounting hole, in which a power connector is installed. The bracket is provided with a wire lead-out hole.
[0014] Preferably, the heat dissipation block is formed by repeatedly folding a metal plate, and the material of the metal plate is copper or aluminum. The cold storage block is formed by repeatedly folding a conductive metal, including folding into a wavy shape, and the material of the metal plate is copper or aluminum.
[0015] Preferably, the fan is a centrifugal fan or an axial flow fan.
[0016] The beneficial effects of the present invention are as follows: The design of the cooling and heat dissipation slopes of the present invention's bracket facilitates efficient output of cold air and faster heat dissipation, thereby improving cooling efficiency. The design of the heat dissipation block being wider than the width of the semiconductor cooling plate facilitates faster heat dissipation and more efficient cooling. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is an exploded view of the present utility model.
[0018] Figure 2 It is a schematic structural diagram of the utility model after the upper shell and the lock ring are opened.
[0019] Figure 3 It is a structural schematic diagram of the cold storage block of the utility model.
[0020] Figure 4 It is a structural schematic diagram of the semiconductor refrigeration plate of the utility model.
[0021] Figure 5 It is a structural schematic diagram of the heat dissipation block of the utility model.
[0022] Figure 6 It is a structural schematic diagram of the bracket of the utility model.
[0023] Figure 7 It is a structural schematic diagram of the utility model in which a bracket is installed with a cold storage block.
[0024] Figure 8It is a structural diagram of the present utility model. DETAILED DESCRIPTION
[0025] The present invention will be further described below with reference to the attached figures and specific embodiments.
[0026] The utility model provides a semiconductor refrigeration device, comprising a semiconductor refrigeration plate 1, a cold storage block 2, a heat sink block 3, a heat dissipation fan 8, a bottom shell 10, and an upper shell 9. One side of the semiconductor refrigeration plate 1 is a cooling surface, and the other side is a heat dissipation surface. The cold storage block 2 is attached to the cooling surface of the semiconductor refrigeration plate 1 to form a cooling end, and the heat sink block 3 is attached to the heat dissipation surface of the semiconductor refrigeration plate 1 to form a heat dissipation end. The bottom shell 10 is provided with a heat dissipation fan 8, and the upper shell 9 covers the bottom shell 10. The bottom shell 10 is mounted with a bracket 6, which is provided with a heat dissipation cavity 61 on the outside, a cold conduction inclined surface 69 on the inside, and support legs 63 and 64 on the bottom. The cooling end and the heat dissipation end of the semiconductor refrigeration plate are mounted on the bracket 6. The upper inner edge of the cold storage block 2 at the cooling end is attached to the lower edge of the cold conduction inclined surface 69, and the upper portion of the heat dissipation block 3 at the heat dissipation end faces the heat dissipation cavity 61. A heat dissipation port 62 is provided on the upper side of the heat dissipation cavity 61 , and a heat dissipation grille hole 91 and an air inlet channel 92 are provided on the upper shell 9 . The heat dissipation port 62 faces the heat dissipation grille hole 91 , and the heat dissipation cavity 61 is connected to the heat dissipation grille hole 91 through the heat dissipation port 62 .
[0027] The cold storage block 2 is provided with a cooling channel 21 , and the heat dissipation block 3 is provided with a heat dissipation channel 31 .
[0028] The width L1 of the cold storage block is the same as the width L of the semiconductor refrigeration plate. The width L2 of the heat dissipation block should be wider than the width L of the semiconductor refrigeration plate to increase the cooling effect of the semiconductor refrigeration plate 1.
[0029] The outer side of the cold storage block 2 is provided with a heat insulation sheet 4, and the outer side of the heat dissipation block 3 is provided with a heat insulation sheet 5.
[0030] An air guide channel 12 is provided in the bottom shell 10 , and the lower air inlet end of the cooling channel 21 of the cooling block 2 faces the air guide channel 12 , and the lower air inlet end of the heat dissipation channel 31 of the heat dissipation block 3 faces the air guide channel 12 .
[0031] The bracket 6 is provided with a rear bonding edge and a front bonding edge. The rear bonding edge includes a bonding edge 65 and a bonding edge 66 , and the front bonding edge includes a bonding edge 67 .
[0032] After the upper shell 9 is covered on the bottom shell 10, the fitting edges 65 and 66 of the bracket are fitted to the inner wall of the upper shell 9, so that the airflow blown by the cooling fan 8 passes through the cooling channel 31, the cooling cavity 61 and the cooling grille hole 91, and quickly blows away the heat dissipated by the cooling block 3, thereby achieving the effect of fast belt cooling.
[0033] A cooling grid hole 101 is provided on the upper portion of the bottom shell 10 , and an air cover 103 is provided outside the cooling grid hole 101 . A locking ring 11 is screwed onto the air cover 103 .
[0034] After the bracket 6 is mounted on the bottom shell 10, the contact edge 67 of the bracket 6 contacts the inner wall of the bottom shell 10 and is located above the bottom shell cooling grid hole 101, connecting the cooling grid hole 101 with the cooling channel 21 of the cooling block 2. The cooling slope 61 facilitates the conduction of airflow. The airflow from the cooling fan 8 passes through the cooling channel 21, the cooling slope 61, and the cooling grid hole 101 and is blown outward to produce cool air.
[0035] The bottom shell 10 is further provided with a mounting hole 102, in which a power connector 7 is mounted. The bracket 6 is provided with a wire lead-out hole 68.
[0036] The heat dissipation block 3 is formed by repeatedly folding a metal plate, and the material of the metal plate is copper or aluminum. The cold storage block 2 is formed by repeatedly folding a conductive metal into a wave shape, including folding into a wave shape, and the material of the metal plate is copper or aluminum. The fan 8 is a centrifugal fan or an axial fan.
Claims
1. A semiconductor refrigeration device, comprising a semiconductor refrigeration sheet, a cold storage block, a heat dissipation block, a cooling fan, a bottom shell, and an upper shell, wherein one side of the semiconductor refrigeration sheet is a cooling surface and the other side is a heat dissipation surface, the cold storage block is attached to the cooling surface of the semiconductor refrigeration sheet to form a cooling end, the heat dissipation block is attached to the heat dissipation surface of the semiconductor refrigeration sheet to form a heat dissipation end, the bottom shell is provided with a cooling fan, and the upper shell covers the bottom shell, characterized in that: A bracket is installed on the bottom shell, and a heat dissipation cavity is provided on the outer side of the bracket, a cooling slope is provided on the inner side, and a support leg is provided on the lower side; the cooling end and the heat dissipation end of the semiconductor refrigeration plate are installed on the bracket, and the upper inner edge of the cold storage block of the cooling end is attached to the lower edge of the cooling slope, and the upper part of the heat dissipation block of the heat dissipation end faces the heat dissipation cavity; a heat dissipation port is provided on the upper side of the heat dissipation cavity, and a heat dissipation grille hole and an air inlet channel are provided on the upper shell, and the heat dissipation port faces the heat dissipation grille hole, and the heat dissipation cavity is connected with the heat dissipation grille hole through the heat dissipation port.
2. A semiconductor refrigeration device according to claim 1, characterized in that: A cooling channel is provided in the cold storage block, and a heat dissipation channel is provided in the heat dissipation block.
3. A semiconductor refrigeration device according to claim 1, characterized in that: The width L1 of the cold storage block is the same as the width L of the semiconductor refrigeration plate; the width L2 of the heat dissipation block is wider than the width L of the semiconductor refrigeration plate to increase the cooling effect of the semiconductor refrigeration plate; an insulation plate is provided on the outside of the cold storage block, and an insulation plate is provided on the outside of the heat dissipation block.
4. A semiconductor refrigeration device according to claim 1, characterized in that: An air guide channel is provided in the bottom shell, the lower portion of the cooling channel of the cooling block faces the air guide channel, and the lower portion of the heat dissipation channel of the heat dissipation block faces the air guide channel.
5. The semiconductor refrigeration device according to claim 1, characterized in that: The bracket is provided with a rear fitting edge and a front fitting edge. After the upper shell is covered on the bottom shell, the rear fitting edge of the bracket is fitted to the inner wall of the upper shell.
6. The semiconductor refrigeration device according to claim 1, characterized in that: A cooling grid hole is provided on the upper portion of the bottom shell, an air cover is provided outside the cooling grid hole, and a locking ring is screwed onto the air cover.
7. The semiconductor refrigeration device according to claim 1, characterized in that: After the bracket is installed on the bottom shell, the front fitting edge of the bracket fits against the inner wall of the bottom shell and the upper part of the fitting edge is located above the cooling grid hole of the bottom shell, so that the cooling grid hole is connected to the cooling channel of the cold storage block.
8. The semiconductor refrigeration device according to claim 1, characterized in that: The bottom shell is further provided with a mounting hole, in which a power connector is installed, and the bracket is provided with a wire lead-out hole.
9. The semiconductor refrigeration device according to claim 1, characterized in that: The heat dissipation block is formed by repeatedly folding a metal plate, and the material of the metal plate is copper or aluminum. The cold storage block is formed by repeatedly folding a conductive metal, including folding into a wave shape, and the material of the metal plate is copper or aluminum.
10. The semiconductor refrigeration device according to claim 1, characterized in that: The fan is a centrifugal fan or an axial flow fan.