Chip resistor

Abstract

The utility model provides a chip resistor, which relates to the technical field of resistors, and comprises a protective layer, a ventilation assembly fixedly connected in the protective layer, a heat dissipation assembly fixedly connected in the ventilation assembly, the ventilation assembly comprises a heat dissipation layer, the outer side of the heat dissipation layer is fixedly connected on the protective layer, and the bottom end of the heat dissipation layer is fixedly connected with a resistance layer. The bottom end of the resistance layer is fixedly connected with the heat conduction layer, and the bottom end of the heat conduction layer is fixedly connected with the substrate layer, so that by optimizing a heat conduction path and increasing a heat dissipation surface area, the working temperature of the resistor body is reduced, and measurement errors caused by temperature rise are reduced; the problem of heat accumulation of an existing chip resistor under a high-power condition is effectively solved, measurement errors caused by temperature rise are solved, and the stability of the resistor under various application occasions is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of resistors, in particular to a sheet resistor. Background Art

[0002] The construction of a chip resistor usually includes a resistor body, which can be made of carbon, metal, alloy or other synthetic materials, and two or more terminals, which can be metal layers, metal wires or metal evaporated layers. The resistor body is usually mounted on a substrate of ceramic or other insulating materials, and the two terminals are usually covered with a metal layer to provide a good electrical connection. The resistance value and tolerance of the chip resistor are usually marked directly on the surface of the component.

[0003] After searching the Chinese patent publication number: CN206401116U, a chip varistor is found, including a varistor shell and a base, the varistor shell is installed on the base, a connecting plate is installed on one side of the varistor shell, a first lead pin and a second lead pin are installed on one side of the connecting plate, a grain boundary layer is installed inside the varistor shell, the interior of the grain boundary layer is filled with zinc oxide particles, a second electrode is installed on one side of the grain boundary layer, and a first electrode is installed on the other side of the grain boundary layer.

[0004] In order to solve the problem that the previously welded pins need to be disassembled, repaired or replaced, and then re-welded, which is troublesome, the above patent only requires the varistor housing to be pulled out and the varistor to be repaired or replaced.

[0005] However, in actual use, existing chip resistors typically use simple surface mount technology. Although this design helps save space, under high-power operating conditions, heat accumulation will cause the resistor body to heat up. Due to the thermal effect of the resistor body, the temperature rise will cause measurement errors.

[0006] Therefore, the utility model provides a chip resistor. Utility Model Content

[0007] The purpose of the utility model is to solve the shortcomings of the prior art and provide a chip resistor.

[0008] In order to achieve the above object, the utility model adopts the following technical solution: a chip resistor, comprising a protective layer, a ventilation component fixedly connected to the interior of the protective layer, and a heat dissipation component fixedly connected to the interior of the ventilation component;

[0009] The ventilation component includes a heat dissipation layer, the outer side of the heat dissipation layer is fixedly connected to the protective layer, the bottom end of the heat dissipation layer is fixedly connected to the resistance layer, the bottom end of the resistance layer is fixedly connected to the heat conduction layer, and the bottom end of the heat conduction layer is fixedly connected to the substrate layer.

[0010] As a preferred embodiment, the heat dissipation component includes a fin, one end of the fin is fixedly connected to the heat conducting layer, and heat dissipation vias are provided inside the heat dissipation layer, the heat conducting layer and the substrate layer.

[0011] The technical effect of adopting the above technical solution is that heat can be quickly transferred from the resistor to the external environment, thereby avoiding heat accumulation inside the resistor.

[0012] As a preferred embodiment, the heat conducting layer is made of copper or aluminum, and the substrate layer is made of FR4 material.

[0013] The technical effect of adopting the above technical solution is that heat can be quickly transferred from the resistor to the external environment, thereby avoiding heat accumulation inside the resistor.

[0014] As a preferred embodiment, the heat dissipation layer is made of aluminum, and the resistance layer is made of a resistance material such as a metal film or a carbon film.

[0015] The technical effect of adopting the above technical solution is to further improve the thermal efficiency and electrical performance of the resistor.

[0016] As a preferred embodiment, the thickness of the resistance layer is 0.005-0.02 mm, and the line diameter and line width of the resistance layer are 0.1-0.3 mm and the line diameter and line width are 0.3-0.5 mm.

[0017] The technical effect of adopting the above technical solution is: optimizing the current distribution of the resistor layer, reducing local overheating, and thus improving the overall performance and service life of the resistor body.

[0018] As a preferred embodiment, the fin is made of copper and runs through the substrate layer and the fin.

[0019] The technical effect of adopting the above technical solution is: the heat is dissipated to the external environment through the fins, thereby effectively reducing the operating temperature of the resistor.

[0020] As a preferred embodiment, the diameter of the fin is 0.1-0.5 mm, and the spacing between the heat dissipation vias is 0.5-2 mm.

[0021] The technical effect of adopting the above technical solution is to ensure that the fins have sufficient surface area and heat dissipation capacity, while avoiding material waste caused by excessive volume.

[0022] As a preferred embodiment, the thickness ratio of the heat dissipation layer, the resistance layer, the heat conductive layer, the substrate layer and the protective layer is 1:2:1:3:1.

[0023] The technical effect of adopting the above technical solution is: achieving good thermal conductivity and mechanical strength between the layers, ensuring that the chip resistor maintains stable performance in a high-temperature working environment.

[0024] Compared with the prior art, the advantages and positive effects of the present invention are:

[0025] The utility model generates heat by the flow of current in the resistor layer. The heat is quickly transferred to the heat dissipation layer through the thickness and wire diameter design of the resistor layer. The heat dissipation layer adopts aluminum material with high thermal conductivity, which can quickly conduct heat to the fins and heat dissipation vias. The structural design of the fins and heat dissipation vias increases the heat dissipation surface area and the heat dissipation path. This design reduces the operating temperature of the resistor body and reduces the measurement error caused by temperature increase by optimizing the heat conduction path and increasing the heat dissipation surface area. It effectively solves the problem of heat accumulation of existing chip resistors under high power conditions and solves the measurement error caused by temperature increase, making the resistor more stable in various applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A three-dimensional diagram of a chip resistor provided by the utility model;

[0027] Figure 2 This is a schematic diagram of the ventilation component structure of a chip resistor provided by the utility model;

[0028] Figure 3 This is a schematic diagram of the disassembled structure of the ventilation component of a chip resistor provided by the present invention;

[0029] Figure 4 This is a schematic diagram of the disassembled structure of the heat dissipation component of a chip resistor provided by the utility model.

[0030] Legend:

[0031] 1. Protective layer;

[0032] 2. Ventilation component; 21. Heat dissipation layer; 22. Resistance layer; 23. Heat conduction layer; 24. Base plate layer;

[0033] 3. Heat dissipation component; 31. Fin; 32. Heat dissipation via. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] like Figure 1 - Figure 3 As shown, this embodiment provides a technical solution: a chip resistor, comprising a protective layer 1, a ventilation component 2 fixedly connected to the interior of the protective layer 1, and a heat dissipation component 3 fixedly connected to the interior of the ventilation component 2;

[0036] The ventilation component 2 includes a heat dissipation layer 21, which is made of aluminum. The outer side of the heat dissipation layer 21 is fixedly connected to the protective layer 1. The bottom end of the heat dissipation layer 21 is fixedly connected to a resistor layer 22. The thickness of the resistor layer 22 is 0.005-0.02mm, and the wire diameter and line width of the resistor layer 22 are 0.1-0.3mm, and the wire diameter and line width are 0.3-0.5m. The heat dissipation layer 21 is made of aluminum, and the bottom end of the resistor layer 22 is fixedly connected to a thermal conductive layer 23. The thermal conductive layer 23 is made of copper or aluminum. The bottom end of the thermal conductive layer 23 is fixedly connected to a substrate layer 24. The substrate layer 24 is made of FR4 material. The thickness ratio of the heat dissipation layer 21, the resistor layer 22, the thermal conductive layer 23, the substrate layer 24 and the protective layer 1 is 1:2:1:3:1. The outermost protective layer 1 provides physical protection for the internal components to prevent external environmental factors such as humidity and dust from affecting the resistance performance. The heat dissipation layer 21 is made of light The heat dissipation layer 21 is made of aluminum material with high quality and high thermal conductivity. This material ensures that the heat dissipation layer 21 can quickly transfer heat from the resistor layer 22 to the external environment. The thickness design of the resistor layer 22 helps to ensure that the heat generated by the resistor layer 22 when current passes through can be effectively transferred to the heat dissipation layer 21. The thermal conductive layer 23 is made of copper or aluminum to increase thermal conductivity. The thermal conductive layer 23 is located between the resistor layer 22 and the substrate layer 24, and can quickly transfer the heat generated by the resistor layer 22 to the substrate layer 24, and further dissipate it into the environment. The substrate layer 24 is made of FR4 material, which has good electrical insulation and mechanical strength, and provides a stable installation platform for the resistor. The thickness ratio of the heat dissipation layer 21, the resistor layer 22, the thermal conductive layer 23, the substrate layer 24 and the protective layer 1 is 1:2:1:3:1. This ratio optimizes the heat conduction path and ensures that heat can be effectively transferred from the resistor layer 22 to the external environment.

[0037] Furthermore, Figure 1 、 Figure 3 and Figure 4As shown: the heat dissipation assembly 3 includes fins 31, the diameter of the fin 31 is 0.1-0.5mm, the fin 31 is composed of copper, and the fin 31 penetrates the substrate layer 24 and the fin 31, one end of the fin 31 is fixedly connected to the heat conduction layer 23, the inside of the heat dissipation layer 21, the heat conduction layer 23 and the substrate layer 24 is provided with a heat dissipation via hole 32, the pitch of the heat dissipation via hole 32 is 0.5-2mm, the heat dissipation assembly 3 includes fins 31, the fins 31 are composed of copper, the diameter is 0.1-0.5mm, the design of the fin 31 increases the heat dissipation surface area, thereby improving the convective heat dissipation efficiency, the fin 31 penetrates the substrate layer 24, one end of the fin 31 is fixedly connected to the heat conduction layer 23, the structure design makes the heat be directly transmitted from the resistance layer 22 to the fin 31 through the heat conduction layer 23, realizes the rapid heat dissipation, the inside of the heat dissipation layer 21, the heat conduction layer 23 and the substrate layer 24 are provided with a heat dissipation via hole 32, the pitch of the via hole is 0.5-2mm, the design of the via hole allows the heat to be directly transmitted from the resistance layer 22 to the other side of the substrate layer 24, increases the heat dissipation path, and improves the heat dissipation efficiency.

[0038] Working principle:

[0039] As shown: Figure 1 - Figure 4 As shown:

[0040] In use: the current passes through the resistance layer 22 to generate heat, due to the thickness and wire diameter design of the resistance layer 22, the heat can be rapidly transmitted to the heat dissipation layer 21, the heat dissipation layer 21 is composed of aluminum and has high thermal conductivity, can quickly conduct heat to the fin 31 and the heat dissipation via hole 32, the structure design of the fin 31 and the heat dissipation via hole 32 increases the heat dissipation surface area and the heat dissipation path, thereby improving the heat dissipation efficiency, the heat conduction layer 23 is located between the resistance layer 22 and the substrate layer 24, further transmits the heat to the substrate layer 24, the substrate layer 24 is composed of FR4 material and has good electrical insulation and mechanical strength, can stably support the entire resistance structure, and dissipate heat to the environment.

[0041] The above is only a preferred embodiment of the present application, not other forms of the present application, any skilled person in the art can use the above disclosed technical content to make changes or modifications to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still belongs to the protection scope of the technical scheme of the present application.

Claims

1. A chip resistor comprising a protective layer (1), characterized in that: The interior of the protective layer (1) is fixedly connected to a ventilation component (2), and the interior of the ventilation component (2) is fixedly connected to a heat dissipation component (3); The ventilation assembly (2) comprises a heat dissipation layer (21), the outer side of the heat dissipation layer (21) is fixedly connected to the protective layer (1), the bottom end of the heat dissipation layer (21) is fixedly connected to a resistance layer (22), the bottom end of the resistance layer (22) is fixedly connected to a heat conduction layer (23), and the bottom end of the heat conduction layer (23) is fixedly connected to a substrate layer (24).

2. The chip resistor according to claim 1, characterized in that: The heat dissipation component (3) comprises a fin (31), one end of the fin (31) is fixedly connected to the heat conduction layer (23), and heat dissipation holes (32) are provided inside the heat dissipation layer (21), the heat conduction layer (23) and the substrate layer (24).

3. The chip resistor according to claim 1, wherein: The heat-conducting layer (23) is made of copper or aluminum, and the substrate layer (24) is made of FR4 material.

4. The chip resistor according to claim 1, wherein: The heat dissipation layer (21) is made of aluminum, and the resistance layer (22) is made of a metal film or carbon film resistance material.

5. The chip resistor according to claim 2, characterized in that: The thickness of the resistance layer (22) is 0.005-0.02 mm, and the line diameter and line width of the resistance layer (22) are 0.1-0.3 mm, and the line diameter and line width are 0.3-0.5 mm.

6. The chip resistor according to claim 2, characterized in that: The fin (31) is made of copper and penetrates the substrate layer (24) and the fin (31).

7. The chip resistor according to claim 2, characterized in that: The diameter of the fins (31) is 0.1-0.5 mm, and the spacing between the heat dissipation holes (32) is 0.5-2 mm.

8. The chip resistor according to claim 2, characterized in that: The thickness ratio of the heat dissipation layer (21), the resistance layer (22), the heat conduction layer (23), the substrate layer (24) and the protective layer (1) is 1:2:1:3:1.

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