Heat dissipation structure of controller PCB heating component

Abstract

The utility model discloses a heat dissipation structure of a controller PCB heating component. The heat dissipation structure comprises a power module, a heat dissipation body and a bottom shell. A power module is arranged on the front face of the heat dissipation body, and a bottom shell is arranged on the back face of the heat dissipation body. The power module comprises a PCB and a heating device arranged on the surface of the PCB. The bottom shell is provided with an oil inlet and an oil outlet, an oil channel is arranged in the bottom shell, one end of the oil channel is connected with the oil inlet, the other end of the oil channel is connected with the oil outlet, and the oil channel is connected with the back face of the heat dissipation body in a sealed mode. The heat dissipation device has the advantages that the heating device can generate a large amount of heat, the large amount of heat is conducted to the heat dissipation body, oil enters the oil channel from the oil inlet, passes through the oil channel and then flows out of the oil outlet, the oil flows in the oil channel and takes away the heat in the heat dissipation body, and the heat dissipation effect of the heating device is improved. Part of the heating devices are in contact with the heat dissipation table, and the heat dissipation effect of the heating devices is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of automobile controllers, in particular to a heat dissipation structure of heating components of a controller PCB. Background Art

[0002] The exhaust gas recirculation (EGR) system in an automobile reduces NOx emissions by directing exhaust gas into the combustion chamber, thereby lowering the engine's combustion peak. The main components of an EGR system are the EGR solenoid valve, EGR valve, EGR valve opening sensor, and EGR controller.

[0003] EGR controller heat dissipation directly impacts its efficiency and service life. Poor heat dissipation can also lead to EGR controller fires and malfunctions. To address these issues, most current heat dissipation schemes for controller PCB components use thermally conductive gels, aluminum heatsinks, and air cooling. These cooling methods are slow and inefficient. Utility Model Content

[0004] The technical problem to be solved by the present invention is to provide a heat dissipation structure for heat-generating components of a controller PCB in view of the deficiencies in the prior art.

[0005] In order to solve the above technical problems, the present utility model adopts the following technical solutions.

[0006] A heat dissipation structure for heating components on a controller PCB comprises a power module, a heat sink and a bottom shell. The power module is provided on the front of the heat sink and the bottom shell is provided on the back of the heat sink. The power module comprises a PCB and a heating component arranged on the surface of the PCB. The bottom shell is provided with an oil inlet and an oil outlet, an oil channel is provided within the bottom shell, one end of the oil channel is connected to the oil inlet and the other end is connected to the oil outlet, and the oil channel is sealed to the back of the heat sink.

[0007] A preferred solution is that the front surface of the heat sink is coated with thermal grease, and the power module is in contact with the thermal grease.

[0008] A preferred solution is that the power module further includes a power MOS device, a fixing groove is recessed on the front of the heat sink, the power MOS device is fixed in the fixing groove, and the pins of the power MOS device are welded to the PCB board.

[0009] A preferred solution is that the oil passages are evenly distributed in the bottom shell.

[0010] A preferred solution is that the heat dissipation structure of the controller PCB heating component also includes a positioning screw, the front of the heat sink is provided with a first positioning hole, and the PCB board is provided with a second positioning hole. After the positioning screw passes through the second positioning hole and the first positioning hole, the PCB board is fixed to the front of the heat sink.

[0011] A preferred solution is that a plurality of heat dissipation platforms are provided on the front of the bottom shell. When the power module is fixed on the front of the heat dissipation body, at least one heating element is in contact with the heat dissipation platform.

[0012] The heat dissipation structure for heat-generating components on a controller PCB provided by the present invention has at least the following beneficial effects: the heat-generating components generate a large amount of heat, which is transferred to the heat sink. Oil enters the oil channel from the oil inlet and flows out of the oil outlet after passing through the oil channel. The oil flowing in the oil channel removes the heat from the heat sink, improving the heat dissipation of the heat-generating components and achieving a good cooling effect. Some of the heat-generating components are in contact with the heat sink, directly transferring heat to the bottom case, thereby improving the heat dissipation of the heat-generating components.

[0013] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the utility model;

[0015] Figure 2 It is an exploded view of the utility model;

[0016] Figure 3 It is a three-dimensional diagram of the power module of the utility model. DETAILED DESCRIPTION

[0017] In order to illustrate the idea and purpose of this application, this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", "left", "right", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0019] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] like Figures 1 to 3 As shown, an embodiment of the present application provides a PCB power module heat dissipation structure, including a power module 10, a heat sink 20 and a bottom shell 30; the power module 10 is provided on the front of the heat sink 20, and the bottom shell 30 is provided on the back of the heat sink 20; the power module 10 includes a PCB board 11 and a heating device 12 arranged on the surface of the PCB board 11; the bottom shell 30 is provided with an oil inlet 31 and an oil outlet 32, and an oil channel 33 is provided in the bottom shell 30, one end of the oil channel 33 is connected to the oil inlet 31, and the other end is connected to the oil outlet 32, and the oil channel 33 is sealed to the back of the heat sink 20.

[0021] like Figures 1 to 3 As shown, the heating device 12 generates a large amount of heat, which is transferred to the heat sink 20. The oil enters the oil channel 33 from the oil inlet 31, and flows out from the oil outlet 32 ​​after passing through the oil channel 33. The oil flows in the oil channel 33, and the oil takes away the heat in the heat sink 20, thereby improving the heat dissipation effect of the heating device 12.

[0022] like Figures 1 to 3 As shown, the front of the heat sink 20 is coated with thermal grease, and the power module 10 is in contact with the thermal grease. The thickness of the thermal grease is 0.2-0.5 mm, and the thermal grease has a good heat conduction effect.

[0023] like Figures 1 to 3 As shown, the power module 10 also includes a power MOS device 13. A fixing groove 21 is recessed on the front of the heat sink 20. The power MOS device 13 is fixed in the fixing groove 21. The pins of the power MOS device 13 are soldered to the PCB board 11. The fixing groove 21 is coated with thermal conductive silicone grease. The power MOS device 13 is installed in the fixing groove 21 and is fixed in the fixing groove 21 using screws. The power MOS device 13 transfers heat to the heat sink 20, and the oil in the oil channel 33 removes the heat.

[0024] like Figures 1 to 3 As shown, the oil passages 33 are evenly distributed in the bottom shell 30. The oil in the oil passages 33 has a large contact area with the radiator 20, which can fully remove the heat of the radiator 20, thereby increasing the heat dissipation effect.

[0025] like Figures 1 to 3 As shown, the heat dissipation structure of the PCB power module 10 also includes a positioning screw 40. The front of the heat sink 20 is provided with a first positioning hole 22, and the PCB board 11 is provided with a second positioning hole. After the positioning screw 40 passes through the second positioning hole and the first positioning hole 22, the PCB board 11 is fixed to the front of the heat sink 20.

[0026] like Figures 1 to 3 As shown, the second positioning hole corresponds to the first positioning hole 22. When the second positioning hole and the first positioning hole 22 are aligned, the positioning screw 40 passes through the second positioning hole and the first positioning hole 22. The positioning screw 40 plays a role of fixing and positioning, so that the heating device 12 corresponds to the position of the oil channel 33, thereby increasing the heat dissipation effect.

[0027] like Figures 1 to 3 As shown, the front of the bottom housing 30 is provided with a plurality of heat dissipation platforms 34. When the power module 10 is fixed to the front of the heat sink 20, at least one heating device 12 contacts the heat dissipation platform 34. Some of the heating devices 12 are in contact with the heat dissipation platform 34, and some of the heating devices 12 can fully conduct heat to the heat dissipation platform 34, thereby improving heat conduction.

[0028] The above is a specific implementation of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a controller PCB heating component, characterized in that: The invention comprises a power module, a heat sink and a bottom shell; the power module is provided on the front of the heat sink, and the bottom shell is provided on the back of the heat sink; the power module comprises a PCB board and a plurality of heating devices arranged on the surface of the PCB board; the bottom shell is provided with an oil inlet and an oil outlet, an oil channel is provided in the bottom shell, one end of the oil channel is connected to the oil inlet, and the other end is connected to the oil outlet, the oil channel is sealed with the back of the heat sink, the front of the heat sink is coated with thermal conductive silicone grease, the power module is in contact with the thermal conductive silicone grease, the power module also comprises a power MOS device, a fixing groove is recessed on the front of the heat sink, the power MOS device is fixed in the fixing groove, the pins of the power MOS device are welded to the PCB board, the fixing groove is coated with thermal conductive silicone grease, the power MOS device is installed in the fixing groove, and the power MOS device is installed in the fixing groove by screws.

2. The heat dissipation structure of the controller PCB heating component according to claim 1, characterized in that: The oil passages are evenly distributed in the bottom shell.

3. The heat dissipation structure of the controller PCB heating component according to claim 1, characterized in that: The heat dissipation structure of the controller PCB heating component also includes a positioning screw. The front of the heat sink is provided with a first positioning hole, and the PCB board is provided with a second positioning hole. After the positioning screw passes through the second positioning hole and the first positioning hole, the PCB board is fixed to the front of the heat sink.

4. The heat dissipation structure of the controller PCB heating component according to claim 1, characterized in that: The front of the bottom shell is provided with a plurality of heat dissipation platforms. When the power module is fixed on the front of the heat dissipation body, at least one heating element contacts the heat dissipation platform.

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