Heat dissipation mechanism

Abstract

The utility model relates to a heat dissipation mechanism, which comprises a heat conduction plate main body, a refrigerant flowing space with a preset thickness is formed in the heat conduction plate main body so as to release heat through one surface and the other surface, and the heat conduction plate main body comprises a vacuum part and a heat dissipation part, and a vacuum chamber provided to vertically communicate with the refrigerant flow space with respect to one of the one surface and the other surface, and to vacuumize the refrigerant flow space before or after filling the refrigerant flow space with the refrigerant, therefore, the refrigerant leakage phenomenon of the heat dissipation mechanism can be prevented, and the heat dissipation performance can be improved.

Description

Technical Field

[0001] The present invention relates to a heat dissipation mechanism and a method for manufacturing the same. More specifically, the invention relates to a heat dissipation mechanism and a method for manufacturing the same, which can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., an electronic device) through a phase change of a refrigerant that is more effective than the refrigerant's own heat-conducting material properties. Background Art

[0002] Across various industries, including communications, electronics, and electrical, technologies are undergoing continuous and advanced development to enable their application in more advanced industries. This advanced technology requires high-output energy, and devices using high-output energy inevitably generate high heat, necessitating the development of cooling systems tailored to this level.

[0003] Cooling systems are used in a variety of industries (such as air conditioning, mobile communications, data centers, aerospace, electric vehicles, energy storage devices, and displays). These cooling systems are one of the main causes of electricity consumption, which is increasing with the development of the industry.

[0004] Generally, heat dissipation mechanisms are roughly divided into active cooling devices and passive cooling devices. Active cooling devices mainly use forced convection based on fans, while passive cooling devices can be divided into technologies that use natural convection without fans.

[0005] However, existing heat dissipation systems have limitations in dissipating the high heat generated by continuously advancing advanced technologies. Therefore, the relevant industries are in need of innovative technologies that can address this problem. As part of this effort, heat dissipation mechanisms utilizing phase change materials are being developed.

[0006] Phase change refers to the phenomenon in which the inherent state of a liquid, gas, or solid changes when it accumulates a large amount of energy or releases stored heat.

[0007] A phase change refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical bonding or formation. The heat used when a substance is subjected to energy but does not undergo a phase change is called sensible heat, while the heat used when a phase change occurs is called latent heat.

[0008] However, because temperature and pressure are directly proportional, there's a problem with increasing the heat sink's temperature, leading to an increase in pressure. If the pressure inside a sealed heat sink increases due to high temperatures transferred from the heating element, this can cause the heat sink itself to rupture. To address this issue, it's necessary to prevent pressure increases. This requires a sufficient internal volume within the heat sink to achieve pressure equilibrium during the phase change cycle.

[0009] As described above, in order to dissipate heat using the phase change material (refrigerant) provided inside the heat dissipation mechanism, a vacuuming process is required to adjust the internal pressure before filling the mechanism with the refrigerant.

[0010] The vacuuming process is a process that uses a vacuum-operated device to vacuumize the interior through suction. In order to form ventilation holes, the ventilation holes are formed to protrude further outward than the initial design value. Then the vacuuming process is performed, and then the caulking finishing process is performed to cover the interior to complete the process.

[0011] At this time, the caulking finishing process is a process in which a caulking tool is used to press the portion additionally protruding for forming the ventilation hole so that the inner peripheral surfaces forming the ventilation hole abut against each other, thereby finishing.

[0012] However, initially, in the case where the vent hole has a completely circular cross-section, shape deformation is achieved by uniform pressure based on the caulking tool. Therefore, in the absence of a single leak, the inner peripheral surface of the vent hole can be completely caulked. However, in the case where the vent hole has a non-circular cross-section including an elliptical shape, the pressure transmitted by the caulking tool is uneven, resulting in uneven shape deformation, and there is a concern that a leak may occur.

[0013] First, if a leak occurs in the heat dissipation mechanism, the refrigerant may leak out, and the decrease in internal pressure makes it difficult for the refrigerant to undergo a phase change, resulting in a problem of a sharp drop in heat dissipation performance. Utility Model Content

[0014] Technical issues

[0015] In order to solve the above technical problems, the purpose of the present invention is to provide a heat dissipation mechanism and a manufacturing method thereof that can improve the heat dissipation performance of a heat-generating device (electronic device).

[0016] Furthermore, another object of the present invention is to provide a heat dissipation mechanism including a vacuum portion and a manufacturing method thereof, wherein the vacuum portion is configured to smoothly perform a caulking and finishing process for ventilation holes formed with an elliptical or non-circular cross-section.

[0017] The technical problems that the present invention intends to solve are not limited to the technical problems mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0018] Technical Solution

[0019] According to an embodiment of the heat dissipation mechanism of the present invention, it includes: a heat conducting plate body, in which a refrigerant flow space of a predetermined thickness is formed to release heat through one surface and the other surface, wherein the heat conducting plate body includes: a vacuum portion, which is arranged to be vertically connected to the refrigerant flow space relative to one of the one surface and the other surface, and is used to vacuum the refrigerant flow space before or after the refrigerant is filled into the refrigerant flow space.

[0020] Here, the refrigerant flow space of the heat transfer plate body can be a space between the one side heat transfer plate forming the one surface and the other side heat transfer plate forming the other surface, and can be formed as a closed empty space for gas-liquid circulation so that the refrigerant is filled and releases heat while changing phase, and the vacuum part can be equipped with a ventilation hole formed in one of the one side heat transfer plate and the other side heat transfer plate.

[0021] Furthermore, the vacuum unit may include: a ventilation tube that is engaged from the inside of the ventilation hole toward the outside and protrudes outward by a predetermined length; and a welding auxiliary ring that is clamped on the outer peripheral surface of the ventilation tube for welding and fixing the ventilation tube.

[0022] Also, the ventilation pipe may include: a pipe body having a hollow pipe shape; and a clamping step portion located in the refrigerant flow space of the pipe body and having an outer diameter larger than an outer circumference of the pipe body.

[0023] Furthermore, the outer diameter of the engaging step portion may be formed to be large enough to engage with the edge of the inner side surface of the ventilation hole.

[0024] Furthermore, the welding auxiliary ring may be closely fixed to an outer side edge portion of one of the heat conducting plate on one side and the heat conducting plate on the other side where the ventilation holes are formed.

[0025] Furthermore, the vacuum unit may further include a shielding solder portion for fixing the tube body to the ventilation hole by welding.

[0026] Also, the shielding solder portion may be a filler material that is welded to shield the hollow of the pipe main body after the pipe main body is cut to match the outer end of the welding auxiliary ring.

[0027] Also, the shield solder part can be a welding material welded in a manner that the pipe body is cut in a manner that the outer side end of the welding auxiliary ring is entirely covered and is cut in a manner that matches the outer side end of the welding auxiliary ring.

[0028] Also, the vacuumizing part can include a ventilation pipe coupled in an inner side direction from an outer side of the ventilation hole and protruding a predetermined length in an outer side direction, wherein the ventilation pipe includes a pipe body having a hollow pipe shape, and a welding reinforcement part formed in one body with the pipe body and coupled to an outer side surface edge portion of the ventilation hole.

[0029] Also, a tapered portion inclined can be formed in a portion of the welding reinforcement part adjacent to the ventilation hole to form a space capable of applying a welding material between the outer side surface edge portion of the ventilation hole.

[0030] Also, when the pipe body is disposed in an inner side direction from an outer side through the ventilation hole, the welding reinforcement part can have an outer diameter coupled to the outer side surface edge portion of the ventilation hole.

[0031] Also, the vacuumizing part can include a shield solder part welded by a welding material to shield the hollow of the pipe body after the pipe body is cut in a manner that matches the outer side end of the welding reinforcement part, and a fixed solder part welded by a welding material to fix between the welding reinforcement part and the outer side surface edge portion of the ventilation hole.

[0032] Also, the fixed solder part can be formed by a welding material applied between the tapered portions of the welding reinforcement part.

[0033] The manufacturing method of the heat dissipation mechanism according to an embodiment of the present application includes: a heat conducting plate body sheet metal process of processing a one-side heat conducting plate and another-side heat conducting plate in which a refrigerant flow space is formed inside, one of the one-side heat conducting plate and the another-side heat conducting plate being integrally formed with a ventilation hole for filling a refrigerant or vacuumizing; a joining process of joining the one-side heat conducting plate and the another-side heat conducting plate to each other after the heat conducting plate body sheet metal process, the one-side heat conducting plate and the another-side heat conducting plate being configured of a single metal plate member or two metal plate members to form the refrigerant flow space; and a vacuumizing process of vacuumizing the refrigerant flow space after the joining process, wherein the vacuumizing process includes a vacuumizing part setting process of setting a vacuumizing part to the ventilation hole.

[0034] Here, the manufacturing method of the heat dissipation mechanism may further include: a bending process, when the one side heat conduction plate and the other side heat conduction plate are composed of a single metal plate component, before the joining process, the single metal plate component is bent so that the one side heat conduction plate forms one side of the refrigerant flow space, and the other side heat conduction plate forms the other side of the refrigerant flow space.

[0035] Furthermore, the vacuum section setting process may be a process in which, before the joining process, the ventilation tube is pre-set to be clamped on the inner edge end of the ventilation hole and protrude outward by a predetermined length, and a welding auxiliary ring is clamped on the outer peripheral surface of the ventilation tube protruding outward of the ventilation hole.

[0036] Furthermore, the vacuuming process may include: a ventilation process of vacuuming the refrigerant flow space using the ventilation pipe provided in the ventilation hole; and a solder filling process of cutting a portion of the ventilation pipe after the ventilation process and then welding the hollow of the ventilation pipe.

[0037] Furthermore, the vacuum portion setting process may be a process in which, after the bonding process, the ventilation tube may be set from the outside to the inside in a manner that is snap-fitted to the outer edge end of the ventilation hole, and the ventilation tube may be set in a manner that is snap-fitted to the outer side edge of the ventilation hole.

[0038] Furthermore, the vacuuming process may include: a ventilation process, in which the refrigerant flow space is vacuumed by using the ventilation pipe provided in the ventilation hole; a solder fixing process, in which after the ventilation process, a welding reinforcement portion integrated with the ventilation pipe and an outer peripheral surface of the ventilation hole are welded by means of a soldering material; and a solder filling process, in which a portion of the ventilation pipe is cut after the ventilation process, and then the hollow of the ventilation pipe is welded.

[0039] Beneficial effects

[0040] According to an embodiment of the heat dissipation mechanism and the manufacturing method thereof of the present invention, the following effects are achieved: not only refrigerant leakage of the completed heat dissipation mechanism is prevented, but also a decrease in internal pressure is prevented, thereby ensuring product quality.

[0041] The effects of the present invention are not limited to the effects mentioned above, and those skilled in the art can clearly understand other technical effects that have not been mentioned through the description of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1a and Figure 1bThe figures are perspective views showing two embodiments of the back side of an antenna device provided with a heat dissipation mechanism according to an embodiment of the present invention.

[0043] Figure 2a and Figure 2b are shown separately Figure 1a and Figure 1b An exploded perspective view of the back side of the antenna device.

[0044] Figure 3 This is a perspective view of an assembled finger protection assembly for protecting the heat dissipation mechanism according to an embodiment of the present invention from the outside.

[0045] Figure 4 It shows Figure 1a and Figure 2a The figure shows a three-dimensional diagram of the manufacturing process of the heat dissipation mechanism according to an embodiment of the present invention.

[0046] Figure 5 It is a plan view showing a heat conducting plate main body in the structure of a heat dissipation mechanism according to an embodiment of the present utility model.

[0047] Figure 6 yes Figure 1a and Figure 2a Shown is a three-dimensional view and a partially enlarged plan view of a heat dissipation mechanism according to an embodiment of the present invention.

[0048] Figure 7 yes Figure 6 Floor plan.

[0049] Figure 8 It is along Figure 7 Cross-sectional view taken along line BB.

[0050] Figure 9 It is a three-dimensional diagram showing a heat dissipation mechanism according to another embodiment of the present utility model.

[0051] Figure 10 yes Figure 9 Exploded three-dimensional diagram.

[0052] Figure 11 yes Figure 9 A cutaway perspective view (a), a partially enlarged view (b), a cross-sectional view of the portion, and a partially enlarged view (c).

[0053] Figure 12 It is a perspective view and a partially enlarged view showing a vacuum portion in the structure of a heat dissipation mechanism according to an embodiment of the present invention.

[0054] Figure 13 It is a cross-sectional view showing a vacuum process using a vacuum portion in the structure of the heat dissipation mechanism according to an embodiment of the present invention.

[0055] Figure 14 yes Figure 13 Partial cutaway perspective view.

[0056] Figure 15 It is a perspective view and a partially enlarged cross-sectional view showing another embodiment of the structure of the heat dissipation mechanism according to the present invention, showing a vacuum portion.

[0057] Figure 16 It is a flow chart for illustrating a method for manufacturing a heat dissipation mechanism according to an embodiment of the present invention.

[0058] Figure 17 It shows Figure 16 Flowchart of the detailed process of the vacuumization process (SA).

[0059] Figure 18 It shows Figure 16 Flowchart of the detailed process of the remaining process (SB).

[0060] Description of Reference Numerals

[0061] DETAILED DESCRIPTION

[0062] Hereinafter, an embodiment of the heat dissipation mechanism and the manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings.

[0063] It should be noted that when assigning reference numerals to the constituent elements of the various drawings, the same reference numerals shall be assigned to the same constituent elements as much as possible, even if they are assigned to different drawings. In addition, in the process of describing the embodiments of the present invention, if it is determined that the detailed description of the relevant well-known structure or function hinders the understanding of the embodiments of the present invention, the detailed description shall be omitted.

[0064] When describing the constituent elements of the embodiments of the present invention, terms such as first, second, A, B, (a), (b) and the like may be used. These terms are only used to distinguish one constituent element from other constituent elements, and the nature, order or sequence of the corresponding constituent elements are not limited by these terms. In addition, unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meaning as commonly understood by people with conventional knowledge in the technical field to which the present invention belongs. Terms that are the same as those defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the relevant technology, and should not be interpreted as having ideal or overly formal meanings unless clearly defined in this application.

[0065] Figure 1a and Figure 1bThe following are perspective views showing two embodiments of the back portion of an antenna device provided with a heat dissipation mechanism according to an embodiment of the present utility model. Figure 2a and Figure 2b are shown separately Figure 1a and Figure 1b An exploded perspective view of the back portion of the antenna device, Figure 3 This is a perspective view of an assembled finger protection assembly for protecting the heat dissipation mechanism according to an embodiment of the present invention from the outside.

[0066] Generally, heat-generating devices (electronic devices) are manufactured in various forms throughout the industry. However, the applicant of the present invention is a company engaged in other wireless communication equipment manufacturing industries. Below, when describing the heat dissipation mechanism according to an embodiment of the present invention, the representative heat-generating device (electronic device) to be heat-dissipated will be described using the antenna device 100 that the applicant of the present invention is very familiar with as a specific example.

[0067] However, it should be noted that the heat dissipation mechanism according to the embodiment of the present invention described later should not be interpreted as being limited to the antenna device 100, and the specific terms "antenna device 100" and "components related thereto" used below must be interpreted as including the concept of all similar electronic devices and their components.

[0068] First, an antenna device 100 employed as an example of a representative electronic device is as follows.

[0069] like Figure 1a and Figure 1b As shown, the antenna device 100 using the heat dissipation mechanism 200 according to an embodiment of the present invention includes: a heat dissipation housing body 110, which forms a receiving space with an opening toward the front and is formed in a rectangular parallelepiped shape with a front-to-rear receiving width that is approximately longer and thinner in the up-down direction.

[0070] Here, the heat dissipation housing body 110 can be made of a sturdy material to provide a setting place (internal space) for the various internal structures described later, and can protect the internal structures from impacts from the outside. In particular, it is preferred that the heat dissipation housing body 110 be made of a metal material with excellent thermal conductivity, which can dissipate the heat generated by the system in the internal structure during operation to the outside by utilizing the thermal conductivity of its own material.

[0071] Although not shown, a motherboard can be stacked and arranged inside the storage space of the heat dissipation housing body 110 using a clamshell as a medium to serve as a substrate for a power amplifier (PAU) and a digital transceiver unit (DTU). The motherboard can have multiple micro bellows filter (MBF) components mounted on the front surface and a heating element mounted on the back surface.

[0072] Here, components defined as heating elements (not shown) that generate a large amount of heat when operated, such as radio frequency integrated circuits (RFICs) or power amplifiers (PAs), may be mounted on the mainboard. However, it should be noted that in the embodiments of the present invention, only electronic devices are used as antenna devices 100, and the heating elements are not limited to the above configuration. For example, semiconductors, which are typical heating elements, may be used as the heating elements.

[0073] A radome panel 50 may be provided on the front surface of the accommodation space of the heat dissipation housing body 110 , thereby protecting the radiating element implemented as the antenna element from external influences while allowing the radiating element to radiate smoothly.

[0074] Here, the antenna cover panel 50 is formed using a non-conductive material that allows the radiation beam of the radiating element to easily pass through, and can be classified as a component that creates an obstacle to the heat dissipation of the system working heat generated in the accommodation space of the heat dissipation housing body 110 to the front side. Therefore, in order to increase the heat dissipation surface area for concentrated heat dissipation to the rear side of the heat dissipation housing body 110, it also becomes a factor in designing the heat dissipation housing body 110 itself to be longer in the vertical direction.

[0075] In addition, the heat dissipation mechanism 200 or 1200 according to the embodiment of the present invention may be provided on the back side of the heat dissipation housing body 110 .

[0076] According to the embodiment of the present invention, the heat dissipation mechanism 200, 1200 is provided in the form of heat dissipation fins. Strictly speaking, Figure 1a and Figure 1b The fixed heat dissipation fins 200F, 200F-1, and 200F-2 shown are different in that they are of a thin vapor chamber type including an absorber 300 that absorbs liquid refrigerant in the refrigerant.

[0077] Typically, a wick component is located within a well-known vapor chamber. This wick component has a wick structure with multiple pores. This wick component can be manufactured by sintering a metal powder to form multiple pores that allow liquid refrigerant, which is filled within a heat-conductive panel, to migrate toward the heating element via capillary forces while allowing gaseous refrigerant to flow freely to the outside.

[0078] However, the wick component is not limited to the aforementioned sintered metal wick component. In particular, as long as it can absorb and disperse liquid refrigerant or promote vaporization, it can be defined as a concept that includes all possible materials, such as fiber materials, despite being named as the absorbent body 300. This will be described in more detail below.

[0079] In addition, the heat dissipation mechanism 200, 1200 according to the embodiments of the present invention can be manufactured in two different ways.

[0080] That is, the heat dissipation mechanism 200, 1200 according to the embodiment of the present invention includes a heat conducting plate body 200-1, 200-2, 1200-1, 1200-2 having a refrigerant flow space 205, 1205, wherein the refrigerant flow space 205, 1205 is filled with refrigerant and flows while undergoing phase change. In one embodiment, as shown in FIG. Figure 1a and Figure 2a As shown, the heat conducting plate bodies 200-1 and 200-2 are manufactured by bending a single metal plate member, and then joining the edge end portions except the bent portion. In another embodiment, as shown in FIG. Figure 1b and Figure 2b As shown, a manufacturing method is adopted in which the heat conducting plate bodies 1200 - 1 and 1200 - 2 made of two metal plate members are directly joined together without any bending process.

[0081] In addition, if Figure 3 As shown in (a) and (b), the heat dissipation mechanism 200, 1200 according to an embodiment of the present invention may further include: a finger protection component 60, which is configured to surround a portion of the back side and the upper side of the heat dissipation housing body 110, thereby blocking external objects (or people) from approaching the heat dissipation mechanism 200, 1200.

[0082] The finger protection assembly 60 may include: a rear finger protection panel 61, which is vertically arranged in an upper and lower direction in a manner that covers the entire rear end of the heat dissipation mechanism 200, 1200; an upper upper surface finger protection panel 62, which is arranged so that its rear end is connected to the upper end of the rear finger protection panel 61 and its front end extends horizontally forward; a right finger protection panel 63, which has its front end connected to the right rear end of the heat dissipation housing body 110 and its rear end connected to the right end of the rear finger protection panel 61, and is arranged so as to cover the rear right part of the heat dissipation housing body 110; a left finger protection panel 64, which has its front end connected to the left rear end of the heat dissipation housing body 110 and its rear end connected to the left end of the rear finger protection panel 61, and is arranged so as to cover the rear left part of the heat dissipation housing body 110; and an upper front surface finger protection panel 65, which is arranged so as to cover between the front end of the upper upper surface finger protection panel 62 and the front upper end of the heat dissipation housing body 110.

[0083] Here, the right finger guard panel 63 and the left finger guard panel 64 may include an upper side guard plate surface provided on the upper side with reference to a clamp bracket 5 described later and a lower side guard panel provided on the lower side with reference to the clamp bracket 5 .

[0084] In addition, the finger protection assembly 60 may further include protection mounting rods 66 , 67 , and 68 , which provide predetermined threaded fastening holes (not marked with reference numerals) for threaded engagement at various corners and enhance the rigidity of the corners.

[0085] Here, the rear finger protection panel 61 to the upper front surface finger protection panel 65 can be configured using plastic materials to reduce the weight of the entire antenna device 100, and the protective mounting rods 66, 67, and 68 can be configured using aluminum extrusion rods to enhance rigidity.

[0086] The protective mounting rods 66, 67, and 68 may include: a front end protective mounting rod 66, arranged between the upper upper surface finger protection panel 62 and the upper front surface finger protection panel 65 to provide multiple screw fastening holes; a rear end protective mounting rod 67, arranged between the upper upper surface finger protection panel 62 and the rear finger protection panel 61 to provide multiple screw fastening holes; and a lower end protective mounting rod 68, arranged at the lower end of the rear finger protection panel 61 and formed with multiple screw fastening holes.

[0087] Furthermore, the finger guard assembly 60 requires air (external air) to flow into the external space for heat exchange with the heat dissipation mechanism 200 or 1200 provided therein, and thus may be formed with a plurality of ventilation holes (not marked) in a mesh (or grid) shape.

[0088] like Figure 3As shown, the finger guard assembly 60 implemented in the above-described configuration may be arranged to surround all but the lower end of the heat dissipation mechanism 200 , 1200 coupled to the rear side of the heat dissipation housing body 110 .

[0089] In addition, clamping brackets 5 for mediating the installation of support rods (not shown) may be provided at the left and right ends of the heat dissipation housing body 110 to surround the outer side surface of the rear finger protection panel 61 in the structure of the above-mentioned finger protection assembly 60.

[0090] As described above, the clamping bracket 5 not only facilitates installation of the support pole, but also functions as a handle for on-site workers to hold and move the antenna device 100 , and handle holes 6 in the form of holes may be formed at the left and right ends for easy holding.

[0091] Below, refer to Figure 1a 、 Figure 2a and Figures 4 to 8 The heat dissipation mechanism 200 according to an embodiment of the present invention is described in detail. Figures 9 to 11 A heat dissipation mechanism 1200 according to another embodiment of the present invention is described in detail.

[0092] Figure 4 It shows Figure 1a and Figure 2a The three-dimensional diagram of the manufacturing process of the heat dissipation mechanism according to an embodiment of the present invention is shown. Figure 5 1 is a plan view showing a heat conducting plate body in the structure of a heat dissipation mechanism according to an embodiment of the present invention. Figure 6 yes Figure 1a and Figure 2a The three-dimensional diagram and partially enlarged plan view of the heat dissipation mechanism according to an embodiment of the present invention are shown. Figure 7 yes Figure 6 Floor plan, Figure 8 It is along Figure 7 Cross-sectional view taken along line BB.

[0093] First, the heat dissipation mechanism 200 according to an embodiment of the present invention is described in detail as follows.

[0094] That is, Figure 1a and Figure 2a As shown, a plurality of heat dissipation mechanisms 200 according to an embodiment of the present invention may be arranged on the back side of the heat dissipation housing body 110 in an upwardly inclined manner toward the left end and the right end respectively.

[0095] In addition, according to the embodiment of the present invention, the heat dissipation mechanism 200 can be equipped with multiple ones, and all of them are formed into rectangular shapes with the same specifications that are longer in the same length direction. The fixed heat dissipation fins 200F-1 and 200F-2 can be arranged on the back side of the heat dissipation shell body 110 that is not occupied by the heat dissipation mechanism 200.

[0096] Here, if Figure 1a and Figure 2a As shown, the fixed heat dissipation fins 200F-1 and 200F-2 include: an upper fixed heat dissipation fin 200F-1, which is arranged on the upper side of the back portion of the heat dissipation housing body 110 not occupied by the heat dissipation mechanism 200 according to an embodiment of the present invention; and a lower fixed heat dissipation fin 200F-2, which is arranged on the left and right lower sides of the back portion of the heat dissipation housing body 110 not occupied by the heat dissipation mechanism 200 according to an embodiment of the present invention.

[0097] It is previously stated that, unlike the heat dissipation mechanism 200 according to an embodiment of the present invention, the upper fixed heat dissipation fins 200F-1 and the lower fixed heat dissipation fins 200F-2 are not filled with refrigerant and transfer heat based on the thermal conductivity of the metal material itself.

[0098] However, if Figure 1a and Figure 2a As shown, the fixed heat dissipation fins 200F-1 and 200F-2 do not have to be provided separately in the upper and lower parts. Similar to the heat dissipation mechanism 1200 according to another embodiment of the present invention, the fixed heat dissipation fins 200F can also be provided only in the lower part not occupied by the heat dissipation mechanism 1200.

[0099] In addition, if Figure 1a and Figure 2a As shown, a press-in portion 150 for press-in installation of a plurality of heat dissipation mechanisms 200 according to an embodiment of the present invention may be formed on the back of the heat dissipation housing body 110 .

[0100] As described above, according to an embodiment of the present invention, the heat dissipation mechanism 200 is arranged with the middle (refer to the reference numeral 170) as the center and tilted upward toward the left end and the right end. The pressing portion 150 may also be equipped with multiple ones, which can be arranged in a "V" shape with the middle (refer to the reference numeral 170) as the reference.

[0101] That is, Figure 1a and Figure 2a As shown, the heat dissipation mechanism 200 according to an embodiment of the present invention can be pressed into and combined with a plurality of press-in portions 150 formed on the back side of the heat dissipation housing body 110 by a press-in insertion (forced insertion) method.

[0102] At this time, although not shown, it is preferred that the press-in portion 150 is press-inserted after being treated with thermal epoxy to improve heat transfer efficiency.

[0103] Here, the press-in portion 150 may be arranged to pass through one or more heat-generating coupling surfaces (not shown) that are recessed and protruded rearward, so as to accommodate the heat-generating surface of the heat-generating element on the inner side surface corresponding to the back side of the heat-dissipating housing body 110 .

[0104] like Figures 4 to 8 As shown, the heat dissipation mechanism 200 according to one embodiment of the present invention includes: a heat conducting plate body 200-1, 200-2, having a refrigerant flow space 205, providing a space for the refrigerant to circulate gas and liquid in a closed space filled with refrigerant, so that the refrigerant releases heat while changing phase.

[0105] Here, the heat conducting plate bodies 200 - 1 and 200 - 2 are single metal plate members and can be formed in a predetermined manner to form the refrigerant flow space 205 .

[0106] In particular, the heat dissipation mechanism 200 according to an embodiment of the present invention can directly form at least the first refrigerant flow path 210 described later in the refrigerant flow space in which the refrigerant is filled and flows by a bending process in a predetermined manner.

[0107] That is, the first refrigerant flow path 210 is a portion of a single metal plate component that is deformed in shape by bending in the predetermined manner, and is formed to be separated from the heating element or the press-fit portion 150 equipped with a heating element by a spacing distance that is only based on the material thickness of the metal plate component, so that the liquid refrigerant in the refrigerant is filled.

[0108] In more detail, the heat dissipation mechanism 200 according to an embodiment of the present invention can be manufactured by bending a single heat conducting plate body 200-1, 200-2 along a predetermined arbitrary reference line T described later (bending process (S20)) and then joining them (joining process (S40)) to form a sealed refrigerant flow space 205 inside.

[0109] However, the heat dissipation mechanism according to the present invention is not necessarily limited to the bending manufacturing method of the above embodiment.

[0110] That is, as described above, by joining two separate metal plate members (joining process ( S40 )), a method for manufacturing heat dissipation mechanism 1200 according to another embodiment of the present invention, in which sealed refrigerant flow space 1205 is formed internally, can also be achieved. This will be described in more detail later.

[0111] Here, the refrigerant flow space 205 may include the first refrigerant flow path 210 as described above, which is provided at a relatively lower position based on the direction of gravity.

[0112] The first refrigerant flow path 210, as a portion deformed in shape by the bending (bending process (S20)), can be defined as a refrigerant filling and flow space that is separated from the press-fit portion 150 equipped with a heating element (heating body) by only a spacing distance based on the material thickness of the metal plate part, so that the refrigerant is filled with liquid-phase refrigerant.

[0113] Specifically, the separation distance refers to a distance between the first refrigerant flow path 210 and the press-fit portion 150 equipped with the heating element, and the separation distance may be a material thickness of the metal plate member.

[0114] However, according to one embodiment of the present invention, the first refrigerant flow path 210 in the heat dissipation mechanism 200 is defined as follows: the first refrigerant flow path 210 includes a common technical structure as an evaporation area, and the evaporation area is an end portion in the width direction that receives heat from the heating body as the heat dissipation object to the heat conduction plate body 200-1, 200-2.

[0115] Furthermore, in the heat dissipation mechanism 200 according to an embodiment of the present invention, the refrigerant flow space 205 may further include a plurality of second refrigerant flow paths 220 for guiding the liquid-phase refrigerant to flow toward the first refrigerant flow path 210 .

[0116] Here, as a portion equipped with the first refrigerant flow path 210, the portion formed by the bending (bending process) is defined as an evaporation area where the liquid refrigerant in the refrigerant evaporates, and the remaining portion outside the evaporation area is defined as a condensation area, and the second refrigerant flow path 220 can be equipped in the condensation area.

[0117] In this case, a plurality of second refrigerant flow paths 220 are formed in the condensation area other than the first refrigerant flow path 210, which serve as flow paths from the other end of the width direction of the heat transfer plate body 200-1, 200-2 to the liquid phase refrigerant in the refrigerant, through which the liquid phase refrigerant condensed from gas to liquid can flow toward the side of the first refrigerant flow path 210 by surface tension or gravity.

[0118] In more detail, if the gaseous refrigerant (gas-phase refrigerant) is condensed into a liquid refrigerant (liquid-phase refrigerant) through a heat exchange process with the external air in the condensation area, the original position volume of the second refrigerant flow path 220 in the refrigerant flow space 205 where condensation is performed gradually increases, and when flowing in the direction of gravity, a flow path is provided in a manner that supplies a uniform amount of liquid-phase refrigerant to the first refrigerant flow path 210 side.

[0119] In particular, as described below, the second refrigerant flow path 220 can be defined between the plurality of inclined guide members 215. When the liquid-phase refrigerant condensed in the condensation region flows toward the first refrigerant flow path 210, surface tension can be used to suppress the dispersed flow toward the second refrigerant flow path 220 adjacent to the second refrigerant flow path 220 serving as the first refrigerant flow path. In other words, because the flow space of the plurality of inclined guide members 215 is smaller than the flow space of the second refrigerant flow path 220, surface tension acts to suppress the flow toward the adjacent second refrigerant flow path 220.

[0120] Furthermore, the plurality of second refrigerant flow paths 220 may be defined between the plurality of inclined guides 215 symmetrically protruding from the opposing surfaces of the heat conducting plate bodies 200 - 1 and 200 - 2 toward the inside of the refrigerant flow space 205 .

[0121] In more detail, the multiple second refrigerant flow paths 220 are defined as the space between the multiple inclined guide members 215 formed on the same surface of the same heat transfer plate body (200-1 or 200-2) in the heat transfer plate body 200-1, 200-2, and are different from the concept of the third refrigerant flow path 230, which is defined as the space between the multiple inclined guide members 215 facing each other and protruding in the direction of decreasing thickness on the side of the refrigerant flow space 205 of the heat transfer plate body 200-1, 200-2 described later.

[0122] Reference Figure 4 (a) According to an embodiment of the present invention, the heat dissipation mechanism 200 can simultaneously form the first refrigerant flow path 210 and the second refrigerant flow path 220 and the plurality of inclined guide members 215 described later for realizing the above-mentioned first refrigerant flow path 210 and the second refrigerant flow path 220 by means of a single component made of a predetermined thermally conductive material through a stamping process (S10) described later.

[0123] At this time, the width of the heat conducting plate main bodies 200-1 and 200-2 in the left-right direction is smaller than Figure 4 In the case of a rectangle with a length in the vertical direction of the figure, the arbitrary reference line T is arranged to cross the center of the left end and the right end in the vertical direction, and can become the bending process described later (refer to Figure 4 (b) and (c)).

[0124] Reference Figure 4 (b) and (c) can be bent by a bending jig (not shown) so that the heat conducting plate 200 - 1 on the left side and the heat conducting plate 200 - 2 on the right side contact each other with respect to an arbitrary reference line T.

[0125] At this time, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 may be formed according to the embodiment, and the bonding process (S40) described later (refer to Figure 4 The plurality of strength reinforcement parts 240 required for (d)) may be formed so as to face each other and be in surface contact with each other.

[0126] Reference Figure 4 (d) If the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side of the heat conducting plate bodies 200-1 and 200-2 are in surface contact with each other, they are joined to each other along their edge ends using a predetermined joining method, and then each of the multiple strength reinforcing parts 240 in surface contact with each other can be joined to each other using a predetermined joining method.

[0127] At this time, one end and the other end of the first refrigerant flow path 210 formed by the bending process ( S20 ) can form the refrigerant flow space 205 in communication with the outside, and the remaining portion (heat dissipation plate portion 203 ) can be sealed and combined to completely block the refrigerant flow space from the outside.

[0128] In more detail, Figure 5 As shown, according to one embodiment of the present invention, the heat dissipation mechanism 200 is based on an arbitrary reference line T defined as a straight line in the vertical direction. The heat conducting plate bodies 200-1 and 200-2 may include: a side heat conducting plate 200-1, which forms the left end portion before the bending process (S20); and a side heat conducting plate 200-2, which forms the right end portion before the bending process (S20). Here, the side heat conducting plate 200-1 and the side heat conducting plate 200-2 may be understood as defining the heat conducting plate bodies 200-1 and 200-2 before the bending process (S20).

[0129] However, the heat conducting plate bodies 200 - 1 and 200 - 2 may be redefined as a configuration after a bending process ( S20 ) described later.

[0130] For example, the heat conducting plate bodies 200-1 and 200-2, which are formed by the bending process (S20) and the bonding process (S40) described later, may include: a press-fit end portion 201 and a middle portion formed on the back side of the heat dissipation housing body 110 as a heat dissipation target (see Figure 2a The press-in portion 150 is press-in combined with the center being inclined upward to the left and right sides respectively (as shown in the figure mark 170); and the heat dissipation plate portion 203, which performs heat dissipation according to the phase change of the refrigerant through the edge ends of the heat conduction plate bodies 200-1 and 200-2 except the press-in end 201.

[0131] However, the heat dissipation plate portion 203 is preferably defined as all regions that perform heat dissipation after exchanging heat with the refrigerant filled therein, as a portion other than the above-mentioned press-fit end portion 201 .

[0132] Here, the heat dissipation plate portion 203 may be formed with a plurality of strength reinforcements 240 protruding from the inner surfaces of the one heat conducting plate 200 - 1 and the other heat conducting plate 200 - 2 separated in the thickness direction toward the refrigerant flow space 205 .

[0133] Furthermore, as described below, a plurality of strength reinforcement portions 240 are formed simultaneously with the second refrigerant flow path 220, the third refrigerant flow path 230 and the plurality of inclined guide members 215 through a stamping process, and after the bending process (S20) and the joining process (S40), when observed from the outside, it can be understood that they are formed by being recessed from the outside to the inside of the heat dissipation plate portion 203.

[0134] If the first refrigerant flow path 210 can be defined as a flow path that performs the following functions: located on the lower side with the direction of gravity as the reference, the refrigerant that is mainly phase-changed into liquid (liquid-phase refrigerant) in the refrigerant flow space 205 flows to the lower side along the direction of gravity and flows, then while capturing the liquid refrigerant, the liquid-phase refrigerant is evenly moved and dispersed in the entire evaporation area that is converted into a gas phase by the heat transferred from the heating element of the heat dissipation housing body 110.

[0135] In this case, the uniform movement and dispersion of the liquid-phase refrigerant in the first refrigerant flow path 210 may refer to the concept of transferring the liquid-phase refrigerant in at least a direction different from the direction of gravity through the absorber 300 described later. This will be described in more detail in the description of the absorber 300.

[0136] By inserting and disposing the absorber 300 described later in the first refrigerant flow path 210 , it is possible to promote the collection and dispersion of the liquid-phase refrigerant and the transfer of the liquid-phase refrigerant in a direction different from the direction of gravity.

[0137] Here, after the above-mentioned bending process ( S20 ), the first refrigerant flow paths 210 may be formed symmetrically with each other along the thickness direction of the refrigerant flow space 205 with reference to an arbitrary reference line T.

[0138] As mentioned above, Figure 5 and Figure 6 As shown, the heat conducting plate bodies 200-1 and 200-2 can be bent with an arbitrary reference line T as a reference at one side heat conducting plate 200-1 and the other side heat conducting plate 200-2, and a first refrigerant flow path 210 can be formed inside, and a press-in end portion 201 can be formed outside to be combined with a press-in portion 150 formed on the back side of the heat dissipation shell body 110 as a heat dissipation object.

[0139] Furthermore, as defined above, the heat conducting plate bodies 200 - 1 and 200 - 2 may further include a heat dissipation plate portion 203 , which is defined as the remaining portion except the press-fit end portion 201 .

[0140] After the bending process ( S20 ) of the heat dissipation plate portion 203 , the edges of the one side heat conduction plate 200 - 1 and the other side heat conduction plate 200 - 2 are joined to each other in a predetermined manner, thereby sealing the refrigerant flow space 205 .

[0141] The predetermined joining method may be welding or a bonding method. Laser welding is preferably used as the welding method. However, laser welding is not required; any joining method may be used as long as it provides a sufficient sealing force to prevent leakage of the refrigerant filled therein.

[0142] In addition, if Figure 6 As shown, the end portion of the press-in end portion 201 that is inserted into the press-in portion 150 may be formed to have a semicircular arc-shaped cross section with a radius of R1.

[0143] The outer side surface of the press-fit end portion 201 formed in the above-described shape may be inserted and installed by press-fitting after the press-fit portion 150 is subjected to a thermal epoxy treatment.

[0144] Furthermore, when the press-in end portion 201 is inserted into the press-in portion 150 , at least a portion of the first refrigerant flow path 210 may flow into the inner side of the front end of the press-in portion 150 .

[0145] In addition, the second refrigerant flow path 220 can perform the following function: the refrigerant that changes phase into a gaseous state (gas-phase refrigerant) flows toward the heat dissipation plate portion 203 side and condenses into a liquid-phase refrigerant (liquid-phase refrigerant) again after heat exchange with the external air naturally flows toward the first refrigerant flow path 210 side.

[0146] In more detail, Figures 4 to 8 As shown, the second refrigerant flow path 220 is provided in the condensation area formed at a position other than the first refrigerant flow path 210, and can be defined as the space between the plurality of inclined guides 215 that guide the flow of the liquid refrigerant that changes from gas phase to liquid phase to the evaporation area.

[0147] Here, if Figure 5 As shown, the plurality of inclined guides 215 defining the second refrigerant flow path 220 may be provided in a form protruding from the inner side surfaces of the one side heat conducting plate 200 - 1 and the other side heat conducting plate 200 - 2 toward the refrigerant flow space 205 after the bending process ( S20 ) described later.

[0148] The plurality of inclined guide members 215 can be provided in a linear configuration that slopes downward in the direction of gravity toward the first refrigerant flow path 210. Therefore, liquid refrigerant condensed on the heat dissipation plate portion 203 side can naturally condense and flow between the plurality of downwardly inclined inclined guide members 215 toward the first refrigerant flow path 210. This minimizes the interval between the gas-liquid cycle period corresponding to the phase transition between the liquid refrigerant and the gaseous refrigerant, thereby increasing the phase transition rate.

[0149] Here, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 can arrange adjacent second refrigerant flow paths 220 or inclined guides 215 in parallel with each other. The liquid-phase refrigerant condensed in a wider condensation area than the evaporation area roughly defined as the first refrigerant flow path 210 is closely and evenly arranged in parallel in the second refrigerant flow paths 220, or the flow of the liquid-phase refrigerant can be dispersed by the inclined guides 215, thereby providing an advantage of heat dissipation with uniform heat dissipation performance throughout the entire condensation area.

[0150] Furthermore, a plurality of inclined guides 215 are respectively formed on one side heat conduction plate 200 - 1 and the other side heat conduction plate 200 - 2 , and the front ends thereof protruding toward the refrigerant flow space 205 can be formed to be separated from each other without being joined in the refrigerant flow space 205 .

[0151] As described above, since second refrigerant flow path 220 functions to guide the flow of liquid-phase refrigerant in the direction of gravity, second refrigerant flow path 220 preferably has a thickness dimension sufficient to naturally form a flow in the direction of gravity without being stopped by surface tension, an inherent characteristic of liquids. Furthermore, second refrigerant flow path 220 can be configured to suppress dispersed flow toward adjacent second refrigerant flow paths 220 due to surface tension or gravity after the liquid-phase refrigerant condenses to a predetermined size or greater.

[0152] At least one of one end and the other end of the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 is connected to the first refrigerant flow path 210 , and the end connected to the first refrigerant flow path 210 is relatively located on the lower side in the gravity direction.

[0153] Furthermore, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be formed such that at least one of one end and the other end is connected to the first refrigerant flow path 210 and the one end and the other end are connected in a straight line.

[0154] As described above, the distance between the first refrigerant flow path 210 (i.e., one end) that receives heat closest to the heating element and the outer end portion (i.e., the other end) of the plurality of second refrigerant flow paths 220 that actively condense through heat exchange with the external air is very short, and is formed into an optimal shape that can minimize the overlapping length (flow resistance length) of the liquid-phase refrigerant flow path and the gas-phase refrigerant flow path through the straight shape of the second refrigerant flow path 220 itself.

[0155] In addition, as described above, the plurality of inclined guide members 215 may be defined such that the second refrigerant flow paths 220 between the respective inclined guide members 215 serve as flow paths for guiding the flow of the liquid-phase refrigerant in the gravity direction.

[0156] Here, the second refrigerant flow path 220, defined as the gap space between the plurality of inclined guide members 215, may be a refrigerant flow path that extends upwardly and obliquely toward the widthwise end portions of the heat transfer plate bodies 200-1 and 200-2 from the first refrigerant flow path 210 corresponding to the reference line T. This is to facilitate the movement of liquid-phase refrigerant liquefied on the heat dissipation plate portion 203 side toward the first refrigerant flow path 210 having the absorber 300 due to its own weight.

[0157] In addition, if Figures 5 to 8 As shown, the heat dissipation mechanism 200 according to an embodiment of the present invention may further include a third refrigerant flow path 230 .

[0158] Here, after the bending process and the joining process are completed, the heat conducting plate bodies 200-1 and 200-2 are joined together with a portion of a surface of the heat conducting plate 200-1 on one side and a portion of a surface of the heat conducting plate 200-2 on the other side to form a refrigerant flow space 205, and the refrigerant flow space 205 can form the first refrigerant flow path 210 and the second refrigerant flow path 220 together with the joining process (S40) as well as the third refrigerant flow path 230 added according to the embodiment.

[0159] The second refrigerant flow path 220 is formed on one side heat conduction plate 200-1 and the other side heat conduction plate 200-2, respectively, and contrary to being defined as being formed between multiple adjacent inclined guide members 215, the third refrigerant flow path 230 can be defined as the space between the inclined guide member 215 formed on one side heat conduction plate 200-1 and the inclined guide member 215 formed on the other side heat conduction plate 200-2.

[0160] The third refrigerant flow path 230 can function as a gas flow path, so that the refrigerant filled in the refrigerant flow space 205 can be easily diffused and flowed throughout the heat sink portion 203 after being transformed into a gas-phase refrigerant in the evaporation region of the first refrigerant flow path 210. The gas-phase refrigerant evaporated in the first refrigerant flow path 210, which is the evaporation region, moves toward the heat sink portion 203 and is smoothly and evenly dispersed through the third refrigerant flow path 230, thereby performing heat dissipation and condensation.

[0161] For example, while the liquid-phase refrigerant naturally flows through the space between the inclined guides 215 adjacent to the second refrigerant flow path 220 , the gas-phase refrigerant actively flows through the third refrigerant flow path 230 which is a space not occupied by the liquid-phase refrigerant.

[0162] However, this does not mean that the liquid-phase refrigerant is completely separated from the gas-phase refrigerant through the third refrigerant flow path 230 and is not occupied. Preferably, it should be understood that the gas-phase refrigerant flows more actively through the third refrigerant flow path 230 .

[0163] That is, the phase change of the refrigerant is not formed by a complete division between the liquid-phase refrigerant and the gas-phase refrigerant, so it is difficult to define accurately, but generally speaking, the second refrigerant flow path 220 is relatively large in the thickness direction, so it becomes the path where the liquid-phase refrigerant mainly flows, and the third refrigerant flow path 230 can be the path where the gas-phase refrigerant mainly flows.

[0164] In addition, if Figures 4 to 8 As shown, the heat dissipation mechanism 200 of an embodiment of the present invention may further include: a plurality of strength reinforcement portions 240, formed on at least one of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side, and protruding a predetermined length toward the refrigerant flow space 205 on the inner surfaces of the heat conducting plate 200-1 on one side and the heat conducting plate 200-2 on the other side and formed in a manner opposite to each other.

[0165] A plurality of strength reinforcement portions 240 are generally formed on at least one of the planar heat conducting plate 200 - 1 and the planar heat conducting plate 200 - 2 , and can enhance the strength to prevent sagging or pressing due to external pressure.

[0166] Here, at least after being bent according to the bending process ( S20 ), the front ends of the plurality of reinforcements 240 may be formed to protrude further toward the refrigerant flow space 205 than the front ends of the plurality of inclined guide members 215 . In this case, the front ends of the plurality of reinforcements 240 preferably protrude toward the refrigerant flow space 205 to such an extent that, at least during the bonding process ( S40 ) described later after the bending process ( S20 ), the facing portions of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 come into surface contact with each other, allowing them to be bonded together using a predetermined bonding method. However, the plurality of reinforcements 240 do not necessarily need to be in surface contact with each other after being bent; they may also be spaced apart within the refrigerant flow space 205 , as illustrated by the inclined guide members 215 .

[0167] In addition, the heat dissipation mechanism 200 according to an embodiment of the present invention may further include an absorber 300 that absorbs the liquid-phase refrigerant guided through the second refrigerant flow path 220 and evenly distributes the absorbed liquid-phase refrigerant to the first refrigerant flow path 210 .

[0168] Here, the absorber 300 is a concept including a wick member having a liquid wick structure provided inside a general vapor chamber, but is not limited to this. In the first refrigerant flow path 210 arranged obliquely with respect to the direction of gravity, the absorber 300 can capture and transfer liquid refrigerant in the upper and lower parts as a whole, thereby improving the limitations of the heat conduction material of the heat dissipation fins formed in the conventional general heat dissipation fin type and maximizing the heat dissipation performance. Such a concept can include all of these.

[0169] In addition, in the absorber 300, the closer to the pressing end 201 side, the easier it is for the heat transferred by the heating element to make the phase change of the liquid phase refrigerant to the gas phase refrigerant more active. Preferably, it is installed as close to the pressing end 201 side as possible.

[0170] However, the absorber 300 does not necessarily need to be provided only near the press-in end portion 201 , and may be provided evenly dispersed throughout the entire evaporation region where the refrigerant can evaporate.

[0171] However, in the case of the heat dissipation mechanism 200 according to an embodiment of the present invention, the heat conduction plate main bodies 200-1 and 200-2 equipped with a single component are bent, and the parts corresponding to the edge ends of the heat dissipation plate part 203 are joined to each other, and the absorber 300 is installed in the opening parts at both ends of the first refrigerant flow path 210 side. Due to manufacturing method reasons, the evaporation area of ​​the refrigerant can be limited to the first refrigerant flow path 210.

[0172] Here, the absorbent body 300 may include one of a non-woven fabric having a plurality of pores (a liquid-absorbing core structure) and a non-woven fabric combined with a braided body made of copper wire.

[0173] That is, the absorber 300 can be made of a non-woven fabric made of a fiber material. In this case, the non-woven fabric material itself is a very soft material, and when the liquid refrigerant is absorbed, it may be difficult to maintain its vertical shape due to the weight of the absorbed liquid refrigerant. Therefore, by including a braided structure made of copper wire in the non-woven fabric to maintain its shape, the non-woven fabric provided as the absorber 300 on the first refrigerant flow path 210 can be stably fixed to prevent it from flowing.

[0174] And, as Figure 5 As shown, the heat dissipation mechanism 200 according to an embodiment of the present invention includes: a plurality of absorber fixing guides 250, which can be formed together with the above-mentioned first refrigerant flow path 210 to the third refrigerant flow path 230 and a plurality of inclined guides 215 or a plurality of strength reinforcement parts 240 during the stamping process (S10).

[0175] If a non-woven fabric absorber 300 is used to absorb liquid refrigerant, there is a concern that the multiple absorber fixing guides 250 may droop in the direction of gravity. In order to prevent this, they are formed to protrude toward the refrigerant flow space 205 side. When the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 are bent through the bending process (S20), they can press the absorber 300 and stably fix the absorber 300.

[0176] Furthermore, the plurality of absorber fixing guides 250 press the outer side surface of the absorber 300 made of nonwoven fabric and also secure a space for the gaseous refrigerant (gas-phase refrigerant) evaporated in the first refrigerant flow path 210 to flow.

[0177] As described above, an absorber 300 is provided inside the first refrigerant flow path 210. After the liquid-phase refrigerant liquefied from the heat sink portion 203 side moves to a portion close to the heating element by the absorption force (or capillary force) of the absorber 300, the gas-phase refrigerant that changes phase by the heat transferred from the heating element can move to the heat sink portion 203 side again.

[0178] The gas-phase refrigerant moved to the side of the heat dissipation plate portion 203 is condensed while being smoothly and evenly dispersed to the entire heat dissipation plate portion 203 through the third refrigerant flow path 230 and performing heat dissipation. The condensed liquid-phase refrigerant can again easily move to the side of the first refrigerant flow path 210 as the direction of its own weight along the second refrigerant flow path 220 which is relatively larger in the thickness direction.

[0179] The heat generated from the heating element is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored in the first refrigerant flow path 210 side with the absorber 300 is in liquid state. After changing into gas state by the heat transferred from the heating element, it preferably flows to the heat dissipation plate portion 203 of the heat transfer plate body 200-1, 200-2 as a whole through the third refrigerant flow path 230 and performs heat dissipation.

[0180] In addition, recent antenna devices that apply Massive MIMO (Massive Multiple Input Multiple Output) technology are generally manufactured to be longer in the vertical length direction than in the width direction, and are manufactured to be as long as possible in the vertical length direction in order to use the minimum number of heat dissipation mechanisms 200 to cover the heat generated by multiple heating elements spaced apart in the vertical direction.

[0181] However, when the heat transfer plate bodies 1200-1 and 1200-2 are formed longer along one side (for example, in the direction of gravity), the length of the first refrigerant flow path 1210 in the direction of gravity can only be lengthened. It is difficult to draw out and disperse sufficient liquid-phase refrigerant from the lower side in the direction of gravity to the upper end portion using only the absorption capacity of the absorber 300 itself to absorb the liquid-phase refrigerant. Moreover, since the absorption rate of the liquid-phase refrigerant along the direction of gravity is different, the heat dissipation performance may also be uneven depending on the position.

[0182] In order to solve the unevenness of heat dissipation performance as described above, as described later Figure 11 As shown, the heat dissipation mechanism 200 according to an embodiment of the present invention may further include: an auxiliary absorber 301 arranged in a portion of the plurality of inclined guide members 215 forming the second refrigerant flow path 220 .

[0183] The auxiliary absorber 301 performs a function of easily guiding the liquid-phase refrigerant to be captured to the upper end portion side of the absorber 300 located on the upper side in the gravity direction among the absorbers 300 arranged longer in the longitudinal direction.

[0184] That is, Figure 11 As shown, the liquid refrigerant that condenses and falls from the heat sink portion 1203 located roughly on the upper side in the direction of gravity is captured and supplied to the upper end side of the absorber 300. By dispersing the liquid refrigerant from the position where the liquid refrigerant is supplied to the upper side in the direction of gravity and lifting it upward, it can supplement the heat dissipation performance of the existing absorber 300 where the absorption rate is low.

[0185] Furthermore, usually, as the high-temperature gas-phase refrigerant evaporated on the lower side in the direction of gravity moves concentratedly to the upper side in the refrigerant flow space, it may be difficult to eliminate the heat at the upper end portion in the refrigerant flow space due to the lack of more sufficient condensation space (condensation area), and the auxiliary absorber 301 performs the function of continuously supplying a portion of the liquid-phase refrigerant flowing from the upper side to the lower side of the refrigerant flow space to the first refrigerant flow path 1210 side corresponding to the upper end portion side of the absorber 300, thereby enabling overall uniform heat dissipation.

[0186] However, for ease of understanding, Figure 11 The auxiliary absorber 301 is shown as a single one. Of course, considering the length of the heat dissipation mechanism 200 according to an embodiment of the present invention, a plurality of auxiliary absorbers 301 may be provided at predetermined intervals in the upper and lower sides in the direction of gravity.

[0187] Figure 9 is a perspective view showing a heat dissipation mechanism according to another embodiment of the present invention. Figure 10 yes Figure 9 Exploded perspective diagram, Figure 11 yes Figure 9 A cutaway perspective view (a), a partially enlarged view (b), a cross-sectional view of the portion, and a partially enlarged view (c).

[0188] So far, reference Figure 1a and Figure 2a and Figures 4 to 8 , a detailed description is mainly given of an embodiment of manufacturing a single metal plate component (ie, a heat dissipation mechanism 200 according to an embodiment of the present invention) by forming a refrigerant flow space 205 through a bending process (S20) and a joining process (S40).

[0189] However, the manufacturing method of the heat dissipation mechanism of the present invention is not limited to the above bending process (S20). Figure 1b and Figure 2b and Figures 9 to 11 As shown, a heat dissipation mechanism 1200 according to another embodiment is proposed and described in which a refrigerant flow space 1205 including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 is formed by joining two separate metal plate members in a joint manner.

[0190] In the heat dissipation mechanism 1200 according to another embodiment of the present invention, Figures 9 to 11As shown, the heat conducting plate bodies 1200-1 and 1200-2 can be formed by joining two separate metal plate parts to form a refrigerant flow space 1205, and can include a heat conducting plate 1200-1 on one side forming one side in the thickness direction of the refrigerant flow space 1205 after joining and a heat conducting plate 1200-2 on the other side forming the other side in the thickness direction of the refrigerant flow space 1205 after joining.

[0191] Here, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 may be formed symmetrically with respect to the joint surface of the one side heat conduction plate 1200 - 1 and the other side heat conduction plate 1200 - 2 .

[0192] The bonding surface of the one side heat conducting plate 1200-1 and the other side heat conducting plate 1200-2 can be defined as an edge end portion including a press-fit end portion 1201 corresponding to the evaporation region and a heat dissipation plate portion 1203 corresponding to the condensation region as a bonding area.

[0193] That is, in the case of the heat dissipation mechanism 200 according to one embodiment of the present invention, the portion joined by the joining process (S40) described later is the edge end of the heat dissipation plate portion 203 other than the press-fit end 201 side of the portion formed by the bending process (S20). It should be noted that the joining portion is partially different from the heat dissipation mechanism 1200 according to another embodiment of the present invention in which two separate metal plate parts are joined and sealed.

[0194] In addition, if Figure 1b and Figure 2b As shown, the heat dissipation mechanism 1200 according to another embodiment of the present invention is provided on a press-fit portion 150 that is arranged vertically and vertically on the back side of the heat dissipation housing body 110. Therefore, the press-fit end portion 1201 corresponding to the front end portion and the outer end portion of the heat dissipation plate portion 1203 corresponding to the rear end portion can be parallel to each other.

[0195] And, as Figure 9 As shown, the heat dissipation mechanism 1200 according to another embodiment of the present invention may further include: an auxiliary absorber 301 for improving the absorption rate of the liquid-phase refrigerant by the absorber 300 .

[0196] Here, similar to the heat dissipation mechanism 200 according to one embodiment of the present invention as described above, the auxiliary absorber 301, in addition to performing the basic function of increasing the absorption rate of the absorber 300 itself, further, as shown in the heat dissipation mechanism 1200 according to another embodiment of the present invention, when the heat dissipation mechanism 1200 extends further upward than the upper end side of the heat dissipation shell body 110 to cover the upper end part of the heat dissipation shell body 110, the liquid-phase refrigerant condensed on the heat dissipation plate portion 1203 side corresponding to the upper side of the heat dissipation shell body 110 can be easily captured on the upper end side of the absorber 300 and absorbed.

[0197] Figure 12 1 is a perspective view and a partially enlarged view showing a vacuum portion in the structure of a heat dissipation mechanism according to an embodiment of the present invention. Figure 13 1 is a cross-sectional view showing a vacuum process using a vacuum portion in the structure of a heat dissipation mechanism according to an embodiment of the present invention. Figure 14 yes Figure 13 Partial cutaway perspective view.

[0198] like Figures 12 to 14 As shown, the heat dissipation mechanism 200, 1200 according to the embodiment of the present invention includes: a vacuum portion 2000, equipped with a ventilation hole 1200-3 formed on one side heat conduction plate 200-1, 1200-1 and one of the other side heat conduction plates 200-2, 1200-2, for forming a vacuum in the refrigerant flow space 205, 1205 before or after filling the refrigerant into the refrigerant flow space 205, 1205.

[0199] The vacuuming unit 2000 can be understood as an additional structure provided for the vacuuming process described later in which the air inside the heat transfer plate bodies 200-1, 200-2, 1200-1, 1200-2 forming the refrigerant flow spaces 205, 1205 is sucked for ventilation to adjust the internal pressure.

[0200] Here, the vacuum part 2000 may include: a ventilation tube 2100, which is clamped from the inside of the ventilation hole 1200-3 to the outside and protrudes outward by a predetermined length; and a welding auxiliary ring 2200, which is clamped on the outer peripheral surface of the ventilation tube 2100 for welding and fixing the ventilation tube 2100.

[0201] The ventilation tube 2100 is provided in a tube shape having a hollow portion, and is connected to a suction mechanism (not shown) to provide a passage function for ventilation through the hollow portion.

[0202] In addition, since the thickness of the heat conducting plates 200-1, 1200-1 on one side and the heat conducting plates 200-2, 1200-2 on the other side are very thin, it is difficult to directly weld the ventilation hole 1200-3 itself, thereby providing a soldering place for placing the shielding solder part 2300 described later.

[0203] On the contrary, when the thickness of the heat conducting plates 200-1, 1200-1 on one side and the heat conducting plates 200-2, 1200-2 on the other side is large, the thickness alone can fix the ventilation pipe 2100, and the welding auxiliary ring 2200 can be eliminated from the necessary structure.

[0204] However, according to the heat dissipation mechanism 200, 1200 of the embodiments of the present invention, the commonly used aluminum (Al) material can be removed from the material of the metal plate parts constituting the heat conducting plate main body 200-1, 200-2, 1200-1, 1200-2. As described above, when its thickness is limited to a stainless steel (SUS) material having an elongation that can be manufactured to be very thin, the welding auxiliary ring 2200 can have the significance of being a necessary component.

[0205] For reference, although aluminum is a metal material having an advantage of having very excellent thermal conductivity, there is a problem in that the refrigerant filling the refrigerant flow spaces 205 and 1205 is limited.

[0206] For example, when the heat conduction plate body is manufactured using a metal plate component made of aluminum, if water (including natural water, distilled water or ultrapure water) is used as a refrigerant to fill the refrigerant flow space 1205, there is a problem of causing a predetermined chemical reaction to generate hydrogen through contact with water.

[0207] Therefore, according to the embodiments of the present invention, the heat dissipation mechanism 200, 1200 uses a metal plate component made of SUS material that can use water as a refrigerant to manufacture the heat conducting plate body 200-1, 200-2, 1200-1, 1200-2. Therefore, in order to smoothly set up during the vacuum process (SA) through the above-mentioned ventilation pipe 2100, a welding auxiliary ring 2200 may be necessary.

[0208] Moreover, when the material of the heat conduction plate main body 200-1, 200-2, 1200-1, 1200-2 is limited to SUS, as described above, when the press-in end portion 201 is inserted into the press-in portion 150 formed on the back portion of the heat dissipation shell main body 110, it has the advantage of being able to be processed so that at least a portion of the first refrigerant flow path 210 can flow into the inner side of the front end of the press-in portion 150.

[0209] As described above, when the heat conducting plate main bodies 200-1, 200-2, 1200-1, 1200-2 are manufactured from SUS material, the elongation directly affected during processing is very good, and the first refrigerant flow paths 210, 1210 for capturing the refrigerant (liquid-phase refrigerant) that performs the actual heat conduction function are arranged as close to the heating element as possible. Even when the heat conducting plate main bodies 200-1, 200-2, 1200-1, 1200-2 are not manufactured from aluminum material with relatively excellent thermal conductivity, the heat dissipation performance has the advantage of fully overcoming the relative disadvantage of its thermal conductivity.

[0210] For reference, pure aluminum has an excellent elongation compared to SUS. However, when aluminum is manufactured in an alloy to ensure the strength of the material, the processability is reduced. SUS can be processed into a thickness thinner than when the heat conducting plate body 200-1, 200-2, 1200-1, 1200-2 is formed using aluminum alloy.

[0211] As described above, when the thin heat conducting plate bodies 200 - 1 , 200 - 2 , 1200 - 1 , and 1200 - 2 are made of SUS material, a welding assist ring 2200 is required as an essential structure for assisting the welding of the ventilation pipe 2100 .

[0212] Here, if Figure 13 and Figure 14 As shown, the ventilation pipe 2100 includes: a pipe body 2101, which has a hollow tube shape 2100S; and a snap-fit ​​step portion 2103, which is located in the refrigerant flow space 1205 in the pipe body 2101 and has an outer peripheral size that is snap-fitted with the edge of the ventilation hole 1200-3.

[0213] The ventilation pipe 2100 is generally longer than the thickness of the refrigerant flow space 1205. Therefore, before the bonding process (S40) described later, the heat conducting plate (equivalent to the heat conducting plate) having the ventilation holes 1200-3 is pre-formed. Figure 13 and Figure 14 The inner side of the heat conducting plate 200-1, 1200-1) on one side passes through the ventilation hole 1200-3 and protrudes outward by a predetermined length. The snap-fit ​​step portion 2103 can be set to be snapped onto the edge end of the ventilation hole 1200-3 at a position corresponding to the inner side of the refrigerant flow space 1205.

[0214] After that, after the welding auxiliary ring 2200 is interposed on the outer peripheral surface of the pipe body 2101 protruding outside the ventilation hole 1200 - 3 , a ventilation process (SA- 20 ) of the pipe body 2101 using the ventilation pipe 2100 may be performed using a suction mechanism.

[0215] In particular, Figure 13 and Figure 14As shown, the welding auxiliary ring 2200 can be closely fixed to the outer side surface of one of the heat conducting plates 200 - 1 , 1200 - 1 on one side and the heat conducting plates 200 - 2 , 1200 - 2 on the other side where the ventilation hole 1200 - 3 is formed.

[0216] In addition, if Figure 13 (b) and Figure 14 As shown in (b), the vacuum portion 2000 may further include a shielding solder portion 2300 that is welded to shield the hollow space 2100S of the tube body 2101 after the tube body 2101 is cut to match the outer end of the welding auxiliary ring 2200 .

[0217] Here, the shield solder portion 2300 is preferably welded so as to completely cover the outer end of the welding auxiliary ring 2200 and the hollow space 2100S of the tube body 2101. This is to prevent the ventilation tube 2100 from separating and detaching from the ventilation hole 1200-3 after installation.

[0218] Figure 15 It is a perspective view and a partially enlarged cross-sectional view showing another embodiment of the structure of the heat dissipation mechanism according to the present invention, showing a vacuum portion.

[0219] Reference Figures 12 to 14 The described vacuum part 2000 is pre-arranged to penetrate the ventilation hole 1200-3 into the inner side of the heat conducting plate 200-1 and 1200-1 on which the ventilation hole 1200-3 is formed before the joining process and protrude outward by a predetermined length, and the snap-fit ​​step part 2103 is set to snap-fit ​​to the edge end of the ventilation hole 1200-3 at a position corresponding to the inner side of the refrigerant flow space 1205.

[0220] This is to increase the fixing force by the welding caulking process (SA-40) described later by additionally sandwiching the welding auxiliary ring 2200 on the ventilation pipe 2100, but the welding auxiliary ring 2200 as described above is not necessarily provided.

[0221] That is, Figure 15 As shown, the vacuum portion 2000 may be configured such that the welding reinforcement portion 2103 ′ corresponding to the welding auxiliary ring 2200 is integrally formed with the tube body 2101 , and the coupling directions thereof are different.

[0222] In more detail, Figure 15 As shown, the vacuum part 2000 may include: a ventilation tube 2100, which is clamped from the outside of the ventilation hole 1200-3 toward the inside and protrudes outward by a predetermined length, wherein the ventilation tube 2100 may include: a tube body 2101, which has a hollow tube shape; and a welding reinforcement part 2103', which is protruded in a manner that the outer diameter is relatively larger than the tube body 2101 and is formed as a whole.

[0223] Here, the outer diameter of the welding reinforcement part 2103' is relatively larger than the outer diameter of the pipe body 2101, and thus, when the pipe body 2101 is disposed in the inner side direction from the outer side through the vent hole 1200-3, it can be engaged with the outer side edge portion of the vent hole 1200-3.

[0224] At this time, a space for welding of the fixing solder part 2301 to be described later can be formed between the welding reinforcement part 2103' and a portion of the outer side edge of the vent hole 1200-3. For this reason, a tapered portion 2104 inclined can be formed in the portion of the welding reinforcement part 2103' adjacent to the vent hole 1200-3 to form a space capable of applying a soldering material between the outer side edge portions of the vent hole 1200-3.

[0225] That is, as shown in FIG. 10, Figure 15 the vacuumization part 2000 can include a shielding solder part 2300 welded by a soldering material after the pipe body 2101 is cut in a manner matching the outer side end of the welding reinforcement part 2103' to shield the hollow of the pipe body 2101, and a fixing solder part 2301 welded by a soldering material to fix between the welding reinforcement part 2103' and the outer side edge portion of the vent hole 1200-3.

[0226] According to the vacuumization part 2000 of the modified example as described above, even after the joining process of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2, it can be disposed from the outer side, and thus, the disposition process can be simplified, and has the advantage that it can be stably fixed by the shielding solder part 2300 and the fixing solder part 2301.

[0227] However, the vacuumization part 2000 according to the modified example can also be formed in any manner, and even after being fixed in the vent hole 1200-3 formed in one of the one side heat conducting plate 1200-1 and the other side heat conducting plate 1200-2 through the solder fixing process (SA-30), the engagement end 2105 can be formed to prevent arbitrary detachment (separation) to the outer side.

[0228] The engagement end 2105 of the vacuumization part 2000 according to the modified example not only functions to prevent arbitrary detachment to the outer side, but also functions to further increase the joining area when the soldering material forming the fixing solder part 2301 is melted, and thus, the soldering material is melted between the welding reinforcement part 2103' and the vent hole 1200-3, thereby also performing a function to strengthen rigidity.

[0229] Figure 16 is a flowchart for explaining a manufacturing method of a heat dissipation mechanism according to an embodiment of the present application, Figure 17 is a flowchart showing a detailed process of a vacuumization process (SA) of Figure 16 , and Figure 18It shows Figure 16 Flowchart of the detailed process of the remaining process (SB).

[0230] The manufacturing method of the heat dissipation mechanism according to the embodiment of the present invention sequentially includes a stamping process ( S10 ), a bonding process ( S40 ), and a refrigerant filling process ( S50 ).

[0231] First, a main description of the heat dissipation mechanism 200 according to an embodiment of the present invention further including a bending process ( S20 ) is as follows.

[0232] According to an embodiment of the present invention, the manufacturing method of the heat dissipation mechanism 200 includes: a stamping process (S10) of pressing the heat conducting plate bodies 200-1 and 200-2 made of a thermally conductive material as a single component, thereby processing the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 to be recessed to a predetermined depth.

[0233] like Figure 4 As shown, the stamping process (S10) can be defined as a process of manufacturing single heat conducting plate bodies 200-1 and 200-2 having the same specifications and specifications in a manner such that the first to third refrigerant flow paths 210 to 230 and the plurality of strength reinforcement portions 240 are symmetrically formed while being bent relative to each other.

[0234] In addition, according to an embodiment of the present invention, the manufacturing method of the heat dissipation mechanism 200 may include: a bending process (S20), after the stamping process (S10), with the reference line T based on the first refrigerant flow path 210 as the reference, using a bending fixture not shown to fold the one side heat conduction plate 200-1 on one side in the width direction and the other side heat conduction plate 200-2 on the other side in the width direction; and a joining process (S40), after the bending process (S20), the edge ends corresponding to the heat dissipation plate portions 203 of the one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 and the second refrigerant flow path 220 and the multiple strength reinforcement portions 240 formed on the third refrigerant flow path 230 are joined to each other.

[0235] In addition, the manufacturing method of the heat dissipation mechanism 200 according to the embodiment of the present invention may also include: an absorber setting process (S30), before the joining process (S40), an absorber 300 that forms the capillary force of the liquid-phase refrigerant is set at a position corresponding to the first refrigerant flow path 210 near the press-in end 201.

[0236] Here, the absorber setting process ( S30 ) is a process performed during the bending process ( S20 ), and may be defined as a process of inserting and setting the absorber 300 in the partially formed first refrigerant flow path 210 before the bending process ( S20 ) is completed.

[0237] That is, the absorber 300 is additionally provided in a manner of being disposed at a portion corresponding to the first refrigerant flow path 210 before the one-side heat conducting plate 200-1 and the other-side heat conducting plate 200-2 are bent in a manner of being completely in contact with each other with the arbitrary reference line T as a reference by the bending process (S20), and can be stably fixed to a portion corresponding to the first refrigerant flow path 210 by completing the bending process (S20) and being fixed by the plurality of absorber fixing guides 250.

[0238] Thereafter, when the one-side heat conducting plate 200-1 and the other-side heat conducting plate 200-2 are joined along the edge end portions thereof by the joining process (S40) as described above, the length direction both ends of one end and the other end corresponding to the press-fitting end portions 201 constituting the first refrigerant flow path 210 are in an open state, one of the both ends of the opening is caulked for a subsequent vacuumization process (SA) to be described later, and after the refrigerant is filled by the refrigerant filling process (S50) to be described later, a welding caulking process (SA-40) can be performed as a detailed process of the vacuumization process (SA) to be described later, to shield the other of the both ends of the opening which is not caulked by the caulking operation, thereby preventing refrigerant leakage from the inside.

[0239] Further, the manufacturing method of the heat dissipation mechanism 200 according to the embodiment of the present application can further include a refrigerant filling process (S50) of filling refrigerant through one of the length direction one-side end or the other-side end of the first refrigerant flow path 210 (i.e., one of the both ends of the opening) after the joining process (S40), and a heat dissipation mechanism fastening process (S60) of being provided in the press-fitting manner to the press-fitting portion 150 of the heat dissipation housing main body 110 after the refrigerant filling process (S50).

[0240] The refrigerant filling process (S50) can be implemented through one of the opening portions formed at the length direction one-side end and the other-side end (i.e., both end portions) of the first refrigerant flow path 210, and completely sealed by the welding caulking process (SA-40) to be described later after the refrigerant is filled, thereby being capable of preventing refrigerant leakage.

[0241] In addition, although not shown in the drawings, the method of the heat dissipation mechanism 1200 according to another embodiment of the present application can be different from the manufacturing method of the heat dissipation mechanism 200 according to an embodiment of the present application including the above-described bending process (S20) and the like as follows.

[0242] That is, according to another embodiment of the present invention, the manufacturing method of the heat dissipation mechanism 1200 may include: a stamping process (S10), in which two separate metal plate components are crimped together respectively, thereby forming a refrigerant flow space including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 at a predetermined depth; a joining process (S40), after the stamping process (S10), joining the edge ends of the heat conducting plate main body 1200-1 and 1200-2 equipped with two separate metal plate components, thereby simultaneously forming a refrigerant flow space 1205 equivalent to the first refrigerant flow path 1210 and the second refrigerant flow path 1220; and a refrigerant filling process (S50), filling the refrigerant into the refrigerant flow space.

[0243] According to an embodiment of the present invention, a manufacturing method of the heat dissipation mechanism 200 utilizes a single metal plate component to perform a stamping process (S10), thereby forming a refrigerant flow space 205 including a first refrigerant flow path 210 and a second refrigerant flow path 220, and forming an edge end portion other than the side portion of the press-fit end portion 201 through a bending process (S20), and manufacturing the heat dissipation mechanism 200 in a state capable of being joined by a subsequent joining process (S40).

[0244] In contrast, according to another embodiment of the present invention, a manufacturing method of the heat dissipation mechanism 1200 forms two separate metal plate components through a stamping process (S10) to form portions corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 together with the edge ends serving as their outer shapes. The two separate metal plate components can then be joined by directly joining the edge ends thereof using a joining process (S40).

[0245] Of course, in the manufacturing method of the heat dissipation mechanism 1200 according to another embodiment of the present invention, it is obvious that the absorber setting process ( S30 ) of setting the absorber 300 or the auxiliary absorber 301 may also be performed before the bonding process ( S40 ).

[0246] Furthermore, in the case where the heat dissipation mechanism 1200 according to another embodiment of the present invention includes a plurality of strength reinforcing parts 1240, the joining process (S40) should be interpreted as a concept including joining the edge ends of two separate metal plate parts in a predetermined manner while joining the plurality of strength reinforcing parts 1240 to each other.

[0247] However, according to another embodiment of the present invention, the manufacturing method of the heat dissipation mechanism 1200 may further include: a vacuuming process (SA), before the absorber setting process (S30), before the cleaning process (not shown) of cleaning the refrigerant flow space 105 and before the refrigerant filling process (S50) (SA-1) or after the refrigerant filling process (S50) (SA-2), the refrigerant flow space 205, 1205 is vacuumed by a vacuuming part 2000 equipped on one of the heat conducting plates 200-1, 1200-1 on one side and the heat conducting plates 200-2, 1200-2 on the other side.

[0248] Here, the cleaning process can be achieved by immersing the heat dissipation mechanism 200, 200A, 200B according to an embodiment of the present invention in a sedimentation tank, an ultrasonic tank, a rinsing tank, and a vapor degreasing tank in sequence, and can be defined as a process of finally drying to remove moisture.

[0249] The vacuum process (SA) is a process that typically vacuums the interior of a vacuum-operated device by suction, then fills it with refrigerant. The refrigerant is then heated and evaporated before being vacuumed again (heating vacuum process), or after filling with refrigerant, the refrigerant is temporarily frozen (solidified) and then vacuumed again (freezing vacuum process).

[0250] For reference, in the former method, the vacuuming process of filling (injecting) the refrigerant after vacuuming, the vacuum degree changes when filling (injecting) the refrigerant. If a high vacuum is first formed and then the refrigerant is filled, a low vacuum state is achieved. As an inexpensive process method, it is mainly suitable for mass production and the manufacture of low-priced products where price takes precedence over quality.

[0251] Furthermore, the latter method involves filling (injecting) liquid refrigerant and performing a vacuum process after the liquid refrigerant is frozen. Specifically, after the first vacuum is performed, the liquid refrigerant is filled and frozen, and then a second vacuum is performed. Although the latter method involves a more complicated process than the former method, it has the advantages of fast reaction speed, minimizing NCG, and improving Qmax of high vacuum products. In addition, the freezing process of the liquid refrigerant can reduce the capacity of the vacuum equipment and increase the vacuum exhaust speed, making it mainly suitable for small-scale production and the manufacture of high-priced products.

[0252] Although there are differences in the specific vacuuming method as described above, the vacuuming process (SA) can include a vacuuming portion setting process (SA-10) in which the vacuuming portion 2000 is set in the vent hole 1200-3, a venting process (SA-20) in which the refrigerant flow space 205, 1205 is vacuumed using the vent pipe 2100 set in the vent hole 1200-3, and a caulking process (SA-40) in which a portion of the vent pipe 2100 is cut after the venting process (SA-20) and then the hollow 2100S of the vent pipe 2100 is welded.

[0253] Here, in the vacuuming portion setting process (SA-10), before the joining process (S40), the vent pipe 2100 is clamped to the inner side edge end of the vent hole 1200-3 and set to protrude outward by a predetermined length, and the welding auxiliary ring 2200 is sandwiched to the outer peripheral surface of the vent pipe 2100 protruding outward of the vent hole 1200-3.

[0254] In addition, the vacuuming process (SA) can further include a venting process (SA-20) in which the refrigerant flow space 205 is vacuumed using the vent pipe 2100 set in the vent hole 1200-3, and a caulking process (SA-40) in which the hollow of the vent pipe 2100 is welded after cutting a portion of the vent pipe 2100 after the venting process (SA-20).

[0255] However, the vacuuming process (SA) as described above is explained as a process using the vacuuming portion 2000 (i.e., the vent pipe represented by reference numeral "2100") as illustrated in FIG. 10, and the vacuuming portion 2000 (i.e., the vent pipe represented by reference numeral "2100") according to the modified example as illustrated in FIG. 11 should be understood as different processes as follows. Figures 11 to 13 Figure 14

[0256] More specifically, after the joining process (S40), the vent pipe 2100 is set from the outside to the inner side direction in a manner of being clamped to the outer side edge end of the vent hole 1200-3, which can be explained as a process in which the vent pipe 2100 is clamped to the outer peripheral surface of the vent hole 1200-3. This is because the pipe body 2101 of the vent pipe 2100 can be set from the outside of the one side heat conduction plate 200-1, 1200-1 with respect to the vent hole 1200-3.

[0257] ​​In addition, the vacuuming process (SA) of the vacuuming portion 2000 according to the modified example may include: a ventilation process (SA-20), in which the refrigerant flow space 205 is vacuumed using the ventilation pipe 2100 provided in the ventilation hole 1200-3; a solder fixing process (SA-30), in which, after the ventilation process (SA-20), the welding reinforcement portion 2103' integrally formed in the ventilation pipe 2100 is welded to the outer peripheral surface of the ventilation hole 1200-3 by a soldering material; and a welding caulking process (SA-40), in which, after the ventilation process (SA-20), a portion of the ventilation pipe 2100 is cut and then the hollow of the ventilation pipe 2100 is welded.

[0258] Moreover, the manufacturing method of the heat dissipation mechanism 200, 1200 according to the embodiment of the present invention may further include at least one of the following processes: a leakage test process (S70), which is used to test whether the refrigerant is leaking after the welding filling process (SA-40) of the vacuum process (SA); a performance inspection process (S80), which finally tests the performance of the heat dissipation mechanism 200, 1200 of the present invention; and a reliability test process (S90), which tests the reliability of the heat dissipation mechanism 200, 1200 of the present invention.

[0259] In addition, although not shown, the manufacturing method of the heat dissipation mechanism according to the embodiment of the present invention may also include: a coating process (not shown), forming a hydrophobic coating material on a surface of the heat conducting plate body 200-1, 200-2, 1200-1, 1200-2 of the refrigerant flow space 205, 1205 where the refrigerant filled by the refrigerant filling process (S50) flows before the bending process (S20) (or the absorber setting process (S30)).

[0260] Here, the description is limited to a hydrophobic coating material as the coating layer, but a hydrophilic coating material may be used depending on the type of refrigerant or the refrigerant flow path.

[0261] According to the heat dissipation mechanism 200, 1200 of the embodiment of the present invention having the above-mentioned structure, heat transfer and heat dissipation are achieved by actively changing the phase of the refrigerant filled inside. Since it can overcome the material limitations of the existing heat dissipation fins themselves and achieve higher heat dissipation performance, it has the advantage of significantly improving the performance of the antenna device 100 or similar electronic equipment.

[0262] Furthermore, when performing the vacuuming process (SA) for adjusting the internal pressure of the refrigerant flow space 205 or 1205, the vacuuming portion 2000 is provided only on one of the heat transfer plates 200-1 or 1200-1 on one side and the heat transfer plates 200-2 or 1200-2 on the other side. This can also provide the following advantage: a high-quality product can be produced without worrying about refrigerant leakage.

[0263] The above describes in detail embodiments of the heat dissipation mechanisms 200 and 1200 and their manufacturing methods according to the present invention with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the above-described embodiment. Persons skilled in the art of the present invention are naturally capable of implementing various modifications within the scope of equivalents. Therefore, the true scope of the present invention should be determined by the claims.

Claims

1. A heat dissipation mechanism, characterized in that: include: The heat conducting plate body has a refrigerant flow space of predetermined thickness formed inside to release heat through one surface and the other surface. Wherein, the heat conducting plate body comprises: The vacuuming portion is provided to communicate with the refrigerant flow space vertically relative to one of the one surface and the other surface, and is used to vacuum the refrigerant flow space before or after the refrigerant is filled into the refrigerant flow space.

2. The heat dissipation mechanism according to claim 1, characterized in that: The refrigerant flow space of the heat-conducting plate body is a space between the heat-conducting plate on one side forming the one surface and the heat-conducting plate on the other side forming the other surface, and is formed as a closed empty space for gas-liquid circulation, so that the refrigerant is filled and releases heat while undergoing phase change. The vacuum portion is provided in a ventilation hole formed in one of the one heat transfer plate and the other heat transfer plate.

3. The heat dissipation mechanism according to claim 2, characterized in that: The vacuum unit includes: a ventilation pipe, which is engaged from the inner side of the ventilation hole toward the outer side and protrudes outward by a predetermined length; and The welding auxiliary ring is interposed on the outer peripheral surface of the ventilation pipe for welding and fixing the ventilation pipe.

4. The heat dissipation mechanism according to claim 3, characterized in that: The ventilation pipe comprises: a tube body having a hollow tube shape; and The engaging step portion is located in the refrigerant flow space in the tube body and has an outer diameter larger than an outer circumference of the tube body.

5. The heat dissipation mechanism according to claim 4, characterized in that: The outer diameter of the engaging step portion is formed to be large enough to engage with an edge portion of an inner side surface of the ventilation hole.

6. The heat dissipation mechanism according to claim 4, characterized in that: The welding auxiliary ring is tightly fixed to the outer side edge of one of the heat conducting plate on one side and the heat conducting plate on the other side where the ventilation holes are formed.

7. The heat dissipation mechanism according to claim 4, characterized in that: The vacuum unit further includes: The solder portion is shielded so that the pipe body is fixed to the ventilation hole by welding.

8. The heat dissipation mechanism according to claim 7, characterized in that: The shielding solder portion is a welding material that is welded after the pipe main body is cut to match the outer side end of the welding auxiliary ring to shield the hollow of the pipe main body.

9. The heat dissipation mechanism according to claim 7, characterized in that: The shield solder portion is a filler material that is welded so as to entirely cover the outer end of the welding auxiliary ring and the hollow portion of the pipe body that is cut to match the outer end of the welding auxiliary ring.

10. The heat dissipation mechanism according to claim 2, characterized in that: The vacuum unit includes: The ventilation pipe is clamped from the outside of the ventilation hole to the inside and protrudes outward by a predetermined length. Wherein, the ventilation pipe comprises: a tube body having a hollow tube shape; and The welding reinforcement part is formed as a whole with the pipe main body and is clamped to the edge of the outer side of the ventilation hole.

11. The heat dissipation mechanism according to claim 10, characterized in that: An inclined tapered portion is formed at a portion of the welding reinforcement portion adjacent to the ventilation hole to form a space for applying a welding repair material between the portion and an outer side edge portion of the ventilation hole.

12. The heat dissipation mechanism according to claim 10, characterized in that: When the pipe body is arranged from the outside to the inside through the ventilation hole, the welding reinforcement portion has an outer diameter that is engaged with an edge portion of an outer side surface of the ventilation hole.

13. The heat dissipation mechanism according to claim 11, characterized in that: The vacuum unit includes: a shielding solder portion, which is welded with a welding material after the pipe main body is cut in a manner matching the outer end of the welding reinforcement portion, so as to shield the hollowness of the pipe main body; and The fixed solder portion is welded by a soldering material to fix the welding reinforcement portion and the outer side edge of the ventilation hole.

14. The heat dissipation mechanism according to claim 13, characterized in that: The fixed solder portion is formed by applying a soldering material between the tapered portions of the solder reinforcement portion.

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