Heat dissipation assembly and integrated power amplifier

Abstract

The utility model provides a heat dissipation assembly and an integrated power amplifier, and relates to the technical field of integrated power amplifiers, the heat dissipation assembly comprises a protective shell, the bottom of the protective shell is fixedly provided with a bottom frame, the two sides of the bottom frame are both fixedly provided with insertion plates, and the bottom of the bottom frame is provided with a supporting protection mechanism; the supporting and protecting mechanism comprises two supporting frames, inserting openings are formed in the two supporting frames, and the inner walls of the inserting openings are connected with inserting plates in an inserted mode. According to the power amplifier, the bottom frame and the supporting and protecting mechanism are arranged, and the bottom frame and the supporting and protecting mechanism are matched with each other to support the protecting shell, so that the space between the bottom of the protecting shell and a supporting plane is effectively enlarged, more channels are provided for air circulation, natural convection and loss of heat are promoted, and the temperature of the power amplifier during working is remarkably reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated power amplifiers, and in particular to a heat dissipation component and an integrated power amplifier. Background Art

[0002] In the field of electronic equipment, integrated power amplifiers (IPA) are key components in audio systems, and their performance stability and service life depend heavily on effective heat dissipation design. Traditional IPA are typically placed directly on a supporting surface (such as a desktop). Due to their compact design, the gap between their base and the supporting surface is often limited. This compact layout restricts natural air convection, making it difficult to effectively dissipate heat, which in turn causes the internal temperature of the IPA to rise. This not only affects power output stability and sound quality, but can also accelerate the aging of electronic components, shortening the service life of the device. Therefore, we have addressed this issue by proposing a heat dissipation component and an IPA. Summary of the Invention

[0003] The purpose of the present invention is to address the problem that the gap between the bottom of the existing integrated power amplifier and the supporting plane is limited, which restricts the natural convection of air and makes it difficult to effectively dissipate heat.

[0004] In order to achieve the above-mentioned purpose of the invention, the present invention provides a heat dissipation component and an integrated power amplifier to improve the above-mentioned problem.

[0005] The specific application is as follows:

[0006] A heat dissipation component includes a protective shell, a bottom frame is fixedly installed at the bottom of the protective shell, plug-in boards are fixedly installed on both sides of the bottom frame, a supporting and protective mechanism is provided at the bottom of the bottom frame, and the supporting and protective mechanism includes two supporting frames, both of which are provided with sockets, and the inner walls of the sockets are connected to the plug-in boards.

[0007] As a preferred technical solution of the present application, a connecting piece is provided between the two support frames.

[0008] As a preferred technical solution of the present application, the connecting member includes a cavity opened in one of the support frames, a T-shaped rod is inserted into the cavity, and one end of the T-shaped rod passes through the cavity and is fixedly connected to the other support frame.

[0009] As a preferred technical solution of the present application, the outer surface of the T-shaped rod is sleeved with a spring located in the cavity, and the two ends of the spring are fixedly connected to the cavity and the T-shaped rod respectively.

[0010] As a preferred technical solution of the present application, both support frames are provided with openings, and protective nets are fixedly installed in both openings.

[0011] As a preferred technical solution of the present application, a heat dissipation element is provided on the protective shell.

[0012] As a preferred technical solution of the present application, the heat sink includes two groups of heat dissipation ports, and the two groups of heat dissipation ports are respectively opened at the top and bottom of the protective shell.

[0013] As a preferred technical solution of the present application, the heat sink further includes two heat sink fins, and the two heat sink fins are both installed on the side of the protective shell.

[0014] An integrated power amplifier includes a heat dissipation component, a control mainboard is arranged in the protective shell, and an interface module and a control panel are respectively arranged at both ends of the protective shell, and the interface module and the control panel are both connected to the control mainboard.

[0015] As a preferred technical solution of the present application, blocks are fixedly installed on both sides of the protective shell.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] In the scheme of this application:

[0018] In order to solve the problem in the prior art that the gap between the bottom of the integrated power amplifier and the supporting plane is limited, which restricts the natural convection of air and makes it difficult to effectively dissipate heat, the present application provides a bottom frame and a supporting protection mechanism, and the bottom frame and the supporting protection mechanism cooperate with each other to support the protective shell, thereby effectively increasing the space between the bottom of the protective shell and the supporting plane, providing more channels for air circulation, promoting natural convection and dissipation of heat, and significantly reducing the temperature of the power amplifier during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of the heat dissipation component and integrated power amplifier provided in this application;

[0020] Figure 2 A schematic diagram of the three-dimensional structure of the heat dissipation component and integrated power amplifier provided in this application from another perspective;

[0021] Figure 3 A schematic diagram of the structure of the socket provided for this application;

[0022] Figure 4 A bottom-up structural diagram of the heat dissipation assembly and integrated power amplifier provided in this application;

[0023] Figure 5 A schematic diagram of the structure of the chamber provided for this application;

[0024] Figure 6Schematic diagram of the structure of the heat dissipation assembly and integrated power amplifier provided in this application during transportation.

[0025] Indicated in the figure:

[0026] 1. Protective shell; 101. Heat dissipation vent; 102. Heat dissipation fins;

[0027] 2. Bottom frame; 201. Insert board;

[0028] 3. Support and protection mechanism; 301. Support frame; 302. Opening; 303. Protection net; 304. Socket; 305. Chamber; 306. T-bar; 307. Spring;

[0029] 4. Stopper;

[0030] 5. Interface module;

[0031] 6. Control panel. DETAILED DESCRIPTION

[0032] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0033] As described in the background technology, traditional integrated power amplifiers are usually placed directly on a supporting surface (such as a desktop, etc.). Due to their compact design, the gap between their bottom and the supporting surface is often limited. This compact layout restricts the natural convection of air, making it difficult to effectively dissipate heat, which in turn causes the internal temperature of the power amplifier to rise, affecting not only the stability of the power output and the sound quality, but also possibly accelerating the aging of electronic components and shortening the service life of the equipment.

[0034] In order to solve this technical problem, the utility model provides a heat dissipation component and an integrated power amplifier.

[0035] Specifically, please refer to Figure 1-Figure 5 , the heat dissipation components and integrated power amplifier specifically include:

[0036] The protective shell 1 has a bottom frame 2 fixedly installed at the bottom of the protective shell 1, and plug-in boards 201 are fixedly installed on both sides of the bottom frame 2. A supporting and protective mechanism 3 is provided at the bottom of the bottom frame 2, and the supporting and protective mechanism 3 includes two supporting frames 301. Both supporting frames 301 are provided with sockets 304, and the inner walls of the sockets 304 are connected to the plug-in boards 201.

[0037] The heat dissipation component and integrated power amplifier provided by the present invention support the protective shell 1 by providing a bottom frame 2 and a supporting protection mechanism 3. The bottom frame 2 and the supporting protection mechanism 3 cooperate with each other to support the protective shell 1, effectively increasing the space between the bottom of the protective shell 1 and the supporting plane, providing more channels for air circulation, promoting natural convection and dissipation of heat, and significantly reducing the temperature of the power amplifier during operation.

[0038] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0039] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein can be combined with each other.

[0040] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0041] Example 1, please refer to Figure 1-Figure 5 A heat dissipation component includes a protective shell 1, a bottom frame 2 is fixedly installed at the bottom of the protective shell 1, and plug-in boards 201 are fixedly installed on both sides of the bottom frame 2. A supporting protection mechanism 3 is provided at the bottom of the bottom frame 2, and the supporting protection mechanism 3 includes two supporting frames 301. The two supporting frames 301 are each provided with a socket 304, and the inner wall of the socket 304 is plugged into the plug-in board 201; the present application supports the protective shell 1 through the provision of the bottom frame 2 and the supporting protection mechanism 3, and the bottom frame 2 and the supporting protection mechanism 3 cooperate with each other, thereby effectively increasing the space between the bottom of the protective shell 1 and the supporting plane, providing more channels for air circulation, promoting natural convection and dissipation of heat, and significantly reducing the temperature of the power amplifier during operation.

[0042] Furthermore, a connecting piece is provided between the two support frames 301 .

[0043] Further, such as Figure 5 As shown, the connecting member includes a chamber 305 opened in one of the support frames 301, a T-shaped rod 306 is inserted into the chamber 305, one end of the T-shaped rod 306 passes through the chamber 305 and is fixedly connected to the other support frame 301, and the connection between the two support frames 301 can be achieved through the mutual cooperation between the chamber 305 and the T-shaped rod 306.

[0044] Further, such as Figure 5As shown, the outer surface of the T-shaped rod 306 is sleeved with a spring 307 located in the cavity 305, both ends of the spring 307 are fixedly connected with the cavity 305 and the T-shaped rod 306 respectively, and the spring 307 is arranged to enable the two support frames 301 to approach each other through the T-shaped rod 306.

[0045] Further, as shown in Figures 1-4 As shown, the two support frames 301 are each provided with an opening 302, and the two openings 302 are each fixedly provided with a protective net 303, which is a hard net made of metal.

[0046] In embodiment 2, the heat dissipation assembly provided in embodiment 1 is further optimized, and specifically, the protective shell 1 is provided with a heat dissipation piece, and the arrangement of the heat dissipation piece is beneficial to heat dissipation of the protective shell 1.

[0047] Further, as shown in Figures 1-4 As shown, the heat dissipation piece includes two groups of heat dissipation openings 101, and the two groups of heat dissipation openings 101 are respectively arranged at the top and bottom of the protective shell 1, the arrangement of the heat dissipation openings 101 is beneficial to the circulation of air in and outside the protective shell 1, thereby facilitating the dissipation of heat in the protective shell 1 to the outside.

[0048] Further, as shown in Figures 1-4 As shown, the heat dissipation piece further includes two heat dissipation fins 102, and the two heat dissipation fins 102 are both mounted on the side surface of the protective shell 1, and the arrangement of the heat dissipation fins 102 is beneficial to the dissipation of heat in the protective shell 1 to the outside.

[0049] In embodiment 3, please refer to Figure 1-Figure 3 A kind of integrated power amplifier, including heat dissipation assembly, control mainboard is arranged in protective shell 1, interface module 5 and control panel 6 are respectively arranged at both ends of protective shell 1, interface module 5 and control panel 6, interface module 5 and control panel 6 are connected with control mainboard interface module 5 is made of several functional interfaces integrated with control mainboard, and control panel 6 has multiple operation buttons, functional interface, operation button and control mainboard are all existing structures, this application will not be repeated, for the heating component on control mainboard, the corresponding radiator is arranged in protective shell 1 in this application, and the radiator adopts existing air-cooled radiator.

[0050] Further, as shown in Figure 2 As shown, the two sides of the protective shell 1 are each fixedly provided with a stopper 4.

[0051] The use process of the heat dissipation assembly and the integrated power amplifier provided by the utility model is as follows:

[0052] The support of the protective shell 1 by the support frame 301 and the bottom frame 2 effectively increases the space between the bottom of the protective shell 1 and the supporting plane, provides more channels for air circulation, and promotes the natural convection and dissipation of heat. When the application is transported, the two support frames 301 are pushed away from each other, so that the plug board 201 is separated from the socket 304, the support and protection mechanism 3 is removed, and then the support and protection mechanism 3 is turned upside down on the top of the protective shell 1, that is, Figure 6 As shown, at this time, the inner side of the support frame 301 contacts the stopper 4 to limit the support frame 301, and the two protective nets 303 protect the interface module 5 and the control panel 6 respectively, which can reduce the damage caused by the interface module 5 and the control panel 6 during the transportation of this application, and the overall volume is reduced, which is convenient for carrying and transportation. When used again, the two support frames 301 are pushed away from each other to separate the socket 304 from the plug-in board 201, and the support and protection mechanism 3 is placed at the bottom of the bottom frame 2 and the socket 304 is plugged into the plug-in board 201, that is, Figure 1 shown.

[0053] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0054] Obviously, the embodiments described above are only some of the embodiments of the present invention, rather than all of the embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of protection of the patent of the present invention.

Claims

1. A heat dissipation component, characterized in that: The invention comprises a protective shell (1), a bottom frame (2) is fixedly mounted on the bottom of the protective shell (1), plug-in boards (201) are fixedly mounted on both sides of the bottom frame (2), a supporting and protective mechanism (3) is provided at the bottom of the bottom frame (2), the supporting and protective mechanism (3) comprises two supporting frames (301), and both supporting frames (301) are provided with a socket (304), and the inner wall of the socket (304) is plugged into the plug-in board (201).

2. A heat dissipation assembly according to claim 1, characterized in that: A connecting piece is provided between the two support frames (301).

3. A heat dissipation assembly according to claim 2, characterized in that: The connecting member comprises a chamber (305) opened in one of the support frames (301), a T-shaped rod (306) is inserted into the chamber (305), and one end of the T-shaped rod (306) passes through the chamber (305) and is fixedly connected to the other support frame (301).

4. A heat dissipation assembly according to claim 3, characterized in that: The outer surface of the T-shaped rod (306) is sleeved with a spring (307) located in the chamber (305), and the two ends of the spring (307) are fixedly connected to the chamber (305) and the T-shaped rod (306) respectively.

5. The heat dissipation assembly according to claim 4, characterized in that: Both support frames (301) are provided with openings (302), and both openings (302) are fixedly provided with protective nets (303).

6. The heat dissipation assembly according to claim 5, characterized in that: A heat dissipation element is provided on the protective shell (1).

7. The heat dissipation assembly according to claim 6, characterized in that: The heat dissipation element comprises two groups of heat dissipation openings (101), and the two groups of heat dissipation openings (101) are respectively opened at the top and bottom of the protective shell (1).

8. The heat dissipation assembly according to claim 7, characterized in that: The heat sink also includes two heat dissipation fins (102), and the two heat dissipation fins (102) are both installed on the side of the protective shell (1).

9. An integrated power amplifier, comprising the heat dissipation assembly according to claim 8, characterized in that: A control mainboard is provided in the protective shell (1), and an interface module (5) and a control panel (6) are provided at both ends of the protective shell (1), and the interface module (5) and the control panel (6) are both connected to the control mainboard.

10. The integrated power amplifier according to claim 9, characterized in that: Stoppers (4) are fixedly mounted on both sides of the protective shell (1).

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