Furnace passing carrier with heat dissipation holes

Abstract

The utility model relates to a furnace carrier with heat dissipation holes, which comprises an upper cover, a tray plate and a base plate, a mounting concave platform for accommodating the tray plate is arranged in the middle of the base plate, the tray plate is used for bearing a PCB (printed circuit board), the heat dissipation holes are arranged in the middle of the mounting concave platform, the heat dissipation holes are arranged on a connecting plate, and the heat dissipation holes are arranged on the connecting plate. The upper cover detachably covers the base plate and the tray plate, a plurality of sliding grooves are formed in the side wall of the base plate, locking mechanisms are arranged in the sliding grooves, and the locking mechanisms are used for clamping the tray plate. According to the utility model, as a structural improvement, the important design is that the upper cover detachably covers the substrate and the tray plate, and a heat dissipation structure is provided, so that heat dissipation is facilitated. A plurality of sliding grooves are formed in the side wall of the base plate, locking mechanisms are arranged in the sliding grooves, and the locking mechanisms are used for clamping the tray plate. A locking mechanism is arranged on the side face of the base plate, and operation is convenient.

Description

Technical Field

[0001] The utility model relates to the field of PCB board carriers, in particular to a furnace carrier with heat dissipation holes. Background Art

[0002] SMT is the abbreviation of Surface Mount Technology, which is an electronic connection technology that uses professional automatic assembly equipment such as solder paste printers, placement machines, and reflow soldering to directly attach and solder surface assembly components (including resistors, capacitors, inductors, etc.) to the surface of the circuit board. It compresses the volume of traditional electronic components to only a few tens of the original size, achieving high density, high reliability, miniaturization, low cost and automated production of electronic product assembly. Due to the high production cost of electronic PCBA, in order to save costs, it is usually designed into a board-free edge structure during the production process. However, when the PCB board with no board edge structure is subjected to SMT placement through the furnace, the positioning of the PCB board is difficult. In order to solve this problem, a placement furnace carrier is usually used to carry the PCB board for placement through the furnace. The PCB board is placed on the placement position provided on the carrier, and then a corner or side of the placement position is attached with a positioning pin and tape.

[0003] Regarding the fixation of the tray plate, there is generally a lack of a heat dissipation structure. In view of this, an invention is specially applied for. Utility Model Content

[0004] In order to solve the above-mentioned problems in the prior art, the present invention provides a furnace carrier with heat dissipation holes to improve the above-mentioned deficiencies.

[0005] The utility model relates to a furnace carrier with heat dissipation holes, comprising an upper cover, a tray plate and a base plate, wherein a mounting recess for accommodating the tray plate is provided in the middle of the base plate, the tray plate is used to carry a PCB board, heat dissipation holes are provided in the middle of the mounting recess, heat dissipation holes are provided on the connecting plate, the upper cover can be detachably covered on the base plate and the tray plate, a plurality of slide grooves are provided on the side walls of the base plate, a locking mechanism is provided in the slide groove, and the locking mechanism is used to clamp the tray plate.

[0006] Furthermore, a magnet is provided on the top surface of the substrate, and the upper cover is fixed on the substrate via the magnet.

[0007] Furthermore, the upper cover has a hollow area in the middle, and a limiting edge is provided on the bottom surface of the upper cover near the edge of the hollow area, and the limiting edge is used to press on the four sides of the PCB board.

[0008] Furthermore, the locking mechanism includes a push rod, a baffle, a spring, a connecting rod and a sliding rod. The baffle is fixed inside the sliding groove, a through hole is set in the middle of the baffle, one end of the push rod is connected to the sliding rod through the through hole, a protrusion and a connecting rod are set between the baffle and the sliding rod, one end of the connection is fixed on the end face of the sliding rod, the other end of the connection is fixed on the protrusion, the protrusion is fixed to the end head of the push rod, and a spring is set between the protrusion and the end face of the sliding rod.

[0009] When the spring is in a natural state, the side of the slide bar away from the spring is exposed on the vertical side surface of the mounting recess, and a slot matching the slide bar is provided on the outer wall of the tray plate.

[0010] Furthermore, an anti-slip pad is provided on the horizontal surface of the mounting recess.

[0011] Furthermore, heat dissipation holes and heat dissipation fins are provided on the bottom surface of the limiting edge.

[0012] This utility model represents a structural improvement. Its key design lies in the removable upper cover that covers the base plate and tray plate, providing a heat dissipation structure that facilitates heat dissipation. The sidewalls of the base plate are provided with multiple chute slots, within which locking mechanisms are located for securing the tray plate. The locking mechanism is also located on the side of the base plate for ease of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of the utility model.

[0014] Figure 2 It is a schematic diagram of the partial cross-sectional structure of the utility model.

[0015] Figure 3 Schematic diagram of the locking mechanism structure.

[0016] Figure 4 Schematic diagram of the bottom surface structure of the limiting edge.

[0017] Illustration: 1 upper cover, 111 limiting edge, 110 fin, 102 heat dissipation hole, 2 PCB board, 3 tray board, 31 card slot, 4 base plate, 5 mounting recess, 6 slide groove, 61 slide rod, 7 push rod, 71 through hole, 72 bump, 8 baffle, 81 connecting rod, 9 spring, 10 magnet, 11 middle connecting plate, 112 heat dissipation hole. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] like Figure 1-4As shown, the utility model relates to a furnace carrier with heat dissipation holes, including an upper cover 1, a tray plate 3 and a base plate 4, a mounting recess for accommodating the tray plate is provided in the middle of the base plate, the tray plate is used to carry a PCB board 2, an intermediate connecting plate 11 is provided in the middle of the mounting recess, heat dissipation holes 12 are provided on the connecting plate, the upper cover is detachable and covers the base plate and the tray plate, 3-4 slide grooves 6 are provided on the side wall of the base plate, a locking mechanism is provided in the slide groove, and the locking mechanism is used to clamp the tray plate 3.

[0020] As a technical improvement, a magnet 10 is provided on the top surface of the substrate, and the upper cover is fixed on the substrate via the magnet.

[0021] As a technical improvement, a limiting edge 111 is provided in the hollow area in the middle of the upper cover and near the edge of the hollow area on the bottom surface of the upper cover. The limiting edge is used to press on the four sides of the PCB board.

[0022] As a technical improvement, the locking mechanism includes a push rod 7, a baffle 8, a spring 9, a connecting rod 91 and a slide rod 61. The baffle is fixed inside the slide groove, and a through hole 71 is set in the middle of the baffle. One end of the push rod is connected to the slide rod through the through hole. A protrusion 72 and a connecting rod 81 are set between the baffle and the slide rod. The size of the protrusion is larger than the inner diameter of the perforation. One end of the connection is fixed on the end face of the slide rod, and the other end of the connection is fixed on the protrusion. The protrusion is fixed to the end of the push rod. A spring 9 is set between the protrusion and the end face of the slide rod. One end of the push rod is exposed outside the substrate for easy grasping.

[0023] As a technical improvement, when the spring is in a natural state, the side of the slide bar away from the spring is exposed on the vertical side of the mounting recess, and a slot 31 matching the slide bar is provided on the outer wall of the tray plate.

[0024] As a technical improvement, an anti-slip pad 51 is provided on the horizontal surface of the mounting recess.

[0025] As a technical improvement, heat dissipation holes 102 and heat dissipation fins 110 are provided on the bottom surface of the limiting rib. The utility model conducts the temperature generated by the furnace carrier during welding work through the limiting rib, and dissipates heat through the heat dissipation fins evenly arranged on the limiting rib. The heat dissipation fins are wavy, which increases the surface area of ​​the heat dissipation fins, so that the heat inside the furnace carrier is fully convectively conducted and dissipated on the heat dissipation fins, thereby improving the heat dissipation performance of the heat dissipation fins and the overall heat dissipation efficiency of the furnace carrier, thereby achieving the effect of rapid heat dissipation, preventing the furnace carrier from being damaged by excessive temperature of the electronic components soldered thereon, and the base plate and cover plate supported by aluminum alloy, as well as the metal heat conductive structure made of aluminum alloy, are convenient for improving the overall heat dissipation effect and service life of the furnace carrier through the excellent heat dissipation effect and metal strength of aluminum alloy.

[0026] Usage Overview: Place the PCB between the upper cover and the tray plate. The upper cover is fixed to the bottom surface of the base plate through magnets. First, pull the push rod outward. The push rod drives the slide bar to move away from the tray plate in the slide slot. The spring returns to the slide slot. Then place the tray plate on the mounting recess. Then release the push rod. When the spring rebounds, push the slide bar. Then, the end of the slide bar slides into the slot to fix the tray plate. Then place the PCB between the tray plate and the upper cover. The upper cover is fixed to the bottom surface of the base plate through magnets.

Claims

1. A furnace carrier with heat dissipation holes, characterized by: It includes an upper cover, a tray plate and a base plate. A mounting recess is provided in the middle of the base plate for accommodating the tray plate. The tray plate is used to carry the PCB board. A heat dissipation hole is provided in the middle of the mounting recess. Heat dissipation holes are provided on the connecting plate. The upper cover can be detachably covered on the base plate and the tray plate. A plurality of slide grooves are provided on the side wall of the base plate. A locking mechanism is provided in the slide groove. The locking mechanism is used to clamp the tray plate.

2. The furnace carrier with heat dissipation holes according to claim 1, characterized in that: A magnet is provided on the top surface of the substrate, and the upper cover is fixed on the substrate through the magnet.

3. The furnace carrier with heat dissipation holes according to claim 1, characterized in that: The upper cover has a hollow area in the middle, and a limiting edge is provided on the bottom surface of the upper cover near the edge of the hollow area, and the limiting edge is used to press on the four sides of the PCB board.

4. The furnace carrier with heat dissipation holes according to claim 1, characterized in that: The locking mechanism includes a push rod, a baffle, a spring, a connecting rod and a sliding rod. The baffle is fixed inside the sliding groove, a through hole is set in the middle of the baffle, one end of the push rod is connected to the sliding rod through the through hole, a protrusion and a connecting rod are set between the baffle and the sliding rod, one end of the connection is fixed on the end face of the sliding rod, the other end of the connection is fixed on the protrusion, the protrusion is fixed to the end head of the push rod, and a spring is set between the protrusion and the end face of the sliding rod.

5. The furnace carrier with heat dissipation holes according to claim 4, characterized in that: When the spring is in a natural state, the side of the slide bar away from the spring is exposed on the vertical side surface of the mounting recess, and a slot matching the slide bar is provided on the outer wall of the tray plate.

6. The furnace carrier with heat dissipation holes according to claim 5, characterized in that: An anti-slip pad is provided on the horizontal surface of the mounting recess.

7. The furnace carrier with heat dissipation holes according to claim 3, characterized in that: Upper heat dissipation holes and heat dissipation fins are arranged on the bottom surface of the limiting edge.

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