Gas supply system of photoetching machine lens and semiconductor manufacturing equipment

Abstract

The embodiment of the utility model provides an air supply system of a photoetching machine lens and semiconductor manufacturing equipment, and the air supply system of the photoetching machine lens comprises a plurality of air purification devices including at least one first air purification device and at least one second air purification device; the first chemical filtering equipment and the second chemical filtering equipment are arranged on the first air purifying equipment and are used for filtering different types of chemical substances; the first chemical filtration equipment is arranged on the second air purification equipment; an air flow concentration device and an air supply channel of a photoetching machine lens, wherein the air flow concentration device and the air supply channel are positioned in the photomask chamber; the airflow concentration device is connected with the air outlet of the first air purification equipment and is used for concentrating air output from the air outlet of the first air purification equipment to the air supply channel of the lens of the photoetching machine. According to the gas supply system provided by the embodiment of the invention, gas supply to the lens of the photoetching machine can be realized, and the cost and the maintenance complexity of the gas supply system are reduced.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the field of semiconductor equipment, in particular to a gas supply system of a lithography machine lens and a semiconductor manufacturing equipment. BACKGROUND

[0002] The lithography machine lens is one of the most core components of the lithography machine, which is composed of multiple optical lenses and is used to copy the integrated circuit pattern on the mask to the photosensitive material (e.g. photoresist) through light exposure to form a pattern. In this process, the lithography machine lens needs to be supplied with gas to maintain the stability of the internal environment of the lithography machine.

[0003] Under this background, how to provide a gas supply system of a lithography machine lens to achieve gas supply to the lithography machine lens and reduce the cost and maintenance complexity of the gas supply system has become a problem that technicians in the field need to solve urgently. CONTENT OF THE INVENTION

[0004] Therefore, embodiments of the present application provide a gas supply system of a lithography machine lens, which can achieve gas supply to the lithography machine lens and reduce the cost and maintenance complexity of the gas supply system.

[0005] To achieve the above-mentioned purpose, embodiments of the present application provide the following technical solutions.

[0006] In a first aspect, embodiments of the present application provide a gas supply system of a lithography machine lens, which comprises:

[0007] A plurality of air purification devices, including at least one first air purification device and at least one second air purification device;

[0008] A first chemical filter device and a second chemical filter device are arranged in the first air purification device, and the first chemical filter device and the second chemical filter device filter different types of chemicals;

[0009] A first chemical filter device is arranged in the second air purification device;

[0010] An air flow concentrating device and a gas supply channel of the lithography machine lens, wherein the air flow concentrating device and the gas supply channel are located in a mask chamber; the air flow concentrating device is connected to an air outlet of the first air purification device, and air output by the air outlet of the first air purification device is concentrated to the gas supply channel of the lithography machine lens.

[0011] Optionally, an air inlet of the air flow concentrating device is connected to the air outlet of the first air purification device, and an air outlet of the air flow concentrating device is connected to the gas supply channel of the lithography machine lens.

[0012] Optionally, the photomask chamber has a first space and a second space, the first space is isolated from the second space; the air flow concentration device and the air supply channel of the photolithography machine lens are arranged in the first space, and the photolithography machine is arranged in the second space.

[0013] Optionally, the air circulation system is further configured to circulate the air input by the second air purification device into the first space to the outside of the first space.

[0014] Optionally, the first chemical filter device comprises an acid-base organic chemical filter screen; and the second chemical filter device comprises a compound filter screen.

[0015] Optionally, the photomask chamber further comprises:

[0016] The air flow control cabinet is connected to the air supply channel and the internal channel of the photolithography machine respectively; the air flow control cabinet adjusts and controls the air supplied by the air supply channel and input into the internal channel of the photolithography machine, and the internal channel leads to the lens of the photolithography machine.

[0017] The exhaust system interface is configured to exhaust the waste gas of the photolithography machine after treatment.

[0018] In a second aspect, the embodiments of the present application provide a semiconductor manufacturing device comprising the air supply system of the photolithography machine lens.

[0019] As can be seen, the air supply system of the photolithography machine lens provided by the embodiments of the present application comprises a plurality of air purification devices, the plurality of air purification devices comprises at least one first air purification device provided with a first chemical filter device and a second chemical filter device, and a second air purification device provided with only the first chemical filter device; and then the air flow concentration device located in the photomask chamber can concentrate the air output by the air outlet of the first air purification device to the air supply channel of the lens of the photolithography machine through the connection of the air outlet of the first air purification device, so as to realize the air supply to the lens of the photolithography machine, wherein the air supply channel of the lens of the photolithography machine is also located in the photomask chamber; that is, the air supply system of the photolithography machine lens provided by the embodiments of the present application simultaneously provides the first chemical filter device and the second filter chemical device on the specific air purification device (i.e. the first air purification device), and only provides the first chemical filter device on the other air purification device (i.e. the second air purification device), instead of providing the first chemical filter device and the second filter chemical device on all air purification devices, so as to reduce the use of the second filter chemical device while realizing the air supply to the lens of the photolithography machine, and reduce the cost and maintenance complexity of the air supply system; at the same time, the air flow concentration device concentrates the air output by the air outlet of the first air purification device to the air supply channel of the lens of the photolithography machine, so as to guarantee the air supply amount of the air supply channel of the lens of the photolithography machine. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute a part of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor based on the provided drawings.

[0021] Figure 1 is a structural example diagram of the gas supply system of the lithography machine lens shown in the embodiments of the present application.

[0022] Figure 2 is a structural example diagram of the semiconductor manufacturing equipment shown in the embodiments of the present application. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] The lithography machine lens is a key component in the lithography machine, which is composed of multiple optical lenses, and is used to accurately project the circuit pattern on the mask onto the photosensitive material (such as photoresist) to form a pattern. With the improvement of lithography precision, the requirements for the internal environment of the exposure objective lens also become more and more strict, including the environmental temperature, air pressure and cleanliness, etc. In order to maintain the stability of these parameters, the internal environment of the exposure objective lens needs to be kept sealed, and high-purity and clean protective gas is supplied to maintain a micro-pressure state to prevent external air from entering the internal environment to pollute the optical lenses. Therefore, a gas supply system needs to be set to supply gas to the lithography machine lens to maintain the stability of the internal environment of the lithography machine.

[0025] Therefore, the embodiments of the present application provide a gas supply system of a lithography machine lens, which can supply gas to the lithography machine lens and reduce the cost and maintenance complexity of the gas supply system.

[0026] Figure 1 is a structural example diagram of the gas supply system of the lithography machine lens shown in the embodiments of the present application, wherein, Figure 1 the arrow direction in indicates the flow direction of the gas provided to the lithography machine lens, with reference to Figure 1 , the gas supply system can include:

[0027] The multiple air purification devices include at least one first air purification device 110 and at least one second air purification device 120.

[0028] The air purification device refers to a device for filtering and purifying pollutants in the air, which can remove particulate matter and harmful gases in the air to provide cleaner gas for the lens of the lithography machine.

[0029] In an optional embodiment, the air purification device can be a fan filter unit (FFU), which is an air purification device integrating a fan and a high-efficiency filter. The fan can generate a pressure difference to suck air, and the high-efficiency filter can filter the air to provide clean air to the lens of the lithography machine.

[0030] The first chemical filter device 111 and the second chemical filter device 112 are arranged in the first air purification device 110, and the first chemical filter device and the second chemical filter device filter different types of chemicals. The first chemical filter device 111 is arranged in the second air purification device 120.

[0031] The chemical filter device is a device specially designed to remove chemical pollutants in the air. In the embodiments of the present application, in order to further enhance the filtering and purifying effect of the inhaled air, a chemical filter device can be arranged above the air purification device, so that the inhaled air can be pretreated by the chemical filter device to remove chemical pollutants in the air, thereby reducing the burden of the subsequent air purification device, improving the purification efficiency of the entire air supply system and the quality of the supplied air, prolonging the service life of the air purification device, and reducing the maintenance cost.

[0032] In optional implementations, the embodiments of the present application can provide two types of chemical filter devices for filtering different types of chemicals, wherein the first air purification device refers to an air purification device provided with a first chemical filter device and a second chemical filter device, and the second air purification device refers to an air purification device provided with only a first chemical filter device.

[0033] In an optional embodiment, the first chemical filter device can include an acid-base organic chemical filter screen, and the second chemical filter device can include a compound filter screen.

[0034] The acid-base organic chemical filter screen is a filter device specially designed to remove acidic, alkaline and organic gas pollutants in the air; the compound filter screen is a filter screen for removing refractory compounds (RC) that are not easily removed by physical filtration methods; by using the above two types of chemical filter devices for removing different types of chemicals, the purification effect of the air can be further improved.

[0035] In other embodiments, other various chemical filter devices can also be arranged in the air purification device to pretreat the air.

[0036] The air flow concentration device 130 and the air supply channel 140 of the lithography machine lens are located in the mask chamber; the air flow concentration device 130 is connected to the air outlet of the first air purification device 110, and the air output by the air outlet of the first air purification device 110 is concentrated to the air supply channel 140 of the lithography machine lens.

[0037] The air flow concentration device is a device specially designed for controlling and concentrating air flow, which can effectively control the direction and speed of air flow and make the air flow concentrate to a specific area. In the embodiment of the present application, the air flow concentration device can be connected with the air supply channel of the lithography machine lens, wherein the air flow concentration device is connected to the air outlet of the first air purification device, and the air output by the air outlet of the first air purification device can be concentrated to the air supply channel of the lithography machine lens, so as to realize air supply for the lithography machine lens.

[0038] In a specific implementation, the air inlet of the air flow concentration device 130 can be connected with the air outlet of the first air purification device 110, and the air outlet of the air flow concentration device 130 can be connected with the air supply channel 140 of the lithography machine lens.

[0039] Further, with reference to Figure 1 , the mask chamber has a first space 201 and a second space 202, and the first space 201 is isolated from the second space 202; wherein the air flow concentration device 130 and the air supply channel 140 of the lithography machine lens are arranged in the first space 201, and the lithography machine 150 is arranged in the second space 202; and then the isolation of the air supply channel 140 can be realized, so as to avoid other interference.

[0040] In the embodiment of the present application, the air supply system further comprises an air circulation system (not shown in the figure) for circulating the air input by the second air purification device 120 into the first space 201 to the outside of the first space 201.

[0041] In an optional embodiment, the air circulation system can be a fresh air system, which circulates the air input by the second air purification device into the first space to the outside of the first space.

[0042] Further, with reference to Figure 1 , the air supply system further comprises an air flow control cabinet 160 and an exhaust system interface 170; the air flow control cabinet 160 is connected to the air supply channel 140 and the internal channel of the lithography machine 150 respectively, can adjust and control the air provided by the air supply channel, and input the internal channel of the lithography machine, and the internal channel leads to the lens of the lithography machine; the exhaust system interface 170 is used for exhausting the waste gas of the processed lithography machine.

[0043] Airflow Control Cabinet (ACC) is a key component in the lens air supply system of a lithography machine, which is used to adjust and control the air flow, pressure, and temperature or humidity, to ensure that the air entering the lens of the lithography machine meets the specific requirements.

[0044] Exhaust System Interface (ESI) is a part of the lens air supply system of a lithography machine, which is used to exhaust the treated air or exhaust gas from the lithography machine; in the embodiments of the present application, the exhaust system interface can be connected to the internal channel of the lithography machine through a pipeline.

[0045] As can be seen, the lens air supply system of the lithography machine provided by the embodiments of the present application includes a plurality of air purification devices, the plurality of air purification devices including at least one first air purification device provided with a first chemical filter device and a second chemical filter device, and a second air purification device provided with only a first chemical filter device; and the air flow concentrating device located in the mask chamber can concentrate the air output by the air outlet of the first air purification device to the air supply channel of the lens of the lithography machine through the connection of the air outlet of the first air purification device, to realize the air supply to the lens of the lithography machine, wherein the air supply channel of the lens of the lithography machine is also located in the mask chamber; that is, the lens air supply system of the lithography machine provided by the embodiments of the present application simultaneously provides a first chemical filter device and a second filter chemical device on only a specific air purification device (i.e. the first air purification device), and other air purification devices (i.e. the second air purification device) are provided with only a first chemical filter device, instead of all air purification devices being provided with a first chemical filter device and a second filter chemical device, so that the use of the second filter chemical device can be reduced while realizing the air supply to the lens of the lithography machine, to reduce the cost and maintenance complexity of the air supply system; at the same time, the air output by the air outlet of the first air purification device is concentrated to the air supply channel of the lens of the lithography machine by the air flow concentrating device, to ensure the air supply amount of the air supply channel of the lens of the lithography machine.

[0046] The embodiments of the present application also provide a semiconductor manufacturing equipment including the lens air supply system of the lithography machine as described in the foregoing embodiments, which is described with reference to Figure 2 , Figure 2 is a structural example of the semiconductor manufacturing equipment shown in the embodiments of the present application, wherein Figure 2 the arrow direction in indicates the direction of air circulation in the semiconductor manufacturing equipment, Figure 2 the same parts as Figure 1 are described in the foregoing.

[0047] In an optional implementation, the machine table of the semiconductor manufacturing equipment includes a truss layer 300 at the top, a lower mezzanine layer 400 at the bottom, and a working layer 500 between the truss layer and the lower mezzanine layer; wherein the plurality of air purification devices of the air supply system are located at the truss layer 300, and the airflow control cabinet 160 and the exhaust system interface 170 of the air supply system are located at the lower mezzanine layer 400.

[0048] The truss layer is located at the top of the machine table of the semiconductor manufacturing equipment, and functions as a structural support to bear and transfer loads.

[0049] The lower mezzanine layer, also known as the equipment layer, can be used to arrange dedicated pipelines and equipment, such as the airflow control cabinet ACC and the exhaust system interface ESI.

[0050] The working layer is located between the truss layer and the lower mezzanine layer, and is used to arrange various equipment required in the semiconductor manufacturing process. In an optional implementation, the reticle chamber of the lithography machine is located at the working layer 500, and the reticle chamber has a first space 201 and a second space 202, which are isolated from each other; the airflow concentration device and the air supply channel of the lens of the lithography machine are arranged in the first space, and the lithography machine is arranged in the second space. The part of the air supply channel 140 extending out of the reticle chamber passes through the channel 600 between the working layer and the lower mezzanine layer, enters the lower mezzanine layer 400, and thus connects the airflow control cabinet 160 located at the lower mezzanine layer 400.

[0051] Further, with reference to Figure 2 the semiconductor manufacturing equipment includes the air supply system of the lens of the lithography machine as described in the foregoing embodiments; wherein the air circulation system in the air supply system can include an air return duct located at one side of the periphery of the working layer, and thus the air input into the working layer 500 by the plurality of second air purification devices 120 and output to the lower mezzanine layer 400 can be circulated back to the truss layer 300 at the top through the air return duct, and then purified by the plurality of air purification devices and supplied to the lens of the lithography machine, to realize the recycling of the air.

[0052] The foregoing describes a plurality of embodiment schemes provided by the embodiments of the present application, and each optional mode introduced by each embodiment scheme can be combined with each other and cross-referenced in the case of no conflict, thereby extending a plurality of possible embodiment schemes, which can all be considered as the embodiment schemes disclosed and published by the embodiments of the present application.

[0053] Although the embodiments of the present application are disclosed as above, the present application is not limited thereto. Any person skilled in the art can make various modifications and changes without departing from the spirit and scope of the present application, and therefore the protection scope of the present application should be subject to the scope defined by the claims.

Claims

1. An air supply system for a lithography machine lens, characterized in that: include: a plurality of air purification devices, including at least one first air purification device and at least one second air purification device; A first chemical filter device and a second chemical filter device are provided in the first air purification device, and the first chemical filter device and the second chemical filter device filter different types of chemical substances; a first chemical filtration device provided in the second air purification device; An airflow concentrating device and an air supply channel for the lithography machine lens are located in the mask room; the airflow concentrating device is connected to the air outlet of the first air purification device, and concentrates the air output from the air outlet of the first air purification device to the air supply channel for the lithography machine lens.

2. The gas supply system for a lithography machine lens according to claim 1, characterized in that: The air inlet of the air flow concentrating device is connected to the air outlet of the first air purification device, and the air outlet of the air flow concentrating device is connected to the air supply channel of the lithography machine lens.

3. The gas supply system for a lithography machine lens according to claim 2, characterized in that: The mask chamber has a first space and a second space, and the first space is isolated from the second space; the air flow concentrating device and the air supply channel of the lithography machine lens are arranged in the first space, and the lithography machine is arranged in the second space.

4. The gas supply system for a lithography machine lens according to claim 1, characterized in that: Also includes: The air circulation system is used to circulate the air input into the first space by the second air purification device to the outside of the first space.

5. The gas supply system for a lithography machine lens according to claim 1, characterized in that: The first chemical filtration equipment includes: an acid-base organic chemical filter screen; the second chemical filtration equipment includes a compound filter screen.

6. The gas supply system for a lithography machine lens according to claim 1, characterized in that: Also includes: an air flow control cabinet, connected to the air supply channel and the internal channel of the photolithography machine respectively; The air flow control cabinet adjusts and controls the air provided by the air supply channel and inputs the air into the internal channel of the photolithography machine, and the internal channel leads to the lens of the photolithography machine; Exhaust system interface, discharges the treated exhaust gas from the lithography machine.

7. A semiconductor manufacturing equipment, characterized in that include: An air supply system for a lithography machine lens as described in any one of claims 1 to 6.

8. The semiconductor manufacturing equipment according to claim 7, wherein: The platform of the semiconductor manufacturing equipment includes a truss layer at the top, a lower interlayer at the bottom, and a working layer between the truss layer and the lower interlayer; Among them, multiple air purification devices of the air supply system are located in the truss layer, and the air flow control cabinet and exhaust system interface of the air supply system are located in the lower mezzanine.

9. The semiconductor manufacturing equipment according to claim 8, wherein: The mask chamber of the photolithography machine is located on the working layer, and the mask chamber has a first space and a second space, and the first space is isolated from the second space; the air flow concentrating device and the air supply channel of the photolithography machine lens are arranged in the first space, and the photolithography machine is arranged in the second space.

10. The semiconductor manufacturing equipment according to claim 9, wherein The air supply channel extends out of a portion of the channel of the mask chamber, passes through the channel between the working layer and the lower interlayer, enters the lower interlayer, and is connected to the air flow control cabinet located in the lower interlayer.

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