Circuit board and electronic equipment

Abstract

The utility model discloses a circuit board and electronic equipment, and belongs to the technical field of electronic equipment. The circuit board comprises a substrate, the substrate comprises a first area and a second area, the second area is located on the peripheral side of the first area, the substrate comprises first welding spots, the first welding spots are distributed in the first area and the second area, and the first welding spots are used for being connected with a chip; the first adhesive layer wraps the first welding spot, the first adhesive layer avoids the first area, and the first adhesive layer is used for bonding the substrate and the chip; the substrate further comprises second welding spots, the second welding spots are distributed on the peripheral side of the second area, the second welding spots are empty welding spots or grounding welding spots, and the second welding spots are used for enabling the first glue layer to extend to the second welding spots in the glue injection process.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic equipment, and particularly relates to a circuit board and electronic equipment. BACKGROUND

[0002] With the performance enhancement and heat intensification of chips in electronic products, the solder joint fatigue failure problem caused by thermal stress on the chip gradually begins to deteriorate.

[0003] In the related art, in order to solve the chip solder joint fatigue failure problem, a local dispensing scheme is usually adopted, that is, the heat generating area of the chip is not dispensed with glue, and at the same time, in order to take into account the mechanical stress, a bottom filling glue is needed in the peripheral area, and then the peripheral solder balls are protected to ensure the mechanical reliability of the chip.

[0004] However, in the local dispensing scheme, the outermost circle of solder balls cannot be completely wrapped by the bottom filling glue, which leads to the problem that the solder joints are prone to breakage and failure in the case of accidental falling, impact and the like, resulting in the technical problems of poor chip connection reliability and easy chip function failure of the electronic product. Utility model content

[0005] The present application aims to provide a circuit board and electronic equipment, which can solve the technical problems of poor chip connection reliability and easy chip function failure in the related art.

[0006] In a first aspect, an embodiment of the present application provides a circuit board, which comprises: a substrate, the substrate comprising a first area and a second area, the second area being located on the outer periphery side of the first area, the substrate comprising first solder joints, the first solder joints being distributed in the first area and the second area, and the first solder joints being used for connecting chips; a first glue layer, the first glue layer wrapping the first solder joints, and the first glue layer avoiding the first area, the first glue layer being used for bonding the substrate and the chips; and the substrate further comprising second solder joints, the second solder joints being distributed on the outer periphery side of the second area, the second solder joints being air connection solder joints or ground connection solder joints, and the second solder joints being used for extending the first glue layer to the second solder joints during glue injection.

[0007] In a second aspect, an embodiment of the present application provides an electronic equipment, which comprises: the circuit board in the first aspect; and chips connected with the first solder joints.

[0008] In the technical scheme, the second solder joints are arranged on the outer periphery side of the second area and distributed around the second area, and the second solder joints can be used as air connection solder joints or ground connection solder joints, that is, the second solder joints have no disconnection failure hidden danger and are not affected by impact.

[0009] On this basis, during the process of injecting glue into the second area, a part of the glue can fill the space in the second area under the capillary effect.

[0010] Meanwhile, the second welding points located at the outer circumferential side of the second area can guide the glue, and the gaps between the second welding points and the gaps between the second welding points and the first welding points can enhance the capillary effect during the flow of the glue, thereby guiding the glue to accumulate at the outer circumferential side of the first welding points in the outermost circle, so as to form the first glue layer extending to the outside of the first welding points, and the first glue layer can provide all-around wrapping for the first welding points in the outermost circle, thereby reducing the stress of the first welding points in the outermost circle, and reducing the probability of fracture failure of the first welding points in the outermost circle when the circuit board falls or is impacted. Thus, the technical problems in the related art are solved, the circuit board structure is optimized, the practicability and reliability of the circuit board are improved, and the user experience is improved.

[0011] Specifically, the shape, three-dimensional size, distance from the first welding point, and other variables of the second welding points in the embodiment are limited. The above variables have different degrees of influence on improving the dispensing form of the glue, and can be used together. At the same time, the area of glue flow can be accurately controlled according to specific needs, and the above scheme is locally used for flow rate control and form control.

[0012] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and / or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0013] The above and / or additional aspects and advantages of the application will become apparent and be readily understood by a person of ordinary skill in the art from the following description, taken in conjunction with the accompanying drawings in which:

[0014] Figure 1 A structure schematic diagram of a circuit board according to an embodiment of the application is shown;

[0015] Figure 2 A structure schematic diagram of a circuit board according to an embodiment of the application is shown;

[0016] Figure 3 A structure schematic diagram of a circuit board according to an embodiment of the application is shown;

[0017] Figure 4 A structure schematic diagram of a circuit board according to an embodiment of the application is shown;

[0018] Figure 5 A structure schematic diagram of a circuit board according to an embodiment of the application is shown;

[0019] Figure 6 A structure schematic diagram of a second welding point according to an embodiment of the application is shown;

[0020] Figure 7 A structure schematic diagram of a circuit board according to an embodiment of the application is shown;

[0021] Figure 8 A structural schematic diagram of an electronic device according to an embodiment of the present application is shown.

[0022] Reference signs:

[0023] 100 circuit board, 110 substrate, 1102 first region, 1104 second region, 1106 empty area, 112 first soldering point, 114 second soldering point, 1142 spherical soldering point, 1144 strip-shaped soldering point, 120 first glue layer, 130 second glue layer, 132 reinforcing section, 140 electrical device, 200 electronic device, 210 chip. DETAILED DESCRIPTION

[0024] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0025] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0026] In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0028] The following describes the circuit board and electronic device according to the embodiments of the present application. Figures 1 to 8 The following describes the circuit board and electronic device according to the embodiments of the present application.

[0029] As Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 indicated, in some embodiments of the present application, a circuit board 100 is provided, the circuit board 100 comprises: a substrate 110, the substrate 110 comprises a first area 1102 and a second area 1104, the second area 1104 is located at the outer periphery side of the first area 1102, the substrate 110 comprises first solder points 112, the first solder points 112 are distributed in the first area 1102 and the second area 1104, and the first solder points 112 are used to connect a chip 210; a first adhesive layer 120, the first adhesive layer 120 wraps the first solder points, and the first adhesive layer 120 avoids the first area 1102, and the first adhesive layer 120 is used to bond the substrate 110 and the chip 210; the substrate 110 further comprises second solder points 114, the second solder points 114 are distributed at the outer periphery side of the second area 1104, the second solder points 114 are empty solder points or ground solder points, and the second solder points 114 are used to make the first adhesive layer 120 extend to the second solder points 114 in the glue injection process.

[0030] In this embodiment, a circuit board 100 capable of being applied in an electronic device 200 is proposed to realize the specified functions of the electronic device 200.

[0031] Specifically, the circuit board 100 comprises a substrate 110, the substrate 110 is printed with a circuit, and the circuit is connected to a chip 210 in the electronic device 200 through the solder points on the substrate 110 to control the chip 210 to realize the corresponding functions.

[0032] The substrate 110 includes a first area 1102 and a second area 1104. During the operation of the circuit board 100, the first area 1102 has a relatively large heat generation and a relatively high temperature. The second area 1104 is located around the first area 1102. The first area 1102 and the second area 1104 can be divided according to the actual temperature value during the operation of the substrate 110. That is, the first area 1102 is a heat concentration area, and the second area 1104 is a part of area close to the heat concentration area. The second area 1104 has a relatively small heat generation and a relatively low temperature.

[0033] The first area 1102 and the second area 1104 are provided with the first solder joints 112. The first solder joints 112 are used to connect the chip 210, so that the circuit in the substrate 110 can be connected with the circuit in the chip 210. In this case, if the glue is covered on the first area 1102, the glue layer after solidification will fail due to high temperature, which will increase the stress of the first solder joints 112 in the first area 1102, increase the fatigue failure problem of the first solder joints 112 in the first area 1102, and cause the connection failure fault of the circuit board 100.

[0034] The glue is covered on the second area 1104 with low heat generation, and the glue is avoided from the first area 1102 with high heat generation. Thus, the first glue layer 120 capable of bonding the substrate 110 and the chip 210 together is formed on the second area 1104. The first glue layer 120 is below the second area 1104 with a relatively low temperature. Thus, the probability of high temperature failure of the first glue layer 120 is low. The first glue layer 120 provides sufficient bonding force for the chip 210, effectively reduces the stress on the first solder joints 112, reduces the probability of fatigue failure of the first solder joints 112, and improves the connection reliability between the chip 210 and the substrate 110.

[0035] However, due to the flow characteristics of the glue, the glue tends to flow to the gap between the first solder joints 112 under the capillary effect during the dispensing process. Thus, the outside of the outermost first solder joints 112 in the first area 1102 cannot be effectively wrapped by the glue. After the glue solidifies, the outermost first solder joints 112 are exposed on the outside. The first glue layer 120 cannot effectively share the force applied thereon. At this time, if the circuit board 100 is subjected to a large impact force, the outermost first solder joints 112 are prone to breakage and failure.

[0036] To this end, the second solder joints 114 distributed around the second area 1104 are provided on the outer circumferential side of the second area 1104. Specifically, the second solder joints 114 can be used as empty solder joints or ground solder joints. That is, the second solder joints 114 have no disconnection failure hidden danger and are not affected by the impact.

[0037] On this basis, during the process of injecting glue into the second region 1104 , a portion of the glue can fill the space in the second region 1104 due to the capillary effect.

[0038] At the same time, the second solder joints 114 located on the outer periphery of the second region 1104 can guide the glue. Specifically, the gaps between the second solder joints 114 and the gaps between the second solder joints 114 and the first solder joints 112 can enhance the capillary effect during the glue flow, playing a guiding role. Ultimately, the glue can accumulate on the outer periphery of the first solder joints 112 of the outermost circle, thereby forming a first adhesive layer 120 that can extend to the outside of the first solder joints 112. The first adhesive layer 120 can provide a full coverage of the first solder joints 112 of the outermost circle, thereby reducing the stress on the first solder joints 112 of the outermost circle, and thus reducing the probability of the first solder joints 112 of the outermost circle breaking and failing when the circuit board 100 is dropped or impacted. This solves the technical problems existing in the related art, achieves the technical effect of optimizing the structure of the circuit board 100, improving the practicality and reliability of the circuit board 100, and enhancing the user experience.

[0039] Specifically, this embodiment does not limit variables such as the shape, three-dimensional dimensions, and distance from the first solder point 112 of the second solder point 114. These variables have varying degrees of impact on improving the glue dispensing morphology and can be used in combination. Furthermore, the above solution can be used to precisely control the glue flow area to meet specific needs, locally controlling flow rate and morphology.

[0040] like Figure 1 、 Figure 2 and Figure 3 As shown, in some embodiments, optionally, the second welding points 114 are arranged around the second area 1104; or the outer peripheral side of the second area 1104 also includes an air avoidance area 1106, and the second welding points 114 avoid the air avoidance area 1106.

[0041] In this embodiment, the second welding points 114 may be disposed around the second region 1104 .

[0042] In this case, the outermost first solder joints 112 can all be wrapped by the first adhesive layer 120, thereby fully protecting the outermost first solder joints 112. Furthermore, the fully wrapped structure effectively distributes stress, effectively alleviating stress concentration on the first solder joints 112, thereby improving the reliability of the circuit board 100 and reducing the failure rate of the circuit board 100.

[0043] In another embodiment, a clearance area 1106 is provided on the outer periphery of the second region 1104. The first solder joint 112 and the second solder joint 114 are not provided in the clearance area 1106. During the glue injection process, the glue avoids the clearance area 1106, so that the first glue layer 120 avoids the clearance area 1106. After the glue injection is completed, a gap is formed in the first glue layer 120 corresponding to the clearance area 1106. The provision of the clearance area 1106 facilitates the layout of the chip 210 and the routing layout, thereby achieving the technical effect of reducing the difficulty of the structural layout of the circuit board 100.

[0044] Among them, the specific selection of a full wrapping solution or a notch solution needs to be determined according to the size of the circuit board 100, the application scenario of the circuit board 100, and the type and number of the connected chips 210. There is no rigid limitation on this in this embodiment, and it is sufficient to meet the requirements that the first adhesive layer 120 can provide effective protection for the first solder joint 112 of the outermost circle and can reduce the fatigue failure problem of the first solder joint 112.

[0045] like Figure 3 As shown, in some embodiments, optionally, the second solder joint 114 includes: a spherical solder joint 1142 ; the first adhesive layer 120 includes a reinforcement section 132 , and in the reinforcement section 132 , the number of distribution layers of the spherical solder joint 1142 is greater than one.

[0046] In this embodiment, the second solder joint 114 includes a ball solder joint 1142, such as Figure 3 From the perspective shown, it can be seen that the ball solder joints 1142 are circular in a top view.

[0047] The spherical second solder joints 114 occupy a smaller area on the circuit board 100. By arranging spherical solder joints 1142 along the circumferential side of the second region 1104, not only can the first adhesive layer 120 be formed on the outer side of the second region 1104, but the width of the first adhesive layer 120 can also be effectively controlled, thereby reducing the size of the circuit board 100 on the basis of effectively wrapping the outermost circle of the first solder joints 112, thereby reducing the cost of the circuit board 100.

[0048] On this basis, the first adhesive layer 120 includes a reinforcement section 132. The reinforcement section 132 is divided according to the specific stress conditions of the circuit board 100. When the circuit board 100 is subjected to an impact, the stress concentration problem in the reinforcement section 132 is more serious. Therefore, the position of the reinforcement section 132 is not fixed, but is specifically affected by the shape and size of the substrate 110, and the type and number of chips 210. For example, if the circuit board 100 is rectangular, the reinforcement section 132 can correspond to a certain edge of the circuit board 100, or a portion of a certain edge.

[0049] In the reinforcing section 132, the spherical solder joints 1142 are multi-layered, and the multi-layered spherical solder joints 1142 in the reinforcing section 132 can increase the width of the first glue layer 120 in the reinforcing section 132, thereby improving the protection effect of the first solder joint 112 in the corresponding orientation, specifically protecting the weak area of the first solder joint 112, and further improving the reliability of the circuit board 100 and reducing the disconnection failure rate of the circuit board 100.

[0050] Specifically, the first solder joint 112 is also spherical, and compared with the irregularly shaped first solder joint 112, the stress on the spherical first solder joint 112 is more uniform, which can reduce the probability of problems caused by stress concentration, and the uniformly distributed spherical first solder joint 112 can effectively fix the substrate 110 and the chip 210 without occupying a large amount of layout space, thereby improving the structural compactness of the circuit board 100 and reducing the production cost of the circuit board 100.

[0051] As shown in FIGS. Figure 4 and Figure 5 In some embodiments, the second solder joint 114 optionally further includes a strip-shaped solder joint 1144 arranged side by side in the circumferential direction (indicated by arrow a in the figure), and the first glue layer 120 includes a reinforcing section 132, and the strip-shaped solder joint 1144 is arranged in the reinforcing section 132. Figure 4

[0052] In this embodiment, the second solder joint 114 further includes a strip-shaped solder joint 1144, which is different from the spherical solder joint 1142, and the length dimension of the strip-shaped solder joint 1144 in the top view is greater than the width dimension, and there is a clear extension direction and extension distance.

[0053] Compared with the spherical solder joint 1142, the length of the gap between the strip-shaped solder joints 1144 is larger, and the shape of the gap can be optimized by controlling the extension direction and extension distance, so that the capillary effect can be fully utilized during the glue injection process, thereby accurately controlling the flow rate, flow direction and shape after solidification of the glue. Further optimize the size and shape of the first glue layer 120, and improve the protection effect of the first glue layer 120 on the outermost circle of the first solder joint 112.

[0054] On this basis, the first glue layer 120 includes a reinforcing section 132, and the reinforcing section 132 is divided according to the specific stress condition of the circuit board 100. When the circuit board 100 is impacted, the stress concentration problem in the reinforcing section 132 is more serious, so the position of the reinforcing section 132 is not fixed, and is affected by the shape of the substrate 110, the size of the substrate 110, the type and number of chips 210. For example, when the circuit board 100 is rectangular, the reinforcing section 132 can correspond to a side of the circuit board 100, or a part of a section. ​

[0055] Among them, when the second solder joints 114 include both spherical solder joints 1142 and strip solder joints 1144, the strip solder joints 1144 can be selectively arranged inside the reinforcement section 132, and the spherical solder joints 1142 can be arranged outside the reinforcement section 132, thereby increasing the width of the first adhesive layer 120 and changing the shape of the first adhesive layer 120 through the longer and more varied strip solder joints 1144 in the reinforcement section 132, thereby improving the protection effect of the first solder joints 112 in the corresponding positions, and performing targeted protection on the weak areas of the first solder joints 112, thereby achieving the technical effect of improving the reliability of the circuit board 100 and reducing the disconnection failure rate of the circuit board 100.

[0056] like Figure 5 As shown, in some embodiments, optionally, the distance between two adjacent strip solder joints 1144 is constant; wherein the strip solder joints 1144 extend along a straight line, or the strip solder joints 1144 extend along a wavy line.

[0057] In this embodiment, the distance between two adjacent strip-shaped solder joints 1144 is constant in the extension direction thereof, that is, the width of the gap formed by the strip-shaped solder joints 1144 is constant.

[0058] By setting strip solder joints 1144 with constant spacing, the flow rate of the glue in the gap can be reduced through the capillary effect, ensuring that the glue can form a first glue layer 120 on the outside of the second area 1104 and protect the first solder joint 112 of the outermost circle through the first glue layer 120.

[0059] Specifically, the width of the strip solder joint 1144 is constant, and the strip solder joint 1144 extends along a wavy line or a straight line. On this basis, multiple strip solder joints 1144 are arranged side by side at equal intervals to form a gap with a constant width between two adjacent strip solder joints 1144.

[0060] like Figure 4 As shown, in some embodiments, optionally, the distance between two adjacent strip-shaped solder joints 1144 is gradually changed; wherein, the distance between two adjacent strip-shaped solder joints 1144 first increases and then decreases.

[0061] In this embodiment, the distance between two adjacent strip-shaped solder joints 1144 changes gradually along their extending direction.

[0062] By setting strip solder joints 1144 with constant spacing, the flow rate of glue in the gap can be reduced through the capillary effect, ensuring that the glue can form a first glue layer 120 on the outside of the second area 1104, and the first glue layer 120 can protect the first solder joints 112 in the outermost circle. At the same time, after the first glue layer 120 solidifies in the gap with a gradually changing width, the first glue layer 120 can be snapped together with the strip solder joints 1144 to reduce the probability of misalignment between the two, thereby achieving the technical effect of improving the structural stability of the circuit board 100.

[0063] Specifically, the width of the strip-shaped solder joint 1144 first decreases and then increases, for example, the strip-shaped solder joint 1144 in the shape of a bone can be provided, and a plurality of strip-shaped solder joints 1144 are arranged side by side at equal intervals, so that a gap with the width first increasing and then decreasing is formed between two adjacent strip-shaped solder joints 1144.

[0064] As shown in Figure 4 and Figure 6 In some embodiments, optionally, in the reinforcing section 132, two layers of adjacent spherical solder joints 1142 are connected by solder to form a strip-shaped solder joint 1144.

[0065] In this embodiment, in order to ensure that the area where the reinforcing section 132 is located has sufficient adhesion, at least two layers of spherical solder joints 1142 are arranged in the reinforcing section 132.

[0066] On this basis, two layers of adjacent spherical solder joints 1142 are connected together by solder to form a strip-shaped solder joint 1144 spanning two layers.

[0067] For example, Figure 4 The two spherical solder joints 1142 laterally adjacent to each other are connected by solder, and the width of the solder is less than the diameter of the two spherical solder joints 1142, so as to form a “bone”-shaped strip-shaped solder joint 1144 with spherical heads at both ends and a long middle section, and the strip-shaped solder joint 1144 meets the requirement of the aforementioned embodiment of the gradually changing interval.

[0068] Alternatively, as shown in Figure 6 The two layers of adjacent spherical solder joints 1142 are cross-connected by solder. The second solder joint not only connects the two spherical solder joints 1142 together to form a strip-shaped solder joint 1144, but also welds a plurality of strip-shaped solder joints 1144 together to form a network-shaped second solder joint, thereby enhancing the capillary effect and ensuring that the glue can spread to the area where the reinforcing section 132 is located.

[0069] In some embodiments, optionally, the first solder joints 112 and the second solder joints 114 are uniformly distributed in the circumferential direction; the interval of the second solder joints 114 is smaller than the interval of the first solder joints 112.

[0070] In this embodiment, the first solder joints 112 and the second solder joints 114 are uniformly distributed in the circumferential direction. Specifically, the first solder joints 112 include a plurality of layers, and the outermost layer needs to be protected by the first glue layer 120. The second solder joints 114 include at least one layer, and the number of layers of the second solder joints 114 can be increased in the reinforcing section 132.

[0071] On this basis, the interval between two first welding points 112 adjacent in the circumferential direction is a first interval, the interval between two second welding points 114 adjacent in the circumferential direction is a second interval, and the first interval is greater than the second interval, that is, the distribution interval of the second welding points 114 is smaller, and the distribution interval of the first welding points 112 is larger.

[0072] By reducing the interval between the second welding points 114, the capillary effect of the glue near the second welding points 114 can be enhanced, on the one hand guiding the glue to spread to the area where the second welding points 114 are located, and on the other hand reducing the flow rate of the glue near the second welding points 114, so as to ensure that the glue can form a first glue layer 120 capable of effectively wrapping the outermost circle of the first welding points 112 at the second welding points 114, thereby solving the technical problems in the related art and achieving the technical effects of improving the electrical connection reliability of the circuit board 100 and reducing the failure rate of the circuit board 100.

[0073] As shown in Figure 6 illustrated, in some embodiments, optionally, the shape of the second welding point 114 further includes a grid shape.

[0074] As shown in Figure 8 illustrated, in some embodiments, optionally, the circuit board 100 further comprises: an electrical device 140 connected with the second welding point 114; wherein the electrical device 140 includes a copper core ball, an empty network device or a ground network device.

[0075] In this embodiment, the circuit board 100 further comprises an electrical device 140 connected with the second welding point 114, and the electrical device 140 does not participate in the function implementation of the circuit board 100. By regularly arranging the electrical device 140 in the area where the second welding point 114 is located, the capillary effect can be further enhanced, and the flow rate, flow direction and shape of the glue can be accurately controlled, thereby improving the protection effect of the first glue layer 120 and reducing the possibility of disconnection of the first welding point 112.

[0076] Specifically, the electrical device 140 includes a copper core ball, an empty network device or a ground network device.

[0077] As shown in Figure 7 illustrated, in some embodiments, optionally, the circuit board 100 further comprises: a second glue layer 130, the second glue layer 130 is arranged on the outer circumferential side of the second area 1104, and the second glue layer 130 is connected with the first glue layer 120, and the second glue layer 130 is used for bonding the substrate 110 and the chip 210; wherein the first glue layer 120 is formed by injecting the first glue into the second area 1104; the second glue layer 130 is formed by injecting the second glue into the outer circumferential side of the first glue layer 120; and the flowability of the first glue is stronger than that of the second glue.

[0078] In this embodiment, the second glue layer 130 capable of being in contact with the first glue layer 120 and located at the outer peripheral side of the first glue layer 120 is additionally arranged on the substrate 110, and after the dispensing process is completed, the second glue layer 130 and the first glue layer 120 jointly completely wrap the first welding points 112 of the outermost circle of the second region 1104, so as to reduce the stress of the first welding points 112 of the outermost circle, thereby reducing the probability of fracture failure of the first welding points 112 of the outermost circle when the circuit board 100 falls or is impacted.

[0079] Therefore, by arranging the second glue layer 130 capable of wrapping the first glue layer 120 at the outer peripheral side of the second region 1104, the technical problem of poor chip connection reliability and easy chip failure in the related art is solved. Further, the technical effects of optimizing the structure of the circuit board 100, improving the practicality and reliability of the circuit board 100, and improving the user experience are achieved.

[0080] Specifically, the first glue layer 120 and the second glue layer 130 are respectively formed by twice glue injection processes. Specifically, the first glue is first injected into the second region 1104 to form the first glue layer 120, and then the second glue is injected at the outer peripheral side of the second region 1104 to form the second glue layer 130 wrapped outside the first glue layer 120.

[0081] Specifically, the first glue is first injected into the edge of the substrate 110, wherein the first glue has good fluidity and penetrates into the first region 1102 under the capillary action provided by the first welding points 112. When the first glue is static, the second glue is injected into the edge of the substrate 110. The second glue has poor fluidity and directly solidifies outside the first glue layer 120 to form the second glue layer 130, which can wrap the first welding points 112 of the outermost circle.

[0082] By forming the first glue layer 120 and the second glue layer 130 on the substrate 110 by twice glue injection processes, the first glue layer 120 and the second glue layer 130 can jointly wrap the first welding points 112 of the outermost circle, thereby reducing the mechanical stress of the first welding points 112, reducing the probability of disconnection of the first welding points 112 when impacted by external force, and achieving the technical effects of improving the structural stability of the circuit board 100 and reducing the failure rate of the circuit board 100.

[0083] As shown in FIG. 2, Figure 8 In some embodiments of the present application, an electronic device 200 is provided, which comprises the circuit board 100 in any of the above embodiments, and a chip 210 connected with the first welding points 112.

[0084] In this embodiment, an electronic device 200 provided with the circuit board 100 in any of the above embodiments is defined, and thus the electronic device 200 has the advantages of the circuit board 100 in any of the above embodiments and can achieve the technical effects of the circuit board 100 in any of the above embodiments. To avoid repetition, details are not described herein.

[0085] Specifically, the circuit board 100 includes a substrate 110 on which a circuit is printed, and the circuit is connected to a chip 210 in the electronic device 200 through a first soldering point 112 on the substrate 110 to control the chip 210 to implement a corresponding function.

[0086] The electronic device 200 can be a terminal or other device other than a terminal. For example, the electronic device 200 can be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device 200, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. The electronic device 200 can also be a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application are not limited in this regard.

[0087] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0088] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board, characterized in that: include: a substrate, the substrate including a first area and a second area, the second area being located on an outer periphery of the first area, the substrate including first solder joints, the first solder joints being distributed in the first area and the second area, the first solder joints being used for connecting a chip; a first adhesive layer, the first adhesive layer wrapping the first solder joint and avoiding the first area, the first adhesive layer being used to bond the substrate and the chip; The substrate further includes a second solder joint, which is distributed on the outer periphery of the second region. The second solder joint is an empty solder joint or a ground solder joint, and is used to extend the first glue layer to the second solder joint during the glue injection process.

2. The circuit board according to claim 1, wherein: The second welding points are arranged around the second area; or The outer peripheral side of the second region further includes a clearance area, and the second welding point avoids the clearance area.

3. The circuit board according to claim 1, wherein: The second welding point includes: Spherical solder joints; The first adhesive layer includes a reinforcement section, and in the reinforcement section, the number of distribution layers of the spherical solder joints is greater than one.

4. The circuit board according to claim 3, wherein: The second welding point further includes: Strip-shaped welding spots, the strip-shaped welding spots are arranged side by side in the circumferential direction; The first adhesive layer includes a reinforcement section, and the strip-shaped welding point is at least arranged in the reinforcement section.

5. The circuit board according to claim 4, characterized in that The distance between two adjacent strip-shaped welding points is constant; Wherein, the strip-shaped solder joints extend along a straight line, or the strip-shaped solder joints extend along a wavy line.

6. The circuit board according to claim 4, wherein: The distance between two adjacent strip-shaped welding points changes gradually; The distance between two adjacent strip-shaped welding points first increases and then decreases.

7. The circuit board according to claim 4, wherein: In the reinforcement section, two adjacent layers of the spherical solder joints are connected by solder to form the strip solder joints.

8. The circuit board according to any one of claims 1 to 7, characterized in that: The first welding spots and the second welding spots are evenly distributed in the circumferential direction; The spacing between the second welding points is smaller than the spacing between the first welding points.

9. The circuit board according to any one of claims 1 to 7, characterized in that: Also includes: an electrical device connected to the second welding point; Wherein, the electrical components include copper core balls, air network components or grounded network components.

10. The circuit board according to claim 1, wherein: Also includes: a second adhesive layer, the second adhesive layer being disposed on an outer peripheral side of the second region and in contact with the first adhesive layer, the second adhesive layer being used to bond the substrate and the chip; Wherein, the first adhesive layer is formed by injecting the first glue into the second area; The second adhesive layer is formed by injecting a second adhesive into the outer peripheral side of the first adhesive layer; The fluidity of the first glue is stronger than the fluidity of the second glue.

11. An electronic device, characterized in that: include: The circuit board according to any one of claims 1 to 10; A chip is connected to the first solder joint.

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