Vertical plating line bubble discharging device

Abstract

The utility model provides a bubble discharging device for a vertical plating line, which is arranged in a last-stage copper dissolving tank of the vertical plating line and comprises a flow guide component and a filter component, the flow guide assembly is provided with a flow guide plate which is obliquely arranged, so that the copper dissolving liquid in the previous-stage copper dissolving tank is obliquely and downwards guided into the last-stage copper dissolving tank; the filtering assembly is arranged between the flow guide assembly and the input port of the circulating pump, and the filtering assembly is provided with a first filtering net for blocking bubbles of the copper dissolving liquid, so that the copper dissolving liquid after the bubbles are filtered enters a copper cylinder through the circulating pump. The vertical electroplating line bubble discharging device is simple in structure and capable of effectively reducing bubbles in the copper dissolving tank from entering the copper cylinder, so that the reliability of subsequent electroplating quality is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to vertical electroplating equipment technical field, concretely relates to a vertical electroplating line bubble arrangement device. BACKGROUND

[0002] In the field of high-end packaging substrate manufacturing, the copper plating process for interlayer conduction is crucial, and the industry has very strict quality requirements for copper plating. One of the processes that has the greatest impact on the quality of packaging substrate products is the hole filling copper plating process, and the quality of hole filling directly determines whether the adjacent layers in the high-end packaging substrate can conduct. Currently, more than 90% of electroplating hole filling equipment in the fine line manufacturing process selects vertical continuous electroplating. This electroplating equipment can realize product non-contact, and has obvious advantages in fine line and blind hole filling manufacturing.

[0003] In the vertical continuous electroplating equipment, the copper dissolving effect of the copper dissolving tank is the most important. Generally, the vertical electroplating equipment adopts a hierarchical overflow method to ensure complete copper dissolution. In actual production process, in order to ensure that the copper cylinder and the copper dissolving tank circulation amount reaches balance, the liquid level height of the last stage of the copper dissolving tank will have a height difference. During the hierarchical overflow process of the copper dissolving tank, a large amount of bubbles will be generated at the position of the height difference. The bubbles will be brought into the copper cylinder during the circulation process between the copper dissolving tank and the copper cylinder. During the electroplating hole filling process, the bubbles will flow into the hole and the middle of the board line through the flow of the electroplating solution, thereby causing defects such as blind hole filling cavity and line gap, directly affecting the conductivity of the product. Therefore, a vertical electroplating line bubble arrangement device is needed to solve such problems. SUMMARY

[0004] The utility model aims at at least one of the above technical problems in the technical field. To this end, the utility model provides a vertical electroplating line bubble arrangement device, which has the advantages of simple structure and can effectively reduce the bubbles in the copper dissolving tank from entering the copper cylinder, thereby ensuring the reliability of the subsequent electroplating quality.

[0005] To achieve the above-mentioned purpose, the utility model provides a vertical electroplating line bubble arrangement device, which is arranged in the last stage of the copper dissolving tank of the vertical electroplating line, and comprises a flow guide assembly and a filter assembly.

[0006] The flow guide assembly has an inclined flow guide plate to guide the copper dissolving liquid in the upper stage of the copper dissolving tank to flow downward into the last stage of the copper dissolving tank.

[0007] The filter assembly is arranged between the flow guide assembly and the input port of the circulating pump, and has a first filter screen to block the bubbles of the copper dissolving liquid, so that the copper dissolving liquid after filtering the bubbles enters the copper cylinder through the circulating pump.

[0008] According to the vertical electroplating line bubble removing device, the copper dissolving liquid with height difference is guided from the upper level to the lower level, the impact force of the copper dissolving liquid flowing from the upper level to the lower level is reduced, the bubbles are further intercepted and filtered through the first filter screen, the filtered copper dissolving liquid is poured into the copper cylinder through the circulating pump, and the copper dissolving liquid in the copper cylinder is prevented from containing bubbles to affect subsequent electroplating quality.

[0009] In addition, the vertical electroplating line bubble removing device can have the following additional technical features.

[0010] Optionally, the flow guide component comprises a baffle, the baffle is arranged obliquely and located above the flow guide plate to block the splashed copper dissolving liquid in the flow guide process.

[0011] Further, the baffle is adjustably arranged between the position close to or away from the flow guide plate to adjust the spacing between the baffle and the flow guide plate.

[0012] Further, the side wall of the copper dissolving tank is provided with a plurality of first limiting structures arranged along the length direction of the side wall, and the baffle is detachably mounted on different first limiting structures to be adjustable between the position close to or away from the flow guide plate.

[0013] Optionally, the filter component comprises a second filter screen, the second filter screen is arranged between the first filter screen and the input port of the circulating pump, and the pore size of the mesh of the second filter screen is smaller than the pore size of the first filter screen.

[0014] Further, the first filter screen is a 40-mesh to 60-mesh stainless steel screen, and the second filter screen is a 90-mesh to 110-mesh stainless steel screen.

[0015] Further, the first filter screen and the second filter screen are detachably mounted in the copper dissolving tank of the last level.

[0016] Further, the two side walls of the copper dissolving tank define a second limiting structure and a third limiting structure to one-to-one correspondingly mount the first filter screen and the second filter screen. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a structural schematic view of the vertical electroplating line bubble removing device according to the embodiment of the utility model.

[0018] Figure 2Another view structure schematic diagram of the vertical electroplating line bubble arranging device according to the embodiment of the utility model;

[0019] Figure 3 For Figure 2 The enlarged view of A in the figure;

[0020] Mark explanation:

[0021] The flow guide assembly 1, the flow guide plate 11, the baffle 12, the filter assembly 2, the first filter screen 21, the second filter screen 22, the copper dissolving tank 3, the first limiting structure 31, the second limiting structure 32, the third limiting structure 33, the circulating pump 4. Specific implementation

[0022] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the utility model and cannot be understood as a limitation of the utility model.

[0023] In order to better understand the above technical solutions, the exemplary embodiments of the utility model will be described in more detail below with reference to the drawings. Although the exemplary embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the utility model and to enable the scope of the utility model to be fully conveyed to those skilled in the art.

[0024] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings and specific embodiments.

[0025] The embodiments of the utility model will be described in detail below with reference to Figures 1-3 The implementation of the vertical electroplating line bubble arranging device according to the embodiment of the utility model is described in detail.

[0026] The vertical electroplating line bubble arranging device according to the embodiment of the utility model is arranged in the last stage of the vertical electroplating line, and includes a flow guide assembly 1 and a filter assembly 2.

[0027] Specifically, the flow guide assembly 1 has an inclined flow guide plate 11 to tilt the copper dissolving liquid in the upper stage copper dissolving tank 3 downwardly to the last stage copper dissolving tank 3; the filter assembly 2 is arranged between the flow guide assembly 1 and the input port of the circulating pump 4, and the filter assembly 2 has a first filter screen 21 to block the bubbles of the copper dissolving liquid, so that the filtered copper dissolving liquid enters the copper cylinder through the circulating pump 4.

[0028] That is, the last stage of copper tank 3 and the upper stage of copper tank 3 is provided with a baffle, when the upper stage of copper liquid overflow baffle, copper liquid from the upper stage overflow to the last stage, due to the height difference caused by the overflow of the upper stage of copper liquid impact the next stage of copper liquid, so as to form bubbles, by the flow guide plate 11 inclined setting, so that the upper stage of copper liquid can along the flow guide plate 11 flow direction to the last stage of copper tank 3, thereby reducing the impact of the copper liquid intersection, in turn to reduce the generation of bubbles, and then through the first filter screen 21 to filter the bubbles generated, so that the bubbles into the circulating pump 4 of copper liquid is further reduced, the circulating pump 4 is pumped into the copper tank for electroplating operation, due to the bubbles in the copper tank is greatly reduced, can be beneficial to improve the quality of electroplating, avoid causing blind hole filling hole, line gap and other defects, directly affect the conductivity of the product.

[0029] Thus, by flow guide assembly 1 with high and low copper liquid from the upper stage of the high flow to the next stage of the low, so that the impact of the copper liquid from the upper stage to the next stage of the reduced bubble generation, by the first filter screen 21 to further intercept the bubbles, so that the filtered copper liquid by circulating pump 4 into the copper tank, avoid the copper tank with bubbles in the copper liquid affect the subsequent electroplating quality. The vertical electroplating line bubble device structure is simple, can effectively reduce the bubbles in the copper tank 3 into the copper tank, so as to ensure the reliability of the subsequent electroplating quality.

[0030] Optionally, the flow guide assembly 1 includes a baffle 12, baffle 12 inclined setting and located above the flow guide plate 11, to block the flow guide plate 11 in the process of flow of splashing copper liquid. It can be understood that, due to the upper stage of copper tank 3 of copper liquid along the flow guide plate 11 to the last stage of copper tank 3 into the process of copper liquid splashing, splashing copper liquid will also produce bubbles when contact with copper liquid again, by the baffle 12 setting can block the splashing of copper liquid, can reduce the impact between the copper liquid and produce bubbles. In which, the inclination angle of baffle 12 can be consistent with the inclination angle of the flow guide plate 11, the angle between the two and the baffle can be 20°~50°, the lower end of the baffle 12 can be higher than the lower end of the flow guide plate 11, to form a channel for the copper liquid through the copper tank 3, the upper end of the baffle 12 can be higher than the upper end of the flow guide plate 11.

[0031] Further, the baffle 12 is close to or away from the position of the flow guide plate 11 can be adjusted to adjust the distance between the baffle 12 and the flow guide plate 11. It can be understood that, by the baffle 12 can be close to or away from the flow guide plate 11, so that the distance between them is adjusted, to match different copper liquid flow and speed, and reduce the generation of bubbles. In which, the baffle 12 can be slidably connected with the side wall of the copper tank 3 to adjust the distance between the baffle 12 and the flow guide plate 11, can be by installing in different positions of the side wall to adjust the distance between them.

[0032] Further, the side wall of the copper dissolving tank 3 is provided with a plurality of first limiting structures 31 arranged along the length direction of the side wall, and the baffle 12 is detachably mounted on different first limiting structures 31 so as to be adjustable between the positions close to or away from the flow guide plate 11. It can be understood that when it is necessary to adjust the distance between the baffle 12 and the flow guide plate 11, the distance therebetween can be adjusted by mounting on different first limiting structures 31. The first limiting structure 31 can be formed by a U-shaped groove protruding from one side wall of the copper dissolving tank 3 and another U-shaped groove opposite to the other side wall. When the baffle 12 is disassembled, it is only necessary to pull out the baffle 12 from the two U-shaped grooves and then put it into the two U-shaped grooves of another first limiting structure 31. A handle can be provided on the baffle 12 to make the disassembly and assembly of the baffle 12 more convenient.

[0033] Optionally, the filtering assembly 2 comprises a second filter screen 22 arranged between the first filter screen 21 and the input port of the circulating pump 4, and the pore size of the second filter screen 22 is smaller than that of the first filter screen 21. It can be understood that the copper dissolving solution after being filtered by the first filter screen 21 can still contain some small bubbles. By arranging the second filter screen 22, the small bubbles remaining after being filtered by the first filter screen 21 can be further intercepted and filtered, so that the bubbles of different sizes in the copper dissolving solution are filtered and then enter the copper tank through the circulating pump 4, thereby ensuring the reliability of the electroplating quality.

[0034] Further, the first filter screen 21 is a 40-mesh to 60-mesh stainless steel screen, and the second filter screen 22 is a 90-mesh to 110-mesh stainless steel screen. It can be understood that by the above arrangement, the size of the bubbles generated in the copper dissolving solution can be matched, so that the bubbles are better intercepted and filtered, thereby ensuring the quality of subsequent electroplating. The first filter screen 21 can be a 50-mesh stainless steel screen, and the second filter screen 22 can be a 100-mesh stainless steel screen.

[0035] Further, the first filter screen 21 and the second filter screen 22 are detachably mounted in the last stage copper dissolving tank 3. It can be understood that since the first filter screen 21 and the second filter screen 22 are likely to attach some impurities after long time use, thereby affecting the filtering effect, by the detachable arrangement of the first filter screen 21 and the second filter screen 22, the cleaning and replacement of the first filter screen 21 and the second filter screen 22 can be facilitated, thereby ensuring the filtering effect of the first filter screen 21 and the second filter screen 22. The first filter screen 21 and the second filter screen 22 can be composed of an outer frame and a stainless steel screen, and the outer frame can be made of PVC material with a 316L stainless steel screen arranged in the middle.

[0036] Further, the two side walls of the copper dissolving tank 3 define a second limiting structure 32 and a third limiting structure 33 to correspondingly install the first filter screen 21 and the second filter screen 22. Understandably, through the second limiting structure 32 and the third limiting structure 33, the first filter screen 21 and the second filter screen 22 can be detachably installed, thereby facilitating the cleaning and replacement of the first filter screen 21 and the second filter screen 22. The second limiting structure 32 and the third limiting structure 33 can be the same as the first limiting structure 31, or two installation plates can be installed between the two side walls of the copper dissolving tank 3, the two installation plates have a gap with the bottom of the copper dissolving tank 3, the first filter screen 21 or the second filter screen 22 can be inserted between the two installation plates, so that the stainless steel screen is located at the gap between the installation plate and the bottom of the copper dissolving tank 3, and the first filter screen 21 and the second filter screen 22 can be provided with handles to facilitate disassembly and assembly.

[0037] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0038] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise specifically limited.

[0039] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can include the first and second features directly contacting, or the first and second features not directly contacting but contacting through another feature between them. Moreover, the first feature "on", "above" and "on the surface" of the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0041] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or several embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application.

[0042] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A vertical electroplating line bubble removal device, arranged in the copper dissolving tank of the last stage of the vertical electroplating line, characterized in that: include: diversion components and filtration components; The guide assembly has a guide plate arranged obliquely to guide the copper solution in the upper copper dissolving tank obliquely downward to the copper dissolving tank of the last stage; The filter assembly is arranged between the guide assembly and the input port of the circulation pump. The filter assembly has a first filter screen for blocking bubbles in the copper solution, so that the copper solution after filtering out the bubbles enters the copper cylinder through the circulation pump.

2. The vertical electroplating line bubble removal device according to claim 1, characterized in that: The guide assembly includes a baffle, which is arranged obliquely and located above the guide plate to block the molten copper liquid splashing during the guide plate drainage process.

3. The vertical electroplating line bubble removal device according to claim 2, characterized in that: The baffle can be adjusted between a position close to or a position far away from the guide plate to adjust the distance between the baffle and the guide plate.

4. The vertical electroplating line bubble removal device according to claim 3, characterized in that: The side wall of the copper dissolving tank is provided with a plurality of first limiting structures arranged along the length direction of the side wall, and the baffle is detachably mounted on different first limiting structures so that the baffle can be adjusted between a position close to or away from the guide plate.

5. The vertical electroplating line bubble removal device according to claim 1, characterized in that: The filter assembly includes a second filter screen, which is arranged between the first filter screen and the input port of the circulation pump. The aperture of the mesh of the second filter screen is smaller than the aperture of the first filter screen.

6. The vertical electroplating line bubble removal device according to claim 5, characterized in that: The first filter screen is a stainless steel screen with a mesh size of 40 to 60, and the second filter screen is a stainless steel screen with a mesh size of 90 to 110.

7. The bubble removal device for a vertical electroplating line according to claim 5, characterized in that: The first filter screen and the second filter screen can be detachably installed in the copper dissolving tank of the last stage.

8. The bubble removal device for a vertical electroplating line according to claim 7, characterized in that: The two side walls of the copper dissolving tank define a second limiting structure and a third limiting structure to install the first filter screen and the second filter screen in a one-to-one correspondence.

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