Cooling mechanism for ceramic tile glue processing

Abstract

The utility model relates to the technical field of cooling mechanisms, and discloses a cooling mechanism for ceramic tile glue processing, which comprises a cooling box, two guide plates are fixedly connected in the cooling box, the two guide plates are symmetrically arranged in a crossed manner, and a plurality of leakage holes are formed in the surfaces of a plurality of baffles. Cooling mechanisms used for cooling tile glue are arranged at the bottoms of the two guide plates, a plurality of ventilation openings are formed in the two sides of the cooling box, fan blades are rotationally connected to the surfaces of the sides, close to the two guide plates, of the cooling box, rotating mechanisms used for rotating the fan blades are arranged on the surfaces of the sides, close to the cooling box, of the two fan blades, and a feeding port is formed in the top of the cooling box; an opening mechanism used for opening the feeding port is arranged on one side of the feeding port. According to the utility model, through the arrangement of the baffle plate, the heat dissipation area of the tile glue can be enlarged, and the plurality of leakage holes are formed in the baffle plate and have certain heights, so that when the tile glue flows, the heat dissipation area of the tile glue can be increased, and the tile glue can rapidly dissipate heat.

Description

TECHNICAL FIELD

[0001] The utility model relates to a cooling mechanism technical field especially relates to a kind of cooling mechanism for ceramic tile glue processing. BACKGROUND

[0002] Ceramic tile glue is usually mixed by multiple components, and these components may generate a large amount of heat during processing. If not cooled in time, the temperature rise will not only affect the quality of the product, but also may cause damage to the equipment. The main function of the cooling mechanism is to quickly remove the heat generated during processing to maintain stable processing temperature. This process usually relies on cooling media such as water or air to achieve effective heat transfer through heat exchange equipment. The cooling mechanism is an indispensable part of ceramic tile glue processing, which not only guarantees the quality and stability of the product, but also prolongs the service life of the equipment. With the advancement of technology, the design and application of the cooling system will continue to optimize, providing stronger support for ceramic tile glue production.

[0003] Some existing ceramic tile glue processing cooling mechanisms are usually placed in the cooling bin when in use, and the cooling bin is internally provided with cooling pipes, so that the ceramic tile glue can be cooled through the cooling pipes. However, when the ceramic tile glue enters the cooling bin, it will be in a stacked state. Due to the stacking, the heat dissipation area of the ceramic tile glue becomes smaller, resulting in low cooling efficiency. Therefore, this problem needs to be solved. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in the prior art and provides a cooling mechanism for ceramic tile glue processing.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A cooling mechanism for ceramic tile glue processing, comprising a cooling box, two guide plates are fixedly connected inside the cooling box, and the two guide plates are cross-symmetrically arranged, a plurality of baffle plates are fixedly connected to the top of each guide plate, a plurality of leakage holes are formed on the surface of each baffle plate, a cooling mechanism for cooling ceramic tile glue is arranged at the bottom of each guide plate, a plurality of ventilation openings are formed on both sides of the cooling box, a fan blade is rotatably connected to the surface of the cooling box near each guide plate, a rotating mechanism for rotating the fan blade is arranged on the surface of each fan blade near the cooling box, an inlet is formed on the top of the cooling box, and an opening mechanism for opening the inlet is arranged on one side of the inlet. The arrangement of the guide plates can increase the heat dissipation area of the ceramic tile glue.

[0007] As a further scheme of the utility model, the cooling mechanism comprises a cooling pipe, the cooling pipe is fixedly connected to the bottom of the guide plate, a plurality of heat dissipation plates are sleeved on the surface of the cooling pipe, and the plurality of heat dissipation plates are all fixedly connected to the bottom of the guide plate, a liquid inlet is formed in one end of the cooling pipe, and a liquid outlet is formed in the other end of the cooling pipe, and the cooling pipe can cool the ceramic tile adhesive.

[0008] As a further scheme of the utility model, the rotating mechanism comprises a first rotating shaft, the first rotating shaft is rotationally connected to cooling box one, a leaf roller is sleeved on the surface of the first rotating shaft, the leaf roller and the guide plate are arranged in a matched mode, a first synchronous wheel is sleeved on the side of the first rotating shaft close to the fan leaf, a second rotating shaft and a third rotating shaft are fixedly connected to the one side of the fan leaf respectively, the second rotating shaft and the third rotating shaft are all rotationally connected to the side of the cooling box, a second synchronous wheel is sleeved on the surface of the side of the second rotating shaft close to the first synchronous wheel, the first synchronous wheel and the second synchronous wheel are sleeved with a same first synchronous belt, a fifth synchronous wheel is sleeved on the surface of the side of the second rotating shaft close to the fan leaf, a fourth synchronous wheel is sleeved on the surface of the side of the third rotating shaft close to the fifth synchronous wheel, the fourth synchronous wheel and the fifth synchronous wheel are sleeved with a same second synchronous belt, and the leaf roller can make the fan leaf rotate.

[0009] As a further scheme of the utility model, the opening mechanism comprises a release plate, the release plate is slidably connected to the side of the feeding port, two hydraulic rods are fixedly connected to the surface of the side of the release plate away from the feeding port, the two hydraulic rods are all fixedly connected to the top of the cooling box, a discharging port is formed in the bottom of the side of the cooling box close to the feeding port, and the release plate can make the feeding port open.

[0010] The utility model discloses the beneficial effect is:

[0011] 1. The utility model discloses a technical scheme that the baffle guides ceramic tile adhesive, so the cooling efficiency of ceramic tile adhesive can be greatly improved, thereby effectively solving the problem that ceramic tile adhesive is in a stacked state when entering the cooling bin, and the heat dissipation area of ceramic tile adhesive is small due to the stacking, thereby causing low cooling efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 The utility model discloses a kind of cooling mechanism for ceramic tile adhesive processing overall structure schematic view;

[0013] Figure 2 An internal structure schematic view of a cooling mechanism for ceramic tile glue processing is provided in the utility model.

[0014] Figure 3 An opening mechanism schematic view of a cooling mechanism for ceramic tile glue processing is provided in the utility model.

[0015] Figure 4 A cooling mechanism schematic view of a cooling mechanism for ceramic tile glue processing is provided in the utility model.

[0016] Figure 5 A rotating mechanism schematic view of a cooling mechanism for ceramic tile glue processing is provided in the utility model.

[0017] In the figure: 1, cooling box; 2, release plate; 3, guide plate; 4, leaf roller; 101, feed inlet; 102, discharge port; 103, ventilation opening; 201, hydraulic rod; 301, baffle; 302, leakage hole; 303, cooling pipe; 304, liquid inlet; 305, liquid outlet; 306, heat sink; 401, first rotating shaft; 402, first synchronous wheel; 403, first synchronous belt; 404, second rotating shaft; 405, second synchronous wheel; 406, third rotating shaft; 408, fourth synchronous wheel; 409, fifth synchronous wheel; 410, second synchronous belt; 411, fan page. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0019] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0020] REFERENCE Figures 1-5The utility model provides a kind of cooling mechanism for ceramic tile glue processing, including cooling box 1, two guide plates 3 are fixedly connected inside cooling box 1, and two guide plates 3 are symmetrically arranged crossing, multiple baffle plates 301 are fixedly connected on the top of two guide plates 3, multiple leakage holes 302 are formed on the surface of multiple baffle plates 301, cooling mechanism for cooling ceramic tile glue is equipped on the bottom of two guide plates 3, multiple ventilation openings 103 are formed on the both sides of cooling box 1, fan leaf 411 is rotatably connected on the surface of cooling box 1 close to two guide plates 3, rotating mechanism for rotating fan leaf 411 is equipped on the surface of two fan leaves 411 close to cooling box 1, feeding port 101 is formed on the top of cooling box 1, opening mechanism for opening feeding port 101 is equipped on the side of feeding port 101, by the setting of guide plate 3, the heat dissipation area of ceramic tile glue can be made larger.

[0021] With reference to Figure 1 And Figure 4 In a preferred embodiment, the cooling mechanism includes a cooling pipe 303 fixedly connected to the bottom of the guide plate 3, a plurality of heat dissipation plates 306 are sleeved on the surface of the cooling pipe 303, and the plurality of heat dissipation plates 306 are fixedly connected to the bottom of the guide plate 3, the cooling pipe 303 is provided with a liquid inlet 304 at one end, and a liquid outlet 305 at the other end, so that the ceramic tile glue can be cooled by the cooling pipe 303.

[0022] With reference to Figure 2 And Figure 5 In a preferred embodiment, the rotating mechanism includes a first rotating shaft 401 rotatably connected to the cooling box 1, a leaf roller 4 is sleeved on the surface of the first rotating shaft 401, the leaf roller 4 is arranged in cooperation with the guide plate 3, a first synchronous pulley 402 is sleeved on the side of the first rotating shaft 401 close to the fan leaf 411, a second rotating shaft 404 and a third rotating shaft 406 are fixedly connected to one side of the cooling box 1 respectively, the second rotating shaft 404 is sleeved with a second synchronous pulley 405 on the side of the surface close to the first synchronous pulley 402, the first synchronous pulley 402 and the second synchronous pulley 405 are sleeved with a first synchronous belt 403, the second rotating shaft 404 is sleeved with a fifth synchronous pulley 409 on the side of the surface close to the fan leaf 411, the third rotating shaft 406 is sleeved with a fourth synchronous pulley 408 on the side of the surface close to the fifth synchronous pulley 409, the fourth synchronous pulley 408 and the fifth synchronous pulley 409 are sleeved with a second synchronous belt 410, and the fan leaf 411 is rotated by the setting of the leaf roller 4.

[0023] With reference to Figure 1 And Figure 3In a preferred embodiment, the opening mechanism comprises a release plate 2 which is slidingly connected to one side of the feeding port 101, and two hydraulic rods 201 are fixedly connected to the top of the cooling box 1 and are fixedly connected to the side surface of the release plate 2 away from the feeding port 101, and the cooling box 1 is provided with a discharging port 102 at the bottom near the feeding port 101, so that the feeding port 101 can be opened by the release plate 2.

[0024] From the above description, it can be seen that the above-mentioned embodiments of the utility model realize the following technical effects: in use, the ceramic tile adhesive is poured into the inside of the cooling box 1 through the feeding port 101, the inside of the cooling box 1 is provided with a guide plate 3, and the guide plate 3 is arranged in an inclined manner, the cooling pipe 303 is installed at the bottom of the guide plate 3, when the external cooling liquid flows in the inside of the cooling pipe 303, the guide plate 3 can be cooled, and after the ceramic tile adhesive enters the inside of the cooling box 1, it will contact the guide plate 3 to achieve the purpose of cooling, a plurality of baffles 301 are installed at the top of the guide plate 3 and are arranged at a V-shaped angle with the guide plate 3, a plurality of leakage holes 302 are formed in the surface of the baffle 301, so that the ceramic tile adhesive will flow again to the surface of the guide plate 3 from the leakage hole 302 as it flows, because the leakage hole 302 has a certain height, so when the ceramic tile adhesive flows, its heat dissipation area can be increased to enable it to be quickly cooled, the leaf roller 4 is installed on one side of the guide plate 3, as the ceramic tile adhesive moves downward, it will contact the leaf roller 4 and make it rotate, the first synchronous belt 403 is installed on one side of the leaf roller 4, and the other end of the first synchronous belt 403 is matched with the fan leaf 411, so that under the assistance of the first synchronous belt 403, when the leaf roller 4 rotates, the fan leaf 411 will also rotate synchronously, a plurality of ventilation holes 103 are formed in the surface of the cooling box 1, so that when the fan leaf 411 rotates, the flow rate of hot air in the inside of the cooling box 1 can be accelerated, so that the ceramic tile adhesive can have a better cooling environment.

[0025] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "vertical", "horizontal", "top", "bottom", "lateral", "medial", "superior", "inferior", "proximal", "distal" and derivatives thereof (e.g., "apex", "antapex", "antecedent", etc.) relate to the apparatus as it is shown in the drawings, unless otherwise specifically noted. It is to be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientations depicted in the drawings. For example, if the device described herein is inverted consistent with the use or operation, then a superior surface, according to the present description, would become an inferior surface. Thus, the exemplary term "superior" can encompass both an orientation that is "superior" according to the depiction of the drawings and an orientation that is "inferior" depending on the orientation of the device in use or operation. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0026] It is to be understood that the terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting. As used herein, the singular form "a", "an" and "the" include plural references unless the context clearly dictates otherwise. As used herein, the term "includes" and / or "including" means, unless the context dictates otherwise, that the named process, method, system, product or apparatus includes at least the listed steps or units, but not excluding others.

[0027] It is to be understood that the terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting. As used herein, the singular form "a", "an" and "the" include plural references unless the context clearly dictates otherwise. As used herein, the term "includes" and / or "including" means, unless the context dictates otherwise, that the named process, method, system, product or apparatus includes at least the listed steps or units, but not excluding others.

[0028] The preferred embodiments of the present application have been described herein above with the intent of illustrating the principles of operation of the application by reference to exemplary embodiments. However, it will be readily understood that the application is capable of numerous modifications, adaptations, and implementations without departing from the spirit and scope of the application as set forth in the following claims.

Claims

1. A cooling mechanism for tile adhesive processing, comprising a cooling box (1), characterized in that: Two guide plates (3) are fixedly connected inside the cooling box (1), and the two guide plates (3) are arranged in a cross-symmetrical manner. A plurality of baffles (301) are fixedly connected to the tops of the two guide plates (3), and a plurality of leak holes (302) are provided on the surfaces of the plurality of baffles (301). A cooling mechanism for cooling the tile adhesive is provided at the bottoms of the two guide plates (3). A plurality of vents (103) are provided on both sides of the cooling box (1). A fan blade (411) is rotatably connected to the surface of the cooling box (1) on one side close to the two guide plates (3). A rotating mechanism for rotating the fan blade (411) is provided on the surface of the two fan blades (411) on the side close to the cooling box (1). A feed port (101) is provided on the top of the cooling box (1), and an opening mechanism for opening the feed port (101) is provided on one side of the feed port (101).

2. The cooling mechanism for tile adhesive processing according to claim 1, characterized in that: The cooling mechanism comprises a cooling pipe (303), the cooling pipe (303) is fixedly connected to the bottom of the guide plate (3), a plurality of heat dissipation plates (306) are sleeved on the surface of the cooling pipe (303), and the plurality of heat dissipation plates (306) are all fixedly connected to the bottom of the guide plate (3), a liquid inlet (304) is provided at one end of the cooling pipe (303), and a liquid outlet (305) is provided at the other end of the cooling pipe (303).

3. The cooling mechanism for tile adhesive processing according to claim 2, characterized in that: The rotating mechanism includes a first rotating shaft (401), the first rotating shaft (401) is rotatably connected to the cooling box (1), a blade roller (4) is sleeved on the surface of the first rotating shaft (401), the blade roller (4) and the guide plate (3) are arranged to cooperate with each other, a first synchronous wheel (402) is sleeved on the side of the first rotating shaft (401) close to the fan leaf (411), and a second rotating shaft (404) and a third rotating shaft (406) are fixedly connected to one side of two fan leaves (411) respectively.

4. The cooling mechanism for tile adhesive processing according to claim 3, characterized in that: The second rotating shaft (404) and the third rotating shaft (406) are both rotatably connected to one side of the cooling box (1); a second synchronous wheel (405) is sleeved on the surface of the second rotating shaft (404) close to the first synchronous wheel (402); and the first synchronous wheel (402) and the second synchronous wheel (405) are sleeved on the same first synchronous belt (403).

5. The cooling mechanism for tile adhesive processing according to claim 4, characterized in that: A fifth synchronous wheel (409) is sleeved on the surface of the second rotating shaft (404) on the side close to the fan leaf (411), a fourth synchronous wheel (408) is sleeved on the surface of the third rotating shaft (406) on the side close to the fifth synchronous wheel (409), and the surfaces of the fourth synchronous wheel (408) and the fifth synchronous wheel (409) are sleeved on the same second synchronous belt (410).

6. The cooling mechanism for tile adhesive processing according to claim 5, characterized in that: The opening mechanism comprises a release plate (2), the release plate (2) being slidably connected to one side of the feed port (101), two hydraulic rods (201) being fixedly connected to the surface of the release plate (2) away from the feed port (101), both of the two hydraulic rods (201) being fixedly connected to the top of the cooling box (1), and a discharge port (102) being provided at the bottom of the cooling box (1) on the side close to the feed port (101).

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