Evaporation performance testing equipment for capillary structure of heat source
By designing a heat source capillary structure evaporation performance test device, the problem that existing equipment cannot evaluate the water volatilization rate on the capillary structure surface is solved. The accurate evaluation of the capillary structure evaporation performance and the efficient recycling of the test liquid are achieved, thereby improving the reliability and accuracy of the test.
Patent Information
- Application Number
- CN202422864241.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-22
AI Technical Summary
Existing testing equipment cannot effectively evaluate the volatilization rate of water on the surface of the capillary structure, and the manufacturing process of the phase change heat sink is complicated, which affects the accuracy and reliability of the test results.
A heat source capillary structure evaporation performance test equipment was designed, which included a test component and a heating component. By simulating the working environment of a phase change radiator, a circulation pump and a condenser were used to recycle the test liquid. Combined with temperature and pressure sensors, the evaporation performance of the capillary structure was accurately evaluated.
It achieves accurate evaluation of the evaporation performance of the capillary structure, avoids dry burning and steam flow effects, and improves the reliability and efficiency of the test.
Smart Images
Figure CN223449858U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to capillary structure test technical field, concretely relates to a heat source capillary structure evaporation performance test equipment. BACKGROUND
[0002] Phase change heat dissipation is the current advanced heat dissipation technology, utilizes the conversion of gas-liquid two-phase to realize heat exchange, and its heat conduction capacity is 1000 times of thermal good conductor. The existing phase change heat dissipation assembly structure is generally as follows: there is a layer of capillary structure on the inner wall of closed vacuum cavity, and contains moving fluid, liquid is evaporated as gas in the heat absorption area, flows to the condensation area, gas condenses when cold, and under the action of capillary force, flows back to the heat absorption area, so that heat is conducted out continuously, wherein the capillary structure can be divided into heat source evaporation capillary core and reflux capillary core, the reflux capillary core is the driving force for providing liquid evaporation and liquid continuous reflux, the heat source evaporation capillary core is applied to the heat source area of phase change heat sink, heat is transferred from the heat source to the evaporation capillary core, and then to water, and water is evaporated as water vapor to take away heat, therefore, the evaporation performance of capillary structure is the key parameter influencing the power of heat transfer assembly, and the evaluation of the evaporation performance of heat source evaporation capillary core has great significance for the design and manufacture of phase change heat sink device.
[0003] At present, when the evaporation performance of heat source evaporation capillary core is tested, generally, the bottom end of capillary structure is submerged in liquid, then the capillary structure is heated, the liquid absorbed in the capillary structure is evaporated by heat, and then the evaporation speed and temperature of liquid and other parameters are detected to evaluate the evaporation performance of capillary structure, but this kind of test method can only represent the speed of heat transfer from capillary structure to water, and cannot represent the speed of water evaporation on the surface of capillary structure.
[0004] In addition, after the capillary structure is made into phase change heat sink, the power and thermal resistance of phase change heat sink can also be tested to reflect the evaporation performance, but phase change heat sink has more than 20 manufacturing processes, and the long manufacturing process and unstable process have great influence on the test result. In addition, the heat transfer performance of phase change heat sink is influenced by various factors, such as: water cannot flow back quickly, leading to insufficient water in capillary core and dry burning; steam flow space is insufficient, leading to that gas cannot condense in time, and the evaporation speed of capillary structure is reduced, etc. The above reasons have great influence on the test of evaporation performance of capillary structure.
[0005] The information disclosed in this BACKGROUND section is only for the purpose of increasing the understanding of the background of the present utility model and should not be construed as acknowledging that this information constitutes related art of prior to the present utility model. CONTENT OF THE UTILITY MODEL
[0006] The utility model discloses a heat source capillary structure evaporation performance test equipment which is used to solve the problem of poor test liquid recycling efficiency of the existing test equipment.
[0007] In order to realize the above-mentioned purpose, the utility model discloses a heat source capillary structure evaporation performance test equipment which is used to solve the problem of poor test liquid recycling efficiency of the existing test equipment.
[0008] In one or more embodiments of the utility model, the test assembly further comprises an air extraction pump, and the air extraction pump is installed on a pipeline through which the input end of the condenser pipe and the test container are communicated.
[0009] In one or more embodiments of the utility model, the test assembly further comprises a vacuum pump and a pressure sensor, the vacuum pump is communicated with the test container and is used to adjust the air pressure in the test container, and the pressure sensor is installed in the test container and is used to detect the air pressure in the test container.
[0010] In one or more embodiments of the utility model, the test assembly further comprises a steam temperature sensor installed in the test container, the steam temperature sensor is arranged close to the accommodation hole and is used to detect the temperature of the water vapor evaporated in the capillary structure.
[0011] In one or more embodiments of the utility model, the test assembly further comprises a liquid temperature sensor installed in the test container, the liquid temperature sensor is located below the bottom edge of the accommodation hole and is used to detect the temperature of the test liquid in the test container.
[0012] In one or more embodiments of the utility model, the test assembly further comprises a liquid level sensor installed in the test container, and the liquid level sensor is used to detect the liquid surface height of the test liquid in the test container.
[0013] In one or more embodiments of the utility model, the output end of the first heater is communicated with the test container through a first liquid inlet pipe, and the connection between the first liquid inlet pipe and the test container is located below the bottom edge of the accommodation hole.
[0014] In one or more embodiments of the present application, the testing assembly further comprises a second liquid inlet pipe in communication with the testing container, and the connection between the second liquid inlet pipe and the testing container is located below the bottom edge of the accommodating hole.
[0015] In one or more embodiments of the present application, the testing assembly further comprises a sealing ring installed in the accommodating hole.
[0016] In one or more embodiments of the present application, the heating assembly further comprises a heat insulation layer arranged around the second heater, the heat conducting member and the heat source temperature sensor, and one end of the heat conducting member penetrates through the heat insulation layer and extends towards the accommodating hole.
[0017] In one or more embodiments of the present application, the heat source temperature sensor is inserted into the heat conducting member.
[0018] In one or more embodiments of the present application, the heat source temperature sensor is a thermocouple.
[0019] Compared with the prior art, the present application can effectively simulate the evaporation environment of the heat source capillary structure in the phase change heat dissipation device, test the ability of absorbing heat and evaporating water, and ensure that the heat source capillary structure has sufficient water and does not dry out. In addition, the speed of water vapor far away from the surface of the heat source capillary structure can be avoided to affect the evaporation speed of water, and the evaporation performance of the capillary structure can be tested in a constant negative pressure environment or a constant steam evaporation speed during the testing process. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0021] Figure 1 FIG. 1 is a structural schematic view of a heat source capillary structure evaporation performance testing device in Embodiment One of the present application;
[0022] Figure 2 FIG. 2 is a structural schematic view of a heating assembly in Embodiment One of the present application.
[0023] Explanation of main figure marks: 1. Test assembly, 101. Test container, 1011. Receiving hole, 102. Condenser, 1021. Shell, 1022. Condenser, 103. Circulation pump, 104. Refrigerator, 105. First heater, 106. Vacuum pump, 107. Vacuum pump, 108. Pressure sensor, 109. Steam temperature sensor, 110. Liquid temperature sensor, 111. Liquid level sensor, 112. First liquid inlet pipe, 113. Second liquid inlet pipe, 114. Sealing ring, 2. Heating assembly, 201. Second heater, 202. Heat conductor, 203. Heat source temperature sensor, 204. Thermal insulation layer, 3. Capillary structure, 4. Copper plate. DETAILED DESCRIPTION
[0024] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only a portion of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present invention.
[0025] In one embodiment, referring to Figure 1 and Figure 2 As shown, the present invention provides a heat source capillary structure evaporation performance test device, which includes a test assembly 1 and a heating assembly 2. The test assembly 1 includes a test container 101, a condenser 102, a circulating pump 103, a refrigerator 104, and a first heater 105. The interior of the test container 101 is used to accommodate the test liquid. The side wall of the test container 101 is provided with a receiving hole 1011 for accommodating the capillary structure 3. The condenser 102 includes a housing 1021 and a condenser tube 1022 disposed within the housing 1021. The input end of the condenser tube 1022 is connected to the test container 101, the output end of the condenser tube 1022 is connected to the input end of the first heater 105, and the output end of the first heater 105 is connected to the test container 101. The input and output ends of the refrigerator 104 are both connected to the housing 1021. The circulating pump 103 is installed on the pipe connecting the input end of the refrigerator 104 and the housing 1021. The heating component 2 includes a second heater 201, a heat conductor 202 and a heat source temperature sensor 203. One end of the heat conductor 202 is thermally connected to the second heater 201, and the other end extends toward the accommodating hole 1011 and is used to heat the capillary structure 3 in the accommodating hole 1011. The heat source temperature sensor 203 is in contact with the heat conductor 202 and is used to detect the temperature of the heat conductor 202.
[0026] According to the above structure, when the tester tests the heat dissipation performance of the capillary structure 3, the capillary structure 3 is placed in the accommodating hole 1011, and then the test liquid heated to a certain temperature is added into the test container 101, so that the liquid level of the test liquid is higher than the bottom edge of the accommodating hole 1011, and the capillary structure 3 is not completely submerged in the test liquid, that is, only the part of the capillary structure 3 close to the bottom edge of the capillary structure 3 is in contact with the test liquid to absorb the test liquid, and the part of the capillary structure 3 not in contact with the test liquid is used for the vapor generated in the capillary structure 3 to flow out of the capillary structure 3. Generally, the depth of the capillary structure 3 submerged in the test liquid can be set to 1 mm to 2 mm. Preferably, the submersion depth of the capillary structure 3 can be set to 2 mm.
[0027] Then the second heater 201 is started to heat the heat conduction member 202, so that the temperature of the heat conduction member 202 is higher than the temperature of the test liquid. Generally, the heating power of the second heater 201 can be controlled to 200 W to 1000 W, and the heating power of the second heater 201 can be kept constant or adjusted according to the needs of the tester. The temperature difference between the heat conduction member 202 and the test liquid can be controlled to 20°C to 30°C. After the heat conduction member 202 is heated, heat is conducted to the capillary structure 3 to heat the capillary structure 3, so that the test liquid in the capillary structure 3 is heated and evaporated, simulating the actual working state of the capillary structure 3.
[0028] During the above test process, the tester can detect the temperature of the heat conduction member 202 through the heat source temperature sensor 203 to know the temperature change of the heat conduction member 202 during the test. If the temperature of the heat conduction member 202 is always at a low level or fluctuates within a low level range, it indicates that the evaporation performance of the capillary structure 3 is strong. Otherwise, it indicates that the evaporation performance of the capillary structure 3 is weak.
[0029] When different capillary structures 3 need to be tested to compare their evaporation performances, the power of the second heater 201 can be kept constant during each test, and the temperature of the heat conduction member 202 during each test can be compared to evaluate the evaporation performance of each capillary structure 3. Generally, the lower the temperature of the heat conduction member 202, the better the evaporation performance of the capillary structure 3.
[0030] When the evaporation performance of the same capillary structure 3 at different temperature environments needs to be tested, the same capillary structure 3 can be tested multiple times by changing the power of the second heater 201.
[0031] And, in the above test process, the vapor formed by the evaporation of the test liquid inside the capillary structure 3 can enter the condensing pipe 1022 for condensation, and the liquid test liquid formed by condensation can flow back into the test container 101 after passing through the first heater 105, realizing the recycling of the test liquid. During the condensation process, the circulating pump 103 can accelerate the flow speed of the cooling medium inside the shell 1021, so that the cooling medium can quickly flow back into the condenser 104 after heat exchange with the vapor in the condensing pipe 1022, and the cooled condensing medium can quickly enter the shell 1021, improving the condensing efficiency of the condenser 102, and further improving the recycling efficiency of the test liquid.
[0032] In addition, it should be noted that the heat-conducting member 202 is generally made of metal material, and the length of the heat-conducting member 202 is generally within 5 mm. In order to avoid the test liquid inside the capillary structure 3 from contacting the heat-conducting member 202 to cause short circuit of the second heater 201, a copper plate 4 can be provided on the capillary structure 3, and the heat-conducting member 202 contacts the copper plate 4 to conduct heat to the inside of the capillary structure 3.
[0033] Generally, the shapes of the capillary structure 3 and the copper plate 4 can be set as cubes, the width of the capillary structure 3 can be set as 10 mm to 40 mm, and the thickness can be set as 0.05 mm to 5 mm, the thickness of the copper plate 4 can be set as 0.1 mm, and the two are fixed together by sintering process.
[0034] In an embodiment, referring to FIG. 1, Figure 1 As shown in FIG. 1, the test assembly 1 further comprises a suction pump 106, which is installed on the pipeline of the condensing pipe 1022 connected to the test container 101, and the suction pump 106 can adjust the speed of the vapor flowing out of the test container 101. During the test, the speed of the vapor flowing out of the test container 101 can also be used as a variable to design corresponding test experiments. For example, the power of the suction pump 106 can be adjusted to stabilize the speed of the vapor flowing out of the test container 101 at the same level or different levels during each test.
[0035] In an embodiment, referring to FIG. 1, Figure 1 As shown in FIG. 1, the test assembly 1 further comprises a vacuum pump 107 and a pressure sensor 108, the vacuum pump 107 is connected to the test container 101 for adjusting the air pressure in the test container 101, and the pressure sensor 108 is installed in the test container 101 for detecting the air pressure in the test container 101, the vacuum pump 107 and the pressure sensor 108 are designed in linkage, which can facilitate the test personnel to adjust and control the air pressure in the test container 101. Similarly, the air pressure in the test container 101 can also be used as a variable to design corresponding test experiments.
[0036] In an embodiment, referring to FIG. 1, Figure 1As shown, the test assembly 1 further comprises a vapor temperature sensor 109 installed in the test container 101, which is arranged close to the accommodation hole 1011 for detecting the temperature of the vapor evaporated in the capillary structure 3.
[0037] Further, the test assembly 1 further comprises a liquid temperature sensor 110 installed in the test container 101, which is arranged below the bottom edge of the accommodation hole 1011 for detecting the temperature of the test liquid inside the test container 101 and is designed in linkage with the first heater 105 for controlling the temperature of the test liquid.
[0038] In an embodiment, referring to Figure 1 As shown, the output end of the first heater 105 is connected with the test container 101 through a first liquid inlet pipe 112, and the connection between the first liquid inlet pipe 112 and the test container 101 is arranged below the bottom edge of the accommodation hole 1011, so that the liquid surface of the test liquid inside the test container 101 can be kept relatively calm and the fluctuation of the liquid surface can be avoided.
[0039] In an embodiment, referring to Figure 1 As shown, the test assembly 1 further comprises a liquid level sensor 111 installed in the test container 101, which is used for detecting the liquid level of the test liquid inside the test container 101, so as to stabilize the liquid level of the test liquid inside the test container 101 and keep the depth of the capillary structure 3 submerged in the test liquid at a fixed value.
[0040] The test assembly 1 further comprises a second liquid inlet pipe 113 connected with the test container 101, and the connection between the second liquid inlet pipe 113 and the test container 101 is arranged below the bottom edge of the accommodation hole 1011. When the flow of the test liquid in the first liquid inlet pipe 112 is too small to cause the liquid level of the test liquid in the test container 101 to drop, the test personnel can supplement the test liquid from outside to the test container 101 through the second liquid inlet pipe 113 to stabilize the liquid level of the test liquid.
[0041] In an embodiment, referring to Figure 2 As shown, the test assembly 1 further comprises a sealing ring 114 installed in the accommodation hole 1011, which is used for sealing the gap between the edge of the capillary structure 3 and the accommodation hole 1011 to prevent the test liquid and vapor in the test container 101 from overflowing out of the test container 101 through the gap.
[0042] In an embodiment, referring to Figure 1As shown, the heating assembly 2 further comprises a heat insulation layer 204, which is arranged around the second heater 201, the heat conducting member 202 and the heat source temperature sensor 203, so as to avoid heat exchange between the second heater 201, the heat conducting member 202 and the heat source temperature sensor 203 and the external environment, and improve the accuracy of the test result.
[0043] Further, one end of the heat conducting member 202 penetrates through the heat insulation layer 204 and extends towards the accommodating hole 1011, so as to facilitate the contact between the heat conducting member 202 and the capillary structure 3 or the copper plate 4 on the capillary structure 3.
[0044] Preferably, the heat source temperature sensor 203 is inserted into the heat conducting member 202, so as to detect the temperature inside the heat conducting member 202 and obtain more accurate detection result.
[0045] Preferably, the heat source temperature sensor 203 is a thermocouple. The distance between the thermocouple and the capillary structure 3 can be controlled within 2mm.
[0046] It should be noted that the test liquid in the above embodiment can be water or other liquid with similar evaporation property as water.
[0047] In actual application, the capillary structure 3 and the copper plate 4 are sintered together in advance, the capillary structure 3 is placed into the accommodating hole 1011, and the copper plate 4 on the outside is tightly attached to the heat conducting member 202, and a layer of heat conducting paste can be coated on the attachment surface of the two. Then, the test liquid is introduced into the test container 101, the heating power W of the second heater 201 is set, and the test negative pressure P inside the test container 101 is set. Then, the second heater 201 is started to heat the heat conducting member 202, the vacuum pump 107 is started to stabilize the test negative pressure P inside the test container 101, and the temperature T of the heat source temperature sensor 203 is recorded after the heat conducting member 202 heats the capillary structure 3 for 3 minutes.
[0048] Alternatively, the test personnel can maintain the test negative pressure P inside the test container 101 at a certain value, and set different heating power W for the second heater 201. During the test, the heating power W is increased at certain intervals until the temperature of the heat conducting member 202 cannot be kept stable. At this time, the heating power W obtained is the maximum heat transfer power of the capillary structure 3 corresponding to the test negative pressure P and the heat source temperature T.
[0049] It is apparent for a person skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, the scope of the present application being defined by the claims appended hereto rather than by the above description, and all the changes which fall within the meaning and the scope of the equivalent elements of the claims are intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.
[0050] Furthermore, it should be understood that, although the present specification is described according to the embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and a person skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be combined appropriately to form other embodiments which can be understood by a person skilled in the art.
Claims
1. A heat source capillary structure evaporation performance testing device, characterized in that: include: A test assembly (1) includes a test container (101), a condenser (102), a circulating pump (103), a refrigerator (104) and a first heater (105). The interior of the test container (101) is used to accommodate a test liquid. A receiving hole (1011) for accommodating a capillary structure (3) is provided on the side wall of the test container (101). The condenser (102) includes a shell (1021) and a condensing tube (1021) provided in the shell (1021). 022), the input end of the condenser (1022) is connected to the test container (101), the output end is connected to the input end of the first heater (105), the output end of the first heater (105) is connected to the test container (101), the input end and the output end of the refrigerator (104) are both connected to the shell (1021), and the circulating pump (103) is installed on the pipeline connecting the input end of the refrigerator (104) and the shell (1021); A heating assembly (2) comprises a second heater (201), a heat conducting member (202) thermally connected to the second heater (201), and a heat source temperature sensor (203) in contact with the heat conducting member (202), wherein one end of the heat conducting member (202) extends toward the accommodating hole (1011) and is used to heat the capillary structure (3) in the accommodating hole (1011).
2. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises an air extraction pump (106), which is installed on a pipe connecting the input end of the condenser (1022) and the test container (101).
3. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises a vacuum pump (107) and a pressure sensor (108); the vacuum pump (107) is in communication with the test container (101) and is used to adjust the air pressure in the test container (101); the pressure sensor (108) is installed in the test container (101) and is used to detect the air pressure in the test container (101).
4. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises a steam temperature sensor (109) installed in the test container (101), wherein the steam temperature sensor (109) is arranged close to the receiving hole (1011) and is used to detect the temperature of the water vapor evaporated in the capillary structure (3).
5. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises a liquid temperature sensor (110) installed in the test container (101), wherein the liquid temperature sensor (110) is located below the bottom edge of the accommodating hole (1011) and is used to detect the temperature of the test liquid inside the test container (101).
6. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises a liquid level sensor (111) installed in the test container (101), wherein the liquid level sensor (111) is used to detect the liquid level of the test liquid in the test container (101).
7. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The output end of the first heater (105) is connected to the test container (101) through a first liquid inlet pipe (112), and the connection between the first liquid inlet pipe (112) and the test container (101) is located below the bottom edge of the accommodating hole (1011).
8. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises a second liquid inlet pipe (113) connected to the test container (101), wherein the connection between the second liquid inlet pipe (113) and the test container (101) is located below the bottom edge of the accommodating hole (1011).
9. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The test assembly (1) further comprises a sealing ring (114) installed in the accommodating hole (1011).
10. The heat source capillary structure evaporation performance testing device according to claim 1, characterized in that: The heating assembly (2) further comprises a heat insulating layer (204) arranged around the second heater (201), the heat conducting member (202) and the heat source temperature sensor (203), one end of the heat conducting member (202) passing through the heat insulating layer (204) and extending toward the receiving hole (1011); and / or, The heat source temperature sensor (203) is inserted into the heat conducting member (202); and / or, The heat source temperature sensor (203) is a thermocouple.