Co-packaged optical device and photovoltaic module

Abstract

The utility model provides a photoelectric module and a co-packaging optical device comprising the same. A co-packaged optical device may include a package substrate; the electronic component is arranged on the packaging substrate; the optical transceiver is arranged on the packaging substrate and arranged around the electronic component, and the electronic component is electrically connected with the optical transceiver; and a waveguide member disposed on the package substrate. The waveguide member includes a waveguide block having an inward surface facing the optical transceiver and an outward surface opposite the inward surface; the first waveguide channel is embedded in the waveguide block and extends from the outward surface to the inward surface; and a second waveguide channel embedded in the waveguide block and extending from the outward-facing surface to the inward-facing surface, wherein the first waveguide channel intersects the second waveguide channel and is directed toward a different one of the optical transceivers.

Description

TECHNICAL FIELD

[0001] The present utility model relates to a packaged optical device and an optoelectronic module. BACKGROUND

[0002] In terms of IC development, there has been a general trend toward increasing functionality (i.e., the number of interconnected devices per chip area) and a simultaneous trend toward decreasing geometry (i.e., the smallest component (or line) that can be created by the manufacturing process). This shrinking process generally results in benefits such as increased production efficiency and reduced costs. This shrinking also increases the complexity of IC processing and manufacturing, and similar developments in packaging processing and manufacturing are needed to realize these advances. For example, co-packaged optical assemblies that integrate electrical and optical components have been developed to achieve higher capacity (e.g., smaller footprint), lower power consumption, and higher data speeds. SUMMARY

[0003] A co-packaged optical device of an embodiment of the present utility model can include a package substrate; electrical components disposed on the package substrate; optical transceivers disposed on the package substrate and arranged around the electrical components, wherein the electrical components are electrically connected to the optical transceivers. A waveguide component is disposed on the package substrate. The waveguide component includes a waveguide block having an inward-facing surface opposite the optical transceivers and an outward-facing surface opposite the inward-facing surface; a first waveguide channel embedded in the waveguide block and extending from the outward-facing surface to the inward-facing surface; and a second waveguide channel embedded in the waveguide block and extending from the outward-facing surface to the inward-facing surface, wherein the first waveguide channel intersects the second waveguide channel and is directed toward a different one of the optical transceivers. In some embodiments, the first waveguide channel and the second waveguide channel have a refractive index greater than the waveguide block. In some embodiments, the co-packaged optical device further includes a gap fill material between the optical transceivers and the waveguide block; and an intermediate waveguide channel surrounded by the gap fill material and extending between one of the first waveguide channel and the second waveguide channel and one of the optical transceivers. In some embodiments, the co-packaged optical device further includes an interposer substrate, wherein the electrical components and the optical transceivers are disposed on the interposer substrate and the interposer substrate is bonded to the package substrate. In some embodiments, the waveguide component is adhered to the package substrate.

[0004] An optoelectronic module according to embodiments of the present application can include a co-packaged optical device, a first fiber array unit, and a second fiber array unit. The co-packaged optical device includes a packaging substrate; an electronic component disposed on the packaging substrate; an optical transceiver disposed on the packaging substrate, arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceiver; a waveguide component disposed on the packaging substrate, wherein the waveguide component has an inward-facing surface facing the optical transceiver. The first fiber array unit is connected to the waveguide component. The second fiber array unit is attached to the waveguide component, wherein at least one of the optical fibers of the first fiber array unit and at least one of the optical fibers of the second fiber array unit communicate with a same one of the optical transceivers through the waveguide component. In some embodiments, the optical fibers in the first fiber array unit are polarization-maintaining optical fibers, and the optical fibers in the second fiber array unit are single-mode optical fibers. In some embodiments, the co-packaged optical device further includes a gap-filling material disposed on the packaging substrate between the optical transceiver and the inward-facing surface of the waveguide component, and an intermediate waveguide channel surrounded by the gap-filling material and extending between the waveguide component and the inward-facing surface of the optical transceiver.

[0005] A co-packaged optical device according to embodiments of the present application can include a packaging substrate; an electronic component disposed on the packaging substrate; an optical transceiver disposed on the packaging substrate, arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceiver. A waveguide block is disposed on the packaging substrate; a waveguide channel is embedded in the waveguide block, wherein an inward-facing end of the waveguide channel pointing towards the optical transceiver and an outward-facing end of the waveguide channel opposite to the inward-facing end are arranged in different orders. In some embodiments, two of the waveguide channels intersect and point to different ones of the optical transceivers.

[0006] In order to make the above features and advantages of the present application more obvious and easy to understand, the following embodiments are described in detail below, and the detailed description is made below with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a schematic diagram illustrating an optoelectronic module according to some embodiments of the present application.

[0008] Figure 2 is a schematic diagram illustrating a cross-sectional view of a co-packaged optical device with fiber array units attached according to some embodiments of the present application.

[0009] Figures 3 to 6 is a schematic diagram illustrating a manufacturing process of a waveguide channel according to some embodiments of the present application.

[0010] Figure 7 is a schematic diagram illustrating a manufacturing process of a waveguide channel according to some embodiments of the present application.

[0011] Figures 8A to 8CA cross-sectional view of some waveguide channels is schematically illustrated in accordance with some embodiments of the present application.

[0012] Figure 9 A cross-sectional view of a co-packaged optical device with an attached fiber array unit is schematically illustrated in accordance with some embodiments of the present application.

[0013] Figures 10 to 13 A manufacturing process of a fiber array unit is schematically illustrated in accordance with some embodiments of the present application.

[0014] Figure 14 and Figure 15 Various optical fibers are schematically illustrated in accordance with some embodiments of the present application. DETAILED DESCRIPTION

[0015] The following disclosure provides many different embodiments, or examples, for implementing different characteristics of the provided subject matter. Specific examples of structures and arrangements are described below to simplify the present application. These are, of course, merely examples and are not intended to be limiting. For example, forming a first feature over or above a second feature in the following description can include embodiments in which the first and second features are formed in direct contact, and can also include embodiments in which additional features can be formed between the first and second features such that the first and second features do not directly contact. Additionally, the present application can repeat use of reference numerals and / or letters in various examples. This repetition of reference numerals and / or letters is for the purpose of simplicity and clarity and does not necessarily indicate a common, shared, or related function between ilustrations that refer to a given reference numeral(s) and / or letter(s).

[0016] Also, for convenience, the present application can use spatial relative terms such as "beneath", "below", "lower", "above", "upper", and the like, to describe a relationship of one component to another in the drawings. Such spatially relative terms are not to be construed as limiting. The terms are used to describe relative and / or approximate positions of components as shown in the drawings and are not used to define absolute positions of the components. Unless otherwise noted, the terms are intended to encompass different orientations of the device in addition to the orientation depicted in the drawings. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0017] Figure 1 An optoelectronic module is schematically illustrated in accordance with some embodiments of the present application. The optoelectronic module 10 can include at least a co-packaged optical device 100 and a fiber array unit 200. In some embodiments, the fiber array unit 200 is optionally attached to the co-packaged optical device 100 in a detachable manner. In some embodiments, the co-packaged optical device 100 integrates optical and electronic components in one package, which shortens the electrical link length through the packaging and co-optimization of electronic and photonic components, thereby increasing the interconnect bandwidth density and energy efficiency.

[0018] Each fiber array unit 200 is composed of a plurality of optical fibers 210 assembled together by an optical connector 220. In some embodiments, a first fiber array unit 202 of the fiber array units 200 can be connected to an external laser source to transmit power, and a second fiber array unit 204 of the fiber array units 200 can be connected to an external device to transmit data signals between the external device and the co-packaged optical device 100. In some embodiments, the number of fiber array units 200 (e.g., the second fiber array unit 204) used to transmit data signals is greater than the number of fiber array units 200 (e.g., the first fiber array unit 202) used to transmit power. For example, Figure 1 The co-packaged optical device 100 in FIG. 1 is rectangular in a top view, and the four fiber array units 200 attached to each side of the co-packaged optical device 100 include one first fiber array unit 202 and three second fiber array units 204, but embodiments of the present application are not limited thereto. In some embodiments, the optical fibers 210 assembled in each fiber array unit 200 have the same configuration. For example, the optical fibers 210 assembled in the first fiber array unit 202 are polarization maintaining optical fibers, and the optical fibers 210 assembled in the second fiber array unit 204 are single-mode optical fibers, but embodiments of the present application are not limited thereto.

[0019] The co-packaged optical device 100 includes, for example, a package substrate 110, electronic components 120, optical transceivers 130, and waveguide components 140. The electronic components 120, the optical transceivers 130, and the waveguide components 140 are disposed and / or stacked on the package substrate 110. In some embodiments, the co-packaged optical device 100 can further include an interposer substrate 150. The electronic components 120 and the optical transceivers 130 are disposed on and carried by the interposer substrate 150, and the interposer substrate 150 is bonded to the package substrate 110. Thus, the interposer substrate 150 is located between the package substrate 110 and the electronic components 120. Figure 1 For a top view of the co-packaged optical device 100, the package substrate 110 can be covered / shielded by other components, such that the indication line of the package substrate 110 directly points to the edge of the co-packaged optical device 100.

[0020] In some embodiments, the electronic component 120 can be a switch chip, such as a switch application-specific integrated circuit (ASIC) chip, and the optical transceivers 130 are arranged around the electronic component 120. Each optical transceiver 130 includes an optoelectronic transducer for converting between optical signals and electrical signals and functions as an optical engine. The electronic component 120 is electrically connected to the optical transceivers 130. Each optical transceiver 130 can receive an optical signal from an external device and convert the optical signal to an electrical signal for transmission to the electronic component 120. Each optical transceiver 130 can receive an electrical signal from the electronic component 120 and convert the electrical signal to an optical signal for transmission to the external device via the fiber array unit 200. In some embodiments, the optical transceivers 130 can be implemented as semiconductor chips, such as photonic IC chips, that are bonded to the interposer substrate 150.

[0021] The waveguide component 140 is an optical component that guides the transmission of optical signals. In some embodiments, the waveguide component 140 includes a waveguide block 142 in which waveguide channels 144 are embedded. In some embodiments, the waveguide block 142 is made of a transparent material, such as glass, although embodiments of the present disclosure are not limited thereto. The waveguide block 142 of the waveguide component 140 has a shape that encloses the optical transceivers 130. The waveguide block 142 of the waveguide component 140 can extend along the periphery of the interposer substrate 150, appearing annular in a top view, with the optical transceivers 130 located within the area enclosed by the waveguide component 140. In some embodiments, the interposer substrate 150 has a rectangular shape, and the waveguide block 142 of the waveguide component 140 is formed to extend along the sides of the interposer substrate 150. In some embodiments, the waveguide block 142 can include segments that are separate from one another and extend along different sides of the interposer substrate 150, respectively.

[0022] The waveguide block 142 of the waveguide component 140 has an inner surface 1421 and an outer surface 142E. The inner surface 1421 faces the optical transceivers 130, and the outer surface 142E is opposite the inner surface 1421. The waveguide block 142 is configured to define the structural shape of the waveguide component 140 such that the inner surface 1421 and the outer surface 142E can also serve as surfaces of the waveguide component 140 and define the profile of the waveguide component 140. The waveguide channels 144 are formed in the waveguide block 142 to provide individual transmission paths for optical signals. Each waveguide channel 144 extends continuously from the inner surface 1421 to the outer surface 142E. The ends of each waveguide channel 144 reach the inner surface 1421 and the outer surface 142E, respectively. The fiber array unit 200 is connected to the waveguide component 140 and mechanically mates with the outer surface 142E according to the configuration of the waveguide channels 144. For example, the fiber array unit 200 is connected to the waveguide component 140 such that each optical fiber 210 is aligned with one of the waveguide channels 144.

[0023] For the purpose of description,Figure 1 A portion of the waveguide channels 144 embedded in the waveguide block 142 is omitted. Specifically, Figure 1 Only the waveguide channels 144 and two fiber array units 200 (i.e., one first fiber array unit 202 and one second fiber array unit 204) are presented. In some embodiments, the waveguide channels 144 include a first waveguide channel 144A and a second waveguide channel 144B. The first waveguide channel 144A provides an optical transmission path for the first fiber array unit 202, and the second waveguide channel 144B provides an optical transmission path for the second fiber array unit 204. In some embodiments, at least one of the optical fibers 210 of the first fiber array unit 202 and at least one of the optical fibers 210 of the second fiber array unit 204 communicate with the same one of the optical transceivers 130 through the waveguide member 140. In some embodiments, the first waveguide channel 144A establishes optical transmission paths from the first fiber array unit 202 to multiple ones of the optical transceivers 130, and the second waveguide channel 144B establishes optical transmission paths from the second fiber array unit 204 to one of the optical transceivers 130, although embodiments of the present application are not limited thereto. In some embodiments, the first waveguide channel 144A establishes optical transmission paths from the first fiber array unit 202 to multiple optical transceivers 130, and the second waveguide channel 144B also establishes optical transmission paths from the second fiber array unit 204 to multiple optical transceivers 130. In embodiments, two of the waveguide channels 144 intersect and are directed to different optical transceivers 130, respectively. For example, at least one of the first waveguide channels 144A intersects at least one of the second waveguide channels 144B and is directed to different optical transceivers 130. In some embodiments, the two waveguide channels 144 of interest can coincide with each other at the intersection point, and the signals transmitted in the two waveguide channels 144 of interest are independent of each other without interference.

[0024] In some embodiments, each first waveguide channel 144A has an inward end I144A reaching the inward surface 142I and an outward end E144A reaching the outward surface 142E, and similarly, each second waveguide channel 144B has an inward end I144B reaching the inward surface 142I and an outward end E144B reaching the outward surface 142E. In some embodiments, the outward ends E144A of the first waveguide channels 144A are arranged on the same side as the outward ends E144B of the second waveguide channels 144B, and one or more of the inward ends I144B of the second waveguide channels 144B are located between two of the inward ends I144A of the first waveguide channels 144A. Thus, the inward ends (I144A and I144B) of the waveguide channels 144 directed to the optical transceivers 130 and the outward ends (E144A and E144B) of the waveguide channels 144 opposite the inward ends (I144A and I144B) are arranged in different orders.

[0025] The refractive index of the waveguide channel 144 is greater than that of the waveguide bulk 142. Light entering the waveguide channel 144 can propagate in the waveguide channel 144, and the light propagating in the waveguide channel 144 can be reflected at the boundary of the waveguide channel 144 without being refracted into the waveguide bulk 142. That is, the light entering the waveguide channel 144 can be confined within the waveguide channel 144 and travel along the path defined by the waveguide channel 144. In some embodiments, the waveguide channel 144 is made of the same material as the waveguide bulk 142, but the crystallinity of the waveguide channel 144 is different from that of the waveguide bulk 142 to achieve a desired refractive index. In some embodiments, the waveguide channel 144 includes the same material as the waveguide bulk 142 and also includes an implanted material such that the refractive index of the waveguide channel 144 is greater than that of the waveguide bulk 142.

[0026] Figure 2 Schematically shows a cross-sectional view of a co-packaged optical device with an attached optical fiber array unit according to some embodiments of the present invention. Figure 2 The co-packaged optical device 100 includes a packaging substrate 110, an electronic component 120, an optical transceiver 130, a waveguide component 140, and an interposer substrate 150. In some embodiments, Figure 1 and Figure 2 The same reference numerals shown may refer to the same components or similar components providing similar functions, so that the descriptions of the components denoted by the same reference numerals in different embodiments may be combined with each other.

[0027] like Figure 2 As shown, the packaging substrate 110 includes a substrate plate 112, a contact pad 114, a redistribution wiring structure 116 and a substrate through-hole 118. The contact pad 114 and the redistribution wiring structure 116 are arranged on opposite sides of the substrate plate 112. The substrate through-hole 118 is formed in the substrate plate 112 and extends between the contact pad 114 and the redistribution wiring structure 116. The substrate through-hole 118 provides an electrical connection path between the contact pad 114 and the redistribution wiring structure 116. The redistribution wiring structure 116 includes one or more conductive wiring layers and one or more dielectric layers to establish the required electrical transmission path. In addition, the co-packaged optical device 100 also includes a conductor connector 160 arranged on the redistribution wiring structure 116 for connecting to an external system.

[0028] The electronic components 120 and the optical transceiver 130 are disposed on an interposer substrate 150 and the interposer substrate 150 is bonded to the package substrate 110 by a bonding member 152. The bonding member 152 is disposed between the contact pads 114 and the interposer substrate 150. In some embodiments, the bonding member 152 can be flip chip bumps, such as C4 bumps, although embodiments of the present application are not limited thereto. In some embodiments, the co-packaged optical device 100 can also include an underfill material 170 encapsulating the bonding member 152 under the interposer substrate 150. The interposer substrate 150 can include a rewiring structure and substrate vias, although Figure 2 The interposer substrate 150 can provide appropriate electrical transmission paths to electrically connect to the electronic components 120 and the optical transceiver 130. In some embodiments, the electronic components 120 are electrically connected to the optical transceiver 130 through the rewiring structure of the interposer substrate 150, although embodiments of the present application are not limited thereto. The substrate vias of the interposer substrate 150 can also form electrical transmission paths between the rewiring structure, the interposer substrate 150, and the bonding member 152. In some embodiments, the interposer substrate 150 can be a silicon substrate having the desired components thereon, although embodiments of the present application are not limited thereto.

[0029] The waveguide member 140 is disposed on the package substrate 110. In some embodiments, the waveguide member 140 is adhered to the package substrate 110. The waveguide member 140 includes a waveguide block 142 and waveguide channels 144 embedded in the waveguide block 142. The waveguide block 142 has an inward facing surface 142I facing the optical transceiver 130 and an outward facing surface 142E opposite the inward facing surface 142I. Each waveguide channel 144 has an inward end I144 reaching the inward facing surface 142I and an outward end E144 reaching the outward facing surface 142E. The waveguide block 142 is transparent and is, for example, a glass material. The waveguide block 142 has a sufficient thickness such that the inward end I144 of the waveguide channels 144 is directed at and aligned with a receiving structure (not shown) of the optical transceiver 130. In some embodiments, the waveguide block 142 can have a thickness such that a top surface T142 of the waveguide block 142 is at a level proximate to a top surface T130 of the optical transceiver 130, although embodiments of the present application are not limited thereto.

[0030] In some embodiments, the inward surface 1421 can contact the optical transceiver 130. In some embodiments, the inward surface 1421 can be attached to the optical transceiver 130 through an optically transparent medium such as optical clear adhesive. The optical fiber array unit 200 can be attached to the waveguide block 142 through the optically transparent medium (e.g., optical clear adhesive). In some embodiments, the optical fiber array unit 200 including the first optical fiber array unit 202 and the second optical fiber array unit 204 can be mechanically detached from the waveguide block 142. The optical fiber array unit 200 can be attached to the waveguide block 142 in a manner that one optical fiber 210 points to and is aligned with the outward end E144 of one waveguide channel 144.

[0031] In some embodiments, the waveguide channels 144 can be arranged in the same horizontal plane such that the waveguide channels 144 can be parallel to the plane of the package substrate 110 and the inward end 1144 of the waveguide channels 144 can be at the same horizontal level as the outward end E144 of the waveguide channels 144. In some embodiments, the waveguide channels 144 can be arranged obliquely with respect to the plane of the package substrate 110 and the inward end 1144 of the waveguide channels 144 can be at a different horizontal level than the outward end E144 of the waveguide channels 144. In some embodiments, two of the waveguide channels 144 are at different horizontal levels above the package substrate 110. In some embodiments, the waveguide channels 144 can be arranged at the shallow depth region of the waveguide block 142 of the waveguide channels 144 and the inward end 1144 and the outward end E144 of the waveguide channels 144 are close to the top surface T142 of the waveguide block 142. For example, the cross-sectional structure of the waveguide channels 144 can extend from the top surface T142 of the waveguide block 142 to a certain depth inside the waveguide block 142. The waveguide channels 144 can have a refractive index greater than that of the waveguide block 142 and can be distinguished from the waveguide block 142 through optical measurement techniques.

[0032] Figures 3 to 6 A manufacturing process of a waveguide channel according to some embodiments of the present application is schematically shown. In Figure 3 In some embodiments, a raw substrate 302 is provided and a mask layer 304 is formed on the outer surface of the raw substrate 302. The mask layer 304 has one or more openings 306 that expose a portion of the outer surface of the raw substrate 302 and cover the rest of the outer surface of the raw substrate 302. In some embodiments, the raw substrate 302 is a glass substrate or other light-transmissive substrate. In some embodiments, the material of the mask layer 304 can be aluminum (Al), titanium (Ti), other metallic material, or a combination thereof. The openings 306 can be formed through a lithography etching process.

[0033] In Figure 4 some embodiments, the unprocessed substrate 302 covered by the mask layer 304 is contacted with a first ion exchange solution 308. In some embodiments, the first ion exchange solution 308 is a solution of a first salt material, such as AgN03. In some embodiments, ion exchange between silver ions in the first ion exchange solution 308 and sodium ions in the unprocessed substrate 302 occurs at the outer surface of the unprocessed substrate 302 exposed by the openings 306. A modified region 302A is formed by the ion exchange process, which is distributed from the surface of the unprocessed substrate 302 exposed by the openings 306 to a certain depth (e.g., a few microns) of the unprocessed substrate 302.

[0034] In Figure 5 some embodiments, the mask layer 304 covering the unprocessed substrate 302 is removed and the unprocessed substrate 302 is contacted with a second ion exchange solution 310. In some embodiments, the second ion exchange solution 310 is a solution of a second salt material, such as NaN03. By contacting the unprocessed substrate 302 with the second ion exchange solution 310, silver ions near the surface are replaced by sodium ions and diffuse to a deeper depth of the unprocessed substrate 302. A waveguide channel 302B is then formed by the ion exchange process of the second ion exchange solution 310. In some embodiments, the waveguide channel 302B can include a core containing silver and a cladding layer containing sodium and cladding the core. In Figure 6 some embodiments, the unprocessed substrate 302 is cut into a desired shape using a cutting machine, such as a laser cutting machine, to obtain a waveguide member 300 including a waveguide block 302C and the waveguide channel 302B embedded therein. The waveguide block 302C is cut from the unprocessed substrate 302 and can be made of glass. The waveguide member 300 can be an implementation example of the waveguide member 140 described in the foregoing embodiments and other waveguide members described in the following embodiments.

[0035] Figure 7 A manufacturing process of a waveguide channel according to some embodiments of the present disclosure is schematically shown. As Figure 7 shown, a waveguide member 400 including a waveguide block 402 and a waveguide channel 404 embedded therein is manufactured by irradiating a laser beam 406 to a predetermined depth of the waveguide block 402 along a predetermined path. In some embodiments, the irradiation of the laser beam 404 causes crystallization of the material of the waveguide block 402 to form the waveguide channel 404 having a refractive index greater than the rest (e.g., unirradiated portions) of the waveguide block 402. The waveguide channel 404 has a greater degree of crystallinity than the waveguide block 402. The waveguide member 400 can be an implementation example of the waveguide member 140 described in the foregoing embodiments and other waveguide members described in the following embodiments.

[0036] Figures 8A to 8CA cross-sectional view of a plurality of waveguide channels according to some embodiments of the present application is schematically shown. In Figure 8A , the waveguide member 500A includes a waveguide block 502 and waveguide channels 504A1 and 504A2 embedded therein. The cross-sectional structure of the waveguide channel 504A1 can include a curved pattern, and the cross-sectional structure of the waveguide channel 504A2 can include a straight pattern extending at a common level. In Figure 8B , the waveguide member 500B includes a waveguide block 502 and a waveguide channel 504B embedded therein. The cross-sectional structure of the waveguide channel 504B can include an elliptical (or circular) pattern. In Figure 8C , the waveguide member 500C includes a waveguide block 502 and a waveguide channel 504C embedded therein. The cross-sectional structure of the waveguide channel 504C can include an inclined pattern extending to a certain depth from a top surface of the waveguide block 502 in an inclined direction. In some embodiments, the waveguide channels 504A1, 504A2, 504B and 504C can be fabricated by using the fabrication process described in Figure 7 . The structural pattern of the waveguide channels 504A1, 504A2, 504B and 504C can be determined by setting the irradiation depth, the action path, etc. of the laser beam 406. Figures 8A to 8C The structural patterns shown are exemplary examples, and are not intended to be limiting to the embodiments of the present application.

[0037] Figure 9 A cross-sectional view of a co-packaged optical device with a fiber array unit attached according to some embodiments of the present application is schematically shown. Figure 9 The co-packaged optical device 500 in Figure 1 includes a package substrate 110, an electronic member 120, an optical transceiver 130, a waveguide member 140, a spacer substrate 150, a conductor connection 160, an underfill material 170, a gap filling material 580 and an intermediate waveguide channel 590. In some embodiments, Figure 2 , Figure 9 the same reference numerals shown in Figure 1 and Figure 2 may refer to the same member or similar members providing similar functions, and thus the description of the members represented by the same reference numerals in different embodiments can be incorporated into each of the embodiments. Specifically, the description of the package substrate 110, the electronic member 120, the optical transceiver 130, the waveguide member 140, the spacer substrate 150, the conductor connection 160, the underfill material 170 can be referred to the embodiments of and

[0038] , and will not be repeated here. Figure 1 The waveguide member 140 of the co-packaged optical device 500 can have a different size design from the waveguide member 140 described in Figure 2 .Figure 9 The waveguide member 140 in FIG. 1C includes waveguide blocks 142' embedded therein and waveguide channels 144. The waveguide blocks 142' are spaced apart from the optical transceivers 130 by a gap G, and the top surfaces T142' of the waveguide blocks 142' can be lower than the optical transceivers 130. The waveguide blocks 142' have inward surfaces 1421' facing the optical transceivers 130 and outward surfaces 142E' opposite the inward surfaces 1421'. Each waveguide channel 144 extends from the inward surface 1421' to the outward surface 142E' and is not directly aligned with the receiving structure (not shown) of the corresponding optical transceiver 130.

[0039] The gap-filling material 580 is disposed between the optical transceivers 130 and the waveguide blocks 142', and the intermediate waveguide channels 590 extend between one of the waveguide channels 144 and one of the optical transceivers 130. The intermediate waveguide channels 590 are surrounded and encapsulated by the gap-filling material 580. The gap-filling material 580 fills the gap G and protects the intermediate waveguide channels 590. The intermediate waveguide channels 590 establish optical signal transmission paths between the waveguide channels 144 and the corresponding optical transceivers 130. The intermediate waveguide channels 590 can be polymer waveguide channels. In some embodiments, the intermediate waveguide channels 590 are fabricated by disposing a photosensitive material at the gap G, irradiating the photosensitive material with a laser beam along a predetermined path to form the intermediate waveguide channels 590, and removing other portions of the photosensitive material. The gap-filling material 580 can be formed to encapsulate the intermediate waveguide channels 590 after the intermediate waveguide channels 590 are formed. In some embodiments, the intermediate waveguide channels 590 have a refractive index greater than the gap-filling material 580. In some embodiments, the co-packaged optical device 500 can include multiple intermediate waveguide channels 590, and the intermediate waveguide channels 590 do not intersect each other.

[0040] Figures 10 to 13 A manufacturing process of a fiber array unit according to some embodiments of the present application is schematically shown. In Figure 10 In the process of FIG. 6A, a base 610 is provided and grooves 612 are formed on the base 610 by a cutting / grinding process. Figure 11 The process of FIG. 6B includes disposing optical fibers 620 on the base 610 and positioning the optical fibers 620 inside the grooves 612, respectively. Each optical fiber 620 can include a core 622 and a cladding 624. The cladding 624 at the end of each optical fiber 620 is removed, and the core at the end of each optical fiber 620 is placed on the corresponding groove 612. Figure 12 The process of FIG. 6C includes assembling a cover 630 with the base 610 to sandwich the optical fibers 620 therebetween. In some embodiments, the cover 630 is attached to the base 610 via an adhesive 640 and assembled with the base 610. Figure 13The manufacturing process includes polishing the end face of the structure so that the core 622 of the optical fiber 620 is substantially flat and smooth to obtain the optical fiber array unit 600. Specifically, the optical fiber array unit 600 may include an optical connector 650 assembled from a plurality of optical fibers 620, and the optical connector 650 includes at least a base 610 and a cover 630.

[0041] The optical fiber array unit 600 may be an implementation of the optical fiber array unit 200 described in the previous embodiment, so Figures 10 to 13 The description of the embodiment of the present invention can be incorporated into the previous embodiment. As described in the previous embodiment, the optical fibers 620 assembled in the optical fiber array unit 600 have the same structure. For example, in some embodiments, the optical fibers 620 assembled in the optical fiber array unit 600 are all single-mode optical fibers 620A (such as Figure 14 shown). Figure 14 The single-mode optical fiber 620A shown includes a core 622A and a cladding 624A. Since the orientation of the core 622A is not limited to a specific orientation, the single-mode optical fiber 620A has greater flexibility in alignment, which is beneficial to the manufacturing yield of the optical fiber array unit 600. In some embodiments, the optical fibers 620 assembled in the optical fiber array unit 600 are all polarization-maintaining fibers (e.g., Figure 15 (As shown in FIG. 1 ). The polarization-maintaining fiber 620B may include a core 622B, a cladding 624B, and a pair of stress rods 626. The core 622B and the stress rods 626 are encapsulated by the cladding 624B, with the core 622B positioned between the stress rods 626. The polarization-maintaining fiber 620B may be assembled in the fiber array unit 600 in a prescribed orientation to maintain linear polarization during propagation, which requires a certain degree of alignment accuracy.

[0042] In summary, co-packaged optical devices according to some embodiments of the present invention may include a waveguide structure that establishes an optical signal transmission path between an optical transceiver and an optical fiber array unit. The waveguide channels within the waveguide structure intersect with each other and redistribute the transmission paths of optical signals from the optical fibers assembled from the optical fiber array unit attached to the co-packaged optical assembly. The optoelectronic module and co-packaged optical device provide flexible transmission configurations for optical signals.

[0043] In some embodiments of the present application, a co-packaged optical device can include a package substrate; electronic components disposed on the package substrate; optical transceivers disposed on the package substrate, arranged around the electronic components, wherein the electronic components are electrically connected to the optical transceivers; and a waveguide component disposed on the package substrate. The waveguide component includes a waveguide block having an inward-facing surface facing the optical transceivers and an outward-facing surface opposite the inward-facing surface; a first waveguide channel embedded in the waveguide block and extending from the outward-facing surface to the inward-facing surface; and a second waveguide channel embedded in the waveguide block and extending from the outward-facing surface to the inward-facing surface, wherein the first waveguide channel intersects the second waveguide channel and points to different ones of the optical transceivers. The first waveguide channel and the second waveguide channel have a refractive index greater than the waveguide block. A gap filler material is disposed between the optical transceivers and the waveguide block. An intermediate waveguide channel is surrounded by the gap filler material and extends between one of the first waveguide channel and the second waveguide channel and one of the optical transceivers. The intermediate waveguide channel has a refractive index greater than the gap filler material. The waveguide block is made of a transparent material. The electronic components and the optical transceivers are disposed on an interposer substrate, which is bonded to the package substrate. The waveguide component is adhered to the package substrate.

[0044] In some embodiments of the present application, an optoelectronic module can include a co-packaged optical device, a first fiber array unit, and a second fiber array unit. The co-packaged optical device includes a package substrate; electronic components disposed on the package substrate; optical transceivers disposed on the package substrate, arranged around the electronic components, wherein the electronic components are electrically connected to the optical transceivers; and a waveguide component disposed on the package substrate, wherein the waveguide component has an inward-facing surface facing the optical transceivers. The first fiber array unit is connected to the waveguide component. The second fiber array unit is attached to the waveguide component, wherein at least one of the optical fibers of the first fiber array unit and at least one of the optical fibers of the second fiber array unit communicate with the same one of the optical transceivers through the waveguide component. The optical fibers of the first fiber array unit are polarization maintaining optical fibers. The optical fibers of the second fiber array unit are single mode optical fibers. The first fiber array unit and the second fiber array unit can be detached from the waveguide component. The co-packaged optical device further includes a gap filler material disposed on the package substrate between the optical transceivers and the inward-facing surface of the waveguide component; and an intermediate waveguide channel surrounded by the gap filler material and extending between the waveguide block and the inward-facing surface of the optical transceivers. The co-packaged optical device further includes an interposer substrate, on which the electronic components and the optical transceivers are disposed, the interposer substrate being bonded to the package substrate.

[0045] In some embodiments of the present application, the co-packaged optical device can include a package substrate; electronic components disposed on the package substrate; optical transceivers disposed on the package substrate, arranged around the electronic components, wherein the electronic components are electrically connected to the optical transceivers. A waveguide block material is disposed on the package substrate; waveguide channels are embedded in the waveguide block material, wherein the arrangement order of the inward end of the waveguide channels pointing to the optical transceivers and the outward end opposite to the inward end is different. Two waveguide channels intersect and point to different optical transceivers. Two waveguide channels are located at different heights above the package substrate. The electronic components and the optical transceivers are disposed on an intermediary substrate, and the intermediary substrate is bonded to the package substrate. The material of the waveguide block material is transparent material. The refractive index of the waveguide channels is greater than that of the waveguide block material.

[0046] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A co-packaged optical device, characterized in that include: packaging substrate; The electronic component is arranged on the packaging substrate; An optical transceiver is provided on the packaging substrate and arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceiver; as well as The waveguide member is provided on the packaging substrate and comprises: a waveguide block having an inwardly facing surface facing the optical transceiver and an outwardly facing surface opposite the inwardly facing surface; a first waveguide channel embedded in the waveguide block and extending from the outwardly facing surface to the inwardly facing surface; and A second waveguide channel is embedded in the waveguide block and extends from the outward-facing surface to the inward-facing surface, wherein the first waveguide channel and the second waveguide channel intersect and are directed toward different ones of the optical transceivers.

2. The co-packaged optical device according to claim 1, wherein: The first waveguide channel and the second waveguide channel have a refractive index greater than that of the waveguide bulk.

3. The co-packaged optical device according to claim 1, wherein: The invention further includes a gap filling material between the optical transceiver and the waveguide block; and an intermediate waveguide channel surrounded by the gap filling material and extending between one of the first waveguide channel and the second waveguide channel and one of the optical transceivers.

4. The co-packaged optical device according to claim 1, wherein: An interposer substrate is further included, wherein the electronic component and the optical transceiver are disposed on the interposer substrate and the interposer substrate is bonded to the packaging substrate.

5. The co-packaged optical device according to claim 1, wherein: The waveguide member is adhered to the packaging substrate.

6. A photovoltaic module, characterized in that: include: The co-packaged optical device includes: packaging substrate; The electronic component is arranged on the packaging substrate; An optical transceiver is provided on the packaging substrate and arranged around the electronic component, wherein the electronic component is electrically connected to the optical transceiver; and A waveguide member is disposed on the packaging substrate, wherein the waveguide member has an inward surface facing the optical transceiver; A first optical fiber array unit is attached to the waveguide member; and A second optical fiber array unit is attached to the waveguide member, wherein at least one optical fiber in the first optical fiber array unit and at least one optical fiber in the second optical fiber array unit are connected to the same one of the optical transceivers through the waveguide member.

7. The photovoltaic module according to claim 6, characterized in that: The optical fibers in the first optical fiber array unit are polarization-maintaining optical fibers, and the optical fibers in the second optical fiber array unit are single-mode optical fibers.

8. The photovoltaic module according to claim 6, wherein: The co-packaged optical device further includes a gap-filling material and an intermediate waveguide channel, wherein the gap-filling material is disposed on the packaging substrate and is located between the optical transceiver and the inward-facing surface of the waveguide member, and the intermediate waveguide channel is surrounded by the gap-filling material and extends between the waveguide member and the inward-facing surface of the optical transceiver.

9. A co-packaged optical device, characterized in that: include: packaging substrate; The electronic component is arranged on the packaging substrate; An optical transceiver is disposed on the packaging substrate and around the electronic component, wherein the electronic component is electrically connected to the optical transceiver; A waveguide block is provided on the packaging substrate; as well as A waveguide channel is embedded in the waveguide block, wherein an inward end of the waveguide channel directed toward the optical transceiver and an outward end opposite to the inward end of the waveguide channel are arranged in a different order.

10. The co-packaged optical device according to claim 9, wherein: Two of the waveguide channels intersect and point to different ones of the optical transceivers.

Images