Wafer edge searching and centering device

Abstract

The utility model discloses a wafer edge searching and centering device, and relates to the technical field of wafer processing. The wafer edge searching and centering device comprises a workbench, and an adsorption disc used for fixing a wafer is rotatably installed above the workbench; the sliding grooves are symmetrically formed in the upper portion of the workbench and located on the two sides of the adsorption disc. The moving assemblies are symmetrically installed below the workbench and correspond to the two sliding grooves respectively. The two laser sensors capable of moving under the driving of the moving frame are arranged to adapt to wafers of different specifications, the edges of the wafers can be detected from different side faces of the wafers, and the accurate positions of the edges of the wafers can be more effectively captured through the bilateral detection mode. The two sensors can provide data at the same time, so that errors possibly generated by a single sensor are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely is a wafer edge finding centering device. BACKGROUND

[0002] Wafer edge finding centering device is one of the key equipment in semiconductor manufacturing, it is mainly used in before wafer transmission to photoetching machine carries out photoetching, to wafer accurate centering and edge finding operation, wafer edge finding device identifies the boundary of wafer and then can calculate the center position of wafer.

[0003] Although the wafer edge finding centering device in prior art can be applicable to wafers of different sizes, the existing edge finding centering device often only has one laser sensor on one side to perform edge finding and centering work on the wafer, and when the only laser sensor has an error, the subsequent wafer processing is greatly affected, and even the wafer may be damaged. The precision of a single laser sensor cannot be guaranteed. In addition, when the edge detection assembly of the device is damaged, the device needs to be stopped for maintenance of the detection assembly, and the wafer edge finding and centering work cannot be performed until the maintenance is completed, which greatly affects the wafer processing process.

[0004] Therefore, it is necessary to provide a wafer edge finding centering device to solve the above technical problems. SUMMARY

[0005] (I) Technical problems solved

[0006] To solve the above technical problems, the utility model provides a wafer edge finding centering device.

[0007] (II) Technical solutions

[0008] To achieve the above purposes, the utility model is implemented by the following technical solutions: a wafer edge finding centering device, comprising:

[0009] A workbench is provided with an adsorption disc above the workbench for fixing a wafer.

[0010] Sliding grooves are symmetrically arranged above the workbench and located on both sides of the adsorption disc.

[0011] A moving assembly is symmetrically installed below the workbench and corresponds to the two sliding grooves respectively. The moving assembly is drivingly connected to a moving frame, and the moving frame extends to the upper side of the workbench through the sliding grooves. The moving assembly is used to drive the moving frame to move along the extension direction of the sliding grooves.

[0012] Laser sensors are detachably inserted into the upper end of the moving frame near one side of the adsorption disc, and the two laser sensors on both sides are symmetrically arranged.

[0013] The positioning component is installed on the mobile frame and is used to position the laser sensor on the mobile frame.

[0014] Preferably, the moving assembly includes a guide rod cylinder fixed below the workbench, and the output end of the guide rod cylinder is fixed to the side wall of the moving frame.

[0015] Preferably, a socket is fixed to a side of the upper end of the movable frame close to the adsorption plate, and one end of the laser sensor is plugged into the socket.

[0016] Preferably, the positioning assembly includes: a motor fixed to the inner wall of the workbench, the output end of the motor being transmission-connected to a hexagonal prism; the bottom ends of the two movable frames extending below the workbench are rotationally connected to sleeves via bearings, and the two sleeves on both sides are slidably sleeved on the outside of the hexagonal prism and are respectively located at the two ends of the hexagonal prism;

[0017] A cam is fixed to one end of the two sleeves that are close to each other, and a positioning rod is movably connected to one side of the two movable frames that are close to each other. The bottom of the positioning rod abuts against the edge of the outer wall of the cam at the longest radial distance from its own shaft hole. The upper end of the positioning rod also extends to the top of the workbench through the sliding groove, and its upper end is movably connected to the side wall of the sleeve through a sliding hole provided at the bottom of the sleeve.

[0018] The upper end of the positioning rod passes through the sliding hole and contacts the outer wall of the laser sensor inside the sleeve.

[0019] Preferably, both sides of the bottom of the positioning rod are arranged in an arc shape.

[0020] Preferably, a connecting sleeve is fixed on each side of the two movable frames that are close to each other, and the positioning rod is slidably inserted into the connecting sleeve.

[0021] (3) Beneficial effects

[0022] The utility model provides a wafer edge-finding and centering device. Compared with the prior art, it has the following beneficial effects:

[0023] 1. This application uses two laser sensors to detect the edge of the wafer from different sides. This bilateral detection method can more effectively capture the precise position of the wafer edge because the two sensors can provide data simultaneously, thereby reducing the error that may be caused by a single sensor.

[0024] 2. This application sets up a positioning component so that the laser sensor can be detachably mounted on a mobile frame, thereby facilitating the inspection and maintenance of the laser sensor. When any laser sensor fails, it can be replaced quickly and easily, thereby preventing delays in the wafer edge-finding and centering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is the whole structure schematic view of the utility model;

[0026] Figure 2 It is the guide rod cylinder and the moving frame relationship schematic view of the utility model;

[0027] Figure 3 It is the sleeve and the cam relationship schematic view of the utility model;

[0028] Figure 4 It is the positioning rod and the cam relationship schematic view of the utility model.

[0029] Reference numeral in the drawing: 1, workbench;2, adsorption disc;3, sliding groove;4, moving frame;5, laser sensor;6, guide rod cylinder;7, insert sleeve;8, hexagonal prism;9, sleeve;10, positioning rod;11, cam;12, motor;13, connecting sleeve. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0031] The utility model provides two technical schemes:

[0032] Figure 1 The first embodiment is shown: a wafer edge finding and centering device, comprising:

[0033] Workbench 1, the adsorption disc 2 for fixing wafer is rotatably installed above workbench 1;

[0034] Sliding groove 3, symmetrically set up above workbench 1 and located at both sides of adsorption disc 2;

[0035] Moving assembly, symmetrically installed below workbench 1, and respectively corresponding two sliding grooves 3 are set;The moving assembly is drivingly connected with a moving frame 4, and the moving frame 4 extends to the upper side of workbench 1 through the sliding groove 3, and the moving assembly is used to drive the moving frame 4 to move along the extension direction of the sliding groove 3;

[0036] Laser sensor 5, the upper end of moving frame 4 is detachably inserted near one side of adsorption disc 2, and two laser sensors 5 on both sides are symmetrically arranged;

[0037] Positioning assembly, installed on moving frame 4, for positioning laser sensor 5 on moving frame 4.

[0038] The application can adapt to different specifications of wafers by setting two laser sensors 5 which can move under the drive of the moving frame 4, and can detect the edges of the wafers from different sides of the wafers respectively. The double-side detection mode can more effectively capture the accurate position of the edges of the wafers, because the two sensors can provide data at the same time, thereby reducing the error that may be caused by a single sensor.

[0039] Figures 2 to 4 The second embodiment is shown, and the main difference from the first embodiment is that:

[0040] In a preferred embodiment, the moving assembly comprises a guide rod cylinder 6 fixed below the workbench 1, and the output end of the guide rod cylinder 6 is fixed with the side wall of the moving frame 4.

[0041] In a preferred embodiment, the upper end of the moving frame 4 is fixed with a bushing 7 near one side of the adsorption disc 2, and one end of the laser sensor 5 is inserted into the bushing 7.

[0042] In a preferred embodiment, the positioning assembly comprises a motor 12 fixed to the inner wall of the workbench 1, and the output end of the motor 12 is drivingly connected with a hexagonal prism 8. Further, the bottom end of the moving frame 4 extending into the workbench 1 below is rotatably connected with a sleeve 9 through a bearing, and the two sleeves 9 on both sides are slidingly sleeved outside the hexagonal prism 8 and are respectively located at both ends of the hexagonal prism 8. Since the moving frame 4 moves under the action of the guide rod cylinder 6, in addition to the sliding groove 3 providing guidance for it, the hexagonal prism 8 also provides guidance for it, so that the moving frame 4 can move stably.

[0043] In addition, one end of each of the two sleeves 9 close to each other is fixed with a cam 11, and one side of each of the two moving frames 4 close to each other is movably connected with a positioning rod 10, and the bottom of the positioning rod 10 abuts against the outer wall edge of the cam 11 at the radially longest distance of the axial hole. The positioning rod 10 also extends above the workbench 1 through the sliding groove 3, and the upper end is movably connected with the side wall of the bushing 7 through a sliding hole opened in the bottom of the bushing 7. In this way, the upper end of the positioning rod 10 abuts against the outer wall of the laser sensor 5 inside the bushing 7 through the sliding hole.

[0044] In a preferred embodiment, the bottom of the positioning rod 10 on both sides is arranged in a circular arc shape, which can stably contact the outer edge of the cam 11.

[0045] In a preferred embodiment, one side of each of the two moving frames 4 close to each other is fixed with a connecting sleeve 13, and the positioning rod 10 is slidingly inserted into the connecting sleeve 13, thereby further ensuring the stable connection of the positioning rod 10.

[0046] Specifically, the connecting sleeve 13 is arranged on the frame of the movable frame 4 above the workbench 1 and extends along the height direction of the movable frame 4. After the positioning rod 10 passes through the connecting sleeve 13, its upper end is bent toward the direction of the plug sleeve 7 and extends into the sliding hole at the bottom of the plug sleeve 7.

[0047] This application sets up a positioning component so that the laser sensor 5 can be detachably mounted on the mobile frame 4, thereby facilitating the inspection and maintenance of the laser sensor 5, and when any laser sensor 5 fails, it can be replaced quickly and conveniently, thereby preventing delays in the wafer edge-finding and centering process.

[0048] Working principle:

[0049] The wafer is placed on the adsorption plate 2, and the adsorption plate 2 adsorbs the wafer and rotates it. This is the existing technology and will not be described in detail. The two guide rod cylinders 6 start to drive the movable frame 4 to move along the slide 3 toward the adsorption plate 2. At the same time, the sleeve 9 will slide along the outer wall of the hexagonal prism 8. When the laser sensor 5 reaches the edge of the wafer, the laser sensor 5 will find the edge of the wafer, calculate the center position of the wafer, and complete the centering of the wafer.

[0050] When any laser sensor 5 fails, the driving motor 12 rotates the hexagonal prism 8, and the cams 11 on the outer walls of the two sleeves 9 rotate and deflect, and the positioning rod 10 moves downward in the connecting sleeve 13 under the action of gravity ( Figure 3 The state of the cam 11 shown in the figure is the orientation before rotation. After the cam 11 rotates, the radial distance of the cam 11 in contact with the positioning rod 10 becomes shorter, so the positioning rod 10 will move downward). Then, the tops of the two positioning rods 10 simultaneously cancel the tight positioning of the laser sensor 5. At this time, the laser sensor 5 to be replaced can be removed; the new laser sensor 5 is inserted into the inner wall of the socket 7 so that the motor 12 drives the hexagonal prism 8 to reverse, and the cam 11 is returned to its position. The returned cam 11 lifts the positioning rod 10, and the positioning rod 10 moves up in the connecting sleeve 13. The top of the positioning rod 10 is again pressed against the bottom of the new laser sensor 5, and the laser sensor 5 is positioned in the socket 7.

[0051] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0052] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0053] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A wafer edge-finding and centering device, characterized in that: include: A workbench (1), wherein a suction plate (2) for fixing a wafer is rotatably mounted above the workbench (1); The chute (3) is symmetrically arranged above the workbench (1) and located on both sides of the adsorption plate (2); A moving assembly is symmetrically mounted below the workbench (1) and is respectively arranged corresponding to the two slide grooves (3); the moving assembly is transmission-connected to a moving frame (4), the moving frame (4) extends to the top of the workbench (1) through the slide groove (3), and the moving assembly is used to drive the moving frame (4) to move along the extension direction of the slide groove (3); A laser sensor (5) is detachably plugged into the upper end of the movable frame (4) on one side close to the adsorption plate (2), with the two laser sensors (5) on both sides being symmetrically arranged; A positioning assembly is mounted on the mobile frame (4) and is used to position the laser sensor (5) on the mobile frame (4).

2. The wafer edge-finding and centering device according to claim 1, wherein: The moving assembly comprises a guide rod cylinder (6) fixed below the workbench (1), and an output end of the guide rod cylinder (6) is fixed to a side wall of the moving frame (4).

3. The wafer edge-finding and centering device according to claim 2, wherein: A socket (7) is fixed to the upper end of the movable frame (4) on a side close to the adsorption disk (2), and one end of the laser sensor (5) is plugged into the socket (7).

4. The wafer edge-finding and centering device according to claim 3, wherein: The positioning assembly comprises: a motor (12) fixed to the inner wall of the workbench (1), wherein the output end of the motor (12) is transmission-connected to a hexagonal prism (8); The bottom ends of the two movable frames (4) extending below the workbench (1) are rotatably connected to sleeves (9) via bearings, and the two sleeves (9) on both sides are slidably sleeved on the outside of the hexagonal prism (8) and are respectively located at the two ends of the hexagonal prism (8); A cam (11) is fixed to one end of each of the two sleeves (9) that are close to each other, and a positioning rod (10) is movably connected to one side of each of the two movable frames (4) on both sides that are close to each other. The bottom of the positioning rod (10) abuts against the outer wall edge of the cam (11) at the longest radial distance from its own shaft hole. The upper end of the positioning rod (10) also extends to the top of the workbench (1) through the slide groove (3), and its upper end is movably connected to the side wall of the sleeve (7) through a slide hole provided at the bottom of the sleeve (7); The upper end of the positioning rod (10) passes through the sliding hole and contacts the outer wall of the laser sensor (5) inside the sleeve (7).

5. The wafer edge-finding and centering device according to claim 4, characterized in that: Both sides of the bottom of the positioning rod (10) are arranged in an arc shape.

6. The wafer edge-finding and centering device according to claim 4, characterized in that: A connecting sleeve (13) is fixed on one side of the two movable frames (4) that are close to each other, and the positioning rod (10) is slidably inserted into the connecting sleeve (13).

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