Fixing structure, wafer box assembly and semiconductor process equipment
By designing fixed structures and detection components that adapt to wafer boxes of different sizes, the problem of inaccurate wafer box positioning in semiconductor process equipment is solved, achieving efficient wafer placement and preventing damage.
Patent Information
- Application Number
- CN202422755479.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-12
AI Technical Summary
Existing semiconductor process equipment cannot adapt to wafer boxes of different sizes, resulting in failure of the robot to pick up or place wafers, affecting work efficiency and possibly damaging the wafers.
A fixed structure is designed, including a base, a limit assembly and an adjustment assembly, which can flexibly adjust the width and height of the wafer box to accommodate wafer boxes of different sizes, and ensure accurate positioning and detection through the box body detection assembly.
It improves the success rate of wafer removal or placement, prevents wafer damage, and improves the adaptability and work efficiency of the equipment.
Smart Images
Figure CN223450878U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor manufacturing equipment especially relates to a fixed knot constructs, wafer box assembly and semiconductor technology equipment. BACKGROUND
[0002] High temperature oxidation, annealing is the important technological process in the semiconductor chip manufacturing process, mainly used for wafer implantation doped after activation treatment, lattice damage repair and generate oxide film on wafer surface.And semiconductor technology equipment is the commonly used equipment of wafer high temperature oxidation, annealing.
[0003] In semiconductor technology equipment, the position of wafer in wafer box is usually identified, and then the wafer is taken and placed by mechanical hand. There are many different sizes of wafer on the market, and the corresponding wafer box size is also different. Wafer box is usually fixed on the loading platform of semiconductor technology equipment for mechanical hand to take and place wafer. The fixing mode of the loading platform provided in the prior art is relatively single, and it cannot adapt to wafer boxes of different width sizes and different height sizes, so that the mechanical hand cannot align the wafer box for taking or placing wafer, resulting in failure of taking or placing wafer, affecting work efficiency and easily causing damage to wafer.
[0004] Therefore, a fixed knot constructs, wafer box assembly and semiconductor technology equipment are needed to solve the above problems. UTILITY MODEL CONTENTS
[0005] According to one aspect of the utility model, the purpose is to provide a fixed knot constructs, which can flexibly adjust the width size and height size to adapt to the fixed installation of different wafer box bodies on the loading platform, improve the success rate of wafer taking or placing, and prevent wafer damage.
[0006] To achieve this purpose, the utility model adopts the following technical scheme:
[0007] The fixed knot constructs comprises:
[0008] The base is installed on the loading platform of the semiconductor technology equipment.
[0009] The limiting assembly is arranged on the base and comprises a plurality of limiting pieces arranged at intervals, and a positioning space with adjustable size in the X direction is formed between the plurality of limiting pieces, and the wafer box body of the wafer box assembly can be positioned in the positioning space.
[0010] The adjusting assembly is arranged on the base and connected to the loading platform, and the adjusting assembly is adjustable in height in the Z direction.
[0011] The X direction is perpendicular to the Z direction.
[0012] As a preferred scheme of the fixing structure provided by the utility model, the plurality of limiters comprises first limiters and second limiters, first installation grooves and second installation grooves are provided on the base and are spaced apart along the X direction, the first limiters and the second limiters are respectively arranged in the first installation grooves and the second installation grooves and are positionally adjustable along the X direction.
[0013] As a preferred scheme of the fixing structure provided by the utility model, the plurality of limiters further comprises third limiters and fourth limiters, the third limiters and the fourth limiters are arranged on the base and are spaced apart along the X direction;
[0014] At least one of the third limiters and the fourth limiters is provided with a limiting groove, the wafer box body is provided with a first positioning pin at a position corresponding to the limiting groove, and the first positioning pin can be embedded in the limiting groove; and / or,
[0015] At least one of the third limiters and the fourth limiters is provided with a second positioning pin, and the wafer box body is provided with a limiting hole at a position corresponding to the second positioning pin, and the second positioning pin can be inserted into the limiting hole.
[0016] As a preferred scheme of the fixing structure provided by the utility model, the base is provided with an adjusting screw hole, the adjusting assembly comprises an adjusting bolt, the adjusting bolt is screw-connected in the adjusting screw hole and is height-adjustable along the Z direction, and the adjusting bolt is supported on the loading platform;
[0017] The distance between the base and the loading platform is equal to the length of the adjusting bolt exposed between the base and the loading platform.
[0018] As a preferred scheme of the fixing structure provided by the utility model, the adjusting assembly further comprises a supporting bolt, the adjusting bolt is internally hollow to form an installation hole, the supporting bolt is arranged in the installation hole and is screw-connected in a preset screw hole of the loading platform.
[0019] As a preferred scheme of the fixing structure provided by the utility model, the fixing structure further comprises a box body detection assembly, the box body detection assembly comprises a sensing pin and a slot-shaped photoelectric sensor, the slot-shaped photoelectric sensor is arranged in a containing groove of the base, the sensing pin is arranged in a through hole of the base, the through hole is communicated with a pair of emitting slots of the slot-shaped photoelectric sensor, the sensing pin can be moved into the pair of emitting slots of the slot-shaped photoelectric sensor along the Z direction under the pressing action of the wafer box body and blocks first pair of emitting light rays in the pair of emitting slots;
[0020] The box detection assembly further comprises an elastic element, the inductive pin is provided with an abutting ring table, the elastic element is sleeved outside the inductive pin and abuts against the base and the abutting ring table at two ends respectively, and the elastic element can be compressed under the pressing action of the wafer box body on the inductive pin; the inductive pin can exit the pair of shooting grooves in the Z direction under the elastic action of the elastic element.
[0021] As a preferred scheme of the fixing structure provided by the utility model, the base is provided with a support, the support is provided with a pin hole, the support can be supported on the bottom of the wafer box body, the inductive pin is movably penetrated through the pin hole and can abut against the bottom of the wafer box body.
[0022] According to still another aspect of the utility model, a wafer box assembly is provided, the wafer box assembly comprises the wafer box body and the fixing structure according to any one of the above schemes, the wafer box body can accommodate wafer pieces, and the fixing structure is configured to fix the wafer box body on the loading platform of the semiconductor process equipment.
[0023] According to still another aspect of the utility model, a semiconductor process equipment is provided, the semiconductor process equipment comprises a rack, a mechanical hand, the loading platform and the wafer box assembly according to the above scheme, the fixing structure is arranged on the loading platform, and the mechanical hand is configured to grab or place the wafer pieces in the wafer box body.
[0024] As a preferred scheme of the semiconductor process equipment provided by the utility model, the semiconductor process equipment further comprises a wafer detection assembly, which can detect the placement state of the wafer pieces in the wafer box body.
[0025] The wafer detection assembly comprises a first detection element and a second detection element, the first detection element is arranged on the rack of the semiconductor process equipment and located above the wafer box body, the second detection element is arranged on the base, the first detection element and the second detection element can form second pair of shooting light rays at the clamping groove opening of the wafer box body, and the wafer pieces protruding from the clamping groove opening can block the second pair of shooting light rays.
[0026] The utility model has the advantages of:
[0027] The fixing structure provided by the utility model includes a base, a limiting assembly, an adjusting assembly and a wafer detection assembly. The base can be installed on a loading platform of a semiconductor process equipment. The limiting assembly is arranged on the base and includes multiple limiting pieces arranged at intervals. A positioning space with adjustable size in the X direction is formed between the limiting pieces, and a wafer box body of a wafer box assembly can be positioned in the positioning space. The adjusting assembly is arranged on the base and connected to the loading platform, and the adjusting assembly is adjustable in height in the Z direction. Through the multiple limiting pieces, the wafer box body of multiple width sizes can be fixed. Through the adjusting assembly, the height of the base can be adjusted according to the wafer box body of different height sizes and the grabbing position of a mechanical hand of the semiconductor process equipment, so that the height of the wafer box body is adjusted, the success rate of wafer picking or wafer placing is improved, and the wafer is prevented from being damaged. BRIEF DESCRIPTION OF DRAWINGS
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the drawings needed to be used in the description of the embodiments of the utility model will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the contents of the embodiments of the utility model and the drawings by those skilled in the art without creative labor.
[0029] Figure 1 is a schematic view of a wafer box assembly provided by the embodiments of the utility model containing a wafer sheet;
[0030] Figure 2 is a partial structure schematic view of a wafer box assembly provided by the embodiments of the utility model;
[0031] Figure 3 is an exploded schematic view of a wafer box assembly provided by the embodiments of the utility model;
[0032] Figure 4 is a structure schematic view of a fixing structure provided by the embodiments of the utility model;
[0033] Figure 5 is a front view of a fixing structure provided by the embodiments of the utility model;
[0034] Figure 6 is Figure 5 a sectional view in the direction of A-A in figure;
[0035] Figure 7 is a structure schematic view of a box body detection assembly provided by the embodiments of the utility model.
[0036] In the figure:
[0037] 1, wafer sheet;
[0038] 10, wafer box body; 11, first positioning pin; 12, limiting hole;
[0039] 100, base; 110, first mounting groove; 120, second mounting groove; 130, adjusting screw hole; 140, accommodating groove; 150, support; 151, pin hole;
[0040] 200, limiting assembly; 210, first limiting piece; 220, second limiting piece; 230, third limiting piece; 231, limiting groove; 240, fourth limiting piece;
[0041] 300, adjusting assembly; 310, adjusting bolt; 311, mounting hole;
[0042] 400, wafer detection assembly; 410, first detection piece; 420, second detection piece; 430, second pair of light beams;
[0043] 500, box body detection assembly; 510, inductive pin; 511, abutting ring table; 520, slot-shaped photoelectric sensor; 521, pair of slots; 530, elastic element. DETAILED DESCRIPTION
[0044] The technical solutions of the present application will be further described below in conjunction with the accompanying drawings and through specific embodiments.
[0045] To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.
[0046] Therefore, the detailed description of the embodiments of the present application provided in the accompanying drawings below is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.
[0047] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0048] In the description of the utility model, it needs to explain that, the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the utility model product is used, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description and cannot be understood as indicating or implying relative importance. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.
[0049] In the description of the utility model, it also needs to explain that, unless otherwise specified and limited, the terms "set", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0050] In the utility model, unless otherwise specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0051] In the embodiment of the utility model, the term "and / or" is only a description of the association relationship of the associated object, which means that there can be three kinds of relationships, for example, A and / or B, which can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in the utility model generally indicates that the front and rear associated objects have an "or" relationship.
[0052] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.
[0053] The embodiment provides a fixing structure, a wafer box assembly and a semiconductor process equipment.
[0054] Figure 1 is a schematic view of a wafer box assembly provided by the embodiment of the utility model accommodating a wafer sheet; Figure 2 is a partial structure schematic view of the wafer box assembly provided by the embodiment of the utility model; Figure 3 is an exploded schematic view of the wafer box assembly provided by the embodiment of the utility model. Figures 1-3 The wafer box assembly comprises a wafer box body 10 and the fixing structure provided by the embodiment. The wafer box body 10 is positioned and carried on the fixing structure. The wafer box body 10 can accommodate the wafer sheet 1.
[0055] The semiconductor process equipment comprises a rack, a mechanical hand, a loading platform and the wafer box assembly provided by the embodiment. The rack is erected above the loading platform. The wafer box body 10 is fixed on the loading platform of the semiconductor process equipment through the fixing structure provided by the embodiment. The mechanical hand is configured to grab or place the wafer sheet 1 in the wafer box body 10. In the embodiment, the semiconductor process equipment can be a SiC high-temperature equipment.
[0056] Figure 4 is a structure schematic view of the fixing structure provided by the embodiment, referring to Figures 1-4 The fixing structure provided by the embodiment comprises a base 100, a limiting assembly 200 and an adjusting assembly 300. The base 100 can be installed on the loading platform of the semiconductor process equipment. The limiting assembly 200 is arranged on the base 100 and comprises a plurality of limiting pieces arranged at intervals, and a positioning space with adjustable size in the X direction is formed between the limiting pieces, and the wafer box body 10 of the wafer box assembly can be positioned in the positioning space. The adjusting assembly 300 is arranged on the base 100 and connected to the loading platform, and the adjusting assembly 300 is adjustable in height in the Z direction. Through the plurality of limiting pieces, the fixing of the wafer box body 10 with various width sizes can be adapted, and through the adjusting assembly 300, the height of the base 100 can be adjusted according to the wafer box body 10 with different height sizes and the grabbing position of the mechanical hand of the semiconductor process equipment, so as to adjust the height of the wafer box body 10, improve the success rate of wafer grabbing or placing, and prevent the wafer sheet 1 from being damaged.
[0057] It should be noted that, in the embodiment, the Z direction is the vertical direction, the X direction is perpendicular to the Z direction and parallel to the width direction of the base 100.
[0058] Continuing to refer to Figures 1-4The plurality of limiting members of the limiting assembly 200 includes a first limiting member 210 and a second limiting member 220. The base 100 is provided with a first mounting slot 110 and a second mounting slot 120 spaced apart along the X direction, and the first limiting member 210 and the second limiting member 220 are respectively arranged in the first mounting slot 110 and the second mounting slot 120 in a position-adjustable manner along the X direction. The first limiting member 210 and the second limiting member 220 can respectively position the wafer box body 10 on the opposite sides in the X direction. Through the first mounting slot 110 and the second mounting slot 120, the first limiting member 210 and the second limiting member 220 can be limited in the Y direction.
[0059] Specifically, the first mounting slot 110 is provided with a first threaded hole at the bottom, and the first limiting member 210 is provided with a first waist countersunk hole. The diameter of the first waist countersunk hole is larger than that of the first threaded hole, and the first bolt passes through the first waist countersunk hole and is screwed into the first threaded hole. Through the above arrangement, after the first bolt is loosened relative to the first threaded hole, the fixed position can be selected within the long axis range of the first waist countersunk hole, so as to realize the fine adjustment of the position of the first limiting member 210 in the first mounting slot 110 along the X direction.
[0060] Similarly, the second mounting slot 120 is provided with a second threaded hole at the bottom, and the second limiting member 220 is provided with a second waist countersunk hole. The diameter of the second waist countersunk hole is larger than that of the second threaded hole, and the second bolt passes through the second waist countersunk hole and is screwed into the second threaded hole. Through the above arrangement, after the second bolt is loosened relative to the first threaded hole, the fixed position can be selected within the long axis range of the second waist countersunk hole, so as to realize the fine adjustment of the position of the second limiting member 220 in the second mounting slot 120 along the X direction.
[0061] Specifically, the plurality of limiting members further include a third limiting member 230 and a fourth limiting member 240. The third limiting member 230 and the fourth limiting member 240 are arranged along the X direction and are fixed on the base 100 by connecting bolts. In the embodiment, the first limiting member 210, the second limiting member 220, the third limiting member 230, and the fourth limiting member 240 are arranged in a rectangular array. At least one of the third limiting member 230 and the fourth limiting member 240 is provided with a limiting groove 231, and the front end of the wafer box body 10 is provided with a first positioning pin 11 corresponding to the position of the limiting groove 231, which can be embedded in the limiting groove 231. Alternatively, at least one of the third limiting member 230 and the fourth limiting member 240 is provided with a second positioning pin (not shown), and the front end of the wafer box body 10 is provided with a limiting hole 12 corresponding to the position of the second positioning pin, which can be inserted into the limiting hole 12. Through the cooperation of the first positioning pin 11 and the limiting groove 231, and the cooperation of the second positioning pin and the limiting hole 12, the wafer box body 10 can be reliably connected to the third limiting member 230 and the fourth limiting member 240.
[0062] In the embodiment, the third limiting member 230 is provided with a limiting groove 231, and the fourth limiting member 240 is provided with a second positioning pin towards the front end of the wafer box body 10. The front end of the wafer box body 10 is provided with a first positioning pin 11 corresponding to the position of the limiting groove 231, which can be embedded in the limiting groove 231. The front end of the wafer box body 10 is provided with a limiting hole 12 corresponding to the position of the second positioning pin, which can be inserted into the limiting hole 12. Through the above arrangement, when the wafer box body 10, the third limiting member 230, and the fourth limiting member 240 are assembled, the placement direction of the wafer box body 10 can be identified through the corresponding relationship between the limiting groove 231 and the first positioning pin 11, and the corresponding relationship between the second positioning pin and the limiting hole 12, avoiding the wrong placement of the wafer box body 10 and improving the foolproof performance.
[0063] Continuing to refer to Figure 3 and Figure 4The base 100 is provided with an adjusting screw hole 130, and the adjusting assembly 300 comprises an adjusting screw 310. The adjusting screw 310 is screw-connected to the adjusting screw hole 130 in a height-adjustable manner along the Z direction, and the adjusting screw 310 is supported on the loading platform. The spacing between the base 100 and the loading platform is equal to the length of the adjusting screw 310 exposed between the base 100 and the loading platform. By adjusting the screwing depth of the adjusting screw 310 in the adjusting screw hole 130, the length of the part of the adjusting screw 310 protruding from the lower end surface of the base 100 can be adjusted, and then the height of the base 100 in the Z direction can be adjusted, and then the spacing between the base 100 and the loading platform can be adjusted, so that the height of the wafer box body 10 is adjusted, and the position of the wafer box body 10 is further adapted to the picking or placing height of the mechanical hand.
[0064] The adjusting screw hole 130 is provided with a plurality of adjusting screw holes 130, and in the embodiment, the adjusting screw hole 130 is specifically provided with four adjusting screw holes 130, and the four adjusting screw holes 130 are arranged in a rectangular array, and one adjusting screw 310 is arranged in each adjusting screw hole 130. By adjusting the length of the part of each adjusting screw 310 protruding from the lower end surface of the base 100, the base 100 can be leveled.
[0065] As an option, the adjusting assembly 300 further comprises a supporting screw (not shown in the figure), the adjusting screw 310 is internally hollow to form a mounting hole 311, the supporting screw is arranged in the mounting hole 311 and screw-connected to a preset screw hole of the loading platform. The adjusting screw 310 is further provided with a countersunk hole coaxially and communicatively arranged with the mounting hole 311, the head of the supporting screw can be sunk in the countersunk hole and abut against the step structure formed between the countersunk hole and the mounting hole 311, so as to stably abut the adjusting screw 310 against the loading platform. And by arranging the countersunk hole, the head of the supporting screw can be avoided from protruding from the top end of the adjusting screw 310, and the flatness of the upper end surface of the base 100 is improved.
[0066] Figure 5 is the front view of the fixing structure provided by the embodiment of the utility model, Figure 6 is Figure 5 is the sectional view of A-A direction in figure Figure 7 is the structure schematic view of the box body detection assembly provided by the embodiment of the utility model. Refer to Figures 5-7The fixing structure further comprises a box body detection assembly 500, which comprises a sensing pin 510 and a slot photoelectric sensor 520. The lower end surface of the base 100 is provided with a receiving slot 140, and the slot photoelectric sensor 520 is arranged in the receiving slot 140. The sensing pin 510 is arranged in a through hole of the base 100, and the through hole is communicated with the receiving slot 140 and a pair of light receiving slots 521 of the slot photoelectric sensor 520. The sensing pin 510 can be driven by the wafer box body 10 to extend into the pair of light receiving slots 521 of the slot photoelectric sensor 520 in the Z direction, and block the first pair of light rays in the pair of light receiving slots 521. When the first pair of light rays is blocked, the slot photoelectric sensor 520 will feed back a signal to the controller of the semiconductor process equipment, so as to identify that the wafer box body 10 has been placed on the base 100.
[0067] Specifically, the box body detection assembly 500 further comprises a resilient element 530. The sensing pin 510 is provided with an abutting ring table 511, and the resilient element 530 is sleeved on the sensing pin 510. The upper end surface of the base 100 is provided with a countersunk mounting slot, and the sensing pin 510 can penetrate through the countersunk mounting slot and extend into the pair of light receiving slots 521. The two ends of the resilient element 530 are respectively abutted against the bottom of the countersunk mounting slot and the lower end surface of the abutting ring table 511. The resilient element 530 can be compressed under the pressure of the wafer box body 10 on the sensing pin 510. The sensing pin 510 can be driven by the elastic element 530 to exit the pair of light receiving slots 521 in the Z direction. That is, through the resilient element 530, the sensing pin 510 can be driven to move upward to the original position after the wafer box body 10 is removed from the base 100.
[0068] Specifically, the base 100 is provided with a support 150. The support 150 has a long strip structure and is arranged along the Y direction. A pin hole 151 is formed in the support 150 corresponding to the position of the sensing pin 510. The support 150 can be supported on the bottom of the wafer box body 10. The sensing pin 510 is movably penetrated through the pin hole 151 and protrudes from the upper end surface of the support 150. When the wafer box body 10 is placed on the support 150, the sensing pin 510 can be pressed to trigger the operation of the groove photoelectric sensor 520. In the embodiment, two supports 150 are arranged on the base 100 and are spaced apart in the X direction. The support 150 can provide more stable support for the wafer box body 10. The support 150 can facilitate the installation of the sensing pin 510 and the positioning of the sensing pin 510 in the X direction and the Y direction. In addition, the support 150 can facilitate the replacement of supports 150 with different sizes in the Z direction to adapt to the manufacturing tolerance of the wafer box body 10. During maintenance, only the support 150 that is often in contact with the wafer box body 10 needs to be replaced, and the base 100 does not need to be directly replaced, which can effectively reduce the maintenance cost. The support 150 can avoid the problem that the length of the sensing pin 510 protruding from the upper end surface of the base 100 is too long, causing the wafer box body 10 to swing, thereby improving the stability of the wafer box body 10.
[0069] With reference to the above Figures 1-4 The semiconductor process equipment further comprises a wafer detection assembly 400 capable of detecting the placement state of the wafer sheet 1 in the wafer box body 10. The wafer detection assembly 400 can detect whether the wafer sheet 1 is placed in place in the wafer box body 10 to prevent the wafer sheet 1 from protruding from the clamping slot of the wafer box body 10, causing collision when the robot grabs the wafer sheet 1, and damaging the wafer sheet 1.
[0070] Specifically, the wafer inspection assembly 400 includes a first inspection member 410 and a second inspection member 420. The first inspection member 410 is arranged on a frame, located above the wafer box body 10, and the second inspection member 420 is arranged on the base 100. The first inspection member 410 and the second inspection member 420 can form a second incident light 430 at the slot of the wafer box body 10. When the first inspection member 410 and the second inspection member 420 can form a complete second incident light 430, it means that there is no wafer 1 protruding from the slot in the wafer box body 10 at this time, that is, the wafers 1 in the wafer box body 10 are all in a state to be grasped. At this time, the robot will not damage the wafer 1 during the process of grasping the wafer 1. During the process of the robot placing the wafer 1 into the wafer box body 10, when the first detection component 410 and the second detection component 420 can form a complete second incident light 430, it means that the robot has placed the wafer 1 in place, and the controller of the semiconductor process equipment will receive a feedback signal indicating that it is in place; when the wafer 1 protrudes from the slot, it will block the second incident light 430, and the controller of the semiconductor process equipment will receive a feedback signal indicating that the wafer 1 is not placed in place.
[0071] Specifically, in this embodiment, the first detection element 410 is a laser transmitter and receiver, and the second detection element 420 is a reflective plate. The laser transmitter and receiver can transmit laser light toward the reflective plate and receive the laser light reflected by the reflective plate to form a complete second incident light beam 430. When the complete second incident light beam 430 is formed, the laser transmitter and receiver can provide feedback to the controller of the semiconductor processing equipment indicating that the wafer 1 is properly placed. If the wafer 1 protrudes from the retaining slot, the laser transmitter and receiver can provide feedback to the controller of the semiconductor processing equipment indicating that the wafer 1 is not properly placed.
[0072] Alternatively, in other embodiments, the first detection element 410 is specifically a laser transmitter, and the second detection element 420 is specifically a laser receiver. The laser transmitter can transmit laser light to the laser receiver, which receives the laser light emitted by the laser transmitter to form a complete second incident light beam 430. When the complete second incident light beam 430 is formed, the laser receiver can provide a feedback signal to the controller of the semiconductor processing equipment indicating that the wafer 1 is properly placed. If the wafer 1 protrudes from the slot, the laser receiver can provide a feedback signal to the controller of the semiconductor processing equipment indicating that the wafer 1 is not properly placed.
[0073] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.
Claims
1. A fixed structure, characterized in that: include: A base (100) is mounted on a loading platform of a semiconductor process equipment; A limiting assembly (200) is provided on the base (100), comprising a plurality of limiting members spaced apart from each other, wherein a positioning space with adjustable size in the X direction is formed between the plurality of limiting members, and a wafer box body (10) of the wafer box assembly can be positioned in the positioning space; an adjusting component (300), arranged on the base (100) and connected to the loading platform, wherein the adjusting component (300) is height-adjustable in the Z direction; The X direction is perpendicular to the Z direction.
2. The fixing structure according to claim 1, characterized in that: The plurality of limiting members include a first limiting member (210) and a second limiting member (220); a first mounting groove (110) and a second mounting groove (120) are provided on the base (100) at intervals along the X direction; the first limiting member (210) and the second limiting member (220) are respectively arranged in the first mounting groove (110) and the second mounting groove (120) in an adjustable manner in the X direction; the first limiting member (210) and the second limiting member (220) can respectively position the wafer box body (10) on two opposite sides in the X direction.
3. The fixing structure according to claim 1, characterized in that: The plurality of limiting members further include a third limiting member (230) and a fourth limiting member (240), wherein the third limiting member (230) and the fourth limiting member (240) are arranged at intervals along the X direction and are respectively arranged on the base (100); At least one of the third limiting member (230) and the fourth limiting member (240) is provided with a limiting groove (231), and the wafer box body (10) is provided with a first positioning pin (11) protruding at a position corresponding to the limiting groove (231), and the first positioning pin (11) can be embedded in the limiting groove (231); and / or, At least one of the third limiting member (230) and the fourth limiting member (240) is provided with a second positioning pin, and the wafer box body (10) is provided with a limiting hole (12) corresponding to the position of the second positioning pin, and the second positioning pin can be inserted into the limiting hole (12).
4. The fixing structure according to claim 1, characterized in that: The base (100) is provided with an adjusting screw hole (130), the adjusting assembly (300) comprises an adjusting bolt (310), the adjusting bolt (310) is screwed into the adjusting screw hole (130) in a height-adjustable manner along the Z direction, and the adjusting bolt (310) is supported on the loading platform; The distance between the base (100) and the loading platform is equal to the length of the adjusting bolt (310) exposed between the base (100) and the loading platform.
5. The fixing structure according to claim 4, characterized in that: The adjustment assembly (300) further comprises a supporting bolt, wherein the interior of the adjusting bolt (310) is hollow to form a mounting hole (311), the supporting bolt is passed through the mounting hole (311) and is screwed into a preset screw hole of the loading platform.
6. The fixing structure according to claim 1, characterized in that: The fixed structure further includes a box body detection component (500), the box body detection component (500) includes a sensing pin (510) and a slot-type photoelectric sensor (520), the slot-type photoelectric sensor (520) is arranged in the receiving slot (140) of the base (100), the sensing pin (510) is passed through a through hole of the base (100), the through hole communicates with the receiving slot (140) and the corresponding slot (521) of the slot-type photoelectric sensor (520), and the sensing pin (510) can be moved along the Z direction into the corresponding slot (521) under the pressure of the wafer box body (10) to block the first corresponding light in the corresponding slot (521); The box body detection component (500) also includes an elastic element (530), the sensing pin (510) is provided with a supporting ring platform (511), the elastic element (530) is sleeved outside the sensing pin (510), and the two ends are respectively abutted against the base (100) and the supporting ring platform (511), the elastic element (530) can be compressed under the pressure of the wafer box body (10) on the sensing pin (510); the sensing pin (510) can withdraw from the shooting slot (521) along the Z direction under the elastic action of the elastic element (530).
7. The fixing structure according to claim 6, characterized in that: A support member (150) is provided on the base (100), and a pin hole (151) is provided on the support member (150). The support member (150) can be supported on the bottom of the wafer box body (10), and the sensing pin (510) is movable through the pin hole (151) and can abut against the bottom of the wafer box body (10).
8. Wafer box assembly, characterized in that, It comprises the wafer box body (10) and the fixing structure as described in any one of claims 1 to 7, the wafer box body (10) is capable of accommodating wafers (1), and the fixing structure is configured to fix the wafer box body (10) on the loading platform of the semiconductor process equipment.
9. Semiconductor process equipment, characterized in that It comprises a frame, a robot, the loading platform and the wafer box assembly as claimed in claim 8, wherein the fixed structure is arranged on the loading platform, and the robot is configured to grab or place the wafer (1) in the wafer box body (10).
10. The semiconductor process equipment according to claim 9, wherein: The semiconductor process equipment further comprises a wafer detection component (400) capable of detecting the placement status of the wafer (1) in the wafer box body (10); The wafer detection assembly (400) includes a first detection component (410) and a second detection component (420), wherein the first detection component (410) is arranged on the rack of the semiconductor process equipment and is located above the wafer box body (10), and the second detection component (420) is arranged on the base (100), and the first detection component (410) and the second detection component (420) can form a second incident light (430) at the slot opening of the wafer box body (10); the wafer (1) protruding from the slot opening can block the second incident light (430).