Connector and electronic equipment

Abstract

The utility model relates to a connector and electronic equipment, the connector is connected with a circuit board, and the connector comprises an insulation structure; the plurality of conductive terminals are arranged on the insulation structure at intervals, each conductive terminal comprises a contact part and a cantilever part, each cantilever part comprises a first section and a second section, the first sections are connected with the contact parts, the contact parts are arranged to penetrate out of the insulation structure, and the second sections are connected with the circuit board; wherein the second section is bent relative to the first section along the thickness direction of the cantilever part, so that the first surface, close to one side of the circuit board, of the second section and the insulating structure are arranged at intervals. The connector is simple in overall structure, and the second section of the cantilever part is bent relative to the first section, so that the first surface, close to one side of the circuit board, of the second section and the insulation structure are arranged in a clearance mode, tin climbing is facilitated, the welding tin climbing effect is remarkably improved, firm connection of welding spots is ensured, and missing tin welding and short circuit are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to a connector and electronic equipment. BACKGROUND

[0002] In the field of electronic manufacturing, especially in the connection part of the circuit board and the connector, the connector and the circuit board are welded, which has a crucial influence on the welding quality and the reliability of the overall product. In the related art, during the welding process of the circuit board and the connector, tin empty welding, short circuit and other undesirable phenomena may occur, thereby affecting the performance and yield of the product. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a connector and electronic equipment, which has sufficient space for soldering tin at the welding position, avoids undesirable phenomena such as tin empty welding and short circuit, and improves the performance and yield of the product.

[0004] In a first aspect, the present application provides a connector connected with a circuit board, the connector comprising:

[0005] an insulating structure; and

[0006] a plurality of conductive terminals arranged at intervals in the insulating structure, the conductive terminals comprising a contact portion and a cantilever portion, the cantilever portion comprising a first segment and a second segment, the first segment being connected with the contact portion, the contact portion being arranged to pass through the insulating structure, and the second segment being connected with the circuit board;

[0007] wherein the second segment is bent relative to the first segment along the thickness direction of the cantilever portion, so that a first surface of the second segment close to the circuit board is arranged at an interval from the insulating structure.

[0008] In a possible implementation, the first surface of the second segment is provided with a support column, and the support column is connected with the circuit board.

[0009] In a possible implementation, at least one of the plurality of cantilever portions is provided with a first positioning hole, and the first positioning hole is formed in the corresponding first segment.

[0010] In a possible implementation, the first segment comprises a first sub-segment and a second sub-segment, and the first sub-segment is connected with the second segment through the second sub-segment.

[0011] wherein the first sub-segment is bent relative to the second sub-segment along the thickness direction of the cantilever portion, so that the first sub-segment and the second sub-segment are arranged in a staggered manner, and the first sub-segment is connected with the contact portion.

[0012] In a possible implementation, the conductive terminals are integrally formed in a stamping manner.

[0013] In a possible implementation, the contact part is in a semispherical shape, and the contact part moves along the thickness direction of the connector under the action of an external force, thereby causing the cantilever part to deform.

[0014] In a possible implementation, a plurality of first positioning columns are arranged on the insulating structure, and the insulating structure is positioned and connected with the circuit board through the first positioning columns.

[0015] In a possible implementation, a plurality of second positioning holes are arranged on the insulating structure.

[0016] Part of the second positioning holes are coaxially arranged with the corresponding first positioning holes, and the inner diameter size of the second positioning holes is greater than the inner diameter size of the first positioning holes.

[0017] In a possible implementation, the insulating structure includes:

[0018] a first insulating part;

[0019] a second insulating part, and the second insulating part is limitingly connected;

[0020] The first insulating part is sequentially and spacedly provided with a plurality of first through holes and a plurality of second through holes along a first direction of the connector, the first through holes and the second through holes penetrate the first insulating part along the thickness direction of the connector, part of the structure of the first section of the cantilever part is located in the corresponding second through hole, and the contact part is located in the corresponding first through hole.

[0021] The second insulating part includes a first layer of insulator and a second layer of insulator, and another part of the structure of the first section of the cantilever part is clamped between the first layer of insulator and the second layer of insulator; wherein the first layer of insulator has a smaller projection area on the connector than the second layer of insulator, so as to expose the second section of the cantilever part.

[0022] In a possible implementation, the first insulating part is provided with a first limiting part, the second insulating part is provided with a second limiting part, and the first limiting part and the second limiting part are limitingly connected.

[0023] The first limiting part includes a plurality of first limiting columns, the second limiting part includes a plurality of first limiting holes, and / or the first limiting part includes a plurality of second limiting holes, and the second limiting part includes a plurality of second limiting columns.

[0024] In a possible implementation, an insulating plate is included, and the insulating plate is bonded to the insulating structure.

[0025] In a second aspect, the present application provides an electronic device, comprising:

[0026] a device body;

[0027] a circuit board comprising a board body and a plurality of conductive sheets, the plurality of conductive sheets being arranged on one side surface of the board body along the thickness direction of the board body, and the plurality of conductive sheets being arranged in sequence and at intervals; and

[0028] The connector of the first aspect, the contact part of the connector is in contact with the device body, the cantilever part of the connector is connected with the conductive sheet in correspondence, and the insulating structure of the connector is connected with the board body in position limiting.

[0029] Compared with the prior art, the above technical solution provided by the embodiments of the present application has the following advantages:

[0030] The connector and the electronic device provided by the embodiments of the present application have a simple overall structure, are suitable for automatic assembly and welding, the second section of the cantilever part is bent relative to the first section to realize sinking, so that the first surface of the second section close to the circuit board is arranged at an interval from the insulating structure, which is conducive to tin climbing and significantly improves the effect of welding tin climbing, ensures firm welding connection, and reduces the occurrence of tin empty welding and short circuit. When the circuit board is welded with the second section, the sinking design can form a better contact angle between the surface of the welding point and the tin liquid, which is conducive to the flow and filling of the tin liquid. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows, and obviously, other drawings can also be obtained by those skilled in the art without creative labor under the premise of not paying any creative labor.

[0033] One or more embodiments are exemplarily illustrated by the pictures in the drawings corresponding thereto, and these exemplary illustrations do not constitute a limitation on the embodiments, and elements with the same reference numerals in the drawings represent similar elements, unless otherwise specified, and the drawings do not constitute a proportional limitation.

[0034] Figure 1 A structural schematic diagram of a connector and a circuit board provided by the embodiments of the present application;

[0035] Figure 2 An exploded schematic diagram of a connector and a circuit board provided by the embodiments of the present application;

[0036] Figure 3 A schematic structural diagram of a conductive terminal provided in an embodiment of the present application;

[0037] Figure 4 A top view of the connector and circuit board provided in an embodiment of the present application;

[0038] Figure 5 for Figure 4 AA cross-sectional schematic diagram shown;

[0039] Figure 6 A schematic diagram of the structure of the connector provided in an embodiment of the present application;

[0040] Figure 7 A schematic structural diagram of a first insulating portion provided in an embodiment of the present application;

[0041] Figure 8 This is a schematic structural diagram of the second insulating portion provided in an embodiment of the present application.

[0042] Description of reference numerals:

[0043] 1. Connector; 11. Insulation structure; 111. First insulating portion; 1111. First limiting portion; 11111. First limiting post; 11112. Second limiting hole; 11113. First limiting rod; 1112. First through hole; 1113. Second through hole; 1114. Reinforcement rib; 112. Second insulating portion; 1121. Second limiting portion; 11211. First limiting hole; 11212. Second limiting post; 11213. Second limiting rod; 1122. First layer of insulator; 1123. Second layer of insulator; 11231, first positioning column; 1124, second positioning hole; 12, conductive terminal; 121, contact portion; 122, cantilever portion; 1221, first section; 12211, first positioning hole; 12212, first sub-section; 12213, second sub-section; 1222, second section; 12221, first surface; 1223, supporting boss; 13, insulating plate; 14, adhesive layer; 2, circuit board; 21, conductive sheet; 22, board body; 221, plug hole; 3, device body. DETAILED DESCRIPTION

[0044] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0045] The disclosure below provides many different embodiments or examples for implementing different structures of the present application. For the sake of simplicity, the description below of the specific examples will not be exhaustive of the disclosure. Indeed, the examples will be given for the purpose of illustration only and not for the purpose of limitation. Furthermore, the disclosure can be implemented in different examples with variations that do not depart from the spirit and scope of the present application. Moreover, where a term is provided across disparate examples, this is intended to be a generic reference in which that same term is used in different examples. Such repetition is for the sake of simplicity and clarity and is not intended to indicate a relationship between the various embodiments and / or aspects discussed.

[0046] For the sake of description, spatial relative terms can be used herein to describe the relative position relationship or movement of one element or feature with respect to another element or feature as shown in the drawings, such as "internal", "external", "inner side", "outer side", "under", "below", "upper", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over or the posture is changed or the movement state is changed, the directional indications will also change accordingly, for example: the element described as "under" or "below" another element or feature will be oriented as "above" or "above" another element or feature. Therefore, the example term "below" can include both the upper and lower positions. The device can be additionally oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein are interpreted accordingly.

[0047] In some example embodiments, as shown in Figures 1-5 A connector 1 is connected with a circuit board 2 to facilitate electrical connection and thus signal transmission, etc. The connector 1 is applied to electronic devices such as mobile phones, tablets, laptops, etc. Taking a tablet as an example, the connector is used to connect the connection mechanism of the smart keyboard and the tablet, playing the role of a bridge. The circuit board 2 is provided in the smart keyboard, for example, and includes a board body 22 and a plurality of conductive sheets 21, which are sequentially and spaced apart on the board body 22. The conductive sheets 21 are terminals or leads, for example.

[0048] The connector 1 includes an insulating structure 11 and a plurality of conductive terminals 12, which are provided on the insulating structure 11. The conductive terminals 12 are connected with the circuit board 2 to facilitate electrical connection.

[0049] The insulating structure 11 is made of plastic material, for example, so that the insulating structure 11 has excellent toughness, durability and flame retardancy, which can effectively improve the service life and safety of the connector 1.

[0050] The high toughness can withstand greater force and is not easy to break. The plastic material is light in weight, durable, easy to process into various shapes, not easy to be affected by the external environment, not easy to age for long-term use, and effectively improves the service life of the insulation structure 11. In addition, the plastic material has certain flame retardance, which can improve the safety of the connector 1.

[0051] The plurality of conductive terminals 12 are arranged at intervals in the first direction (refer to the X axis) of the connector 1 on the insulation structure 11. The signal function between each conductive terminal 12 is subject to actual conditions. Figure 1

[0052] Exemplarily, the conductive terminal 12 includes a contact portion 121 and a cantilever portion 122, the cantilever portion 122 includes a first segment 1221 and a second segment 1222, the first segment 1221 is fixedly connected with the second segment 1222, the first segment 1221 is connected with the contact portion 121, the contact portion 121 can pass out of the insulation structure 11 and be in contact with the shell of an electronic device such as a tablet computer, the second segment 1222 is connected with the circuit board 2, at this time, a complete circuit communication is formed, and the smart keyboard can be controlled.

[0053] The second segment 1222 is bent relative to the first segment 1221 along the thickness direction (refer to the Z axis) of the cantilever portion 122, so that the first surface 12221 of the second segment 1222 close to the circuit board 2 is arranged at an interval from the insulation structure 11. Figure 1

[0054] The side connected with the circuit board 2 is bent downward to increase the interval between the second segment 1222 and the insulation structure 11, and the second segment 1222 can be sunken downward by 0.1 mm relative to the first segment 1221. When the circuit board 2 and the connector 1 are welded, the effect of soldering tin climbing can be significantly improved. Tin climbing is the process of tin liquid flowing along the surface of the welding point and filling the gap between the welding points. Good tin climbing effect can ensure firm welding point connection and reduce the occurrence of tin empty welding and short circuit.

[0055] The 0.1 mm slight sinking design of the connector in the embodiment can form a better contact angle between the welding point surface and the tin liquid, which is beneficial to the flow and filling of the tin liquid and improves the connection effect between the connector 1 and the circuit board 2.

[0056] In some exemplary embodiments, as Figures 1-5 ​​As shown, the first surface 12221 of each second segment 1222 is provided with a support boss 1223, which is connected to the circuit board 2. The support boss 1223 not only provides positioning for the circuit board 2, ensuring that the conductive sheet 21 on the circuit board 2 is aligned and connected, but also further elevates the circuit board 2 to change its position, providing ample space for soldering and welding, optimizing the contact angle between the solder joint surface and the molten solder, and improving soldering quality and connection reliability. It also effectively prevents solder voids and short circuits, reduces the failure rate during the soldering process, and improves the overall performance and stability of the electronic device.

[0057] It is understood that the number, shape, and size of the supporting bosses 1223 can be adjusted according to actual needs and the design requirements of the electronic device. At the same time, other parts of the connector 1 can also be adaptively designed to ensure perfect docking and efficient connection with the circuit board 2.

[0058] In this embodiment, if Figures 1-5 As shown, multiple cantilever portions 122 are sequentially spaced along the first direction of the connector 1. One or two cantilever portions 122 can be selected for design, and first positioning holes 12211 are provided. These first positioning holes 12211 are formed in the corresponding first segments 1221. Providing first positioning holes 12211 in the first segments 1221 provides a positioning reference for the molding die and subsequent manufacturing processes, improving process accuracy and increasing production yield. This effectively prevents offset and misalignment of the cantilever portions 122 during the manufacturing process, enhancing product quality and reliability.

[0059] It is understood that the shape, size, and position of first positioning holes 12211 can be adjusted based on actual needs and manufacturing process requirements. For example, first positioning holes 12211 can be designed as circular, square, or other shapes to accommodate different molding molds and manufacturing process requirements. Furthermore, the number of first positioning holes 12211 can also be selected and adjusted based on actual needs to ensure the stability and reliability of connector 1 during the manufacturing process.

[0060] In this embodiment, if Figures 1-5 As shown, the first section 1221 includes a first sub-segment 12212 and a second sub-segment 12213 , and the first sub-segment 12212 is connected to the second section 1222 through the second sub-segment 12213 , thereby achieving the continuity of the cantilever portion 122 .

[0061] The first sub-section 12212 is bent relative to the second sub-section 12213 along the thickness direction of the cantilever portion 122, such as upward bending, so that the first sub-section 12212 and the second sub-section 12213 are staggered, and the first sub-section 12212 is connected with the contact portion 121. The upward bending of the first sub-section 12212 can raise the height of the contact portion 121, ensuring that the contact portion 121 can pass through the insulating structure 11.

[0062] When the contact portion 121 contacts the shell of the tablet computer, the contact portion 121 and the shell are extruded, the connection between the first sub-section 12212 and the second sub-section 12213 is in a bent state, which can be deformed, and the cantilever portion 122 has good elasticity, which can ensure that the contact portion 121 can normally move and always contact the shell of the tablet computer, realizing the stability and non-falling of the conductive terminal 12 under stress, prolonging the service life of the connector 1, and improving the overall performance and user experience of the electronic equipment.

[0063] It can be understood that the shape, size and position of the bending structure can be adjusted according to actual needs and manufacturing process requirements. For example, the bending angle and bending radius of the first sub-section 12212 can be optimized according to needs to adapt to different electronic equipment and use environments. At the same time, the shape, size and material of the contact portion 121 can also be selected and adjusted to ensure good contact and stability with the shell. For example, the contact portion 121 is in a hemispherical shape, and the contact portion 121 moves along the thickness direction of the connector 1 under the action of external force, thereby driving the cantilever portion 122 to deform, and the contact portion 121 can always contact and connect with the shell.

[0064] In this embodiment, as shown in Figures 1-5 The conductive terminal 12 is integrally formed by stamping. For example, the cantilever portion 122 is a plate-shaped structure, and a metal base plate is provided, and a metal material with good electrical conductivity and mechanical strength, such as copper alloy, is selected as the base material of the conductive terminal 12.

[0065] According to the shape and size requirements of the conductive terminal 12, the metal base plate is cut to obtain a preliminary plate-shaped structure.

[0066] The cut plate-shaped structure is subjected to a first stamping to form a bending state between the first section 1221 and the second section 1222 of the cantilever portion 122.

[0067] The first section 1221 is subjected to a second stamping to form a bending state between the first sub-section 12212 and the second sub-section 12213.

[0068] The first sub-section 12212 is distal from the second section 1222, and is subjected to third stamping from bottom to top to form a hollow structure with an open bottom and a hemispherical top, i.e., the contact portion 121. The hemispherical contact portion 121 is not only easy to realize and beneficial to molding, but also smooth to abut against the shell and will not scratch the shell, thereby improving the safety of the shell and prolonging the service life of the shell.

[0069] It should be noted that the first, second and third stamping does not represent the sequence, and the definition of the first, second and third is only for the convenience of understanding, and does not limit the present application. The sequence before and after is subject to the actual situation.

[0070] The conductive terminal 12 in the embodiment is formed by multiple stamping to form a bending structure, which effectively enhances the structural strength and stability of the conductive terminal 12, so that it can better withstand external stress and vibration. The stamping method is used for integrated molding, which reduces the processing steps and assembly process, improves the manufacturing efficiency and quality.

[0071] In some example embodiments, as shown in Figures 1-8 The insulating structure 11 is positioned and connected with the board body 22 of the circuit board 2 through the first positioning column 11231. Each first positioning column 11231 is located between the second sections 1222 of two conductive terminals 12, and the board body 22 is provided with a corresponding plug-in hole 221 for plug-in connection.

[0072] The first positioning column 11231 added to the insulating structure 11 can make the circuit board 2 and the connector 1 more easily achieve accurate positioning during assembly. The first positioning column 11231 protrudes from the insulating structure 11 and has a certain height, so that the circuit board 2 and the insulating structure 11 can be more closely fitted during assembly, reducing assembly error and improving welding yield.

[0073] In the embodiment, as shown in Figures 1-8 The insulating structure 11 is provided with a plurality of second positioning holes 1124 for the molding die to press the terminal in the up-down direction. Some of the second positioning holes 1124 are coaxially arranged with the corresponding first positioning holes 12211, and the inner diameter size of the second positioning holes 1124 is greater than that of the first positioning holes 12211 to expose part of the cantilever portion 122 and provide a positioning reference for the molding die and the subsequent process. The molding die can press the cantilever portion 122 in the up-down direction, improving process accuracy and improving production yield.

[0074] The positioning design of connector 1 in this embodiment not only enhances the product's degree of automation but also significantly improves product quality and yield. On automated production lines, precise assembly and welding significantly reduce human interference and improve production efficiency. Furthermore, combined with the aforementioned solder joint design and improved assembly precision, product reliability is significantly improved, reducing rework and scrap due to poor soldering, thereby lowering production costs.

[0075] In this embodiment, if Figures 1-8 As shown, the insulating structure 11 includes a first insulating portion 111 and a second insulating portion 112. The first insulating portion 111 and the second insulating portion 112 are connected in a position-limiting manner to improve reliability during connection. For example, the first insulating portion 111 is provided with a first position-limiting portion 1111, and the second insulating portion 112 is provided with a second position-limiting portion 1121. The first position-limiting portion 1111 and the second position-limiting portion 1121 are connected in a position-limiting manner.

[0076] First example

[0077] The first limiting portion 1111 includes a plurality of first limiting posts 11111, which are sequentially spaced along the first direction of the connector 1. The second limiting portion 1121 includes a plurality of first limiting holes 11211. The first limiting holes 11211 are, for example, arch-shaped avoidance holes, and the first limiting posts 11111 are engaged with the first limiting posts 11111 in a one-to-one correspondence to achieve alignment.

[0078] Second example

[0079] The first limiting portion 1111 includes a plurality of second limiting holes 11112, which are spaced apart in sequence along the first direction of the connector 1. The second limiting portion 1121 includes a plurality of second limiting columns 11212, which correspond one-to-one with the second limiting holes 11112 and are plug-connected to achieve interlocking, thereby improving the tightness and reliability of the connection.

[0080] Third example

[0081] The first limiting portion 1111 includes multiple first limiting columns 11111, multiple second limiting holes 11112 and a first limiting rod 11113. The first limiting rod 11113 is connected to the multiple first limiting columns 11111, and the second limiting holes 11112 can be correspondingly arranged on the first limiting columns 11111.

[0082] The second limiting portion 1121 includes a plurality of first limiting holes 11211, a plurality of second limiting columns 11212 and a second limiting rod 11213. The second limiting columns 11212 are arranged in the corresponding first limiting holes 11211, and the second limiting rod 11213 and the first limiting holes 11211 are aligned with each other along the second direction of the connector 1 (refer to FIG.Figure 1 The Y-axis) are arranged to form a first limiting groove, and the first limiting rod 11113 is embedded in the first limiting groove. The first limiting part 1111 is provided with a second limiting groove corresponding to the second limiting rod 11213 to realize embedded connection.

[0083] The connection mode of the first limiting hole 11211 and the first limiting column 11111 and the connection mode of the second limiting column 11212 and the second limiting hole 11112 are the same or similar, which will not be repeated here.

[0084] In this embodiment, multiple limiting is adopted to further improve the stability between the first insulating part 111 and the second insulating part 112, and to avoid loosening.

[0085] In this embodiment, as Figures 1-8 shown, in order to further improve the assembly degree, the insulating structure 11 is also provided with a groove structure or a hole structure to cooperate with positioning or mounting.

[0086] For example, the first insulating part 111 is sequentially and spacedly provided with a plurality of first through holes 1112 and a plurality of second through holes 1113 along the first direction of the connector. The plurality of first through holes 1112 are sequentially and spacedly arranged along the first direction of the connector 1. The first through hole 1112 penetrates the first insulating part 111 along the thickness direction of the connector 1, and the contact part 121 is located in the corresponding first through hole 1112 to ensure that the contact part 121 can pass through the insulating structure 11. And the first through hole 1112 is provided with a reinforcing rib 1114 around the first through hole 1112 to improve the structural strength of the position of the first through hole 1112 and prolong the service life of the first insulating part 111.

[0087] The plurality of second through holes 1113 are sequentially and spacedly arranged along the first direction of the connector 1. The second through hole 1113 penetrates the first insulating part 111 along the thickness direction of the connector 1. Part of the structure of the first section 1221 of the cantilever part 122 is located in the corresponding second through hole 1113 to avoid shielding, avoiding and exposing part of the structure of the cantilever part 122 to improve the strength of signal transmission. And the second through hole 1113 can provide enough space for the elastic deformation of the first section 1221 to avoid interference.

[0088] For example, the second insulating part 112 includes a first layer of insulator 1122 and a second layer of insulator 1123, and another part of the structure of the first section 1221 of the cantilever part 122 is clamped between the first layer of insulator 1122 and the second layer of insulator 1123. Among them, the first layer of insulator 1122 in the connector 1 is smaller than the second layer of insulator 1123 in the connector 1 to form an avoiding area. At this time, the avoiding area can expose the second section 1222 of the cantilever part 122 to facilitate connection with the circuit board 2.

[0089] And the first layer of insulation 1122 avoids the avoidance area formed by the second layer of insulation 1123, and also facilitates the installation of the circuit board 2, such as the circuit board 2 attached to the avoidance area, and the height of the circuit board 2 is the same as the height of the first layer of insulation 1122, so as to ensure the flatness of the appearance of the connector 1.

[0090] It can be understood that the above-mentioned first positioning column 11231 can be provided on the second layer of insulation 1123, that is, the avoidance area, so as to facilitate the positioning connection of the circuit board 2. Among them, the board body 22 of the circuit board 2 is provided with a plug-in hole 221, so as to facilitate the one-to-one alignment and plug-in of the first positioning column 11231. The second positioning hole 1124 is provided on the second insulation part 112, which can be provided on the first layer of insulation 1122, can be provided on the second layer of insulation 1123, can also be provided on the first layer of insulation 1122 and the second layer of insulation 1123, and is coaxially arranged to expose the cantilever part 122 of the conductive terminal 12, and then press it in the up-down direction.

[0091] In this embodiment, as shown in Figures 1-8 The connector 1 further comprises an insulation plate 13, which is bonded to the insulation structure 11. The insulation plate 13 is arranged on the side of the connector 1 away from the circuit board 2 in the thickness direction, forming a closed side of the connector 1, achieving the flatness and stability of the appearance of the connector 1. Among them, the insulation plate 13 is an insulation tape, which has good insulation performance and can improve the safety factor of the connector 1.

[0092] Exemplarily, the insulation plate 13 can be bonded to the insulation structure 11 by a glue layer 14, improving the reliability during connection. Among them, the glue layer 14 will avoid the conductive terminal 12 and the like, so as to avoid the adhesion to it, and improve the safety.

[0093] The application also provides an electronic device, as shown in Figures 1-8 The device body 3 is a tablet computer, the circuit board 2 is a flexible circuit board, which has a certain bendability, and the circuit board 2 is arranged in a smart keyboard (not shown in the figure). The circuit board 2 comprises a board body 22 and a plurality of conductive sheets 21, which are arranged on one side surface of the board body 22 in the thickness direction. The plurality of conductive sheets 21 are arranged in sequence and at intervals.

[0094] The contact part 121 of the connector 1 is in contact with the shell of the tablet computer, and the cantilever part 122 of the connector 1 is in one-to-one correspondence with the conductive sheet 21 of the circuit board 2 and is welded. The connection mode of the connector 1 and the circuit board 2 has been described in detail in the above embodiment, and will not be repeated here.

[0095] In the related art, a spring is arranged in the contact portion to form an elastic stroke, and the contact portion needs a thick insulating structure layer, which is not conducive to miniaturization design when installed in an electronic device. Moreover, the contact portion and the cantilever portion are riveted, and the contact portion needs a numerical control lathe process with high price, small product and difficult positioning. When connected with a circuit board, the welding stability is poor, which reduces the production yield.

[0096] The connector 1 in the present application has a simple overall structure, is suitable for automatic assembly and welding, and has a higher yield of the connector 1. The welding position of the cantilever portion 122, i.e., the second section 1222, is sunken downward by 0.1 mm relative to the first section 1221, the gap between the second section 1222 and the insulating structure 11 is increased, the effect of tin climbing can be significantly improved, the welding point connection is ensured to be firm, and the occurrence of tin empty welding and short circuit is reduced. Moreover, the slight sinking design can just form a better contact angle between the welding point surface and the tin liquid, which is conducive to the flow and filling of the tin liquid. In combination with the use of the first positioning column 11231, the circuit board 2 is more easily positioned and attached, has a higher degree of automation, realizes accurate positioning, reduces assembly errors, and improves the welding yield.

[0097] Moreover, the contact portion 121 adopts a stamping mode, the elastic stroke is small, and a thinner thickness can be achieved. Moreover, the conductive terminal 12 adopts a stamping mode, which can reduce the investment in automatic machine equipment, achieve a better yield, and save materials and costs.

[0098] It should be understood that the terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises", "comprising", "includes", "including" and "has" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order in which they are described, unless specifically indicated as such. It is also to be understood that additional or alternative steps can be employed.

[0099] Although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example implementations.

[0100] The foregoing is merely illustrative of the principles of the application and various modifications can be made by those skilled in the art without departing from the spirit and scope of the application. The above-described embodiments are intended to be illustrative, not restrictive, of the scope of the present application, which is set out in the following claims.

Claims

1. A connector connected to a circuit board, characterized in that: The connector comprises: Insulation structure; and a plurality of conductive terminals spaced apart on the insulating structure, the conductive terminals comprising a contact portion and a cantilever portion, the cantilever portion comprising a first section and a second section, the first section being connected to the contact portion, the contact portion being configured to pass through the insulating structure, and the second section being connected to the circuit board; The second section is bent relative to the first section along the thickness direction of the cantilever portion, so that the second section is disposed close to the first surface of one side of the circuit board and in a gap with the insulating structure.

2. The connector according to claim 1, wherein: The first surface of the second section is provided with a supporting protrusion, and the supporting protrusion is connected to the circuit board.

3. The connector according to claim 1, wherein: At least one of the plurality of cantilever portions is provided with a first positioning hole, and the first positioning hole is formed in the corresponding first section.

4. The connector according to claim 1, wherein: The first segment includes a first subsegment and a second subsegment, and the first subsegment is connected to the second segment through the second subsegment; The first subsegment is bent relative to the second subsegment along the thickness direction of the cantilever portion, so that the first subsegment and the second subsegment are staggered, and the first subsegment is connected to the contact portion.

5. The connector according to claim 1, wherein: The conductive terminal is integrally formed by stamping.

6. The connector according to claim 1, wherein: The contact portion is hemispherical in shape and moves along the thickness direction of the connector under the action of an external force, thereby driving the cantilever portion to deform.

7. The connector according to claim 1, wherein: A plurality of first positioning columns are provided on the insulating structure, and the insulating structure is positioned and connected to the circuit board via the first positioning columns.

8. The connector according to claim 3, wherein: A plurality of second positioning holes are provided on the insulating structure; Part of the second positioning holes is coaxially arranged with the corresponding first positioning holes, and the inner diameter of the second positioning holes is larger than the inner diameter of the first positioning holes.

9. The connector according to claim 1, wherein: The insulating structure comprises: a first insulating portion; a second insulating portion, being position-limitingly connected to the second insulating portion; The first insulating portion is provided with a plurality of first through holes and a plurality of second through holes spaced apart in sequence along a first direction of the connector. The first through holes and the second through holes penetrate the first insulating portion along a thickness direction of the connector. Part of the first section of the cantilever portion is located in the corresponding second through holes, and the contact portion is located in the corresponding first through holes. The second insulating portion includes a first layer of insulator and a second layer of insulator, and another part of the structure of the first section of the cantilever portion is sandwiched between the first layer of insulator and the second layer of insulator; wherein the orthographic projection area of ​​the first layer of insulator on the connector is smaller than the orthographic projection area of ​​the second layer of insulator on the connector, so as to expose the second section of the cantilever portion.

10. The connector according to claim 9, wherein: The first insulating portion is provided with a first limiting portion, the second insulating portion is provided with a second limiting portion, and the first limiting portion and the second limiting portion are connected in a limiting manner; Wherein, the first limiting portion includes a plurality of first limiting columns, and the second limiting portion includes a plurality of first limiting holes; and / or, the first limiting portion includes a plurality of second limiting holes, and the second limiting portion includes a plurality of second limiting columns.

11. The connector according to claim 1, wherein: An insulating plate is included, and the insulating plate is bonded to the insulating structure.

12. An electronic device, characterized in that: include: Equipment body; A circuit board, comprising a board body and a plurality of conductive sheets, wherein the plurality of conductive sheets are arranged on one side surface of the board body along the thickness direction thereof, and the plurality of conductive sheets are arranged in sequence and spaced apart; and The connector according to any one of claims 1 to 11, wherein the contact portion of the connector is electrically connected to the device body, the cantilever portion of the connector is correspondingly connected to the conductive sheet, and the insulating structure of the connector is limitedly connected to the plate body.

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