Intelligent power module, load driving circuit and air conditioner

By integrating the rectifier circuit and the inverter circuit inside the intelligent power module, the need for converting AC power into DC power in the existing technology is solved, higher integration and lower cost are achieved, and the power conversion efficiency and stability are improved.

CN223451842UActive Publication Date: 2025-10-17GREE ELECTRIC APPLIANCE INC OF ZHUHAI
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Patent Information

Application Number
CN202422338609.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-24
Publication Date
2025-10-17
Estimated Expiration
2034-09-24

AI Technical Summary

Technical Problem

Existing intelligent power modules need to convert AC power into DC power, which requires a rectifier circuit and a PFC circuit, resulting in low integration, large area and high cost.

Method used

The rectifier circuit, inverter circuit and drive circuit are integrated inside the intelligent power module to realize the conversion of AC to DC power, and the load operation is controlled by the drive circuit and inverter circuit, reducing dependence on external circuits.

Benefits of technology

The integration of the intelligent power module is improved, the occupied printed circuit board area is reduced, the cost is reduced, and the power conversion efficiency and stability are improved.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides an intelligent power module, load drive circuit and air conditioner, the intelligent power module includes rectifier circuit, inverter circuit and drive circuit, the rectifier circuit is connected with the AC power supply that connects inductor and capacitor, the rectifier circuit converts the AC power that the AC power supply provides into the DC power, and the inverter circuit is connected with the drive circuit. The direct current is supplied to the inverter circuit and the driving circuit; the driving circuit is used for receiving a logic control signal and controlling the opening and closing of a power chip of the inverter circuit according to the logic control signal; and the inverter circuit is used for converting the direct current into controllable alternating current based on the logic control signal so as to control a load to work through the controllable alternating current. The intelligent power module not only integrates the driving circuit and the inverter circuit, but also integrates the rectifying circuit capable of converting alternating current into direct current, so that the integration level of the intelligent power module is high.
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Description

TECHNICAL FIELD

[0001] The utility model relates to circuit technical field especially, and it is a kind of intelligent power module, load driving circuit and air conditioner. BACKGROUND

[0002] Intelligent power module is a kind of intelligent power switch device, its English full name is Intelligent Power Module, English abbreviation is IPM. IPM module integrates power chip and control chip inside, has the characteristics of high speed, low power consumption, simultaneously has the advantages of GTR (high power transistor, Giant Transistor) high current density, low saturation voltage and high voltage resistance, and the advantages of MOSFET (field effect transistor, Metal-Oxide-Semiconductor Field-Effect Transistor) high input impedance, high switching frequency and low driving power, in addition, IPM module has voltage undervoltage protection, overheat protection, overcurrent protection and short-circuit protection and other protection functions, with the characteristics of small size, compact layout, convenient to use, is widely used in household appliances, industry, energy and other industries.

[0003] However, the current intelligent power module is all using direct current, so normal power (alternating current) needs to be converted into standard direct current when using intelligent power module, otherwise intelligent power module cannot work normally. Alternating current is converted into direct current by the external circuit of intelligent power module, and just because of this, intelligent power module needs to be equipped with rectifier circuit+PFC (Power Factor Correction, power factor correction) circuit to work normally, resulting in low integration of intelligent power module, and it needs to occupy larger area of printed circuit board. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of intelligent power module, load driving circuit and air conditioner, and specific technical solutions are as follows:

[0005] In the utility model, an intelligent power module is provided, the intelligent power module includes rectifier circuit, inverter circuit and driving circuit, the rectifier circuit is connected with the alternating current power supply connected with inductance and capacitance, wherein:

[0006] The rectifier circuit converts alternating current provided by the alternating current power supply into direct current, and provides the direct current to the inverter circuit and the driving circuit;

[0007] The driving circuit is used to receive logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal;

[0008] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the load to work through the controllable alternating current.

[0009] Optionally, the power chips in the rectifier circuit and the inverter circuit are connected with diodes respectively.

[0010] Optionally, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, and the drive circuit comprises a first control chip and a second control chip; the rectifier circuit comprises a seventh power chip and an eighth power chip, and the drive circuit further comprises a third control chip; a collector of the first power chip is connected with an emitter of the seventh power chip through the capacitor; a collector of the eighth power chip is connected with collectors of the first power chip, the second power chip and the third power chip;

[0011] The microcontroller unit is connected with an input pin of the first control chip, an input pin of the second control chip and an input pin of the third control chip;

[0012] An output pin of the first control chip is connected with gates of the first power chip, the second power chip and the third power chip;

[0013] An output pin of the second control chip is connected with gates of the fourth power chip, the fifth power chip and the sixth power chip;

[0014] An output pin of the third control chip is connected with gates of the seventh power chip and the eighth power chip.

[0015] Optionally, an emitter of the first power chip and a collector of the fourth power chip are connected with the output pin of the first control chip, and then a first control pin is led out and connected to the load;

[0016] An emitter of the second power chip and a collector of the fifth power chip are connected with the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0017] An emitter of the third power chip and a collector of the sixth power chip are connected with the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0018] Optionally, emitters of the fourth power chip, the fifth power chip and the sixth power chip are connected with a resistor and then grounded.

[0019] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected with the alternating current power source through an inductor.

[0020] Optionally, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0021] Optionally, the intelligent power module further comprises a heat sink.

[0022] Optionally, the load at least comprises a motor.

[0023] Optionally, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package body according to a preset packaging process.

[0024] The utility model discloses a kind of load driving circuits, and the load driving circuit includes intelligent power module and peripheral circuit, and the peripheral circuit includes alternating current power source, capacitor, inductor, resistance and load;The intelligent power module includes rectifier circuit, inverter circuit and drive circuit, and the rectifier circuit is connected with the alternating current power source of connecting inductor and capacitor, wherein:

[0025] The rectifier circuit converts alternating current provided by the alternating current power source into direct current, and provides the direct current to the inverter circuit and the drive circuit;

[0026] The drive circuit is used to receive logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal;

[0027] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, to control load work through the controllable alternating current.

[0028] Optionally, the power chip in the rectifier circuit and the inverter circuit is connected with diode respectively.

[0029] Optionally, the inverter circuit includes first power chip, second power chip, third power chip, fourth power chip, fifth power chip, sixth power chip, and the drive circuit includes first control chip and second control chip;The rectifier circuit includes seventh power chip and eighth power chip, and the drive circuit further includes third control chip;The collector of the first power chip is connected with the emitter of the seventh power chip through the capacitor;The collector of the eighth power chip is connected with the collector of the first power chip, the second power chip and third power chip;

[0030] Microcontroller unit is connected with the input pin of the first control chip, the input pin of the second control chip and the input pin of the third control chip.

[0031] The output pin of the first control chip is connected with the gate of the first power chip, the second power chip and the third power chip;

[0032] The output pin of the second control chip is connected with the gate of the fourth power chip, the fifth power chip and the sixth power chip;

[0033] The output pin of the third control chip is connected with the gate of the seventh power chip and the eighth power chip.

[0034] Optionally, the emitter of the first power chip and the collector of the fourth power chip are connected with the output pin of the first control chip, and then a first control pin is led out and connected to the load;

[0035] The emitter of the second power chip and the collector of the fifth power chip are connected with the output pin of the first control chip, and then a second control pin is led out and connected to the load;

[0036] The emitter of the third power chip and the collector of the sixth power chip are connected with the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0037] Optionally, the emitters of the fourth power chip, the fifth power chip and the sixth power chip are connected with the ground through resistors.

[0038] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected with the AC power supply through an inductor.

[0039] Optionally, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0040] Optionally, the intelligent power module further comprises a heat sink.

[0041] Optionally, the load at least comprises a motor.

[0042] Optionally, the rectifier circuit, the inverter circuit and the driving circuit in the intelligent power module are packaged in a plastic package body according to a preset packaging process.

[0043] The utility model discloses a kind of air conditioners including load driving circuit, and the load driving circuit includes intelligent power module and peripheral circuit, and the peripheral circuit includes AC power supply, capacitor, inductor, resistance and load;The intelligent power module includes rectifier circuit, inverter circuit and driving circuit, and the rectifier circuit is connected with the AC power supply of connecting inductor and capacitor, and wherein:

[0044] The rectifier circuit converts the alternating current provided by the alternating current power supply into direct current and provides the direct current to the inverter circuit and the driving circuit;

[0045] The driving circuit is configured to receive a logic control signal and control the opening and closing of power chips of the inverter circuit according to the logic control signal.

[0046] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of the load through the controllable alternating current.

[0047] Optionally, the power chips in the rectifier circuit and the inverter circuit are connected with diodes respectively.

[0048] Optionally, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip, the rectifier circuit comprises a seventh power chip and an eighth power chip, and the driving circuit further comprises a third control chip; a collector of the first power chip is connected with an emitter of the seventh power chip through the capacitor; a collector of the eighth power chip is connected with collectors of the first power chip, the second power chip and the third power chip.

[0049] The microcontroller unit is connected with an input pin of the first control chip, an input pin of the second control chip and an input pin of the third control chip.

[0050] An output pin of the first control chip is connected with gates of the first power chip, the second power chip and the third power chip.

[0051] An output pin of the second control chip is connected with gates of the fourth power chip, the fifth power chip and the sixth power chip.

[0052] An output pin of the third control chip is connected with gates of the seventh power chip and the eighth power chip.

[0053] Optionally, an emitter of the first power chip and a collector of the fourth power chip are connected with the output pin of the first control chip, and then a first control pin is led out and connected to the load.

[0054] An emitter of the second power chip and a collector of the fifth power chip are connected with the output pin of the first control chip, and then a second control pin is led out and connected to the load.

[0055] The emitter of the third power chip and the collector of the sixth power chip are connected with the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0056] Optionally, the emitters of the fourth power chip, the fifth power chip and the sixth power chip are connected to ground after connecting resistors.

[0057] Optionally, the collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply through an inductor.

[0058] Optionally, the intelligent power module further comprises a lead frame, an aluminum wire and a gold wire.

[0059] Optionally, the intelligent power module further comprises a heat sink.

[0060] Optionally, the load at least comprises a motor.

[0061] Optionally, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package body according to a preset packaging process.

[0062] Compared with the related art, the utility model has at least the following advantages:

[0063] In the utility model, the intelligent power module comprises a rectifier circuit, an inverter circuit and a drive circuit, the rectifier circuit is connected with an AC power supply connected with an inductor and a capacitor, wherein the rectifier circuit converts AC power provided by the AC power supply into DC power and provides the DC power to the inverter circuit and the drive circuit, the drive circuit is used for receiving a logic control signal and controlling the opening and closing of the power chip of the inverter circuit according to the logic control signal, the inverter circuit is used for converting the DC power into controllable AC power based on the logic control signal, so as to control the load to work through the controllable AC power. The intelligent power module of the utility model not only integrates the drive circuit and the inverter circuit, but also integrates the rectifier circuit, so that the AC power provided by the AC power supply can be converted into DC power in the intelligent power module, and then the DC power can be converted into controllable AC power through the drive circuit and the inverter circuit to control the load to work. The intelligent power module has high integration, so that the area of the printed circuit board occupied by the intelligent power module is smaller, meanwhile, the printed circuit board does not need to be laid out with other rectifier circuits, further reducing the area of the printed circuit board occupied by the intelligent power module, which is more friendly to application engineers, so that the application engineers will be more convenient to lay out other circuits or elements. BRIEF DESCRIPTION OF DRAWINGS

[0064] In order to more clearly illustrate the technical scheme in the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description.

[0065] Figure 1 A structural block diagram of the intelligent power module provided in the utility model;

[0066] Figure 2 A circuit structural schematic diagram of the intelligent power module provided in the utility model;

[0067] Figure 3 A circuit structural schematic diagram of a traditional intelligent power module;

[0068] Figure 4 An appearance schematic diagram of the intelligent power module provided in the utility model;

[0069] Figure 5 An internal structural schematic diagram of the intelligent power module provided in the utility model;

[0070] Figure 6 A front view of the internal structure of the intelligent power module provided in the utility model;

[0071] Figure 7 A schematic diagram of the power chip patch provided in the utility model;

[0072] Figure 8 A schematic diagram of the gold wire bonding provided in the utility model;

[0073] Figure 9 A schematic diagram of the frame assembly provided in the utility model. DETAILED DESCRIPTION

[0074] In order to make the purpose, technical scheme and advantages of the utility model more clear, the various embodiments of the utility model will be described in detail below with reference to the drawings. However, those skilled in the art can understand that, in the various embodiments of the utility model, many technical details are proposed in order to make the readers better understand the utility model. However, even if there are no such technical details and various changes and modifications based on the following embodiments, the technical scheme claimed by the utility model can also be implemented. The division of the following various embodiments is for the convenience of description, and should not be construed as the specific implementation of the utility model.

[0075] In a specific implementation, the internal part of the intelligent power module can mainly include 6 groups of power chips (power devices) and drive circuits, the drive circuits can include drive ICs (Integrated Circuit, drive circuits), the power chips mainly control the switching of U, V, W, NU, NV, and NW phases; the drive ICs mainly control the actions of the power chips, and have various protection functions to prevent damage to the power chips. The circuit of the intelligent power module is mainly an inverter circuit, and the power chips of the inverter circuit can be controlled to be turned on and turned off through the drive circuit, so as to convert direct current into controllable alternating current. In actual application, the frequency, current size, and conversion efficiency of alternating current can be controlled by adjusting the parameters of the drive circuit, so as to realize accurate control and optimization of power conversion.

[0076] The current intelligent power module uses direct current, and the use of the intelligent power module needs to convert normal power (alternating current) into standard direct current, otherwise the intelligent power module cannot work normally. The conversion of alternating current into direct current is completed by the external circuit of the intelligent power module, and it is just for this reason that the intelligent power module needs to be equipped with a rectifier circuit (rectifier bridge) + PFC (Power Factor Correction, power factor correction) circuit to work normally, which limits the application of the intelligent power module, and the external circuit occupies a larger area of the PCB (Printed Circuit Board, printed circuit board), which affects the layout of the power chips in the intelligent power module, and the system cost is higher due to the need for equipment.

[0077] In view of the above problems, one of the core ideas of the utility model is to provide a multifunctional intelligent power module, which internally includes an inverter circuit and a protection function, and the intelligent power module also includes a rectifier circuit for converting alternating current into direct current, so that the intelligent power module can be converted without the external circuit of the intelligent power module, and the intelligent power module is small in size, convenient in layout, and low in cost. In addition, the traditional rectifier circuit is connected to the intelligent power module through the printed circuit board, and the circuit is longer, while the internal circuit wiring of the intelligent power module of the utility model is shorter than that of the traditional intelligent power module system, so that the intelligent power module can work more stably and the stray inductance is lower.

[0078] Reference Figure 1 The structure block diagram of the intelligent power module provided in the utility model is shown in Figure 1 As shown, the intelligent power module can include a rectifier circuit, an inverter circuit, and a drive circuit, the rectifier circuit is connected with an alternating current power source connected with an inductor and a capacitor, wherein:

[0079] The rectifier circuit converts alternating current provided by the alternating current power supply into direct current and provides the direct current to the inverter circuit and the driving circuit;

[0080] The driving circuit is configured to receive a logic control signal and control opening and closing of a power chip of the inverter circuit according to the logic control signal.

[0081] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the load to work through the controllable alternating current.

[0082] In the utility model, the intelligent power module includes a rectifier circuit, an inverter circuit and a driving circuit, the rectifier circuit is connected with an alternating current power supply connected with an inductor and a capacitor, wherein the rectifier circuit converts alternating current provided by the alternating current power supply into direct current and provides the direct current to the inverter circuit and the driving circuit, the driving circuit is configured to receive a logic control signal and control opening and closing of a power chip of the inverter circuit according to the logic control signal, and the inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the load to work through the controllable alternating current. The intelligent power module of the utility model not only integrates the driving circuit and the inverter circuit, but also integrates the rectifier circuit, so that the alternating current provided by the alternating current power supply can be converted into direct current inside the intelligent power module, and then the direct current can be converted into controllable alternating current through the driving circuit and the inverter circuit to control the load to work, the intelligent power module has high integration, and thus the area of the printed circuit board occupied by the intelligent power module is smaller, meanwhile, the printed circuit board does not need to be laid out with other rectifier circuits, the area of the printed circuit board occupied by the intelligent power module is further reduced, and the application engineer is more friendly, so that the application engineer can conveniently lay out other circuits or elements.

[0083] In an embodiment of the utility model, the power chip in the rectifier circuit and the inverter circuit is connected with a diode respectively. Wherein, the diode can be FRD (Fast Recovery Diode, fast recovery diode). In the specific implementation, the power chip can be IGBT, MOSFET and the like, and can be connected with the fast recovery diode to realize specific circuit functions and improve the performance of the system. For example, the main function of the inverter circuit is to convert direct current into alternating current, and the fast recovery diode can be used in the inverter circuit. When the power device is turned off, the inductance in the load will generate a reverse electromotive force, causing the current to continue to flow. At this time, the fast recovery diode provides a low-impedance path to allow the current to continue to flow, thereby preventing voltage spikes and electromagnetic interference (EMI).

[0084] Reference Figure 2It is the utility model provides a kind of circuit structure schematic diagram of intelligent power module, in the utility model one embodiment, the inverter circuit can include first power chip IGBT1, second power chip IGBT2, third power chip IGBT3, fourth power chip IGBT4, fifth power chip IGBT5, sixth power chip IGBT6, the drive circuit can include first control chip HVIC1 and second control chip LVIC;The rectifier circuit can include seventh power chip IGBT7 and eighth power chip IGBT8, the drive circuit can also third control chip HVIC2;The collector of the first power chip IGBT1 is connected by the capacitor with the emitter of the seventh power chip IGBT7;The collector of the eighth power chip IGBT8 is connected with the collector of the first power chip IGBT1, the second power chip IGBT2 and third power chip IGBT3;

[0085] Microcontroller Unit (MC control) is connected with the input pin of the first control chip HVIC1, the input pin of the second control chip LVIC and the input pin of the third control chip HVIC;Wherein, the input pin of HVIC1 can include VCCH etc.

[0086] The output pin of the first control chip HVIC1 is connected with the output pin of the first control chip HVIC1 and the gate of the first power chip IGBT1, the second power chip IGBT2 and third power chip IGBT3;

[0087] The output pin of the second control chip LVIC is connected with the gate of the fourth power chip IGBT4, the fifth power chip IGBT5 and the sixth power chip IGBT6;

[0088] The output pin of the third control chip HVIC2 is connected with the gate of the seventh power chip IGBT7 and the eighth power chip IGBT8.

[0089] Refer to Figure 2 In the utility model one embodiment, the emitter of the first power chip IGBT1 and the collector of the fourth power chip IGBT4 are connected with the output pin of the first control chip HVIC, then first control pin U is led out and connected to the load;The emitter of the second power chip IGBT2 and the collector of the fifth power chip IGBT5 are connected with the output pin of the first control chip HVIC, then second control pin V is led out and connected to the load;The emitter of the third power chip IGBT3 and the collector of the sixth power chip IGBT6 are connected with the output pin of the first control chip HVIC, then third control pin W is led out and connected to the load.

[0090] With reference to Figure 2 In an embodiment of the utility model, the fourth power chip IGBT4, the fifth power chip IGBT5 and the sixth power chip IGBT6 are connected to ground after connecting resistance to the emitter, and the collector of the seventh power chip IGBT7 and the emitter of the eighth power chip IGBT8 are connected to the AC power supply through inductance. In the utility model, the VIC1 is connected to the bootstrap diode, and the power supply of VCC is connected to VB, so that the IGBT switch can be driven by the electric energy of VB. When the AC power is the negative half cycle and the IGBT7 is turned on, the IGBT7 needs to be continuously turned on, and the VIC1 needs to be in the bootstrap state. The bootstrap diode can prevent the high voltage from entering the VCC voltage, thereby protecting the elements such as IGBT in the circuit.

[0091] With reference to Figure 3 It is a kind of traditional intelligent power module circuit structure schematic diagram, traditional intelligent power module when working, AC 220V input, 220V AC is rectified to 310V DC by rectifier bridge (rectifier circuit), again by PFC circuit adjustment input to the inverter circuit of intelligent power module, to provide operating power supply for intelligent power module, to drive motor or other load work;Wherein, PFC circuit can automatically adjust conversion efficiency according to power grid and load fluctuation, improve the power factor of power system, improve the utilization efficiency of energy.

[0092] And the intelligent power module of the utility model when working, AC 220V input, series inductance is connected to intelligent power module, to provide power supply for intelligent power module, and the AC power is converted into DC power by the switching of IGBT and diode (FRD) in intelligent power module, and the DC power is transmitted to the inverter circuit of intelligent power module, to drive motor or other load work.

[0093] It can be seen that the traditional intelligent power module needs to be connected to DC module (rectifier bridge+PFC circuit) to work, and the intelligent power module of the utility model can be directly connected to the module by series inductance of AC power (220V AC) to work, and the rectifier circuit for converting AC to DC is integrated in the intelligent power module. It can be known that the utility model and the traditional intelligent power module realize AC conversion in different ways. The traditional intelligent power module is rectifier bridge+PFC circuit for conversion, and the intelligent power module of the utility model is converted by 2 groups of IGBT+FRD, which can be realized by a set of logic for controlling IGBT switch.

[0094] With reference to Figure 4Is the appearance schematic diagram of the intelligent power module, in an embodiment of the utility model, the intelligent power module still includes the fin, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are encapsulated in the plastic package body according to preset packaging process.

[0095] Specifically, the appearance of the intelligent power module can be composed of the plastic package body, the pin, the fin; the plastic package body is mainly to protect the internal circuit and power chip of the intelligent power module, improves the reliability and strength of the intelligent power module; the function of the pin of the intelligent power module is to realize the electrical connection between the internal circuit of the intelligent power module and the peripheral circuit, and play the role of the intelligent power module; the fin is to conduct the heat generated by the intelligent power module in work, thereby ensuring the stability and reliability of the intelligent power module when working.

[0096] Refer to Figure 5 Is the internal structure schematic diagram of the intelligent power module, in an embodiment of the utility model, the intelligent power module can still include the lead frame, the aluminum wire and the gold wire.

[0097] Specifically, the internal structure of the intelligent power module is composed of the drive circuit (including the drive IC, namely the HVIC, LVIC and the like control chip), the lead frame, the power chip (IGBT), the aluminum wire, the gold wire and the like, wherein the main function of the drive IC is to control the switching and protection of the power chip; the main function of the lead frame is to realize the internal circuit connection of the intelligent power module, the fixation of the internal chip and the internal support of the intelligent power module; the function of the power chip is to convert the alternating current into the direct current, and then convert the alternating current into the controllable alternating current.

[0098] Refer to Figure 6 Is the internal structure front view of the intelligent power module, specifically, the internal structure of the intelligent power module can mainly include 3 parts of circuits, which are: ① drive circuit, controls the switching action of the power chip and IPM module protection function;② inverter circuit, mainly converts the direct current into controllable alternating current;③ rectifier circuit, converts the alternating current of commercial power into required direct current.

[0099] In an embodiment of the utility model, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are encapsulated in the plastic package body according to preset packaging process. In a specific example of the utility model, the packaging process of the intelligent power module (product) can be specifically as follows:

[0100] 1) scribing

[0101] The crystal grains on the wafer processed in the previous step are cut and separated. If chip cutting is to be performed, wafer die bonding must be performed first, and then the wafer is sent to a chip cutting machine for cutting. The crystal grains are arranged in an orderly manner on the blue film after cutting.

[0102] 2) Solder paste printing

[0103] The DBC is placed in a jig and then conveyed to a device. The device steel mesh is pressed on the fixed position of the DBC (Direct Bonded Copper). The scraper prints the solder paste on the fixed position of the DBC.

[0104] 3) Power chip die bonding

[0105] Referring to Figure 7 , a schematic diagram of a power chip die bonding provided in the utility model, the printed DBC is conveyed to a die bonding device by a device. The device picks up the chip from the blue film and places it on the DBC. This process needs to be repeated to complete the die bonding of multiple power chips.

[0106] 4) Frame assembly

[0107] The die-bonded DBC is placed in a jig, and then the lead frame is placed in the same jig. The DBC, lead frame, and jig are conveyed to a reflow soldering device. After passing through the reflow soldering device, the lead frame and DBC are assembled.

[0108] 5) Cleaning process

[0109] After reflow soldering, the product is sent to a device for cleaning the solder paste volatiles and other foreign matter in the product using chemical solution.

[0110] 6) Drive chip die bonding

[0111] The lead frame is conveyed to the dispensing station of the die bonding device. The device dispenses silver adhesive on the fixed position of the frame. Then, the lead frame is conveyed to the die bonding station. The device picks up the chip from the blue film and places it on the fixed position of the frame. After completion, the frame is sent to a high-temperature oven for curing.

[0112] 7) Aluminum wire bonding

[0113] The lead frame is fixed on the device by the device. The aluminum wire bonding device completes the electrical connection between the chip and the lead frame through aluminum wire bonding.

[0114] 8) Gold wire bonding

[0115] Referring to Figure 8 , a schematic diagram of gold wire bonding provided in the utility model, the lead frame is fixed on the device by the device. The gold wire bonding device completes the electrical connection between the chip and the lead frame and the power chip through gold wire bonding.

[0116] 9) Plastic encapsulation:

[0117] After the product is assembled, the frame is transferred to the mold cavity of the plastic encapsulation equipment, the mold is closed, the equipment is vacuumized, and after reaching the set vacuum value, the melted plastic encapsulation material is filled into the cavity of the mold to fill the gap in the cavity. After the plastic encapsulation material is pre-solidified, the mold is opened and the product is taken out.

[0118] 10) PMC (Post-Mold Cure, Post-Mold Cure)

[0119] The pre-solidified product is sent to the oven, and after 125°C for 6 hours, the plastic encapsulation body is completely solidified.

[0120] 11) Cutting and forming:

[0121] The solidified frame is sent to the mold of the cutting equipment, and after the stamping of the mold, the connecting rib of the frame is cut off, and then sent to the forming mold to complete the bending of the functional foot of the product.

[0122] 12) Printing

[0123] The product is sent to the laser printing equipment to complete the identification of the relevant information of the product.

[0124] 13) FT (Final Test, Final Test) test

[0125] After the product is printed, the final electrical performance test is completed, and the requirements for shipment are met.

[0126] 14) Packaging and shipment

[0127] After the product is tested, it is packaged in the specified form and arranged for shipment.

[0128] In another specific example of the utility model, the packaging process of the intelligent power module (product) can be as follows:

[0129] 1) Scribing

[0130] The individual dies on the wafer processed in the previous process are cut and separated. If chip cutting is to be performed, wafer die bonding must be performed first, and then sent to the chip cutting machine for cutting. The dies after cutting are arranged in order on the blue film.

[0131] 2) Solder paste printing

[0132] The DBC is placed in the jig and then transferred to the equipment. The steel mesh of the equipment is pressed on the fixed position of the DBC, and the doctor blade prints the solder paste on the fixed position of the DBC.

[0133] 3) Frame assembly

[0134] Referring toFigure 9 , the schematic diagram of the frame assembly provided in the utility model, the completed DBC is placed in the clamp, then the lead frame is placed in the same clamp, the DBC, the lead frame and the clamp are conveyed to the reflow soldering equipment, after passing through the reflow soldering equipment, the lead frame and the DBC are assembled;

[0135] 4) tin paste printing

[0136] The DBC is placed in the jig and then is conveyed to the equipment, the steel net of the equipment is pressed on the fixed position of the DBC, and the doctor blade prints the tin paste on the fixed position of the DBC.

[0137] 5) power chip patching

[0138] The printed DBC and the frame are conveyed to the patching equipment by the equipment, the chip is grabbed from the blue film by the equipment and is placed on the DBC, and the process needs to be repeated to complete the patching work of multiple power chips.

[0139] 6) vacuum reflow soldering

[0140] After the patching is completed, the lead frame is sent into the vacuum reflow soldering equipment, and after passing through the equipment, the power chip and the lead frame are combined;

[0141] 7) cleaning process

[0142] After the reflow soldering, the product is sent into the equipment, and the tin paste volatiles and other foreign matters in the product are cleaned by using the chemical solution;

[0143] 8) drive chip patching

[0144] After the lead frame is conveyed to the dispensing station of the patching equipment, the silver glue is dispensed on the position of the frame by the equipment, then is conveyed to the patching station, the chip is grabbed from the blue film by the equipment and is placed on the fixed position of the frame, and after the process is completed, the frame is sent into the high-temperature box for solidification;

[0145] 9) aluminum wire bonding

[0146] The lead frame is fixed on the equipment by the equipment, and the aluminum wire bonding equipment completes the electrical connection between the chip and the lead frame through aluminum wire bonding;

[0147] 10) gold wire bonding

[0148] The lead frame is fixed on the equipment by the equipment, and the gold wire bonding equipment completes the electrical connection between the chip and the lead frame and the power chip through gold wire bonding;

[0149] 11) plastic packaging

[0150] After the product is assembled, the frame is transferred to the mold cavity of the plastic packaging equipment, the mold is closed, the equipment is vacuumized, and the molten plastic is filled into the cavity after reaching the set vacuum value. After the plastic is pre-solidified, the mold is opened and the product is taken out.

[0151] 12) PMC

[0152] The pre-solidified product is sent to the oven, and the plastic package is completely cured after 6 hours at 125°C.

[0153] 13) Cutting and forming:

[0154] The cured frame is sent to the mold of the cutting equipment, and the connecting rib of the frame is cut off after being punched by the mold, and then it is sent to the forming mold to complete the bending of the functional foot of the product.

[0155] 14) Printing

[0156] The product is sent to the laser printing equipment to complete the identification of the relevant information of the product.

[0157] 15) FT test

[0158] After the product is printed, the final electrical performance test is completed to meet the requirements for shipment.

[0159] 16) Packaging and shipment

[0160] After the product is tested, it is packaged in the specified form and arranged for shipment.

[0161] In summary, the utility model provides a kind of multifunctional intelligent power module, and there is great difference with traditional intelligent power module.Specifically speaking:(1) the inside of traditional intelligent power module only includes drive IC and inverter circuit, and function is relatively single, and its main function is to convert direct current into controllable alternating current, to realize more efficient conversion, while integrated detection and protection function, traditional intelligent power module cannot complete other work.(2) the utility model provides a kind of multifunctional intelligent power module, and its inside is integrated into the function of alternating current conversion into direct current (rectifier circuit), can make intelligent power module realize alternating current (mains) → direct current → alternating current (controllable) function, while it includes many detection and protection functions, to ensure that intelligent power module works stably and safely.①compared with traditional intelligent power module, direct current needs to be connected to fixed pin by PCB to work normally, and circuit wiring is long;The intelligent power module of the utility model is connected by intelligent power module inside, and circuit line is short, can reduce the stray inductance of intelligent power module system, improve the stability and safety of intelligent power module when working.②after the integration of intelligent power module is improved, the area of printed circuit board PCB it occupies is smaller, and there is no need to layout rectification function on printed circuit board PCB.③the intelligent power module of the utility model reduces a rectifier bridge compared with traditional intelligent power module, and can reduce the BOM (Billof Materials, material list) cost provided.④the appearance of the intelligent power module of the utility model is small and exquisite, and the function is perfect, and it is more friendly to application engineer, and layout is more convenient.⑤the power conversion efficiency of the intelligent power module of the utility model is more efficient, and it is more energy-saving and environment-friendly.

[0162] Based on the above intelligent power module, the utility model discloses a kind of load driving circuit, and the load driving circuit includes intelligent power module and peripheral circuit, and the peripheral circuit can include alternating current source, capacitor, inductor, resistance and load.

[0163] The intelligent power module includes rectifier circuit, inverter circuit and drive circuit, and the rectifier circuit is connected with alternating current source connected with inductor and capacitor, and wherein:

[0164] The rectifier circuit converts alternating current provided by the alternating current source into direct current, and provides the direct current to the inverter circuit and the drive circuit;

[0165] The drive circuit is used to receive logic control signal and control the opening and closing of the power chip of the inverter circuit according to the logic control signal;

[0166] The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, to control the load work through the controllable alternating current.

[0167] In an embodiment of the utility model, the power chip in the rectifier circuit and the inverter circuit is connected with diode respectively.

[0168] In an embodiment of the utility model, the inverter circuit includes first power chip, second power chip, third power chip, fourth power chip, fifth power chip, sixth power chip, the drive circuit includes first control chip and second control chip, the rectifier circuit includes seventh power chip and eighth power chip, the drive circuit still includes third control chip, the collector of first power chip is connected with the emitter of seventh power chip through the capacitor, the collector of eighth power chip is connected with the collector of first power chip, second power chip and third power chip,

[0169] The microcontroller unit is connected with the input pin of first control chip, the input pin of second control chip and the input pin of third control chip,

[0170] The output pin of first control chip is connected with the gate of first power chip, second power chip and third power chip,

[0171] The output pin of second control chip is connected with the gate of fourth power chip, fifth power chip and sixth power chip,

[0172] The output pin of third control chip is connected with the gate of seventh power chip and eighth power chip.

[0173] In an embodiment of the utility model, the emitter of first power chip and the collector of fourth power chip are connected with the output pin of first control chip, then first control pin is led out and is connected to the load,

[0174] The emitter of second power chip and the collector of fifth power chip are connected with the output pin of first control chip, then second control pin is led out and is connected to the load,

[0175] The emitter of third power chip and the collector of sixth power chip are connected with the output pin of first control chip, then third control pin is led out and is connected to the load.

[0176] In an embodiment of the utility model, the emitter of fourth power chip, fifth power chip and sixth power chip is connected with resistance and then is grounded.

[0177] In an embodiment of the utility model, the collector of seventh power chip and the emitter of eighth power chip are connected with AC power supply through inductance.

[0178] In an embodiment of the utility model, the intelligent power module further includes a lead frame, an aluminum wire and a gold wire.

[0179] In an embodiment of the utility model, the intelligent power module further includes a heat sink.

[0180] In an embodiment of the utility model, the load at least includes a motor.

[0181] In an embodiment of the utility model, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in the plastic package body according to a preset packaging process.

[0182] In the utility model, the load drive circuit includes intelligent power module, intelligent power module includes rectifier circuit, inverter circuit and drive circuit, rectifier circuit is connected with the alternating current power supply of connecting inductance and electric capacity, wherein, rectifier circuit, alternating current power supply provides alternating current is converted into direct current, and direct current is provided for inverter circuit and drive circuit, drive circuit is used for receiving logic control signal and is opened and closed according to logic control signal control power chip of inverter circuit, inverter circuit is used for based on logic control signal direct current is converted into controllable alternating current to control load work through controllable alternating current.The utility model discloses intelligent power module not only integrates drive circuit and inverter circuit, but also integrates rectifier circuit, so that alternating current provided by alternating current power supply can be converted into direct current in the intelligent power module, and then direct current can be converted into controllable alternating current through drive circuit and inverter circuit to control load to work, and the integration degree of intelligent power module is high, and then the area of printed circuit board that it needs to occupy is smaller, at the same time, the printed circuit board also does not need to be laid out other rectifier circuit, further reduces the area of printed circuit board that it needs to occupy, and is more friendly to application engineer, so that application engineer lays out other circuit or element will be more convenient.

[0183] For the above embodiment, because it is basically similar with the intelligent power module embodiment, so the description is relatively simple, and the related part refers to the part of the description of the intelligent power module embodiment.

[0184] Based on the above load drive circuit, the utility model discloses a kind of air conditioners, and the air conditioner includes load drive circuit, and the load drive circuit includes intelligent power module and peripheral circuit, and the peripheral circuit can include alternating current power supply, electric capacity, inductance, resistance and load.

[0185] The intelligent power module includes rectifier circuit, inverter circuit and drive circuit, and the rectifier circuit is connected with the alternating current power supply of connecting inductance and electric capacity, wherein:

[0186] The rectifier circuit converts alternating current provided by the alternating current power supply into direct current and provides the direct current to the inverter circuit and the driving circuit;

[0187] The driving circuit is configured to receive a logic control signal and control the opening and closing of power chips of the inverter circuit according to the logic control signal.

[0188] The inverter circuit is configured to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load by the controllable alternating current.

[0189] In an embodiment of the utility model, the power chips in the rectifier circuit and the inverter circuit are connected with diodes respectively.

[0190] In an embodiment of the utility model, the inverter circuit comprises a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip and a sixth power chip, the driving circuit comprises a first control chip and a second control chip, the rectifier circuit comprises a seventh power chip and an eighth power chip, the driving circuit further comprises a third control chip, the collector of the first power chip is connected with the emitter of the seventh power chip through the capacitor, the collector of the eighth power chip is connected with the collectors of the first power chip, the second power chip and the third power chip,

[0191] The microcontroller unit is connected with the input pin of the first control chip, the input pin of the second control chip and the input pin of the third control chip.

[0192] The output pin of the first control chip is connected with the gate of the first power chip, the second power chip and the third power chip.

[0193] The output pin of the second control chip is connected with the gate of the fourth power chip, the fifth power chip and the sixth power chip.

[0194] The output pin of the third control chip is connected with the gate of the seventh power chip and the eighth power chip.

[0195] In an embodiment of the utility model, the emitter of the first power chip and the collector of the fourth power chip are connected with the output pin of the first control chip, and then a first control pin is led out and connected to the load.

[0196] The emitter of the second power chip and the collector of the fifth power chip are connected with the output pin of the first control chip, and then a second control pin is led out and connected to the load.

[0197] The emitter of the third power chip and the collector of the sixth power chip are connected with the output pin of the first control chip, and then a third control pin is led out and connected to the load.

[0198] In an embodiment of the utility model, the emitter of fourth power chip, fifth power chip and sixth power chip is connected resistance and then grounded.

[0199] In an embodiment of the utility model, the collector of seventh power chip and the emitter of eighth power chip are connected with the AC power supply through inductance.

[0200] In an embodiment of the utility model, the intelligent power module further includes a lead frame, an aluminum wire and a gold wire.

[0201] In an embodiment of the utility model, the intelligent power module further includes a heat sink.

[0202] In an embodiment of the utility model, the load at least includes a motor.

[0203] In an embodiment of the utility model, the rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in the plastic package body according to a preset packaging process.

[0204] In the utility model, the air conditioner can include a load driving circuit, the load driving circuit includes an intelligent power module, the intelligent power module includes a rectifier circuit, an inverter circuit and a drive circuit, the rectifier circuit is connected with an AC power supply connected with inductance and capacitor, wherein the rectifier circuit converts AC power provided by the AC power supply into DC power and provides the DC power to the inverter circuit and the drive circuit, the drive circuit is used for receiving a logic control signal and controlling the opening and closing of the power chip of the inverter circuit according to the logic control signal, the inverter circuit is used for converting the DC power into controllable AC power based on the logic control signal to control the load to work through the controllable AC power. The intelligent power module of the utility model not only integrates the drive circuit and the inverter circuit, but also integrates the rectifier circuit, so that the AC power provided by the AC power supply can be converted into DC power in the intelligent power module, and then the DC power can be converted into controllable AC power through the drive circuit and the inverter circuit to control the load to work. The intelligent power module has high integration, so that the area of the printed circuit board occupied by the intelligent power module is smaller, at the same time, the printed circuit board does not need to be laid out with other rectifier circuits, further reducing the area of the printed circuit board occupied by the intelligent power module, which is more friendly to application engineers, so that the application engineers will be more convenient to layout other circuits or elements.

[0205] For the above embodiments, since they are basically similar to the smart power module embodiments, the description is relatively simple, and the relevant part can be referred to the part of the description of the smart power module embodiments.

[0206] The above only describes the preferred embodiments of the present application, and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An intelligent power module, characterized in that: The intelligent power module includes a rectifier circuit, an inverter circuit, and a drive circuit. The rectifier circuit is connected to an AC power supply connected to an inductor and a capacitor, wherein: The rectifier circuit converts the AC power provided by the AC power source into DC power, and provides the DC power to the inverter circuit and the drive circuit; The driving circuit is configured to receive a logic control signal and control the power chip of the inverter circuit to be turned on and off according to the logic control signal; The inverter circuit is used to convert the direct current into controllable alternating current based on the logic control signal, so as to control the operation of a load through the controllable alternating current.

2. The intelligent power module according to claim 1, characterized in that: The power chips in the rectifier circuit and the inverter circuit are respectively connected to diodes.

3. The intelligent power module according to claim 2, characterized in that: The inverter circuit includes a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, and a sixth power chip; the drive circuit includes a first control chip and a second control chip; the rectifier circuit includes a seventh power chip and an eighth power chip; the drive circuit further includes a third control chip; the collector of the first power chip is connected to the emitter of the seventh power chip through the capacitor; the collector of the eighth power chip is connected to the collectors of the first power chip, the second power chip, and the third power chip; The microcontroller unit is connected to the input pin of the first control chip, the input pin of the second control chip, and the input pin of the third control chip; The output pin of the first control chip is connected to the gates of the first power chip, the second power chip and the third power chip; The output pin of the second control chip is connected to the gates of the fourth power chip, the fifth power chip and the sixth power chip; The output pin of the third control chip is connected to the gates of the seventh power chip and the eighth power chip.

4. The intelligent power module according to claim 3, characterized in that: The emitter of the first power chip and the collector of the fourth power chip are connected to the output pin of the first control chip, and then a first control pin is led out and connected to the load; The emitter of the second power chip and the collector of the fifth power chip are connected to the output pin of the first control chip, and then a second control pin is led out and connected to the load; The emitter of the third power chip and the collector of the sixth power chip are connected to the output pin of the first control chip, and then a third control pin is led out and connected to the load.

5. The intelligent power module according to claim 4, characterized in that: The emitters of the fourth power chip, the fifth power chip, and the sixth power chip are connected to resistors and then grounded.

6. The intelligent power module according to claim 4, characterized in that: The collector of the seventh power chip and the emitter of the eighth power chip are connected to the AC power supply through an inductor.

7. The intelligent power module according to claim 1, characterized in that: The intelligent power module further includes a lead frame, aluminum wires and gold wires.

8. The intelligent power module according to claim 1, wherein: The intelligent power module further includes a heat sink.

9. The intelligent power module according to claim 1, wherein: The load includes at least a motor.

10. The intelligent power module according to claim 1, wherein: The rectifier circuit, the inverter circuit and the drive circuit in the intelligent power module are packaged in a plastic package according to a preset packaging process.

11. A load driving circuit, characterized in that: The load driving circuit includes the intelligent power module according to any one of claims 1 to 10 and a peripheral circuit, wherein the peripheral circuit includes an AC power supply, a capacitor, an inductor, a resistor, and a load.

12. An air conditioner, characterized in that: The air conditioner includes the load driving circuit according to claim 11.