W-band low-cost TR assembly
By adopting the design of integrated packaging multi-functional chips and RF PCB boards in W-band TR components, the problems of high cost and high complexity of traditional TR components are solved, low-cost and highly integrated multi-channel functions are achieved, and production efficiency and reliability are improved.
Patent Information
- Application Number
- CN202422937435.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Traditional W-band TR components require multiple channels, which requires multiple sets of transceiver chips and amplitude and phase control chips, resulting in high cost and complexity.
It adopts a design of a TR component structure, two waveguide cover plates and two RF PCB boards, integrates and packages a multi-function chip and a transceiver chip, realizes multiple channel functions through the common end waveguide port and the branch end waveguide port, and uses one multi-function chip to replace multiple chips.
It significantly reduces costs and design complexity, improves production efficiency and reliability, and achieves high integration and flexible installation of multi-channel functions.
Smart Images
Figure CN223452158U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of phased array antennas, in particular to a W-band low-cost TR assembly. BACKGROUND
[0002] W phased array antennas are more and more widely applied in the field of communication radars due to wider communication bandwidth and higher resolution. The TR assembly is a core component of the phased array antenna system, which mainly amplifies, shifts and controls the amplitude of the transceiving signal, and the performance of the TR assembly is crucial to the performance of the entire phased array antenna.
[0003] The traditional W-band TR assembly needs as many sets of corresponding transceiving chips and amplitude and phase control chips as the number of channels, which is high in cost and complexity. CONTENT OF THE UTILITY MODEL
[0004] In order to at least partially overcome the problem that the W-band TR assembly in the related art needs as many sets of corresponding transceiving chips and amplitude and phase control chips as the number of channels, which is high in cost and complexity, the application provides a W-band low-cost TR assembly.
[0005] The scheme of the application is as follows:
[0006] A W-band low-cost TR (Transmitter and / Receiver) assembly comprises:
[0007] a TR assembly structure, two waveguide cover plates and two radio frequency PCB boards;
[0008] The TR assembly structure is a square plate structure, and recesses with the same shape are formed in the upper and lower surfaces of the square plate structure;
[0009] The two radio frequency PCB boards are arranged in the recesses in the upper and lower surfaces of the TR assembly structure, respectively;
[0010] The two radio frequency PCB boards are buckled on the upper and lower surfaces of the TR assembly structure;
[0011] The radio frequency PCB board comprises a common end waveguide port, a packaged multifunctional chip, a plurality of branch end waveguide ports and a plurality of packaged transceiving chips;
[0012] Each branch end waveguide port and each packaged transceiving chip are connected one by one;
[0013] All the packaged transceiving chips are connected to the packaged multifunctional chip;
[0014] The packaged multifunctional chip is connected to the common end waveguide port;
[0015] The common end waveguide port and the branch end waveguide port are both leaked outside the TR assembly structure for accessing external devices.
[0016] Preferably, the radio frequency PCB board further comprises:
[0017] A plurality of transition structures;
[0018] The branch end waveguide port is connected with the packaged transceiver chip through the transition structure.
[0019] Preferably, the transition structure is a ridge fin line transition probe structure.
[0020] Preferably, the radio frequency PCB board further comprises:
[0021] A power supply control interface connector;
[0022] One end of the power supply control interface connector accesses an external power supply, and the other end is connected with the packaged multifunctional chip and each packaged transceiver chip.
[0023] Preferably, the common end waveguide port is leaked outside a first end of the TR assembly structure;
[0024] The branch end waveguide port is leaked outside a second end of the TR assembly structure.
[0025] Preferably, the first end and the second end of the TR assembly structure are opposite ends.
[0026] Preferably, the packaged multifunctional chip is internally integrated with an amplifier, a phase shifter, a digital controlled attenuator and a power division network circuit.
[0027] Preferably, the packaged transceiver chip is internally integrated with a transmitting power amplifier, a receiving low noise amplifier and a transceiver switch.
[0028] The technical scheme provided in the application can have the following beneficial effects:
[0029] The W-band low-cost TR assembly in the application comprises a TR assembly structure, two waveguide cover plates and two radio frequency PCB boards; the TR assembly structure is a square plate structure, and recesses with the same shape are arranged on the upper and lower surfaces of the square plate structure; the two radio frequency PCB boards are arranged in the recesses on the upper and lower surfaces of the TR assembly structure; the two radio frequency PCB boards are buckled on the upper and lower surfaces of the TR assembly structure; the radio frequency PCB board comprises a common end waveguide port, a packaged multifunctional chip, a plurality of branch end waveguide ports and a plurality of packaged transceiver chips; each branch end waveguide port and each packaged transceiver chip are connected in one-to-one correspondence; all the packaged transceiver chips are connected to the packaged multifunctional chip; the packaged multifunctional chip is connected to the common end waveguide port; the common end waveguide port and the branch end waveguide port are exposed outside the TR assembly structure and used for connecting external devices.
[0030] When the technical solution is implemented, one input device can be connected through the common end waveguide port, a plurality of output devices can be connected through the plurality of branch end waveguide ports, or a plurality of input devices can be connected through the plurality of branch end waveguide ports, and one output device can be connected through the common end waveguide port. Only one multifunctional chip can realize the functions of multiple channels, and the functions of multiple chips or even dozens of chips are realized at the cost of one chip, so that the cost and design complexity are greatly reduced.
[0031] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the application. BRIEF DESCRIPTION OF DRAWINGS
[0032] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the application and, together with the specification, serve to explain the principles of the application.
[0033] Figure 1 is a structure explosion view of a W-band low-cost TR assembly provided by an embodiment of the application;
[0034] Figure 2 is an internal view of a W-band low-cost TR assembly provided by an embodiment of the application;
[0035] Figure 3 is a schematic diagram of a W-band low-cost TR assembly provided by an embodiment of the application.
[0036] Reference signs: TR assembly structure-101; waveguide cover plate-102; radio frequency PCB board-103; common end waveguide port-201; branch end waveguide port-202; transition structure-203; packaged multifunctional chip-204; packaged transceiver chip-205; power supply control interface connector-206. DETAILED DESCRIPTION
[0037] The exemplary embodiments will be described in detail herein with reference to the attached drawings. In the following description, like reference numerals refer to like elements throughout the description. The following exemplary embodiments are not representative of all embodiments consistent with the present application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present application, as detailed in the appended claims.
[0038] Figure 1 is an exploded view of a structure of a W-band low-cost TR assembly according to an embodiment of the present application, Figure 2 is an internal view of a W-band low-cost TR assembly according to an embodiment of the present application, referring to Figures 1-2 A W-band low-cost TR assembly comprises:
[0039] a TR assembly structure 101, two waveguide cover plates 102, and two RF PCBs 103.
[0040] The TR assembly structure 101 is in a square plate shape, and recesses are formed on the upper and lower surfaces of the square plate shape.
[0041] The two RF PCBs 103 are respectively arranged in the recesses on the upper and lower surfaces of the TR assembly structure 101.
[0042] The two RF PCBs 103 are fastened to the upper and lower surfaces of the TR assembly structure 101.
[0043] The RF PCB 103 comprises a common end waveguide port 201, a packaged multifunctional chip 204, branch end waveguide ports 202, and packaged transceiver chips 205.
[0044] Each branch end waveguide port 202 is connected to one of the packaged transceiver chips 205.
[0045] All the packaged transceiver chips 205 are connected to the packaged multifunctional chip 204.
[0046] The packaged multifunctional chip 204 is connected to the common end waveguide port 201.
[0047] The common end waveguide port 201 and the branch end waveguide ports 202 are exposed outside the TR assembly structure 101, and are used to connect to external devices.
[0048] As shown in Figures 1-2 , the common end waveguide port 201 is exposed outside the first end of the TR assembly structure 101, and the branch end waveguide ports 202 are exposed outside the second end of the TR assembly structure 101.
[0049] The first end and the second end of the TR assembly structure 101 are opposite ends.
[0050] The common end waveguide port 201 leaks outside the first end of the TR component structure 101, and the branch end waveguide port 202 leaks outside the second end of the TR component structure 101, which can facilitate the connection of external devices.
[0051] It should be noted that the packaged multifunctional chip 204 internally integrates an amplifier, a phase shifter, a digital controlled attenuator, and a power dividing network circuit.
[0052] The packaged transceiver chip 205 internally integrates a transmitting power amplifier, a receiving low noise amplifier, and a transceiver switch.
[0053] The radio frequency PCB board 103 is a core component, and in specific practice, the selection of the board material thereof needs to select a high frequency board material to reduce the loss of signal transmission and the delay of signals.
[0054] The packaged multifunctional chip 204 internally integrates an amplifier, a phase shifter, a digital controlled attenuator, and a power dividing network circuit, and mainly realizes the amplification of signals and the modulation of amplitudes and phases. The chip is a packaged chip, and does not need to be mounted in a clean environment.
[0055] The packaged transceiver chip 205 internally integrates a transmitting power amplifier, a receiving low noise amplifier, and a transceiver switch. The chip is also a packaged chip, and can be mounted in a conventional environment. Moreover, different performance packaged transceiver chips 205 can be replaced according to the requirements of different powers and gains to be mounted.
[0056] It should be noted that the radio frequency PCB board 103 further comprises:
[0057] A plurality of transition structures 203;
[0058] The branch end waveguide port 202 is connected with the packaged transceiver chip 205 through the transition structure 203.
[0059] Preferably, the transition structure 203 is a pair of ridge fin line transition probe structures.
[0060] It can be understood that the transition structure 203 adopts the form of a pair of ridge fin line transition probes to realize the transition conversion from a waveguide to a microstrip. The waveguide port of the circuit transition structure 203 and the microstrip line are on a parallel transmission link, which facilitates the wiring design of the radio frequency board and improves the spatial utilization efficiency of the output port.
[0061] It should be noted that the radio frequency PCB board 103 further comprises:
[0062] A power supply control interface connector 206;
[0063] The power supply control interface connector 206 is connected to an external power supply at one end and connected to the packaged multifunctional chip 204 and each packaged transceiver chip 205 at the other end.
[0064] The power supply control interface connector 206 can supply power to each chip through the interface, and communicate and control the multifunctional chip through the interface.
[0065] The purpose of the technical solution is to realize a small and low-cost TR assembly. The W-band low-cost TR assembly in the technical solution adopts a combination design of PCB and cavity. The high-frequency PCB is designed with high-frequency circuit materials, and the PCB can be designed with multiple layers to avoid the single-layer wiring design of traditional soft substrates. The core RF device used on the high-frequency PCB is an integrated packaged multifunctional chip 204, which integrates a receiver amplifier, a transmitter amplifier, a phase control chip, an attenuation control chip, and a power division network circuit.
[0066] The high-frequency PCB can be installed on both sides of the structural cavity, and the schematic diagram is shown in Figure 3 The space utilization is further compressed to improve the integration of the product and double the number of channels. The signal input and output interface adopts a standard waveguide port to facilitate interconnection with various standard interface antennas and subsequent equipment, improving its wide adaptability. The transition from the PCB to the standard waveguide port uses a ridge fin line transition, which aligns the signal link transmission direction with the input and output waveguide port direction, thereby avoiding the need for a curved waveguide for transformation circuit, improving the space utilization of circuit design.
[0067] The technical solution solves the problems of high cost and high complexity of the W-band low-cost TR assembly. The traditional TR requires as many sets of corresponding transceiver chips and amplitude-phase control chips as the number of channels. This solution only needs one multifunctional chip to realize the function of multiple channels, achieving the function of multiple or even dozens of chips at the cost of one chip, greatly reducing the cost and design complexity.
[0068] The technical solution improves production efficiency and reduces production difficulty. Since the design uses PCB, automatic placement machines can be used for placement during production, reducing manual assembly and improving production efficiency and reliability.
[0069] The technical scheme cancels the traditional bare chip micro-assembly mode, can carry out quick PCB replacement repair, and improves the product repairability.
[0070] It can be understood that the same or similar parts in the above-mentioned embodiments can be mutually referred to, and the content not described in detail in some embodiments can refer to the same or similar content in other embodiments.
[0071] It should be noted that in the description of the present application, the terms "first", "second", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meaning of "a plurality of" is at least two.
[0072] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0073] Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above-mentioned embodiments within the scope of the present application.
Claims
1. A W-band low-cost TR component, characterized in that: include: A TR component structure, two waveguide cover plates and two RF PCB boards; The TR assembly structure is a square plate structure, and the upper and lower surfaces of the square plate structure are provided with grooves of the same shape; Two radio frequency PCB boards are respectively arranged in grooves on the upper and lower surfaces of the TR component structure; Two radio frequency PCB boards are fastened to the upper and lower surfaces of the TR component structure; The radio frequency PCB board includes: a common end waveguide port, a packaged multifunctional chip, multiple branch end waveguide ports and multiple packaged transceiver chips; The waveguide ports at each branch end are connected to each packaged transceiver chip in a one-to-one correspondence; All packaged transceiver chips are connected to the packaged multifunctional chip; The packaged multifunctional chip is connected to the common end waveguide port; The common-end waveguide port and the branch-end waveguide port are both exposed outside the TR component structure for connecting to external devices.
2. The W-band low-cost TR component according to claim 1, characterized in that: The radio frequency PCB board also includes: multiple transition structures; The branch end waveguide port is connected to the packaged transceiver chip through the transition structure.
3. The W-band low-cost TR component according to claim 2, characterized in that: The transition structure is a transition probe structure for the dorsal fin line.
4. The W-band low-cost TR component according to claim 1, characterized in that: The radio frequency PCB board also includes: Power supply control interface connector; One end of the power supply control interface connector is connected to an external power supply, and the other end is connected to the packaged multifunctional chip and each of the packaged transceiver chips.
5. The W-band low-cost TR component according to claim 1, characterized in that: The common end waveguide port leaks outward from the first end of the TR component structure; The branch end waveguide port leaks outward from the second end of the TR component structure.
6. The W-band low-cost TR component according to claim 5, characterized in that: The first end and the second end of the TR assembly structure are opposite ends.
7. The W-band low-cost TR component according to claim 1, characterized in that: The packaged multifunctional chip internally integrates an amplifier, a phase shifter, a digitally controlled attenuator and a power division network circuit.
8. The W-band low-cost TR component according to claim 1, characterized in that: The packaged transceiver chip internally integrates a transmitting power amplifier, a receiving low noise amplifier and a transceiver switch.